CN104289392A - Glue filling technology for sealing - Google Patents

Glue filling technology for sealing Download PDF

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Publication number
CN104289392A
CN104289392A CN201310308546.9A CN201310308546A CN104289392A CN 104289392 A CN104289392 A CN 104289392A CN 201310308546 A CN201310308546 A CN 201310308546A CN 104289392 A CN104289392 A CN 104289392A
Authority
CN
China
Prior art keywords
side plate
sealing
glue
outer panel
filling technology
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310308546.9A
Other languages
Chinese (zh)
Inventor
洪光岱
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ten Pao Electronics Huizhou Co Ltd
Original Assignee
Ten Pao Electronics Huizhou Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ten Pao Electronics Huizhou Co Ltd filed Critical Ten Pao Electronics Huizhou Co Ltd
Priority to CN201310308546.9A priority Critical patent/CN104289392A/en
Publication of CN104289392A publication Critical patent/CN104289392A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a glue filling technology for sealing. The glue filling technology for sealing comprises the following steps that an outer side plate and an inner side plate are connected through bolts, the periphery of a gap between the outer side plate and the inner side plate is coated with a hot melt glue ring, the space defined by the outer side plate and the inner side plate is filled with liquid glue, standing is conducted till the surface is solidified, and hot melt glue is torn down so as to be used repeatedly later. A better sealing effect can be achieved through ordinary popular low-cost materials according to the production technology, and the method is simple and practical.

Description

For the process for filling colloid sealed
Technical field
The present invention relates to electronic product production technology, being specially the process for filling colloid for sealing.
Background technology
At present, known conventional waterproof sealing mode, at seam crossing pad sealing ring (silica gel or rubber blanket) or filling with sealant; Silica gel and rubber seal mode, need to be split into mould specially, is easily corroded and is oxidized simultaneously, can not work long hours out of doors, in the environment such as oiliness and Acidity of Aikalinity, otherwise must regularly carry out maintaining and changing; The mode of filling with sealant, material success is high, is also easily corroded and is oxidized, can not work long hours out of doors, in the environment such as oiliness and Acidity of Aikalinity, otherwise must regularly carry out maintaining and refilling; All can not recycle, not environmentally.
Summary of the invention
Technical problem solved by the invention is the process for filling colloid being provided for sealing, to solve the shortcoming in above-mentioned background technology.
Technical problem solved by the invention realizes by the following technical solutions:
For the process for filling colloid sealed, comprise the following steps:
The first step: outer panel and interior plate are bolted;
Second step: the gap surrounding between outer panel and interior plate is coated PUR;
3rd step: in the space that outer panel and interior plate enclose; Leave standstill a period of time, until surface solidification.
4th step: PUR of tearing, recycles after giving over to.
Beneficial effect: by the lower cost materials of ordinary populace, according to manufacturing technique method of the present invention, can reach better sealing effectiveness, method simple practical.
Accompanying drawing explanation
Fig. 1 is the component schematic diagram that the present invention treats encapsulating.
Detailed description of the invention
The technological means realized to make the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with concrete diagram, setting forth the present invention further.
See Fig. 1, the process for filling colloid for sealing treats the component schematic diagram of encapsulating, for the process for filling colloid sealed, comprises the following steps:
The first step: outer panel 2 is connected by bolt 1 with interior plate 3;
Second step: the gap surrounding between outer panel 2 and interior plate 3 is coated PUR;
3rd step: pour into liquid glue in the space that outer panel and interior plate enclose; Leave standstill and solidify to surface;
4th step: PUR of tearing, recycles after giving over to.
In order to overcome existing encapsulation process material, in resistance to oxidation, corrosion-resistant, service life is short, produce and maintenance cost high, the deficiency that can not recycle, the invention provides a kind of novel encapsulating product sealing production technology, not only overcome the deficiency of more than existing encapsulation process material, simple and practical again.The product carrying out encapsulating process is needed for all, before encapsulating, first by being linked and packed of needing to combine, then the common PUR of last layer is coated with at the seam crossing outer surface combined, due to the characteristic of PUR, only seal the seam crossing outer surface of combination, cannot penetrate into and combine inside the gap between connecting, then carry out encapsulating operation.And carry out dispelling the heat or glue (as epoxy resin, polyurethane, organosilicon etc.) more liquid of fixation, can penetrate into after encapsulating operation and combine inside the gap between connecting.After glue curing after a while, torn it down by the PUR of outer surface, the PUR torn it down again can by recycling after high temperature melt process again.And due to product combine connect between gap inside be cured after glue be filled with, in conjunction with the characteristic of glue and the requirement of shelter of product, just can play sealing function completely, resistance to oxidation, corrosion-resistant, long service life.An advanced person's encapsulating production technology, environmental protection and can be recycled, and reduce the technology difficulty of product in waterproof sealing occasion.
More than show and describe general principle of the present invention and principal character and advantage of the present invention; the technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications; these changes and improvements all fall in the claimed scope of the invention, and application claims protection domain is defined by appending claims and equivalent thereof.

Claims (1)

1. the process for filling colloid for sealing, is characterized in that, comprises the following steps:
The first step: outer panel and interior plate are bolted;
Second step: the gap surrounding between outer panel and interior plate is coated hot melt cushion rubber;
3rd step: pour into liquid glue in the space that outer panel and interior plate enclose; Leave standstill and solidify to surface;
4th step: PUR of tearing, recycles after giving over to.
CN201310308546.9A 2013-07-19 2013-07-19 Glue filling technology for sealing Pending CN104289392A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310308546.9A CN104289392A (en) 2013-07-19 2013-07-19 Glue filling technology for sealing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310308546.9A CN104289392A (en) 2013-07-19 2013-07-19 Glue filling technology for sealing

Publications (1)

Publication Number Publication Date
CN104289392A true CN104289392A (en) 2015-01-21

Family

ID=52309477

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310308546.9A Pending CN104289392A (en) 2013-07-19 2013-07-19 Glue filling technology for sealing

Country Status (1)

Country Link
CN (1) CN104289392A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103008171A (en) * 2012-12-14 2013-04-03 天津筑高机器人技术有限公司 Gluing machine for injecting glue to slits of building boards

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103008171A (en) * 2012-12-14 2013-04-03 天津筑高机器人技术有限公司 Gluing machine for injecting glue to slits of building boards

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PB01 Publication
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Application publication date: 20150121