CN104241973A - Electrical connector and circuit board assembly including the same - Google Patents
Electrical connector and circuit board assembly including the same Download PDFInfo
- Publication number
- CN104241973A CN104241973A CN201410366065.8A CN201410366065A CN104241973A CN 104241973 A CN104241973 A CN 104241973A CN 201410366065 A CN201410366065 A CN 201410366065A CN 104241973 A CN104241973 A CN 104241973A
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- China
- Prior art keywords
- contact
- ground connection
- circuit board
- connector
- electric connector
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6582—Shield structure with resilient means for engaging mating connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
- H01R13/6588—Shielding material individually surrounding or interposed between mutually spaced contacts with through openings for individual contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/735—Printed circuits including an angle between each other
- H01R12/737—Printed circuits being substantially perpendicular to each other
Abstract
An electrical connector (306) comprises a connector body (360) having a mounting side (362) and an array of signal contacts (368) disposed along the mounting side. A grounding matrix (310) extends along the mounting side. The grounding matrix includes a plurality of ground contacts (341, 342) that are interconnected in a web-like manner to define a plurality of openings (350). The signal contacts of the electrical connector extend through the openings, and the ground contacts are electrically coupled to the electrical connector. The grounding matrix includes attachment features (352) that directly engage and couple to the electrical connector to hold the grounding matrix in a designated position along the mounting side.
Description
Technical field
The present invention relates to and a kind ofly there is ground connection feature to improve the electric connector of electrical property.
Background technology
For meeting digital communication demand, usually wish that communication system and equipment have higher data traffic in less space.Therefore, the electric connector interconnected with circuit board and other electric components should contact density process higher signal speed with height.Above-mentioned electric connector applied environment is used to be in high speed, differential electrical connector, such as usual those electric connectors in radio communication or computing environment.In conventional methods where, two circuit boards pass through to use the electric connector being installed to each circuit board interconnected amongst one another in backboard and subcard structure.
At least one problem area is the interface between electric component, the interface such as between two electric connectors.In some cases, electric connector comprises the conductive shell of the shielding part as electric connector.When electric connector is combined together, housing is electric coupling also, thus sets up return path between electrical.But due to the less desirable particle (such as dirt or dust) between the manufacturing tolerance of such as electric connector or electric connector, there is gap along the interface between electric connector.These gaps can have a negative impact to the electrical property of connector assembly.Interface between electric connector and circuit board also can have the gap had a negative impact to the electrical property of assembly.
Needs can the electric connector setting up reliable electrical interconnection along interface between two electric connectors.
Summary of the invention
According to the present invention, electric connector comprises the connector body with installation side and the signal contact array arranged along this installation side.This signal contact array has the gap be formed between adjacent signal contact array.Ground connection matrix extends along this installation side.This ground connection matrix comprises multiple grounding contact, and described multiple grounding contact interconnects with web form to limit multiple opening.The signal contact of electric connector extends through this opening, and grounding contact is conductively coupled to electric connector.Ground array comprises attachment features, and this attachment features and electric connector directly engage and couple to be remained on by ground array along in the assigned address of installation side.
According to another aspect, circuit board assemblies comprises electric connector, and this electric connector comprises the connector body with installation side and the signal contact array arranged along this installation side.This signal contact array has the gap be formed between adjacent signal contact array.The circuit board with engagement side comprises signal via and ground connection via hole.Ground connection arranged in matrix is between this engagement sides and installation side.This ground connection matrix comprises multiple grounding contact, and this grounding contact interconnects with web form to limit multiple opening.The signal contact of electric connector extends through this opening to engage this signal via, and the ground connection via hole of circuit board is couple to the grounding path running through electric connector by grounding contact.
Accompanying drawing explanation
Fig. 1 shows electric coupler component that formed according to an embodiment, that comprise ground connection feature.
Fig. 2 is the perspective view of electric connector and the ground connection matrix formed according to embodiment.
Fig. 3 is the schematic diagram showing the terminal that can use together with the electric connector in Fig. 2 and the layout that can be present in the contact point in the connector assembly of Fig. 1.
Fig. 4 is the enlarged partial perspective view of the ground connection matrix that can use together with the electric connector in Fig. 2.
Fig. 5 is the independent view of the exemplary embodiment of the grounding contact that can use together with ground connection matrix.
Fig. 6 is the end view of the electric connector with the ground connection matrix being positioned at staggered receiving area.
Fig. 7 is the enlarged perspective illustrating in greater detail ground connection matrix.
Fig. 8 is the perspective view of the communication system according to embodiment.
Fig. 9 shows the perspective view of the ground connection matrix formed according to an embodiment.
Figure 10 is the bottom perspective view of the socket connector with the ground connection matrix that the installation side along the socket connector of Fig. 9 is located.
Figure 11 is the birds-eye perspective of the circuit board assemblies that can use together with the communication system of Fig. 8.
Figure 12 is the enlarged drawing of the circuit board that can use together with the circuit board assemblies of Figure 11.
Figure 13 is the side cut away view of the socket connector of the Figure 10 of the circuit board being installed to Figure 11.
Figure 14 is the bottom perspective view of the pin connector with the ground connection matrix that the installation side along pin connector is located.
Figure 15 is the plane graph of circuit board, illustrates in greater detail the layout of signal via, ground connection via hole and voltage contact area.
Embodiment
Fig. 1 shows the electric coupler component 100 formed according to exemplary embodiment.The ground connection matrix 106 that connector assembly 100 comprises the first and second electric connectors 102,104 and kept by electric connector 102.In other embodiments, electric connector 104 can keep ground connection matrix 106.Electric connector 102,104 is configured to be engaged with each other, and sets up electrical connection betwixt during compounding practice.First electric connector 102 can be called the pin connector of back board system, and the second electric connector 104 can be called the socket connector of back board system.But, be to be understood that embodiment described herein can use in various applications and be not limited to back board system.As shown in the figure, connector assembly 100 is next directed relative to mutually perpendicular axis 191-193, and axis 191-193 comprises and coordinates axis 191 and transversal line 192,193.
Electric connector 102 has installation side 110 and engagement side 112, and electric connector 104 also has installation side 114 and engagement side 116.In the illustrated embodiment, installation side and engagement side 110,112 along cooperation axis 191 face in the opposite direction, and installation side and engagement side 114,116 also face is in the opposite direction.Like this, the feature of electric connector 102,104 is that it is vertical connector.But in alternate embodiments, electric connector 102 and 104 can be rigging-angle connector, and wherein respective installation side and engagement sides are to direction perpendicular to one another.Installation side 110,114 is configured to engage respective electric component, such as circuit board (not shown).
Electric connector 102 comprises connector body or housing 118, and electric connector 104 comprises connector body 120.Connector body 118,120 comprises electric conducting material (such as, metal, have the mould etc. of conductive particle).Connector body 118,120 at electric connector 102, can form return path during 104 cooperation.Electric connector 102 comprises the electric terminal 122 being held in array by connector body 118.Electric connector 104 also comprises electric terminal (not shown).The electric terminal of electric connector 104 also can be referred to as mating terminals.In the exemplary embodiment, electric connector 102 has the main body reception cavity 126 opened wide to engagement side 112.The size and dimension of this reception cavity 126 is suitable for socket connector main body 120.
During compounding practice, this reception cavity 126 receives engagement side 116.The electric terminal of electric terminal 122 and electric connector 104 is engaged with each other and sets up electrical connection.When the electric terminal of electric connector 102 and electric connector 104 engages, ground connection matrix 106 makes connector body 118,120 electric coupling along mating interface.In alternate embodiments, engagement side 116 comprises reception cavity, and the reception cavity that engagement side 112 is configured to engaged side 116 receives.
When electric connector 102,104 coordinates, electric connector 102,104 along substantially with the cooperation direction M coordinating axis 191 to extend in parallel
1move relative to each other.Because electric connector 102 can move to electric connector 104, or moves conversely, therefore coordinate direction M
abe expressed as two-way.And both electric connectors 102,104 can move towards each other simultaneously.In the exemplary embodiment, the electric terminal of electric terminal 122 and electric connector 104 slides over each other when compounding practice joint.
In the exemplary embodiment, electric connector 102 is back panel connectors, and electric connector 104 is daughter board connector.But in alternate embodiments, electric connector 102 can be daughter board connector, and electric connector 104 can be back panel connector.Although describe connector assembly 100 with reference to back panel connector and daughter board connector herein, will be appreciated that theme is herein except back panel connector or daughter board connector, also can be realized by the electric connector of other types.Back panel connector and daughter board connector are only the exemplary illustrations of the embodiment of connector assembly 100.In certain embodiments, connector assembly 100 transmitting high speed data signal.Such as, data-signal can transmit with the speed greater than or equal to 15Gbps.In embodiment particularly, data-signal can to transmit greater than or equal to 20Gbps or greater than or equal to the speed of 25Gbps.But, in other embodiments, the speed transmission data signal that connector assembly 100 can be lower.
Fig. 2 is the perspective view of electric connector 102 and ground connection matrix 106.In the exemplary embodiment, connector body 118 comprises the conductive surface 132 and shell wall 128-131 that limit reception cavity 126.Shell wall 128-131 gives prominence to from conductive surface 132 along cooperation axis 191.Conductive surface 132 define from the degree of depth of the reception cavity 126 of the edge metering of shell wall 128-131 be Di.As shown in the figure, reception cavity 126 not only along coordinating the direction of axis 191 to open wide towards engagement side 112, also along the direction of transversal line 192,193 towards the external open of electric connector 102.More specifically, can have opening 138-141 between shell wall 128-131, this opening to provide from outside to reception cavity 126 access.In certain embodiments, the feature complementary of the one or more and electric connector 104 of opening 138-141, slides through opening 138-141 to make these features.
In the exemplary embodiment, electric terminal 122 is formed from conductive surface 132 along the contact stud coordinating axis outstanding.Electric terminal 122 also can form the receptacle contacts with respective contact chamber 134, and this contact chamber is configured to the electric terminal receiving electric connector 104.Electric terminal 122 is from conductive surface 132 extended height H.Height H can equal degree of depth D1 substantially.As shown in the figure, electric terminal 122 has relative to each other substantially equal height H.In alternate embodiments, height H can be different.
Fig. 3 shows the layout be positioned at according to the electric terminal 122 on the conductive surface 132 (Fig. 2) of exemplary embodiment.As shown in the figure, electric terminal 122 is spatially separated from each other, and is positioned at array along conductive surface 132.In the illustrated embodiment, electric terminal 122 is arranged to the row and column in array.But array does not require to have linear row or column.But electric terminal 122 can orientate desired any predetermined arrangement as.
In the illustrated embodiment, adjacent terminal 122 can be separated by gap 142 and gap 144.Gap 142 totally extends along transversal line 192 (Fig. 1), and gap 144 totally extends along transversal line 193 (Fig. 1).If between there is no other terminal, two terminals can be adjacent.Like this, adjacent terminal 122 also can by relative to transversal line 192, and the gap 143 that 193 diagonal ground extend is separated.Gap 142-144 can form the staggered receiving area 146 extended along the conductive surface 132 between electric terminal 122 jointly.
Receiving area 146 can comprise the first and second paths 148,150, and wherein each multiple gaps through separating electric terminal 122 in the first and second paths 148,150 extend.Path 148,150 can extend continuously through it and not intercept by wall or from other projections that conductive surface 132 extends.As used herein, when at least two paths to extend and when intersecting each other, receiving area is staggered along multiple corresponding terminal.Such as, receiving area 146 comprises the first path 148 extending through gap 142,143 along corresponding terminal 122, and comprises the second path 150 extending through gap 144,143 along corresponding terminal 122.The each of first and second paths 148,150 extends along a series of terminal 122.
In the exemplary embodiment, the first path 148 is parallel to transversal line 193 and extends, and the second path 150 is parallel to transversal line 192 extends, and path 148,150 is intersected each other in vertical manner.Equally in the exemplary embodiment, receiving area 146 can comprise multiple first path 148 and multiple second path 150 that intersect each other.In the embodiment shown in fig. 3, path 148,150 is linear and perpendicular to one another substantially.But in the path substituted, path 148,150 can be nonlinear and/or can non-ly extend perpendicular to each other.
As the following more detailed description, the solid dot 184 shown in Fig. 3 and hollow dots 186 represent the contact point that ground connection matrix 106 engages with electric connector 102,104 (Fig. 1) respectively.
Get back to Fig. 2, in certain embodiments, ground connection matrix 106 can be positioned in reception cavity 126 along conductive surface 132.As shown in the figure, ground connection matrix 106 can have main body or the framework 136 of plane substantially, the connecting rod 154,155 that the main body of plane or framework 136 comprise grounding contact 152 and interconnect with hatch manner and grounding contact 152.Grounding contact 152 and connecting rod 154,155 can form terminal openings 156.When ground connection matrix 106 is positioned in receiving area 146, grounding contact 152 and connecting rod 154 can be positioned within least some in gap 142-144 (Fig. 3) and path 148,150 (Fig. 3).Electric terminal 122 can enter in terminal openings 156.
In the exemplary embodiment, ground connection matrix 106 is formed by sheet layer punching press.Ground connection matrix 106 can all conduct electricity.But in other embodiments, ground connection matrix 106 can be formed by alternate manner.Such as, in an alternative embodiment, ground connection matrix can comprise the organizer of the grounding contact keeping discrete.Organizer can comprise connecting rod.
As shown in the figure, ground connection matrix 106 can comprise the edge member 160 along the periphery of ground connection matrix 106.In one embodiment, edge member 160 can be tab outwardly as shown in Figure 2.Shell wall 128-131 can comprise the inside groove or ditch 158 that are configured to receive edge member 160.When ground connection matrix 106 is placed within receiving area 146, edge member 160 and groove 158 frictional engagement.In certain embodiments, ground connection matrix 106 can be couple to electric connector 102 to make ground connection matrix 106 removable relative to connector body 118 by floating ground.Such as, ground connection matrix 106 at least can float along cooperation axis 191 towards with away from conductive surface 132.
Fig. 4 is the enlarged partial perspective view of ground connection matrix 106, and it illustrates in greater detail grounding contact 152 and connecting rod 154,155.Connecting rod comprises inner link 154, tail end connecting rod 155A and side connecting rod 155B.This end and side connecting rod 155A, 155B limit the girth of ground connection matrix 106.As shown in the figure, inner link 154 links adjacent grounding contact 152A and 152B.Therefore, the feature of inner link 154 can be connecting rod between contact.Inner link 154 has the link body 162 with the edge 164 becoming certain profile.The size and dimension of link body 162 is suitable for being positioned within the corresponding gap 144 (Fig. 3) between adjacent terminal 122 (Fig. 1).The outer surface that edge 164 can be configured as along corresponding terminal 122 extends.In certain embodiments, inner link 154 can prevent the movement of ground connection matrix 106 on the direction along the plane limited by transversal line 192,193 (Fig. 1).In certain embodiments, inner link 154 also can be used for the screening ability improving connector assembly 100 (Fig. 1).
As shown in Figure 4, tail end connecting rod 155A links adjacent grounding contact 152C and 152D.Side connecting rod 155B also can comprise by its outward extending edge member 160.In the exemplary embodiment, end and side connecting rod 155A, 155B are around grounding contact 152.Tail end connecting rod 155A also can have the edge 166 being configured to the certain profile of one-tenth extended along the outer surface of corresponding terminal 122.
Fig. 5 is the independent view of the exemplary embodiment of grounding contact 152.Alternatively, grounding contact described herein can comprise one or more away from or the sweep that extends towards conductive surface 132 (Fig. 2).Such as, the grounding contact 152 shown in Fig. 5 has the first and second sweeps 170,172, and links the contact base 175 of sweep 170,172.Contact base 175 can be positioned within contact plane P and to extend along contact plane P.Contact plane P can be parallel to the plane limited by transversal line 192,193 (Fig. 1) and extend.Sweep 170,172 extends at rightabout away from each other from contact base 175 to respective far-end 171,173.Sweep 170,172 also can extend away from contact plane P.In the illustrated embodiment, sweep 170,172 curves inwardly or curling on the equidirectional away from contact plane P.Like this, grounding contact 152 can be C shape or cup-shaped substantially.
But in other embodiments, sweep 170,172 can have different shapes.Such as, grounding contact 152 can have overall V-type or grounding contact 152 can not bend and extend in a linear fashion.One of sweep can extend away from a direction of contact plane P, and another sweep can extend on the rightabout away from contact plane P.And in alternate embodiments, ground connection matrix 106 can not comprise sweep 170,172.In such embodiments, ground connection matrix 106 only can comprise connecting rod, such as inner link 154 and end and side connecting rod 155A, 155B.
Get back to Fig. 4, grounding contact 152 can have feature different from each other or characteristic.Such as, ground connection matrix 106 can comprise different grounding contact 152A-D.Grounding contact 152A comprises sweep 170A, 172A, and sweep 170A, 172A extend towards conductive surface 132 when ground connection matrix 106 is correctly positioned.Grounding contact 152B comprises sweep 170B, 172B, and sweep 170B, 172B extend away from conductive surface 132.Each of grounding contact 152C and 152D comprises single sweep 174,176 respectively.Sweep 174,176 extends towards with away from conductive surface 132 respectively.
Fig. 6 is the end view of the electric connector 102 with the ground connection matrix 106 being positioned at staggered receiving area 146, and Fig. 7 is the enlarged perspective illustrating in greater detail ground connection matrix 106 and conductive surface 132.As shown in Figure 6, connector body 118 has the passage 180,182 extended through connector body 118 for a pair.Passage 180,182 can be limited between conductive surface 132 and shell wall 128-131.Passage 180,182 are configured to receive corresponding edge member 160 when ground connection matrix 106 is positioned within receiving area 146.Insert period in receiving area 146 at ground connection matrix 106, edge member 160 partly can be deflected by shell wall 128-131.Edge member 160 after emptying shell wall 128-131, can bounce back into the position of non-deflection at admission passage 180,182.
According to Fig. 6 and 7, grounding contact 152A (Fig. 7), 152C (Fig. 6) engage with conductive surface 132, and grounding contact 152B (Fig. 7), 152D (Fig. 6) extend away from conductive surface 132.Multiple grounding contact 152 can be positioned at contiguous one or more electric terminal 122, and multiple grounding contact 152 can between two terminals 122.During compounding practice, grounding contact 152A, 152C are configured to engage with conductive surface 132 at first, and grounding contact 152B, 152D are configured to engage with the corresponding conductive surface (not shown) of matching connector 104 (Fig. 1) at first.Therefore, ground connection matrix 106 engages with each conductive surface thus sets up between connector body 118,120 (Fig. 1) and is electrically connected.
In the exemplary embodiment, ground connection matrix 106 engages with connector body 120 with multiple contact points 184 (the being expressed as solid dot in figure 3) place that the conductive surface (not shown) of electric connector 104 (Fig. 1) contacts at sweep 170B, 172B (Fig. 7).Ground connection matrix 106 also engages with connector body 118 with multiple contact points 186 (the being expressed as hollow dots in figure 3) place that conductive surface 132 contacts at sweep 170A, 172A (Fig. 7).In certain embodiments, grounding contact 152A and 152B replaces in an array, to make each grounding contact 152A for engaging with conductive surface 132, adjacent grounding contact 152B engages with the conductive surface (not shown) of electric connector 104, for each grounding contact 152B engaged with the conductive surface of electric connector 104, adjacent grounding contact 152A engages with conductive surface 132.
Inner link 154, tail end connecting rod 155A, side connecting rod 155B and grounding contact 152 are the parts of the sheet material that same punching press is formed.But in the alternative embodiment, grounding contact 152 can be coupled to each other indirectly through such as organizer or interpolater.Such as, organizer can comprise the hole having and be configured to receive one or more grounding contact 152 and the flat dielectric body being configured to the opening receiving electric terminal 122.In other embodiments, grounding contact 152 can be completely independent from one another, is positioned at discretely in receiving area 146 to make each grounding contact 152.
Fig. 8 shows the communication system 300 comprising the circuit board assemblies 302 and circuit board assemblies 304 being configured to be engaged with each other during compounding practice.Communication system 300 is directed relative to mutually perpendicular axis 391-393, and axis 391-393 comprises and coordinates axis 391 and axis of pitch 392,393.As shown in the figure, circuit board assemblies 302 comprises electric connector 306 (hereinafter referred to as socket connector 306), circuit board 308 and ground connection matrix 310.Circuit board 308 comprises leading edge 312 and the first and second contrary sides 314,315.Hereinafter the first side 314 is called engagement side 314.Socket connector 306 is installed to engagement side 314 along leading edge 312.
Still as shown in the figure, circuit board assemblies 304 comprises pin connector 316, circuit board 318 and ground connection matrix 320.Circuit board 318 has the first and second contrary sides 322,323.Hereinafter the first side 322 is called engagement side 322.Although not shown in Fig. 8, circuit board assemblies 304 is also included in the ground connection matrix 321 (illustrating in fig. 14) between pin connector 316 and circuit board 318.
Ground connection matrix 310 is located along the mounting interface 327 between circuit board 308 and socket connector 306.Similarly, ground connection matrix 321 is located along the mounting interface 326 between circuit board 318 and pin connector 316.When socket connector 306 and pin connector 316 engage, ground connection matrix 320 can along the mating interface (not shown) location between socket connector 306 and pin connector 316.
As illustrated by this paper, ground connection matrix 310,320 and 321 is configured to set up multiple contact point along the interface of correspondence between the two elements, thus maintain ground connection or return path during operation.Such as, ground connection matrix 310 is configured to provide the multiple contact points along mounting interface 327.Be similar to ground connection matrix 106 (Fig. 1), ground connection matrix 320 is configured to along the interface between socket connector 306 and pin connector 316 to provide multiple contact point.Ground connection matrix 310,320 and 321 can improve the electrical property (such as improving the communication of digital signal) between the component of correspondence.
Pin connector 316 has the cooperation side 324 comprising the electric terminal 325 arranged along it.Each electric terminal 325 comprises the contact housing 328 of the electrical contact (not shown) around a pair correspondence.Socket connector 306 also has the cooperation side 330 comprising jack chamber (not shown), and each jack chamber is included in a pair electrical contact (not shown) wherein.During compounding practice, advance towards the cooperation side 324 of pin connector 316 in the cooperation side 330 of socket connector 306.Electric terminal 325 is received by the jack chamber of the correspondence of socket connector 306 and to proceed in jack chamber until the contact in the contact of electric terminal and jack chamber is engaged with each other.During compounding practice, ground connection matrix 320 can be compressed by socket connector 306 and pin connector 316 and thus set up grounding path between it.
Communication system 300 can use in various applications.By way of example, communication system 300 can be used in telecommunications and computer application, router, server, supercomputer and uninterrupted electric power supply (UPS) system.In such embodiments, circuit board assemblies 302 can be described to daughter card components and circuit board assemblies 304 can be described to back panel connector assembly.Socket connector 306 and pin connector 316 can be the electric connectors being similar to STRADA Whisper or the Z-PACK TinMan product line developed by TE Connectivity.In certain embodiments, socket connector 306 and pin connector 316 can under the high speed of such as 10Gbps, 20Gpbs or higher transmission of digital signals.Although communication system 300 is depicted as back board system, embodiment is not limited to such system and can be used in the communication system of other type.Like this, socket connector 306 and pin connector 316 more generally can be called electric connector.
Fig. 9 shows the independent perspective view of ground connection matrix 310 and the magnified partial view of ground connection matrix 310.Although ensuing specification carries out with reference to ground connection matrix 310, ground connection matrix 320 (Fig. 8) and ground connection matrix 321 (Figure 14) can have similar with ground connection matrix 310 or identical feature.Ground connection matrix 310 can be similar to ground connection matrix 106 (Fig. 1).Such as, as shown in Figure 9, ground connection matrix 310 can have and comprises grounding contact 340-343 and with the main body for basic plane of the connecting rod 346,348 of web form interconnection grounding contact 340-343 or framework 336.Grounding contact 340-343 and connecting rod 346,348 form opening 350.
Ground connection matrix 310 is formed by electric conducting material.The non-limiting example that can be used to form the material of ground connection matrix 310 comprises metal, conductive elastomer, the elastomer being coated with electric conducting material, conductive strips etc.In the illustrated embodiment, ground connection matrix 310 is formed by sheet metal punching press and all conducts electricity.But ground connection matrix 310 can be formed by different way in other embodiments.Such as, in an alternative embodiment, ground connection matrix can comprise organizer, and organizer comprises the dielectric frame keeping grounding contact.In some cases, at least some in these grounding contacts can with the electric isolution of other grounding contact.
As shown in the figure, ground connection matrix 310 can comprise the attachment features 352 along the periphery of ground connection matrix 310.In certain embodiments, attachment features 352 can be protuberance or the tab of the direction extension being orthogonal to the plane limited by ground connection matrix 310.Such as, the part of framework 336, grounding contact 340-343 and connecting rod 346,348 can coincide in the ground plane of the cooperation be parallel in Fig. 9 and axis of pitch 391,393.Attachment features 352 can extend on the direction being parallel to axis of pitch 392.Attachment features 352 is configured to directly engage and couple that ground connection matrix 310 is fixed to socket connector 306 with socket connector 306 (Fig. 8).
In certain embodiments, ground connection matrix 310 can be couple to socket connector 306 and is allowed to move relative to socket connector 306 in limited space to make ground connection matrix 310 by floating ground.In other embodiments, ground connection matrix 310 can directly engage with circuit board 308 (Fig. 8) and couple or alternately not couple with circuit board 308 or socket connector 306.
The amplifier section of Fig. 9 illustrates in greater detail grounding contact 340-343 and connecting rod 346,348.Connecting rod 346 is configured to grounding contact 340,342 to be directly connected to each other.Such as, connecting rod 346 links adjacent grounding contact 340,342 in fig .9.Connecting rod 348 extends along the girth of ground connection matrix 310 and links the adjacent grounding contact of such as grounding contact 341,343.
Be similar to grounding contact 152 (Fig. 2), grounding contact described herein can comprise the one or more sweeps outside the ground plane that extends to and limited by ground connection matrix 310.Such as, grounding contact 342 has the first and second sweeps 354,356 and links the contact base 358 of sweep 354,356.Sweep 354,356 extends to the respective far-end 355,357 of side one segment distance be arranged on away from ground plane at rightabout away from each other from contact base 358.Grounding contact 340 also has sweep 354,356.But the sweep 354,356 of grounding contact 340 extends from ground plane with direction contrary compared with the sweep 354,356 of grounding contact 342.
In the illustrated embodiment, sweep 354,356 can have bending or curling profile and extending away from the equidirectional of ground plane to make the sweep 354,356 of single grounding contact.Like this, grounding contact 340,342 can be basic C shape.As shown in Figure 9 same, grounding contact 341,343 only can have the single sweep 361 similar with sweep 354,356 shape.The sweep 361 of grounding contact 341,343 can extend on the direction roughly contrary with ground plane.
In certain embodiments, contact base 358 and comprise base jut 359.Base jut 359 shape is similar to the button in Fig. 9, but can have other shape in the alternative embodiment.Base jut 359 with just extending from ground plane in the opposite direction of extending with sweep 354,356, and is configured to engageable electrical parts in operation.Such as, if sweep 354,356 extends towards socket connector 306 (Fig. 8), base jut 359 can extend towards circuit board 308 (Fig. 8) and directly engage with it.If sweep 354,356 extends towards circuit board 308, base jut 359 can extend towards socket connector 306 and directly engage with it.
Figure 10 comprises the face upwarding view of the part (particularly socket connector 306) of circuit board assemblies 302.Socket connector 306 comprises the connector body 360 having installation side 362 and coordinate side 330.The installation side 362 ground connection matrix 310 be configured by between itself and circuit board 308 is installed to circuit board 308 (Fig. 8).Connector body 360 can be constructed by dielectric and electric conducting material.Such as, connector body 360 comprises conduction (the such as metallizing) housing 370 formed by multiple module housing 372 and casing shielding part 374.In the illustrated embodiment, conductive shell 370 comprises three module housings 372, and it is stacked side by side and is positioned between pair of shells shielding part 374.Each in module housing 372 and casing shielding part 374 can comprise the electric conducting material for making circuit board assemblies 302 ground connection.Such as, casing shielding part 374 can be formed by sheet metal punching press and module housing 372 can comprise metallized outer surface.
The amplifier section of installation side 362 also illustrates in Fig. 10.Socket connector 306 comprises the signal conductor 366 kept by connector body 360.As shown in the figure, signal conductor 366 has from the outstanding signal contact (or contact tail) 368 of installation side 362.Signal contact 368 is configured to mechanically and the perforation (not shown) of the plating of bonded circuitry plate 308 (Fig. 8) electrically.
As shown in the figure, signal contact 368 extends through the opening 350 of ground connection matrix 310.Such as, signal contact 368 forms signal to 376A-376C.Each signal extends through one in opening 350 to 376A-376C.Like this, adjacent signal is separated from one another and electric screen to the part being grounded matrix 310.Such as, adjacent signal is separated from one another by connecting rod 346 to 376A and 376B, and adjacent signal group 376B and 376C to be grounded contact 341 and 342 separated from one another.
Equally as shown in Figure 10, attachment features 352 is extensible enters the characteristic of correspondence chamber of connector body 360 or the opening 378 of connector body 360 and direct joining connector main body 360.In a particular embodiment, attachment features 352 is formed and the interference fit on the surface of the connector body 360 limiting feature cavity 378 or frictional engagement.Like this, framework 336 can be maintained at and separate spacing X apart from installation side 362
jassigned address.In other embodiments, attachment features 352 can grasp the outside of connector body 360.In various embodiments, the surface of the connector body 360 of direct bond attachments feature 352 can be conduction, is formed to make grounding path pass attachment features 352.
In the illustrated embodiment, attachment features 352 is stamped and is formed with framework 336 and grounding contact.But in other embodiments, attachment features 352 can be the discrete element of interconnect frame 336 and connector body 360.Such as, attachment features 352 can be discrete securing member (such as clip, latch or other hardware), and the framework 336 of ground connection matrix 310 is attached to connector body 360 by this discrete securing member.
In certain embodiments, ground connection matrix 310 can be allowed to float relative to installation side 362.Such as, ground connection matrix 310 can be allowed to float to installation side 362 and float and/or laterally floating from installation side 362, is parallel to installation side 362 moves to make framework 336.For this reason, attachment features 352 can relative to feature cavity 378 selected size and shape, mobile to make attachment features 352 to be allowed in feature cavity 378.
Figure 11 is the birds-eye perspective of circuit board assemblies 302 before socket connector 306 is installed to circuit board 308.As shown in the figure, ground connection matrix 310 is arranged along installation side 362.Circuit board 308 comprises the plate substrate 380 with engagement side 314 and opposition side 315.Plate substrate 380 has the thickness T measured perpendicular to side 314,315
1.
Figure 12 illustrates the amplifier section of the circuit board 308 simply illustrated in the frame of Figure 11.As shown in the figure, circuit board 308 comprises the signal via 382 exposed along engagement side 314.Signal via 382 can be arranged to form multiple signal to 384.Circuit board 308 also comprises the ground connection via hole 390 along engagement side 314.Just as described below, in certain embodiments, ground connection via hole 390 is located with by signal via 382 electric screen each other relative to signal via 382.In the embodiment being configured to differential signal transmission, ground connection via hole 390 relative to signal to 384 location, with by signal via 384 electric screen each other.
Circuit board 308 comprises conductive layer 388 and is optionally positioned at the mask layer 386 on the top of conductive layer 388.As shown in the figure, signal via 382 and conductive layer 388 electric isolution.Such as, the part of conductive layer 388 can be removed (such as etching) to make conductive layer 388 be free of attachment to signal via 382.Conductive layer 388 can at least some in electrically connect ground connection via hole 390.In addition, mask layer 386 can be patterned to make the part of conductive layer 388 expose along engagement side 314 and can engage grounding contact 340,342 and the grounding contact 341,343 (Fig. 9) of ground connection matrix 310 (Fig. 9).The part exposed can be called as contact area 394 and can be selected size and dimension relative to the corresponding grounding contact in Bonding contact region 394.
Figure 13 is the side cut away view of the socket connector 306 being installed to circuit board 308.In a particular embodiment, signal via 382 is perforation (PTH) of plating, and ground connection via hole 390 is microchannels.Microchannel can be blind vias and its diameter is less than the diameter of signal via 382 usually.Such as, the diameter of microchannel can be less than 0.4mm.Microchannel can be manufactured by different process, and such as those can be used for the technique manufacturing blind vias.Such as, microchannel can be manufactured in one or more dielectric layer by machine drilling or laser drill (such as using UV or CO2 laser to provide the boring through dielectric layer).Microchannel can also be photosensitive restriction or etching (such as chemistry (wet method) etching or plasma etching) blind vias.Microchannel once be formed, dielectric layer and then be there is other dielectric layer lamination of (maybe will have) microchannel.In this fashion, the microchannel from different dielectric layer can be stacked to make microchannel substantially be end to end and form row effectively.US number of patent application 13/493632 (" ' 632 application " ") describe the circuit board with the ground connection row that can comprise microchannel.Such circuit board can comprise conductive layer 388 described herein and mask layer 386.The full content of ' 632 applications is incorporated herein by reference.
As shown in figure 13, ground connection matrix 310 extends along the mounting interface 327 be limited between socket connector 306 and circuit board 308.The sweep 354 of grounding contact 342 extends towards the installation side 362 of socket connector 306.Such grounding contact 342 can be described to the contact extended inwardly.The sweep 354 of grounding contact 340 extends away from the engagement side 314 of installation side 362 towards circuit board 308.Such grounding contact 340 can be described to the contact extended outwardly.
Signal contact 368 forms the array 369 comprising gap 398, and gap 398 can be similar to gap 142-144 (Fig. 3).As shown in the figure, each gap 398 extends between adjacent signal contact 368.Before fitting operation or period, socket connector 306 can be coupled to ground connection matrix 310.Signal contact 368 can pass opening 350 forward, and grounding contact 340,342 can be positioned in corresponding gap 398.
Figure 13 shows the profile of in module housing 372.As shown in the figure, module housing 372 comprises conducting host materials 402 and dielectric spine 404.Material of main part 402 limits passage 406, and its dielectric spine extends through this passage.Such as, dielectric spine 404 can extend to close to cooperation side 330 (Fig. 8) continuously from installation side 362.One in each inhibit signal conductor 366 in dielectric spine 404.Dielectric spine 404 is applied to signal conductor 366 by such as crossing mold technique.When socket connector 306 is installed to circuit board 308, the contact area 394 of the direct engaged conductive layer 388 of grounding contact 340, and grounding contact 342 directly engagement body material 402.As shown in the figure, contact area 394 width W 1 can with the width W 2 being greater than grounding contact 340 is to guarantee that grounding contact 340 is by engaged conductive layer 388 when not on mask layer 386.
When socket connector 306 is installed to circuit board 308, grounding contact 340,342 is relative to installation side 362 or engagement side 314 elastic bending.When grounding contact 340,342 directly engages engagement side 314 and installation side 362 respectively, ground connection matrix 310 sets up at least one grounding path through the ground connection matrix 310 between socket connector 306 and circuit board 308.Grounding path also can be formed through the conducting host materials 402 of socket connector 306 and the ground connection via hole 390 of circuit board 308.
As shown in Figure 13, signal contact 368 directly engages signal via 382.More particularly, the inner surface of signal contact 368 frictional engagement signal via 382.Jointly, these frictional engagement provide retain strength.In certain embodiments, retain strength is greater than the separating force applied by grounding contact 340,342.In other embodiments, the extra element of such as securing member can be used to socket connector 306 to be attached to circuit board 308.
During fitting operation, signal contact 368 inserts the signal via 382 of the correspondence of circuit board 308.When signal contact 368 proceeds in signal via 382, grounding contact 340,342 is extruded, and moves towards installation side 362 to make sweep 354 and sweep 356 (not shown).The resilient property of sweep 354,356 allows sweep 354,356 to bend independently relative to installation side 362.In other words, each sweep 354,356 can deflect more or less relative to other sweep 354,356.Like this, the operation that the multiple contact point between ground connection matrix 310 and engagement side 314 and the multiple contact points between ground connection matrix 310 and installation side 362 can run through circuit board assemblies 302 is formed and keeps.
Figure 14 comprises the face upwarding view of the part (particularly pin connector 316 and ground connection matrix 321) of circuit board assemblies 304.Pin connector 316 comprises the connector body 410 having installation side 412 and coordinate side 324.Installation side 412 and cooperation face, side 324 are in the opposite direction.The pair of shells wall 418,420 that the direction that connector body 410 comprises being parallel to electric terminal 325 is given prominence to from cooperation side 324.Shell wall 418,420 limits the connector receiving area 422 between it.Connector receiving area 422 size and dimension is suitable for the cooperation side 330 (Fig. 8) of receiver socket connector 306 (Fig. 8).Electric terminal 325 is arranged in connector receiving area 422.
As shown in the amplifier section of Figure 14, pin connector 316 also comprises the signal conductor 414 kept by connector body 410.Extend through connector body 410 to signal conductor 414 substantial linear and comprise from the outstanding signal contact (or contact tail) 416 of installation side 412.Signal contact 416 is configured to mechanically and electrically engage with the plated through holes (not shown) of circuit board 318 (Fig. 8).
Signal contact 416 and ground connection matrix 321 can have the similar structure of structure as signal contact 368 (Figure 10) and ground connection matrix 310 (Fig. 8).Such as, as shown in the amplifier section of Figure 14, signal contact 416 forms signal to 424A-424C and each signal extends through the corresponding opening 426 of ground connection matrix 321 to 424A-424C.
Adjacent signals is to and electric screen separated from one another by the part of ground connection matrix 321.More specifically, adjacent signals is separated from one another by connecting rod 428 to 424A and 424B, and adjacent signals is grounded contact 430,432 separated from one another to 424B and 424C.
Ground connection matrix 321 also comprises attachment features 434.Be similar to attachment features 352 (Fig. 9), attachment features 434 can be the protuberance or the tab that are configured to direct joining connector main body 410.Attachment features 434 extensible enter the characteristic of correspondence chamber of connector body 410 or opening 436 direct joining connector main body 410.In a particular embodiment, attachment features 434 forms interference fit with the surface of the connector body 410 limiting feature cavity 436.Like this, the framework 438 of ground connection matrix 321 can remain on the position of specifying in the space of distance installation side 412 spacing X2.Be similar to ground connection matrix 310, ground connection matrix 321 can be allowed to float relative to installation side 412.Such as, ground connection matrix 321 can be allowed to float to installation example 412 and float and/or laterally floating from installation side 412, is parallel to installation side 412 moves to make framework 438.
Although not shown, pin connector 316 similar fashion as described about socket connector 306 (Fig. 8) and circuit board 308 (Fig. 8) can be installed to circuit board 318.When mounted, the grounding contact (such as grounding contact 430,432) of ground connection matrix 321 can the directly engagement side 322 (Fig. 8) of bonded circuitry plate 318 and the installation side 412 of pin connector 316.Like this, the operation that the multiple contact point between ground connection matrix 321 and joint example 322 and the multiple contact points between ground connection matrix 321 and installation side 412 can run through circuit board assemblies 304 (Fig. 8) is formed and keeps.Except ground connection matrix 321, to be similar to as above about the mode described in circuit board assemblies 302 (Fig. 8), grounding path is formed by the conducting host materials (not shown) of connector body 410 and the ground connection via hole (not shown) of circuit board 318.
Figure 15 is the plan view of circuit board 308 and illustrates in greater detail a layout of signal via 382, ground connection via hole 390 and contact area 394.It should be noted that circuit board 318 (Fig. 8) can be similar or be equal to circuit board 308.Signal via 382 is arranged to and forms multiple signal to 384.In the illustrated embodiment, signal is arranged to the structure of row and column to 384, although also can use other structure.As shown in the figure, conductive layer 388 (it is shade in fig .15) links ground connection via hole 390 in mask layer 386 bottom rail across engagement side 314.
The contact area 394 of conductive layer 388 exposes along engagement side 314.In fig .15, contact area 394 forms elongate band 442, and wherein each elongate band 442 links multiple ground connection via hole 390.Elongate band 442 can extend continuously along of engagement side 314 dimension.In the exemplary embodiment, conductive layer 388, at mask layer 386 downward-extension, is a part for single layer to make each elongate band 442.Alternatively, conductive layer 388 can such as be etched, and is the part of the separate structure along engagement side 314 to make elongate band 442.
When socket connector 306 (Fig. 8) as described herein is installed to circuit board 308, contact area 394 size and dimension is suitable for being grounded contact 340-343 (Fig. 9) and directly engages.Such as, contact point 444 illustrates along contact area 394 in fig .15.The region in the far-end 355,357 (Fig. 9) that contact point 444 represents grounding contact 340-343 directly Bonding contact region 394.Due to the tolerance in the manufacture of the various parts of socket connector 306 and ground connection matrix 310 (Fig. 9), the size and dimension of contact area 394 can allow some dislocation between far-end 355,357 and conductive layer 388.And during fitting operation, the size and dimension of contact area 394 can allow the far-end 355,357 of grounding contact 340-343 to slide (being also referred to as " wiping ") along conductive layer 388.
In certain embodiments, ground connection via hole 390 by locate to be formed around correspondence signal to 384 mask array 440.The representative girth of mask array 440A and 440B by extend and the dotted line connected represents between the corresponding ground connection via hole 390 of the mask array 440A of correspondence, 440B.Mask array 440 can be similar to the mask array described in ' 632 applications, and its full content is incorporated to herein by reference.
Mask array 440 is configured to reduce the interference stood 384 by signal.By way of example, signal is adjacent signal pair to 384A and 384B.Mask array 440A, 440B are respectively around signal group 384A, 384B.In the illustrated embodiment, each of mask array 384A and 384B comprises eight ground connection via holes 390.But the replacing structure of mask array can comprise less or more ground connection via hole.In a particular embodiment, mask array 440A, 440B can share shared grounding via hole 390 '.Such as, mask array 440A, 440B share two shared grounding via holes 390 '.In other embodiments, mask array 341-343 can not share shared grounding via hole.
Claims (10)
1. an electric connector (306), comprise connector body (360), the array (369) of signal contact (368) that this connector body has installation side (362) and arranges along this installation side, the array of this signal contact has the gap (398) between the adjacent signal contact being formed in this array, and the feature of described electric connector is:
Along the ground connection matrix (310) that described installation side extends, this ground connection matrix comprises with hatch manner interconnection with the multiple grounding contacts (340,341,342,343) limiting multiple opening (350), the signal contact of wherein said electric connector extends through described opening, described grounding contact is conductively coupled to described electric connector, and described ground connection matrix comprises attachment features (352), this attachment features directly engages and is couple to described electric connector described ground connection matrix to be remained on the assigned address along described installation side.
2. electric connector according to claim 1, comprise signal conductor (366) further, described signal conductor comprises described signal contact (368), when described ground connection matrix (310) is compressed between described electric connector and electric parts, described grounding contact (340-343) electric property coupling is to the one or more grounding paths extending through described electric connector.
3. electric connector according to claim 1, wherein said grounding contact (340-343) comprises the contact that extends internally (342) extended towards described installation side (362).
4. electric connector according to claim 1, wherein said grounding contact (340-343) comprises the contact that stretches out (340) extended away from described installation side (362).
5. electric connector according to claim 4, the wherein said contact that stretches out (340) comprises sweep (354,356), when the described contact that stretches out engages electric parts, described sweep is configured to towards described installation side (362) elastic bending.
6. a circuit board assemblies (302), comprise electric connector (306), this electric connector comprises connector body (360), the array (369) of signal contact (368) that this connector body has installation side (362) and arranges along this installation side, the array of described signal contact has the gap (398) between the adjacent signal contact being formed in described array, circuit board (308) has engagement side (314), described circuit board comprises signal via (382) and ground connection via hole (390), the feature of described circuit board assemblies is:
Be arranged on the ground connection matrix (310) between described engagement side and described installation side, described ground connection matrix comprises with hatch manner interconnection with the multiple grounding contacts (340,341,342,343) limiting multiple opening (350), the signal contact of wherein said electric connector extends through described opening to engage described signal via, and the ground connection via hole of described circuit board is conductively coupled to grounding path by described electric connector by described grounding contact.
7. circuit board assemblies according to claim 6, wherein said circuit board (308) comprises the conductive layer (388) exposed along described engagement side (314), this conductive layers couple is to described ground connection via hole (390), and described grounding contact (340-343) is configured to engage at least one in described conductive layer or described ground connection via hole.
8. circuit board assemblies according to claim 7, wherein said circuit board (308) comprises mask layer (386), described mask layer covers the part of described conductive layer (388), to make the contact area (394) of the exposure of this conductive layer be formed along this engagement side (314), the grounding contact (340-343) of described ground connection matrix (310) engages the contact area of described conductive layer.
9. circuit board assemblies according to claim 6, wherein said grounding contact (340-343) comprises far-end (355,357), when described electric connector (306) is installed to described circuit board (308), allows conductive layer (388) described in described distal engagement to engage and slide along it.
10. circuit board assemblies according to claim 6 (302), wherein said grounding contact (340-343) comprises sweep (354,356), when described sweep is compressed between described installation side and the described plate surface of described circuit board (308), described sweep is mobile towards the installation side (362) of described connector body (360).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/910,670 | 2013-06-05 | ||
| US13/910,670 US8888531B2 (en) | 2011-10-11 | 2013-06-05 | Electrical connector and circuit board assembly including the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104241973A true CN104241973A (en) | 2014-12-24 |
| CN104241973B CN104241973B (en) | 2018-10-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410366065.8A Expired - Fee Related CN104241973B (en) | 2013-06-05 | 2014-06-05 | Electric connector and circuit board assemblies including electric connector |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP2811589B1 (en) |
| CN (1) | CN104241973B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105990763A (en) * | 2015-02-15 | 2016-10-05 | 泰科电子(上海)有限公司 | Electric connector |
| CN108366485A (en) * | 2017-01-27 | 2018-08-03 | 泰连公司 | Printed circuit connector footmark |
| CN110088985A (en) * | 2016-10-19 | 2019-08-02 | 安费诺有限公司 | The flexible shield being electrically interconnected for ultrahigh speed high density |
| CN110212376A (en) * | 2018-02-28 | 2019-09-06 | 中航光电科技股份有限公司 | It is grounded buckle and back panel connector, connector assembly using the ground connection buckle |
| CN110212332A (en) * | 2018-02-28 | 2019-09-06 | 中航光电科技股份有限公司 | Back panel connector and its ground connection buckle and connector assembly |
| US10931062B2 (en) | 2018-11-21 | 2021-02-23 | Amphenol Corporation | High-frequency electrical connector |
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| CN105098517B (en) * | 2014-04-22 | 2019-03-12 | 泰连公司 | Mezzanine connector component |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040097112A1 (en) * | 2001-11-14 | 2004-05-20 | Minich Steven E. | Electrical connectors having contacts that may be selectively designated as either signal or ground contacts |
| CN102427178A (en) * | 2010-05-28 | 2012-04-25 | 泰科电子公司 | Ground interface for a connector system |
| CN102683945A (en) * | 2011-01-20 | 2012-09-19 | 泰科电子公司 | Electrical connector having substrate |
| CN103124030A (en) * | 2011-10-11 | 2013-05-29 | 泰科电子公司 | Electrical connector with interface grounding feature |
-
2014
- 2014-06-03 EP EP14171032.7A patent/EP2811589B1/en not_active Not-in-force
- 2014-06-05 CN CN201410366065.8A patent/CN104241973B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040097112A1 (en) * | 2001-11-14 | 2004-05-20 | Minich Steven E. | Electrical connectors having contacts that may be selectively designated as either signal or ground contacts |
| CN102427178A (en) * | 2010-05-28 | 2012-04-25 | 泰科电子公司 | Ground interface for a connector system |
| CN102683945A (en) * | 2011-01-20 | 2012-09-19 | 泰科电子公司 | Electrical connector having substrate |
| CN103124030A (en) * | 2011-10-11 | 2013-05-29 | 泰科电子公司 | Electrical connector with interface grounding feature |
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| US11522310B2 (en) | 2012-08-22 | 2022-12-06 | Amphenol Corporation | High-frequency electrical connector |
| CN105990763A (en) * | 2015-02-15 | 2016-10-05 | 泰科电子(上海)有限公司 | Electric connector |
| CN105990763B (en) * | 2015-02-15 | 2019-10-29 | 泰科电子(上海)有限公司 | Electric connector |
| CN110088985A (en) * | 2016-10-19 | 2019-08-02 | 安费诺有限公司 | The flexible shield being electrically interconnected for ultrahigh speed high density |
| US11387609B2 (en) | 2016-10-19 | 2022-07-12 | Amphenol Corporation | Compliant shield for very high speed, high density electrical interconnection |
| CN108366485A (en) * | 2017-01-27 | 2018-08-03 | 泰连公司 | Printed circuit connector footmark |
| CN110212332B (en) * | 2018-02-28 | 2022-06-17 | 中航光电科技股份有限公司 | Backplane connector and grounding buckle plate and connector assembly thereof |
| CN110212376B (en) * | 2018-02-28 | 2022-06-17 | 中航光电科技股份有限公司 | Grounding buckle plate, backboard connector using grounding buckle plate and connector assembly |
| CN110212332A (en) * | 2018-02-28 | 2019-09-06 | 中航光电科技股份有限公司 | Back panel connector and its ground connection buckle and connector assembly |
| CN110212376A (en) * | 2018-02-28 | 2019-09-06 | 中航光电科技股份有限公司 | It is grounded buckle and back panel connector, connector assembly using the ground connection buckle |
| US11444398B2 (en) | 2018-03-22 | 2022-09-13 | Amphenol Corporation | High density electrical connector |
| US10931062B2 (en) | 2018-11-21 | 2021-02-23 | Amphenol Corporation | High-frequency electrical connector |
| US11742620B2 (en) | 2018-11-21 | 2023-08-29 | Amphenol Corporation | High-frequency electrical connector |
| US11469554B2 (en) | 2020-01-27 | 2022-10-11 | Fci Usa Llc | High speed, high density direct mate orthogonal connector |
| US11469553B2 (en) | 2020-01-27 | 2022-10-11 | Fci Usa Llc | High speed connector |
| US11799246B2 (en) | 2020-01-27 | 2023-10-24 | Fci Usa Llc | High speed connector |
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Also Published As
| Publication number | Publication date |
|---|---|
| EP2811589B1 (en) | 2016-08-24 |
| CN104241973B (en) | 2018-10-12 |
| EP2811589A1 (en) | 2014-12-10 |
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