CN104270014A - Three-level high-power module structure and power conversion unit - Google Patents

Three-level high-power module structure and power conversion unit Download PDF

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Publication number
CN104270014A
CN104270014A CN201410373464.7A CN201410373464A CN104270014A CN 104270014 A CN104270014 A CN 104270014A CN 201410373464 A CN201410373464 A CN 201410373464A CN 104270014 A CN104270014 A CN 104270014A
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CN
China
Prior art keywords
power device
power
clamp diode
water channel
busbar
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Pending
Application number
CN201410373464.7A
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Chinese (zh)
Inventor
谭海鸥
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Shenzhen Invt Electric Co Ltd
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Shenzhen Invt Electric Co Ltd
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Application filed by Shenzhen Invt Electric Co Ltd filed Critical Shenzhen Invt Electric Co Ltd
Priority to CN201410373464.7A priority Critical patent/CN104270014A/en
Publication of CN104270014A publication Critical patent/CN104270014A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/32Means for protecting converters other than automatic disconnection
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/483Converters with outputs that each can have more than two voltages levels
    • H02M7/487Neutral point clamped inverters

Abstract

The invention provides a three-level high-power module structure. The three-level high power module structure comprises a single-phase circuit in diode clamping three-level topology and a rectangular substrate carrying the single-phase circuit. The single-phase circuit comprises power devices and clamping diodes. The power devices comprise the first power device, the second power device, the third power device and the fourth power device. The clamping diodes comprise the first clamping diode and the second clamping diode. The length direction of the power devices and the length direction of the clamping diodes are the same as that of the rectangular substrate. The centers of the power devices and the centers of the clamping diodes are collinear. In the width direction of the rectangular substrate, the first power device is closely adjacent to the fourth power device, the first clamping diode is closely adjacent to the second clamping diode, and the second power device is closely adjacent to the third power device; in this way, the overall three-level high-power module structure is compact in arrangement, and the size of the three-level high-power module structure is reduced. The invention further provides a power conversion unit which is compact in arrangement and wide in application occasion.

Description

A kind of high-power modular structure of three level and power conversion unit
Technical field
The present invention relates to frequency converter field, particularly the high-power modular structure of a kind of three level and power conversion unit.
Background technology
Along with China's expanding economy, coal industry is develop rapidly also, the frequency converter of existing 660V, 1140V electric pressure is difficult to the requirement meeting coal mining enterprise, starting torque situation is not ideal, affect also larger to a certain extent on the impulsive force of electrical network, along with coal mining enterprise constantly expands scale, the scope of operation also expands thereupon, and low-power machine originally can not adapt to the production requirement in heavy duty work face.Heavy-duty motor could allow the scope of operation produce smoothly, and thus, high-power, high voltage, high reliability frequency converter demand is more and more urgent.
Usually high-power, high voltage appearance frequency converter adopts in the industry diode-clamped three-level topology circuit structure, in order to meet high-power output demand, the power device (such as insulated gate bipolar transistor power device) of more high power level is needed in described three-level topology circuit structure, but the power device of high power level often volume is larger, power consumption is also larger, also higher to the requirement of cooling, this is concerning the explosion-proof frequency converter being used in underground coal mine, and its confined space obviously can not meet the needs of structural allocation and cooling.
Summary of the invention
The first aspect of the embodiment of the present invention provides the high-power modular structure of a kind of three level, comprise the single phase circuit in diode clamping tri-level topology and carry the rectangular substrate of described single phase circuit, described single phase circuit comprises power device and clamp diode, described power device comprises the first power device, the second power device the 3rd power device and the 4th power device, and described clamp diode comprises the first clamp diode and the second clamp diode.
Described first power device, the first clamp diode and the second power device are linearly successively set on the side of described rectangular substrate, described first power device, the first clamp diode are all consistent with the length direction of described rectangular substrate with the length direction of the second power device itself, the center conllinear of described first power device, the first clamp diode and the second power device.
Described 3rd power device, the second clamp diode and the 4th power device are linearly successively set on the opposite side of described rectangular substrate, described 3rd power device, the second clamp diode are all consistent with the length direction of described rectangular substrate with the length direction of the 4th power device itself, the center conllinear of described 3rd power device, the second clamp diode and the 4th power device.
Along the Width of described substrate, described first power device is closely adjacent with described 4th power device, and described first clamp diode is closely adjacent with described second clamp diode, and described second power device is closely adjacent with described 3rd power device.
In conjunction with first aspect, second aspect present invention comprises further: described rectangular substrate is water-cooling base plate, described rectangular substrate inside is provided with many end to end cooling water channels, described cooling water channel extends along the length direction of described rectangular substrate, the region at the first power device that described cooling water channel is linearly arranged with described respectively, the first clamp diode and the second power device place is corresponding, and the region at the 3rd power device linearly arranged with described, the second clamp diode and the 4th power device place is corresponding.
In conjunction with second aspect, third aspect present invention comprises further:
Described cooling water channel comprises:
Water inlet, for accessing cooling water channel by cooling water;
First water channel, for connecting into the mouth of a river, is arranged on corresponding first power device, the first clamp diode and the second power device column;
Second water channel, for being communicated with the first water channel, is arranged on corresponding 3rd power device, the second clamp diode and the 4th power device column;
3rd water channel, for being communicated with the first water channel and the second water channel;
Delivery port, for discharging cooling water, is communicated with the second water channel;
Described water inlet, delivery port are separately positioned on the position of contiguous described first power device, the 4th power device.
In conjunction with second aspect, fifth aspect present invention comprises further: described rectangular substrate is water-cooling base plate, and described rectangular substrate inside is provided with cooling water channel, and described cooling water channel comprises:
Water inlet, for accessing cooling water channel by cooling water;
First water channel, for connecting into the mouth of a river, is arranged on the left part column of corresponding first power device, the first clamp diode and the second power device;
Second water channel, for being communicated with the first water channel, is arranged on the right part column of corresponding first power device, the first clamp diode and the second power device;
3rd water channel, for being communicated with the second water channel, is arranged on the left part column of corresponding 3rd power device, the second clamp diode and the 4th power device;
4th water channel, for being communicated with the 3rd water channel, is arranged on the right part column of corresponding 3rd power device, the second clamp diode and the 4th power device;
5th water channel, for being communicated with the second water channel and the 3rd water channel;
Delivery port, for discharging cooling water, is communicated with the 4th water channel;
Described water inlet, delivery port are separately positioned on the position of contiguous described first power device, the 4th power device.
In conjunction with first aspect, fifth aspect present invention comprises further:
The positive pole of described first power device, the second power device, the 3rd power device, the 4th power device, the first clamp diode and the second clamping diode is all positioned at the left part of respective body, and the negative pole of described first power device, the second power device, the 3rd power device, the 4th power device, the first clamp diode and the second clamping diode is all positioned at the right part of respective body;
The positive pole of described first power device, the second power device and the first clamp diode is all positioned at the left end of described rectangular substrate;
The negative pole of described 3rd power device, the 4th power device and the second clamp diode is all positioned at the right-hand member of described rectangular substrate.
In conjunction with first aspect to the either side in the 5th aspect, sixth aspect present invention comprises further:
Stack bus bar, including positive busbar, negative busbar, intermodule connection busbar, input and output busbar and mid point copper bar, being electrically connected for realizing between each power device and clamp diode;
Described positive busbar, negative busbar, input and output busbar and intermodule connect mutual insulating isolation between busbar, and described intermodule connection busbar comprises the first connection busbar and is connected busbar with second;
The positive pole of described first power device is electrically connected with positive busbar, the negative pole of described first power device, the negative pole of the first clamp diode and the positive pole of the second power device are connected in parallel on described first and connect busbar, the negative pole of the second power device and the positive pole of the 3rd power device are connected in parallel on described input and output busbar, the positive pole of described 4th power device, the positive pole of the second clamp diode and the negative pole of the 3rd power device are connected in parallel on described second and connect busbar, the negative pole of the 4th power device is electrically connected with negative busbar, the positive pole of described first clamp diode and the negative pole of the second clamp diode are connected in parallel on described mid point busbar.Stack bus bar
Another object of the present invention is to provide a kind of power conversion unit, the high-power modular structure of three level that above-mentioned first aspect to the 6th aspect is recorded.
In conjunction with seven aspects, eighth aspect present invention comprises further: comprise the high-power modular structure of three level, electric capacity and DC master row, DC master row comprises the first DC master row and the second DC master row, the positive busbar of the high-power modular structure of three level is electrically connected with the positive pole of electric capacity by straight first-class busbar, and the negative busbar of the high-power modular structure of three level is connected with the negative electricity of electric capacity by the second DC master row.
In conjunction with either side in seven aspects to the 9th aspect, tenth aspect present invention comprises further: described power conversion unit is rectifier, inverter or frequency converter.
As can be seen from the above technical solutions, the embodiment of the present invention has the following advantages:
The invention provides the high-power modular structure of a kind of three level, comprise the single phase circuit in diode clamping tri-level topology and carry the rectangular substrate of described single phase circuit, described single phase circuit comprises power device and clamp diode, described power device comprises the first power device, second power device the 3rd power device and the 4th power device, described clamp diode comprises the first clamp diode and the second clamp diode, power device is all consistent with the length direction of rectangular substrate with the length direction of clamp diode itself, the center conllinear of power device and clamp diode, along the Width of rectangular substrate, first power device is closely adjacent with the 4th power device, first clamp diode is closely adjacent with the second clamp diode, second power device is closely adjacent with the 3rd power device, the width that single phase circuit is taken is accomplished minimum, make overall arrangement compact, reduce the width dimensions of rectangular substrate, reduce the volume of the high-power modular structure of three level, Appropriate application assembly space, in addition, present invention also offers a kind of power conversion unit, volume compact, applicable situation is extensive.
Term " first ", " second ", " the 3rd " " 4th " etc. in specification of the present invention and claims and above-mentioned accompanying drawing are for distinguishing similar object, and need not be used for describing specific order or precedence.The embodiments described herein should be appreciated that the data used like this can be exchanged in the appropriate case, so that can be implemented with the order except the content except here diagram or description.In addition, term " comprises " and " having " and their any distortion, intention is to cover not exclusive comprising, such as, contain those steps or unit that the process of series of steps or unit, method, system, product or equipment is not necessarily limited to clearly list, but can comprise clearly do not list or for intrinsic other step of these processes, method, product or equipment or unit.
Refer to Fig. 1, in the embodiment of the present invention, a kind of embodiment of the high-power modular structure of three level comprises:
Single phase circuit in tri-level inversion topology and carry the rectangular substrate 100 of described single phase circuit, single phase circuit comprises power device and clamp diode, power device comprises the first power device 101, second power device 102, the 3rd power device 103 and the 4th power device 104, and clamp diode comprises the first clamp diode 111 and the second clamp diode 112.
Rectangular substrate 100 shape of carrying single phase circuit is not limited only to rectangle, also can adopt other shapes, and such as circle, irregular quadrilateral etc., meet single phase circuit and carry.
First power device 101, first clamp diode 111 and the second power device 102 are linearly successively set on the side of rectangular substrate 100, the length direction of the first power device 101, first clamp diode 111 and the second power device 102 itself is all consistent with the length direction of rectangular substrate 100, the center conllinear of the first power device 101, first clamp diode 111 and the second power device 102.
This first clamp diode 111 between the first power device 101 and the second power device 102, this first power device 101, first clamp diode 111 and second power device 102 conllinear,
3rd power device 103, second clamp diode 112 and the 4th power device 104 are linearly successively set on the opposite side of rectangular substrate 100, the length direction of the 3rd power device 103, second clamp diode 112 and the 4th power device 104 itself is all consistent with the length direction of rectangular substrate 100, the center conllinear of the 3rd power device 103, second clamp diode 112 and the 4th power device 104.
This second clamp diode 112 between the 3rd power device 103 and the 4th power device 104, the 3rd power device 103, second clamp diode 112 and the 4th power device 104 conllinear,
Along the Width of rectangular substrate 100, the first power device 101 is closely adjacent with the 4th power device 104, and the first clamp diode 111 is closely adjacent with described second clamp diode 112, and the second power device 102 is closely adjacent with the 3rd power device 103.
Above-mentioned closely adjacently can be understood as two devices and can be abutted together, or under the prerequisite not affecting device terminal, two devices, apart from minimum, can reduce the width shared by two devices, to a great extent to reach the object of compact conformation.
In the present embodiment, by the arrangement that power device is closely adjacent, the width that power device is taken diminishes, and overall arrangement is compact, the space that entirety is taken reduces the volume also reducing the high-power modular structure of three level to a certain extent, Appropriate application assembly space.
Power device (the Insulated Gate Bipolar Transistor above mentioned, insulated gate bipolar transistor), each power device is equipped with module drive plate, and be furnished with driving power, realize isolated from power, meet the security regulations requirement of withstand voltage under high voltage, it will be recognized by those skilled in the art that and repeat no more.
It should be noted that, the length direction mentioned herein refers to the longest corresponding direction of object self side length, and Width refers to hereinafter repeat no more the direction corresponding to the length of side that the ratio length value of object self is little to this.
In the present embodiment, first power device 101, first clamp diode 111 and the second power device 102 are linearly successively set on the side of rectangular substrate 100, first power device 101, the length direction of the first clamp diode 111 and the second power device 102 itself is all consistent with the length direction of rectangular substrate 100, first power device 101, the center conllinear of the first clamp diode 111 and the second power device 102, 3rd power device 103, second clamp diode 112 and the 4th power device 104 are linearly successively set on the opposite side of rectangular substrate 100, 3rd power device 103, the length direction of the second clamp diode 112 and the 4th power device 104 itself is all consistent with the length direction of rectangular substrate 100, 3rd power device 103, the center conllinear of the second clamp diode 112 and the 4th power device 104, along the Width of rectangular substrate 100, first power device 101 is closely adjacent with the 4th power device 104, make overall arrangement compact, reduce the volume of the high-power modular structure of three level.
Herein for convenience of description; with the vertical placement location of rectangular substrate in accompanying drawing 100 for reference; definition rectangular substrate 100 up and down; be convenient to herein to the understanding of position; in other equivalents embodiment of the present invention; up and down, right position can exchange, and do not affect protection scope of the present invention.
Refer to Fig. 2, the electric connecting relation below for power device, clamp diode is described:
The positive pole of this first power device T1 (the first power device in corresponding structural representation of the present invention) is connected with DC bus positive pole, the negative pole of this first power device T1 and the negative pole of the first clamp diode D5 (the first clamp diode in corresponding structural representation of the present invention), the positive pole of the second power device T2 (the second power device in corresponding structural representation of the present invention) is connected, the negative pole of this second power device T2 connects with the positive pole of the 3rd power device T3 (the 3rd power device in corresponding structural representation of the present invention) and exports to be formed to exchange or input, the negative pole of the 3rd power device T3 and the positive pole of the second clamp diode D6 (the second clamping diode in corresponding structural representation of the present invention), the positive pole of the 4th power device T4 (the 4th power device in corresponding structural representation of the present invention) is connected, the negative pole of the 4th power device T4 is connected with DC bus negative pole.
In the present embodiment, first power device 301, second power device 302, 3rd power device 303, 4th power device 304, the positive pole of the first clamp diode 311 and the second clamping diode 312 is all positioned at the left part of respective body, described first power device 301, second power device 302, 3rd power device 303, 4th power device 304, the negative pole of the first clamp diode 311 and the second clamping diode 312 is all positioned at the right part of respective body, first power device 301, the positive pole of the second power device 302 and the first clamp diode 311 is all positioned at the left end of described rectangular substrate, 3rd power device 303, the negative pole of the 4th power device 304 and the second clamp diode 312 is all positioned at the right-hand member of described rectangular substrate, facilitate wiring like this, also each overall device can be made to arrange and connect up neat, compact conformation, also convenient heat radiation, time cooling water channel is particularly installed, correspondence is only needed to be arranged on power device and clamp diode column, do not need to carry out more changes to cooling water channel shape.It should be noted that, the both positive and negative polarity of power device and the both positive and negative polarity of clamp diode also can be positioned at the diverse location of respective body, do not limit herein.
Refer to Fig. 3, in order to solve the problem of single power device overtension, additionally providing another kind of embodiment in the embodiment of the present invention and comprising: grading resistor 313 in parallel between the positive pole of this first clamp diode 311 and the negative pole of the second clamp diode 312.According to the single phase circuit of three-level topology structure, first power device 301 is called outer tube together with the 4th power device 304, second power device 302 is called interior pipe together with the 3rd power device 303, by grading resistor 313 in parallel between the positive pole of the first clamp diode 311 and the negative pole of the second clamp diode 312, solve the problem of the dynamic voltage un-balance of inner and outer tubes, avoid the risk of single power device overtension.
Refer to Fig. 3 A, introduce physical circuit annexation below, the positive pole of this first power device T1 is connected with DC bus positive pole, the negative pole of this first power device T1 and the negative pole of the first clamp diode D5, the positive pole series connection of the second power device T2, the negative pole of this second power device T2 is connected with the positive pole of the 3rd power device T3 and exports to be formed to exchange, the negative pole of the 3rd power device T3 and the positive pole of the second clamp diode D6, the positive pole series connection of the 4th power device T4, 4th power device T4 is connected with DC bus negative pole, grading resistor R in parallel between the positive pole of the first clamp diode D5 and the negative pole of the second clamp diode D6, solve the problem of the dynamic voltage un-balance of inner and outer tubes, avoid the risk of single power device overtension.
Refer to Fig. 4, below for the electrical connection between power device and clamp diode, in the embodiment of the present invention, another kind of embodiment comprises:
The high-power modular structure of this three level also comprises:
Stack bus bar, is electrically connected between power device and clamp diode for realizing.
This stack bus bar comprises positive busbar 405, negative busbar 406, intermodule connection busbar 407, input and output busbar 413 and mid point busbar 410, this positive busbar 405, negative busbar 406, input and output busbar 413 and intermodule connect mutual insulating isolation between busbar 407, this positive busbar 405 is electrically connected with positive pole, this negative busbar 406 is connected with negative pole, input and output busbar 413 exports or input as interchange, and this intermodule connection busbar 407 comprises the first connection busbar 408 and is connected busbar 409 with second.
The positive pole of this first power device 401 is electrically connected with positive busbar 405, the negative pole of this first power device 401, the negative pole of the first clamp diode 411 and the positive pole of the second power device 402 are connected in parallel on this first connection busbar 408, the negative pole of the second power device 402 and the positive pole of the 3rd power device 403 are connected in parallel on input and output busbar 413, the positive pole 404 of the 4th power device, the positive pole of the second clamp diode 412 and the negative pole of the 3rd power device 403 are connected in parallel on this second connection busbar 409, the negative pole 404 of the 4th power device is electrically connected with negative busbar 406, the positive pole of this first clamp diode 411 and the negative pole of the second clamp diode 412 are connected in parallel on this mid point busbar 410.
Current terminal 420 comprises positive terminal 421, negative terminals 422 and mid point terminals 423, and positive terminal 421 is electrically connected with positive busbar 405, and negative terminals 422 is electrically connected with negative busbar 406, and mid point terminals 423 are electrically connected with mid point busbar 407.
By use stack bus bar realize power device and clamp diode electrical connection effectively can reduce current circuit, reduce stray inductance, improve mechanical performance.
Refer to Fig. 5, lower mask body introduces the structure about stack bus bar, and the another kind of embodiment in the embodiment of the present invention comprises:
This stack bus bar comprises the first busbar layer 501, second busbar layer 502 and insulation board 503.
This first busbar layer 501, for placing this mid point busbar.
This second busbar layer 502, connects busbar for placing this positive busbar, this negative busbar, this input and output busbar and this intermodule.
This insulation board 503 is arranged between the first busbar layer 501 and the second busbar layer 502 for insulation, avoid the generation of partial discharge, in addition, the thickness of insulation board 503 is different along with the difference of electric pressure, also thicken along with the area of stack bus bar increases, increase the safety standard requirements that insulation board 503 makes stack bus bar meet to avoid high voltage partial discharge.
The busbar of several polarity is included in second busbar layer 502, and can not be in electrical contact between opposed polarity busbar, therefore all carry out insulation isolation processing.
This stack bus bar also comprises insulating part 504, at the upper surface of stack bus bar and lower surface and between the positive pole and negative pole of power device, specifically, the position of insulating part 504 is positioned at the lower surface of the first busbar layer 501 and the upper surface of the second busbar layer 502, the position relationship placed with stack bus bar in accompanying drawing in the present embodiment defines direction, the lower surface of the first busbar layer 501 is the one side that the first busbar layer 501 deviates from the second busbar layer 502, and the upper surface of the second busbar layer 502 is the one side that the second busbar layer 502 deviates from the first busbar layer 501.
In order to play the effect of insulation, insulating part 504 should be arranged between the opposed polarity of same power device, and in the present embodiment, insulating part 504 is between the positive pole and negative pole of same power device.
Shown in composition graphs 5, insulating part 504 comprises the first insulating part 5041, second insulating part 5042, the 3rd insulating part 5043 and the 4th insulating part 5044, described first insulating part 5041 is between the positive pole and negative pole of the first power device, described second insulating part 5042 is between the positive pole and negative pole of described second power device, 3rd insulating part 5043 is between the positive pole and negative pole of the 3rd power device, 4th insulating part 5044 between the positive pole and negative pole of the 4th power device, to make mutually insulated between the positive pole of this power device and negative pole.
It should be noted that, in the present embodiment, stack bus bar adopts the effective weight reduction of double-layer structure, reduces costs, the realization of more favourable processing and the facility of assembling.
Refer to Fig. 5 A and Fig. 5 B, as better scheme, in order to increase creepage distance further, the surface of this insulating part 504 has the groove 505 of at least one, and the number of groove 505 can be chosen according to actual needs, meets and increases creepage distance, due to the existence of groove 505, make the path on insulating part 504 surface longer, avoid the generation of creepage situation, improve fail safe.
In order to improve the insulation between the first busbar layer 501 and the second busbar layer 502 further, in the present embodiment, being provided with insulating paper on the surface of the first busbar layer 501 and the second busbar layer 502 surface, strengthening surface insulation, improve fail safe.
It should be noted that, stack bus bar can adopt the material that can make busbar in prior art widely, and such as copper bar etc. meets stack bus bar electric conductivity, does not do the restriction of concrete material herein.
Shown in composition graphs 1, for shape and the position of each device in rectangular substrate 100 of substrate 100, another embodiment in the embodiment of the present invention comprises:
This rectangular substrate 100 is water-cooling base plate 100, first power device 101, second power device 102, the 3rd power device 103 and the 4th power device 104 are respectively four angles being positioned at this rectangular substrate 100 side, and be row with the first power device 101, second power device 102, the first power device 101, the 3rd power device 103 are diagonal angle setting.
First power device 101, second power device 102 is row, first power device 101, the 3rd power device 103 are diagonal angle setting, then the second power device 102 and the 4th power device 102 are also that diagonal angle is arranged, so the first power device 101, second power device 102, the 3rd power device 103 and the 4th power device 104 is orthogonal is in the present embodiment arranged in rectangular substrate 100.
This first clamp diode 111 is positioned at the centre position of the first power device 101 and the second power device in rectangular substrate 100, and this second clamp diode 112 is positioned at the centre position of the 3rd power device 103 and the 4th power device 104 in rectangular substrate 100.
Be specially:
First power device 101 is positioned at the lower left corner of this rectangular substrate 100;
Second power device 102 is positioned at the upper left corner of this rectangular substrate 100;
3rd power device 103 is positioned at the upper right corner of this rectangular substrate 100;
4th power device 104 is positioned at the lower right corner of this rectangular substrate 100;
This first clamp diode 111 is positioned at this rectangular substrate 100 left side central portion;
This second clamp diode 112 is positioned at this rectangular substrate 100 right side central;
The positive pole of this first power device 101, second power device 102, the 3rd power device 103 and the 4th power device 104 is towards left side negative pole towards right side;
The positive pole of this first clamp diode 111 and this second clamp diode 112 is towards left side negative pole towards right side.
Certainly, the positive pole of above each device also towards left side, can be unified towards any direction, can be arranged in rectangular substrate 100 according to actual needs here.
For the high-power modular structure of three level, operationally quantity of heat production is comparatively large, the invention provides a kind of embodiment:
Rectangular substrate is water-cooling base plate, rectangular substrate inside is provided with many end to end cooling water channels, cooling water channel extends along the length direction of described rectangular substrate, the region at the first power device that cooling water channel is linearly arranged with described respectively, the first clamp diode and the second power device place is corresponding, corresponding with the region at the 3rd power device linearly arranged, the second clamp diode and the 4th power device place.
Refer to Fig. 6, provide a kind of embody rule scene to illustrate below:
The surface of rectangular substrate 600 is arranged the electric elements such as single phase circuit and stack bus bar, be provided with cooling water channel in the inside of this rectangular substrate 100, this cooling water channel comprises:
Water inlet 630, for accessing cooling water channel by cooling water;
First water channel 631, for connecting into the mouth of a river, is arranged on the left part column of corresponding first power device 601, first clamp diode 611 and the second power device 602;
Second water channel 632, for being communicated with the first water channel 631, is arranged on the right part column of corresponding first power device 601, first clamp diode 611 and the second power device 602;
3rd water channel 633, for being communicated with the second water channel 632, is arranged on the left part column of corresponding 3rd power device 603, second clamp diode 612 and the 4th power device 604;
4th water channel 634, for being communicated with 633 with the 3rd water channel, is arranged on the right part column of corresponding 3rd power device 603, second clamp diode 612 and the 4th power device 604;
5th water channel 636, for being communicated with the second water channel 632 and the 3rd water channel 633;
Delivery port 635, for discharging cooling water, is communicated with the 4th water channel 634, by arranging cooling water channel at each components and parts correspondence position, accelerates heat radiation, and the well balanced heat radiation of power device, ensures that each power device normally effectively runs, improve stability.
Position about water inlet 630 and delivery port 635 can be chosen according to actual needs, and facilitate cooling water channel to arrange, particular location does not limit.
In the present embodiment, 630 water inlets, delivery port 635 is separately positioned on contiguous first power device 601, the position of the 4th power device 604, specifically, corresponding first power device 601 of this water inlet 630, corresponding 4th power device 604 of this delivery port 635, first power device 601 is directly electrically connected with bus positive pole, and the second power device 602 is because there is the buffering of the first clamp diode 611, the caloric value of the first power device 601 when single phase circuit works is higher than the caloric value of other devices, therefore the position cooling effect water inlet 630 of cooling water channel being arranged on corresponding first power device 601 is better.
In addition, the number about cooling water channel also provides another kind of embodiment, and described cooling water channel comprises:
Water inlet, for accessing cooling water channel by cooling water;
First water channel, for connecting into the mouth of a river, is arranged on corresponding first power device, the first clamp diode and the second power device column;
Second water channel, for being communicated with the first water channel, is arranged on corresponding 3rd power device, the second clamp diode and the 4th power device column;
3rd water channel, for being communicated with the first water channel and the second water channel;
Delivery port, for discharging cooling water, is communicated with the second water channel;
Described water inlet, delivery port are separately positioned on the position of contiguous described first power device, the 4th power device.
Preferably, first water channel is arranged on the center column of the center of the first power device, the first clamp diode center and the second power device, second water channel is arranged on the center column of the corresponding center of the 3rd power device, the center of the second clamp diode and the 4th power device, be beneficial to the setting of cooling water channel, strengthen radiating effect.
Refer to Fig. 7, the above is described for the high-power modular structure of three level in the present invention, is described below in the present invention based on the power conversion unit of the high-power modular structure composition of above-mentioned three level.
The invention provides a kind of power conversion unit, comprise the high-power modular structure of three level, electric capacity and DC master row, DC master row comprises the first DC master row 700 and the second DC master row (not shown), the positive busbar of the high-power modular structure of three level is electrically connected with the positive pole of electric capacity by straight first-class busbar, and the negative busbar of the high-power modular structure of three level is connected with the negative electricity of electric capacity by the second DC master row.
This power conversion unit comprises three high-power modular structures of three level, specifically be divided into the high-power modular structure 701 of the first three level, the high-power modular structure of second three level 702 and the high-power modular structure 703 of the 3rd three level, electric capacity comprises the first electric capacity 711, second electric capacity 712 and the 3rd electric capacity 713, the high-power modular structure of first three level 701 is corresponding with the first electric capacity 711 to be electrically connected, the high-power modular structure of second three level 702 is corresponding with the second electric capacity 712 to be electrically connected, the high-power modular structure of 3rd three level 703 is corresponding with the 3rd electric capacity 713 to be electrically connected, be the positive pole of the high-power modular structure 701 of the first three level, the positive pole of the high-power modular structure of the second three level 702 and the positive pole of the high-power modular structure 703 of the 3rd three level are connected in parallel on the first DC master row 700, the positive pole of the first electric capacity 711, the positive pole of the second electric capacity 712 and the positive pole of the 3rd electric capacity 713 are connected in parallel on the first DC master row, the negative pole of each device is all connected in parallel on the second DC master row above, specifically repeat no more.It should be noted that, the substrate design of three high-power modular structures of three level is integrated, and also can combine, and three cooling water channels can be shared delivery port and water inlet by relating to of cooling water channel, also can be provided separately, all be not specifically limited.
In addition, power conversion unit also comprises housing, high-power for three level modular structure, electric capacity and DC master row are placed in housing, the high-power modular structure compact conformation of three level in the present invention, volume is little, be convenient to be arranged in the power conversion unit housing of limited space, power conversion unit volume can be made to reduce to adapt to more workplaces.Described power conversion unit can be rectifier, inverter or frequency converter, is adapted to explosion-proof frequency converter field especially.
Those skilled in the art can be well understood to, and for convenience and simplicity of description, the system of foregoing description, the specific works process of device and unit, with reference to the corresponding process in preceding method embodiment, can not repeat them here.
In several embodiments that the application provides, should be understood that, disclosed system, apparatus and method, can realize by another way.Such as, device embodiment described above is only schematic, such as, the division of described unit, be only a kind of logic function to divide, actual can have other dividing mode when realizing, such as multiple unit or assembly can in conjunction with or another system can be integrated into, or some features can be ignored, or do not perform.Another point, shown or discussed coupling each other or direct-coupling or communication connection can be by some interfaces, and the indirect coupling of device or unit or communication connection can be electrical, machinery or other form.
The described unit illustrated as separating component or can may not be and physically separates, and the parts as unit display can be or may not be physical location, namely can be positioned at a place, or also can be distributed in multiple network element.Some or all of unit wherein can be selected according to the actual needs to realize the object of the present embodiment scheme.
In addition, each functional unit in each embodiment of the present invention can be integrated in a processing unit, also can be that the independent physics of unit exists, also can two or more unit in a unit integrated.Above-mentioned integrated unit both can adopt the form of hardware to realize, and the form of SFU software functional unit also can be adopted to realize.
If described integrated unit using the form of SFU software functional unit realize and as independently production marketing or use time, can be stored in a computer read/write memory medium.Based on such understanding, the part that technical scheme of the present invention contributes to prior art in essence in other words or all or part of of this technical scheme can embody with the form of software product, this computer software product is stored in a storage medium, comprising some instructions in order to make a computer equipment (can be personal computer, server, or the network equipment etc.) perform all or part of step of method described in each embodiment of the present invention.And aforesaid storage medium comprises: USB flash disk, portable hard drive, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disc or CD etc. various can be program code stored medium.
The above, above embodiment only in order to technical scheme of the present invention to be described, is not intended to limit; Although with reference to previous embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of a kind of embodiment of the high-power modular structure of three level in the embodiment of the present invention;
Fig. 2 is the schematic diagram of power device and clamp diode annexation in single phase circuit in the embodiment of the present invention;
Fig. 3 is the schematic diagram of a kind of embodiment of grading resistor in parallel in the embodiment of the present invention;
Fig. 3 A is the circuit diagram of grading resistor in parallel in the embodiment of the present invention;
Fig. 4 is the schematic diagram of a kind of embodiment of stack bus bar in the embodiment of the present invention;
Fig. 5 is the schematic diagram of the another kind of embodiment of stack bus bar in the embodiment of the present invention;
Fig. 5 A is the enlarged diagram at A place in Fig. 5;
Fig. 5 B is the structural representation of a kind of embodiment of the second busbar layer in the embodiment of the present invention;
Fig. 6 is the schematic diagram of a kind of embodiment of cooling water channel in the embodiment of the present invention;
Fig. 7 is the schematic diagram of a kind of embodiment of power conversion unit in the embodiment of the present invention.
Embodiment
Embodiments provide the high-power modular structure of a kind of three level, be provided for overall arrangement compact, reduce the volume of the high-power modular structure of three level, can be arranged in frequency converter.
The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.

Claims (10)

1. the high-power modular structure of three level, it is characterized in that, comprise the single phase circuit in diode clamping tri-level topology and carry the rectangular substrate of described single phase circuit, described single phase circuit comprises power device and clamp diode, described power device comprises the first power device, the second power device the 3rd power device and the 4th power device, described clamp diode comprises the first clamp diode and the second clamp diode
Described first power device, the first clamp diode and the second power device are linearly successively set on the side of described rectangular substrate, described first power device, the first clamp diode are all consistent with the length direction of described substrate with the length direction of the second power device itself, the center conllinear of described first power device, the first clamp diode and the second power device;
Described 3rd power device, the second clamp diode and the 4th power device are linearly successively set on the opposite side of described rectangular substrate, described 3rd power device, the second clamp diode are all consistent with the length direction of described rectangular substrate with the length direction of the 4th power device itself, the center conllinear of described 3rd power device, the second clamp diode and the 4th power device;
Along the Width of described substrate, described first power device is closely adjacent with described 4th power device, and described first clamp diode is closely adjacent with described second clamp diode, and described second power device is closely adjacent with described 3rd power device.
2. the high-power modular structure of three level according to claim 1, it is characterized in that, described rectangular substrate is water-cooling base plate, described rectangular substrate inside is provided with many end to end cooling water channels, described cooling water channel extends along the length direction of described rectangular substrate, the region at the first power device that described cooling water channel is linearly arranged with described respectively, the first clamp diode and the second power device place is corresponding, and the region at the 3rd power device linearly arranged with described, the second clamp diode and the 4th power device place is corresponding.
3. the high-power modular structure of three level according to claim 2, is characterized in that, described cooling water channel comprises:
Water inlet, for accessing cooling water channel by cooling water;
First water channel, for connecting into the mouth of a river, is arranged on corresponding first power device, the first clamp diode and the second power device column;
Second water channel, for being communicated with the first water channel, is arranged on corresponding 3rd power device, the second clamp diode and the 4th power device column;
3rd water channel, for being communicated with the first water channel and the second water channel;
Delivery port, for discharging cooling water, is communicated with the second water channel;
Described water inlet, delivery port are separately positioned on the position of contiguous described first power device, the 4th power device.
4. the high-power modular structure of three level according to claim 2, is characterized in that, described cooling water channel comprises:
Water inlet, for accessing cooling water channel by cooling water;
First water channel, for connecting into the mouth of a river, is arranged on the left part column of corresponding first power device, the first clamp diode and the second power device;
Second water channel, for being communicated with the first water channel, is arranged on the right part column of corresponding first power device, the first clamp diode and the second power device;
3rd water channel, for being communicated with the second water channel, is arranged on the left part column of corresponding 3rd power device, the second clamp diode and the 4th power device;
4th water channel, for being communicated with the 3rd water channel, is arranged on the right part column of corresponding 3rd power device, the second clamp diode and the 4th power device;
5th water channel, for being communicated with the second water channel and the 3rd water channel;
Delivery port, for discharging cooling water, is communicated with the 4th water channel;
Described water inlet, delivery port are separately positioned on the position of contiguous described first power device, the 4th power device.
5. the high-power modular structure of three level according to claim 1, it is characterized in that, the positive pole of described first power device, the second power device, the 3rd power device, the 4th power device, the first clamp diode and the second clamping diode is all positioned at the left part of respective body, and the negative pole of described first power device, the second power device, the 3rd power device, the 4th power device, the first clamp diode and the second clamping diode is all positioned at the right part of respective body;
The positive pole of described first power device, the second power device and the first clamp diode is all positioned at the left end of described rectangular substrate;
The negative pole of described 3rd power device, the 4th power device and the second clamp diode is all positioned at the right-hand member of described rectangular substrate.
6. the high-power modular structure of the three level according to any one of claim 1 to 5, is characterized in that, the high-power modular structure of described three level also comprises:
Stack bus bar, including positive busbar, negative busbar, intermodule connection busbar, input and output busbar and mid point busbar, being electrically connected for realizing between each power device and clamp diode;
Described positive busbar, negative busbar, input and output busbar and intermodule connect mutual insulating isolation between busbar, and described intermodule connection busbar comprises the first connection busbar and is connected busbar with second;
The positive pole of described first power device is electrically connected with positive busbar, the negative pole of described first power device, the negative pole of the first clamp diode and the positive pole of the second power device are connected in parallel on described first and connect busbar, the negative pole of the second power device and the positive pole of the 3rd power device are connected in parallel on described input and output busbar, the positive pole of described 4th power device, the positive pole of the second clamp diode and the negative pole of the 3rd power device are connected in parallel on described second and connect busbar, the negative pole of the 4th power device is electrically connected with negative busbar, the positive pole of described first clamp diode and the negative pole of the second clamp diode are connected in parallel on described mid point busbar.
7. a power conversion unit, is characterized in that, comprises the high-power modular structure of three level according to any one of claim 1 to 6.
8. power conversion unit according to claim 7, it is characterized in that, comprise the high-power modular structure of three level, electric capacity and DC master row, DC master row comprises the first DC master row and the second DC master row, the positive busbar of the high-power modular structure of three level is electrically connected with the positive pole of electric capacity by the first DC master row, and the negative busbar of the high-power modular structure of three level is connected with the negative electricity of electric capacity by the second DC master row.
9. power conversion unit according to claim 8, it is characterized in that, the high-power modular structure of described three level comprises the high-power modular structure of the first three level, the high-power modular structure of the second three level and the high-power modular structure of the 3rd three level, described electric capacity comprises the first electric capacity, the second electric capacity and the 3rd electric capacity, the high-power modular structure of first three level is corresponding with the first electric capacity to be electrically connected, the high-power modular structure of second three level is corresponding with the second electric capacity to be electrically connected, and the high-power modular structure of the 3rd three level is corresponding with the 3rd electric capacity to be electrically connected.
10. the power conversion unit according to any one of claim 7 to 9, is characterized in that, described power conversion unit is rectifier, inverter or frequency converter.
CN201410373464.7A 2014-07-31 2014-07-31 Three-level high-power module structure and power conversion unit Pending CN104270014A (en)

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CN105429438A (en) * 2015-12-29 2016-03-23 湖北江汉建筑工程机械有限公司 Cabinet-type frequency converter for construction hoist and construction hoist
CN109742923A (en) * 2018-12-10 2019-05-10 武汉船用电力推进装置研究所(中国船舶重工集团公司第七一二研究所) A kind of high-capacity power cabinet
CN110971137A (en) * 2019-12-18 2020-04-07 阳光电源股份有限公司 Inversion module

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US6456516B1 (en) * 1998-07-24 2002-09-24 Siemens Aktiengesellschaft Provision of a low-inductive rail for three-point phase module
JP2003134823A (en) * 2001-10-16 2003-05-09 Hitachi Ltd Power converter
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105429438A (en) * 2015-12-29 2016-03-23 湖北江汉建筑工程机械有限公司 Cabinet-type frequency converter for construction hoist and construction hoist
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CN109742923A (en) * 2018-12-10 2019-05-10 武汉船用电力推进装置研究所(中国船舶重工集团公司第七一二研究所) A kind of high-capacity power cabinet
CN109742923B (en) * 2018-12-10 2021-03-19 武汉船用电力推进装置研究所(中国船舶重工集团公司第七一二研究所) Large-capacity power cabinet
CN110971137A (en) * 2019-12-18 2020-04-07 阳光电源股份有限公司 Inversion module

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