CN104241891A - Connector, electronic device and production method of electronic device - Google Patents

Connector, electronic device and production method of electronic device Download PDF

Info

Publication number
CN104241891A
CN104241891A CN201410449172.7A CN201410449172A CN104241891A CN 104241891 A CN104241891 A CN 104241891A CN 201410449172 A CN201410449172 A CN 201410449172A CN 104241891 A CN104241891 A CN 104241891A
Authority
CN
China
Prior art keywords
connector
circuit board
stitch
pad
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410449172.7A
Other languages
Chinese (zh)
Other versions
CN104241891B (en
Inventor
李光裕
庞卫文
覃敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Netcom Electronics Co Ltd
Original Assignee
Shenzhen Netcom Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Netcom Electronics Co Ltd filed Critical Shenzhen Netcom Electronics Co Ltd
Priority to CN201410449172.7A priority Critical patent/CN104241891B/en
Publication of CN104241891A publication Critical patent/CN104241891A/en
Application granted granted Critical
Publication of CN104241891B publication Critical patent/CN104241891B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The invention relates to a connector, an electronic device and a production method of the electronic device. One end of the connector is used for being connected with a circuit board. The connector comprises a shell, a rubber core arranged in the shell and connecting terminals. Each connecting terminal comprises a terminal body and a pin, wherein the terminal body is connected with the pin. The terminal bodies are located in the rubber core, and the pins are located outside the rubber core. The pins of the multiple connecting terminals are arranged in two rows, a gap is reserved between the two rows of pins, and the two rows of pins are used for being connected to the two faces of the circuit board respectively. The tail end of each pin is bent away from the other rows of pins so that the circuit board can be inserted in the gap between the two rows of pins of the connector conveniently. The pins are not prone to deformation when the pins are connected with the circuit board in an inserting mode, the amount of solder paste, pushed forward, on corresponding bonding pads printed on the circuit board in advance can be effectively reduced, and poor soldering and connection soldering are reduced. Therefore, the connector with small pin intervals and with the pins arranged in the upper row and the lower row can be mounted through the surface mount technology (SMT).

Description

Connector, electronic equipment and production method thereof
Technical field
The present invention relates to the field of electronic product, particularly relate to a kind of connector, electronic equipment and production method thereof.
Background technology
Portable media player generally arranges HDMI female on product, then could with real world devices as panel TV is connected by such as the HDMI patchcord of corresponding interface line, with playing network audio-video document.
HDMI (High Definition Multimedia Interface, HDMI (High Definition Multimedia Interface)) to have PIN (stitch) spacing little for male, stitch divides the characteristics such as two rows arrangement, therefore often adopt manual welding HDMI male on the circuit board of portable media player, thing followed problem is that manual welding efficiency is low, and due to the stitch spacing of HDMI male little, manual welding also can bring the pad on stitch and circuit board to locate inaccuracy, welding difficulty is large, be unfavorable for the problems such as repairing, thus make the portable multimedia products unstable properties containing HDMI male reliable.
Application number is the welding method that application discloses a kind of HDMI of improvement of 201310232237.8, the method comprises the following steps: A, on PCB HDMI to be welded pad in print solder paste, cross reflow ovens and carry out first time heating, solidification tin cream; B, the pin of HDMI to be inserted on described pad, and to brush scaling powder on described pin; C, by described PCB by reflow ovens carry out second time heating, the pin of described HDMI is welded on described PCB.Although said method have employed SMT (Surface Mount Technology, surface mounting technology), but openly how HDMI is not inserted into pad, and HDMI is when being inserted into pad, stitch is easily out of shape, and preprinted tin cream can be pushed away forward, the problem of failure welding can be brought.
Except HDMI male, the connector that other stitch spacing are little, stitch divides two rows to arrange, carry out in surface-pasted process at employing SMT, also connector can be run into when being inserted into pad, stitch is easily out of shape, and preprinted tin cream can be pushed away forward, the problem of failure welding can be brought.
Summary of the invention
Based on this, be necessary the connector that, stitch little for stitch spacing divides two rows to arrange, carry out in surface-pasted process at employing SMT, when being inserted into pad, stitch is easily out of shape, and preprinted tin cream can be pushed away forward, bring the problem of failure welding, a kind of connector, electronic equipment and production method thereof are provided.
A kind of connector, one end of described connector is used for being connected with circuit board, comprising:
Housing;
Glue core, is arranged in described housing; And
Splicing ear, comprises terminal body and stitch, and described terminal body is connected with described stitch; Described terminal body is positioned at described glue in-core, and described stitch is positioned at outside described glue core; Described splicing ear is multiple, and the described stitch of multiple described splicing ear divides two row's arrangements, has space between the described stitch of two rows, and the described stitch of two rows is respectively used to be connected on the two sides of described circuit board; The end of described stitch is in another arranges described stitch bending dorsad.
Wherein in an embodiment, the bending place of the end of described stitch is in folding planar or arc surfaced.
Wherein in an embodiment, the bending place of the end of described stitch is in folding planar, and the angle of the bending part of the described stitch of two rows is 30 degree to 90 degree.
Wherein in an embodiment, the material of described glue core is the material of resistance to 245 DEG C and above high temperature.
Wherein in an embodiment, described housing is provided with two pairs of fixing feet near one end of described circuit board, and often pair of described fixing feet is for clamping described circuit board; Two pairs of described fixing feet lay respectively at the both sides of the edge place of described housing.
Wherein in an embodiment, described connector is HDMI (High Definition Multimedia Interface) public connector.
A kind of electronic equipment, comprises equipment body and described connector;
Described equipment body comprises circuit board, and the relative two sides of described circuit board is respectively end face and bottom surface; Described circuit board inserts two of described connector and arranges in the space between stitch, and wherein the described stitch of a row is electrically connected with the corresponding pad on described end face, and another is arranged described stitch and is electrically connected with the corresponding pad on described bottom surface.
A production method for described electronic equipment, comprises the steps:
Print solder paste on the pad of end face being positioned at circuit board;
First time crosses reflow ovens;
Print solder paste on the pad of bottom surface being positioned at described circuit board;
By connector and described circuit board grafting, described circuit board inserts two of described connector and arranges in the space between stitch, described stitch inserts corresponding pad, and wherein the described stitch of a row is connected with the pad being positioned at described end face, and another is arranged described stitch and is connected with the pad being positioned at described bottom surface;
Second time crosses reflow ovens.
Wherein in an embodiment, before crossing the step of reflow ovens, also comprise and mount components and parts on the top surface in described first time, the described components and parts after attachment are only positioned at the step of the side of described circuit board.
Wherein in an embodiment, cross the step of reflow ovens in described second time before, be also included in the step described bottom surface mounting components and parts.
Wherein in an embodiment, in described tin cream, include scaling powder or weld-aiding cream.
Wherein in an embodiment, described on the pad of end face being positioned at circuit board print solder paste step before, be also included in be positioned at described end face pad on the step of print fluxing or weld-aiding cream;
And/or, before the step of described print solder paste on the pad of bottom surface being positioned at described circuit board, be also included in be positioned at described bottom surface pad on the step of print fluxing or weld-aiding cream.
Wherein in an embodiment, after described first time crosses the step of reflow ovens, and before the step of described print solder paste on the pad of bottom surface being positioned at circuit board, also be included in corresponding described stitch and print fluxing or weld-aiding cream on the pad being positioned at described end face, or printing includes the step of the tin cream of scaling powder or weld-aiding cream.
Wherein in an embodiment, in the step of described print solder paste on the pad of end face being arranged in circuit board, in the subregion print solder paste of the pad of the described stitch of correspondence.
Wherein in an embodiment, in the step of described print solder paste on the pad of end face being arranged in circuit board, the pad that described stitch is corresponding placed in the middle 40% to 60% region print solder paste, in the region print solder paste of 30% to 50% of the close described connector both sides of pad corresponding to the fixing feet of described connector.
Wherein in an embodiment, described connector is by guide fixture and described circuit board grafting;
Described guide fixture comprises pushing mechanism, fixture and pallet; Described pushing mechanism is fixedly connected with described fixture, and described fixture offers at least one for clamping the draw-in groove of described connector, and described pallet is used for fixing described circuit board;
Described connector is fixed on described fixture by described draw-in groove, and described circuit board is fixed on described pallet, and described pushing mechanism drives described fixture to move to described pallet, makes described connector and described circuit board grafting.
Wherein in an embodiment, described pallet is detachable, and after described connector inserts described circuit board, pallet enters subsequent production flow process along with described circuit board.
Above-mentioned connector, electronic equipment and production method thereof, by being set to by the end of stitch dorsad, another arranges described stitch bending, two row's stitch side-lookings are made to be bell-mouthed shape, be convenient to circuit board insertion connector two arrange in the space between described stitch, make described stitch with the process of circuit board grafting in not yielding, and the design of bending stitch effectively can reduce the quantity pushed away by the tin cream printed in advance on corresponding pad on circuit boards forward, thus be more convenient to welding, reduce rosin joint, connect the generation of the situations such as weldering.Therefore, the connector making, stitch little for stitch spacing divide two rows to arrange is applicable to adopting SMT to carry out surface mount, improves production efficiency, improves the qualification rate of product, saved production cost.
Accompanying drawing explanation
Fig. 1 is the front view of connector in an embodiment;
Fig. 2 is the cutaway view along A-A line in Fig. 1;
Fig. 3 is the end view of connector shown in Fig. 1;
Fig. 4 is the schematic diagram of the circuit board of electronic equipment in an embodiment;
Fig. 5 is the flow chart of the production method of electronic equipment in an embodiment;
Reflow ovens heating observed temperature curve chart in the production method that Fig. 6 is electronic equipment shown in Fig. 5;
The schematic diagram in paste solder printing region in the production method that Fig. 7 is electronic equipment shown in Fig. 5;
The schematic diagram of guide fixture in the production method that Fig. 8 is electronic equipment shown in Fig. 5;
Fig. 9 is the flow chart of the production method of electronic equipment in another embodiment.
Embodiment
For the ease of understanding the present invention, below with reference to relevant drawings, connector, electronic equipment and production method thereof are described more fully.The first-selected embodiment of connector, electronic equipment and production method thereof is given in accompanying drawing.But connector, electronic equipment and production method thereof can realize in many different forms, are not limited to embodiment described herein.On the contrary, provide the object of these embodiments be make the disclosure of connector, electronic equipment and production method thereof more comprehensively thorough.
Term as used herein " vertical ", " level ", "left", "right", " on ", D score and similar statement just for illustrative purposes, do not represent it is unique execution mode.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of the term used in the specification of connector, electronic equipment and production method thereof herein just in order to describe specific embodiment, is not intended to be restriction the present invention.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
As shown in Figure 1 to Figure 3, the connector 100 of an execution mode comprises housing 120, glue core 140 and splicing ear 160, and glue core 140 is arranged in housing 120.Connector 100 is generally connector 100 that is little for stitch 164 spacing, stitch 164 points of two rows arrangements, and in the present embodiment, connector 100 is HDMI (High Definition Multimedia Interface) public connector 100, i.e. HDMI connector.
Splicing ear 160, comprise terminal body 162 and stitch 164, terminal body 162 is connected with stitch 164.Terminal body 162 is positioned at glue core 140, and stitch 164 is positioned at outside glue core 140.Splicing ear 160 is multiple, and the stitch 164 point two row arrangement of multiple splicing ear 160, has space between two row's stitch 164, and two row's stitch 164 are respectively used to be connected on the two sides of circuit board.The end of stitch 164 is in another arranges stitch 164 bending dorsad.
Two its ends of row's stitch 164 of general connector 100 are parallel to each other, in the process of connector 100 and circuit board grafting, because the stitch 164 of connector 100 is finer and closely woven, and connector 100 and circuit board position are often uneven, thus easily cause the distortion of stitch 164 on direction up and down, if there is the situation of left and right distortion, then stitch 164 that is easy and surrounding even welds.If there is the situation of being out of shape up and down, due to the finite thickness of the tin cream on pad, be generally 0.12mm, then easily cause stitch 164 to occur with the situation of pad rosin joint.
By the end of stitch 164 being set to another row's stitch 164 bending dorsad, two row's stitch 164 side-lookings are made to be bell-mouthed shape, be convenient to circuit board insertion connector 100 two arrange in the space between stitch 164, make stitch 164 with the process of circuit board grafting in not yielding, and the design of bending stitch 164 effectively can reduce the quantity pushed away by the tin cream printed in advance on corresponding pad on circuit boards forward, thus be more convenient to welding, reduce rosin joint, connect the generation of the situations such as weldering.Therefore, make connector 100 that is little for stitch 164 spacing, stitch 164 points of two rows arrangements be applicable to adopting SMT to carry out surface mount, improve production efficiency, improve the qualification rate of product, saved production cost.
Wherein in an embodiment, the bending place of the end of stitch 164 can in folding planar or arc surfaced.In the embodiment of Fig. 2, the bending place of the end of stitch 164 is in folding planar, and in order to better realize easy grafting and the less object pushing away the amount of tin cream, the angle preferably 30 degree to 90 degree of the bending part of two row's stitch 164, in the embodiment of Fig. 2, this angle is 60 degree.
The material of glue core 140 is the material of resistance to 245 DEG C and above high temperature.In one embodiment, glue core 140 is the material of the degree of resistance to 245-260 high temperature, and this material can be LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer).By the glue core 140 adopting resistant to elevated temperatures material to manufacture connector 100, make connector 100 indeformable at glue core 140 when reflow ovens heats.
Wherein in an embodiment, housing 120 is provided with two pairs of fixing feet 122 near one end of circuit board, and often pair of fixing feet 122 is two, and often pair of fixing feet 122 for clamping circuit board, thus makes connection that connector 100 is more firm on circuit boards.Two pairs of fixing feet 122 lay respectively at the both sides of the edge place of housing 120, can improve the steadiness that connector 100 is connected with circuit board further.
The position of two row's splicing ears 160 can be crisscross arranged.In one embodiment, connector 100 is the HDMI Male head connector 100 of standard, and stitch 164 is divided into two rows, row's distribution 9 stitch 164, and the position that another row's distribution 10 stitch 164, two arrange splicing ear 160 interlocks.
The electronic equipment of one execution mode, comprises equipment body and connector as shown in Figure 1 to Figure 3 100.Equipment body comprises circuit board 200, and as shown in Figure 4, the relative two sides of circuit board 200 is respectively end face 220 and bottom surface 240.Circuit board 200 inserts two of connector 100 and arranges in the space between stitch 164, and wherein row's stitch 164 is electrically connected with the corresponding pad on end face 220, and another row's stitch 164 is electrically connected with the corresponding pad on bottom surface 240.Above-mentioned electronic equipment can be portable electric appts, such as portable media player.
As shown in Figure 5, the production method of an execution mode electronic equipment, for the manufacture of above-mentioned electronic equipment, comprises the steps:
S100, print solder paste on the pad of end face 220 being positioned at circuit board 200.In this step, print solder paste on the pad being included in connector 100 correspondence, mounts components and parts 260 if end face 220 needs, print solder paste on the pad being also included in components and parts 260 correspondence.
Wherein in an embodiment, in tin cream, include scaling powder or weld-aiding cream, so that firm being welded on corresponding pad of components and parts 260.In another embodiment, in certain tin cream, also scaling powder or weld-aiding cream be can not comprise, if do not comprise the composition helping weldering, then print solder paste and scaling powder respectively needed.Before step S100, be also included in be positioned at end face 220 pad on the step of print fluxing or weld-aiding cream.Print fluxing or weld-aiding cream before print solder paste, to avoid touching the tin cream spent and print.
S200, end face 220 mounts components and parts 260.In the present embodiment, end face 220 and bottom surface 240 can be specified when producing, and also can be specified when design circuit plate 200 by research staff.In one embodiment, the components and parts 260 after attachment are only positioned at the side of circuit board 200, and the components and parts 260 being namely welded on end face 220 can not pass circuit board 200, protrude from bottom surface 240.If certain one side of the circuit board 200 of that is printed on both sides is after having pasted components and parts 260, what have components and parts 260 has protruded from another side through circuit board 200, then this simultaneously can not as end face 220, can only as bottom surface 240, and another side is as end face 220.Because if the components and parts 260 of end face 220 protrude from bottom surface 240, then the plant equipment automatic printing tin cream passing through basis is inconvenient in bottom surface 240.In another embodiment, if certain end face 220 does not need attachment components and parts 260, step S200 can omit.
S300, first time crosses reflow ovens.Make the tin cream solidification be positioned on the pad of end face 220, the components and parts of board top surface 220 can be weldingly fixed on circuit board 200.In one embodiment, reflow ovens divides 12 warm areas, and temperature arranges and is followed successively by 210 DEG C, 210 DEG C, 195 DEG C, 180 DEG C, 180 DEG C, 185 DEG C, 200 DEG C, 220 DEG C, 245 DEG C, 250 DEG C, 265 DEG C, 245 DEG C, and transfer rate is 90 centimeters per minute.Be illustrated in figure 6 reflow ovens heating observed temperature curve chart, the maximum temperature shown in curve is 244.89 DEG C, and the maximum temperature crossing reflow ovens is general not higher than 245 DEG C.So the material of glue core 140 is that the material of resistance to 245 DEG C and above high temperature can avoid glue core 140 to be out of shape.
S400, print solder paste on the pad of bottom surface 240 being positioned at circuit board 200.In this step, print solder paste on the pad being included in connector 100 correspondence, mounts components and parts 260 if bottom surface 240 needs, print solder paste on the pad being also included in components and parts 260 correspondence.
Wherein in an embodiment, in tin cream, include scaling powder or weld-aiding cream, so that firm being welded on corresponding pad of components and parts 260.In another embodiment, in certain tin cream, also scaling powder or weld-aiding cream be can not comprise, if do not comprise the composition helping weldering, then print solder paste and scaling powder respectively needed.Before step S400, be also included in be positioned at bottom surface 240 pad on the step of print fluxing or weld-aiding cream.Print fluxing or weld-aiding cream before print solder paste, to avoid touching the tin cream spent and print.
S500, by connector 100 and circuit board 200 grafting, circuit board 200 inserts two of connector 100 and arranges in the space between stitch 164, stitch 164 inserts corresponding pad, and wherein row's stitch 164 is connected with the pad being positioned at end face 220, another row's stitch 164 is connected with the pad being positioned at bottom surface 240.
S600, bottom surface 240 mounts components and parts 260.If certainly bottom surface 240 does not need attachment components and parts 260, step S600 to omit.
S700, second time crosses reflow ovens.The tin cream solidification be positioned on the pad of bottom surface 240 can be made.In step S700, the temperature of reflow ovens is arranged can be identical with step S300, and reflow ovens heating observed temperature curve chart is see Fig. 6.
The production method of the electronic equipment of present embodiment, utilize the bending structure of the end of stitch 164, be convenient to circuit board 200 insert connector 100 two row stitch 164 between space in, make stitch 164 with the process of circuit board 200 grafting in not yielding, and the design of bending stitch 164 can effectively reduce the quantity pushed away by the tin cream be printed in advance on circuit board 200 on corresponding pad forward, thus be more convenient to welding, reduce rosin joint, connect the generation of the situations such as weldering.Therefore, make connector 100 that is little for stitch 164 spacing, stitch 164 points of two rows arrangements be applicable to adopting SMT to carry out surface mount, improve production efficiency, improve the qualification rate of product, saved production cost.
Wherein in an embodiment, in the step s 100, can only in the subregion print solder paste of the pad of corresponding stitch 164.After end face 220 print solder paste, after step S300 first time crosses reflow ovens, tin cream can draw close projection to the centre of pad, thus affect connector 100 and insert pad place corresponding on circuit board 200, by reduce tin cream on end face 220 stitch 164 corresponding pad number to be printed and in the suitable subregion print solder paste of pad, can effectively solve because tin cream draws close the problem that projection causes stitch 164 difficulty of connector 100 to be inserted in the middle of pad.In one embodiment, the pad of the end face 220 of fixing feet 122 correspondence of connector 100 also can only in subregion print solder paste.
Concrete, as shown in Figure 7, can in the pad 222 of stitch 164 correspondence of the connector 100 of end face 220 roughly 50% region print solder paste placed in the middle, the region of print solder paste can be 40% to 60%.In region, close connector 100 both sides roughly 40% print solder paste of the pad 222 of fixing feet 122 correspondence of connector 100, the region of print solder paste can be 30% to 50%.Fig. 7 bend filling part is the region of print solder paste.In order to realize such scheme, generally need again to make steel mesh, namely the steel mesh perforate of the pad 222 of stitch 164 correspondence of circuit board 200 end face 220 connector 100 is for leave 50% region between two parties, and the steel mesh perforate of the corresponding pad 222 of fixing feet 122 is in steel mesh perforate 40% region, the left and right sides.The normal standard-sized sheet of size of pad 222 is pressed in the stitch 164 of the connector 100 of circuit board 200 bottom surface 240 and the pad 222 steel mesh perforate of fixing feet 122 correspondence.Steel mesh is the template of SMT, is a kind of SMT particular manufacturing craft, and its major function is matched with the pre-slotting on steel mesh or hole by the scraper on stencil printer, by the accurate location of the paste solder printing of accurate quantity on null circuit plate 200.
Simultaneously see Fig. 8, wherein in an embodiment, in step S500, connector 100 is by guide fixture 300 and circuit board 200 grafting.By guide fixture 300, stitch 164 is inserted to pad place corresponding on circuit board 200, relative man-made assembly grafting, effectively can improve packaging efficiency, and location is more accurate, improves assembly precision.
Guide fixture 300 comprises pushing mechanism 320, fixture 340 and pallet 360.Pushing mechanism 320 is fixedly connected with fixture 340, and fixture 340 offers at least one draw-in groove for clamping connector 100, and pallet 360 is for fixing circuit board 200.Connector 100 is fixed on fixture 340 by draw-in groove, and circuit board 200 is fixed on pallet 360, and pushing mechanism 320 drives fixture 340 to move to pallet 360, makes connector 100 and circuit board 200 grafting.
Pushing mechanism 320 can be two, sets up the left and right sides separately.Fixture 340 is also two, set up the left and right sides separately, and each fixture 340 can arrange multiple draw-in groove, thus connector 100 can not be offset left and right in the process inserting the corresponding pad of circuit board 200, and assembling is inserted while can realizing multiple connector 100, improve packaging efficiency.The surrounding of pallet 360 can be provided with 4 location holes 362, makes connector 100 can insert pad corresponding on circuit board 200 accurately.Pallet 360 can be made up of aluminium alloy, there is at high temperature indeformable characteristic, pallet 360 is provided with the bracket of support connector 100, make connector 100 in the process being plugged into the corresponding pad of circuit board 200, maintenance connector 100 is parallel with circuit board 200, and realize locating accurately, be convenient to grafting.Simultaneously, pallet 360 is demountable structure, pallet 360 can disassemble from guide fixture 300, to insert on circuit board 200 after corresponding pad at the stitch 164 of connector 100, pallet 360 can enter subsequent production flow process along with circuit board 200, makes connector 100 not sagging in follow-up production procedure, keeps the parastate of connector 100 and circuit board 200, thus reduce the rosin joint situation brought because the two is not parallel, and the problem such as Total Product bad order.
See Fig. 9, wherein in an embodiment, after step S300, before step S400, also be included in corresponding stitch 164 and print fluxing or weld-aiding cream on the pad being positioned at end face 220, or printing includes the step (step S800) of the tin cream of scaling powder or weld-aiding cream.Because the temperature in reflow ovens is higher, be printed on the tin cream high temperature melting on the corresponding pad of stitch 164, the one-tenth branch of weldering that helps in tin cream volatilizees, and namely circuit board 200 is after first time crosses reflow ovens, and the composition major part of weldering that helps in print solder paste vapors away.By increasing step S800 and can effectively reducing because help the composition of weldering vaporization at high temperature thus cause the situation of follow-up failure welding in reflow ovens in step S300 in tin cream.
The step of above-mentioned print fluxing/cream can be completed by hand by artificial, and also can be completed by Machine automated, can be carry out print fluxing/cream by pad printer by the Machine automated method completed.Bat printing is that one indirectly can recessed glue head printing technology.Pad printer is a kind of printing equipment, is applicable to plastic cement, toy, glass, metal, pottery, electronics, IC etc.
The production method of the present embodiment electronic equipment, by improving the stitch 164 of connector 100 and glue core 140, make stitch 164 spacing little, the connector 100 of stitch 164 points of two rows arrangements is applicable to SMT technology, and whole production procedure is optimized, introduce the automatic assembling that guide fixture 300 carries out connector 100 and circuit board 200, overcome connector 100 hand assembled, the variety of problems that manual welding brings, as efficiency is low, precision is low, tin cream easily touches the problems such as paste, substantially increase the production efficiency of electronic product, and improve the qualification rate of product.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.

Claims (17)

1. a connector, one end of described connector is used for being connected with circuit board, it is characterized in that, comprising:
Housing;
Glue core, is arranged in described housing; And
Splicing ear, comprises terminal body and stitch, and described terminal body is connected with described stitch; Described terminal body is positioned at described glue in-core, and described stitch is positioned at outside described glue core; Described splicing ear is multiple, and the described stitch of multiple described splicing ear divides two row's arrangements, has space between the described stitch of two rows, and the described stitch of two rows is respectively used to be connected on the two sides of described circuit board; The end of described stitch is in another arranges described stitch bending dorsad.
2. connector according to claim 1, is characterized in that, the bending place of the end of described stitch is in folding planar or arc surfaced.
3. connector according to claim 1, is characterized in that, the bending place of the end of described stitch is in folding planar, and the angle of the bending part of the described stitch of two rows is 30 degree to 90 degree.
4. connector according to claim 1, is characterized in that, the material of described glue core is the material of resistance to 245 DEG C and above high temperature.
5. connector according to claim 1, is characterized in that, described housing is provided with two pairs of fixing feet near one end of described circuit board, and often pair of described fixing feet is for clamping described circuit board; Two pairs of described fixing feet lay respectively at the both sides of the edge place of described housing.
6. the connector according to any one of claim 1 to 5, is characterized in that, described connector is HDMI (High Definition Multimedia Interface) public connector.
7. an electronic equipment, is characterized in that, comprises equipment body and the connector described in any one of claim 1 to 6;
Described equipment body comprises circuit board, and the relative two sides of described circuit board is respectively end face and bottom surface; Described circuit board inserts two of described connector and arranges in the space between stitch, and wherein the described stitch of a row is electrically connected with the corresponding pad on described end face, and another is arranged described stitch and is electrically connected with the corresponding pad on described bottom surface.
8. a production method for electronic equipment according to claim 7, is characterized in that, comprises the steps:
Print solder paste on the pad of end face being positioned at circuit board;
First time crosses reflow ovens;
Print solder paste on the pad of bottom surface being positioned at described circuit board;
By connector and described circuit board grafting, described circuit board inserts two of described connector and arranges in the space between stitch, described stitch inserts corresponding pad, and wherein the described stitch of a row is connected with the pad being positioned at described end face, and another is arranged described stitch and is connected with the pad being positioned at described bottom surface;
Second time crosses reflow ovens.
9. the production method of electronic equipment according to claim 8, is characterized in that, before crossing the step of reflow ovens, also comprises and mounts components and parts on the top surface in described first time, and the described components and parts after attachment are only positioned at the step of the side of described circuit board.
10. the production method of electronic equipment according to claim 8, is characterized in that, before crossing the step of reflow ovens, is also included in the step described bottom surface mounting components and parts in described second time.
The production method of 11. electronic equipments according to claim 8, is characterized in that, includes scaling powder or weld-aiding cream in described tin cream.
The production method of 12. electronic equipments according to claim 8, is characterized in that, described on the pad of end face being positioned at circuit board print solder paste step before, be also included in be positioned at described end face pad on the step of print fluxing or weld-aiding cream;
And/or, before the step of described print solder paste on the pad of bottom surface being positioned at described circuit board, be also included in be positioned at described bottom surface pad on the step of print fluxing or weld-aiding cream.
The production method of 13. electronic equipments according to claim 11 or 12, it is characterized in that, after described first time crosses the step of reflow ovens, and before the step of described print solder paste on the pad of bottom surface being positioned at circuit board, also be included in corresponding described stitch and print fluxing or weld-aiding cream on the pad being positioned at described end face, or printing includes the step of the tin cream of scaling powder or weld-aiding cream.
The production method of 14. electronic equipments according to claim 8, is characterized in that, in the step of described print solder paste on the pad of end face being arranged in circuit board, in the subregion print solder paste of the pad of the described stitch of correspondence.
The production method of 15. electronic equipments according to claim 8, it is characterized in that, in the step of described print solder paste on the pad of end face being arranged in circuit board, the pad that described stitch is corresponding placed in the middle 40% to 60% region print solder paste, in the region print solder paste of 30% to 50% of the close described connector both sides of pad corresponding to the fixing feet of described connector.
The production method of 16. electronic equipments according to claim 8, is characterized in that, described connector is by guide fixture and described circuit board grafting;
Described guide fixture comprises pushing mechanism, fixture and pallet; Described pushing mechanism is fixedly connected with described fixture, and described fixture offers at least one for clamping the draw-in groove of described connector, and described pallet is used for fixing described circuit board;
Described connector is fixed on described fixture by described draw-in groove, and described circuit board is fixed on described pallet, and described pushing mechanism drives described fixture to move to described pallet, makes described connector and described circuit board grafting.
The production method of 17. electronic equipments according to claim 16, is characterized in that, described pallet is detachable, and after described connector inserts described circuit board, pallet enters subsequent production flow process along with described circuit board.
CN201410449172.7A 2014-09-04 2014-09-04 Electronic device production method Active CN104241891B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410449172.7A CN104241891B (en) 2014-09-04 2014-09-04 Electronic device production method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410449172.7A CN104241891B (en) 2014-09-04 2014-09-04 Electronic device production method

Publications (2)

Publication Number Publication Date
CN104241891A true CN104241891A (en) 2014-12-24
CN104241891B CN104241891B (en) 2017-04-19

Family

ID=52229532

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410449172.7A Active CN104241891B (en) 2014-09-04 2014-09-04 Electronic device production method

Country Status (1)

Country Link
CN (1) CN104241891B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102142878B1 (en) * 2020-03-04 2020-08-10 주식회사 에이치에스씨 Micro-usb plug connector
CN112864663A (en) * 2020-12-29 2021-05-28 上海摩勤智能技术有限公司 HDMI connector and electronic equipment with same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060276064A1 (en) * 2005-06-01 2006-12-07 Japan Aviation Electronics Industry, Limited Connector having an electronic element built therein without disturbing a characteristic impedance
CN102047507A (en) * 2008-06-04 2011-05-04 星电株式会社 Electric connector
CN102215638A (en) * 2010-04-09 2011-10-12 昌硕科技(上海)有限公司 Method for welding pin through-hole element in surface mounting technology process
CN102801032A (en) * 2011-05-27 2012-11-28 富士康(昆山)电脑接插件有限公司 Electric connector
CN103311773A (en) * 2013-06-13 2013-09-18 惠州Tcl移动通信有限公司 HDMI (high-definition multimedia interface) welding method and data card
CN204144490U (en) * 2014-09-04 2015-02-04 深圳市江波龙电子有限公司 Connector and electronic equipment

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060276064A1 (en) * 2005-06-01 2006-12-07 Japan Aviation Electronics Industry, Limited Connector having an electronic element built therein without disturbing a characteristic impedance
CN102047507A (en) * 2008-06-04 2011-05-04 星电株式会社 Electric connector
CN102215638A (en) * 2010-04-09 2011-10-12 昌硕科技(上海)有限公司 Method for welding pin through-hole element in surface mounting technology process
CN102801032A (en) * 2011-05-27 2012-11-28 富士康(昆山)电脑接插件有限公司 Electric connector
CN103311773A (en) * 2013-06-13 2013-09-18 惠州Tcl移动通信有限公司 HDMI (high-definition multimedia interface) welding method and data card
CN204144490U (en) * 2014-09-04 2015-02-04 深圳市江波龙电子有限公司 Connector and electronic equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102142878B1 (en) * 2020-03-04 2020-08-10 주식회사 에이치에스씨 Micro-usb plug connector
CN112864663A (en) * 2020-12-29 2021-05-28 上海摩勤智能技术有限公司 HDMI connector and electronic equipment with same

Also Published As

Publication number Publication date
CN104241891B (en) 2017-04-19

Similar Documents

Publication Publication Date Title
CN201178163Y (en) Electric connector assembly
CN100508697C (en) Technique for placing connectors on printing circuit board
CN102689065B (en) A kind of welding method of circuit board element
GB2494919A (en) Joining PCB together using prongs and holes, preferably staggered and with solder
CN103934537A (en) Plug-in welding process on PCB and welding carrier
CN204144490U (en) Connector and electronic equipment
CN107592751B (en) A kind of circuit board assemblies and preparation method thereof, contact pin component, mobile terminal
CN104241891A (en) Connector, electronic device and production method of electronic device
CN102340062A (en) Connecting device with positioning pins and positioning method thereof
CN102883549A (en) Circuit board with heat collection structure and manufacturing method for circuit board
CN102300449A (en) Fixing device for printed circuit board
CN207264644U (en) A kind of electrical and electronic technology teaching experiment PCB circuit board
CN101599588A (en) Electric connector
CN205231297U (en) Micro -USB plug with cartridge welding hole
CN204094281U (en) The fixture of optic module PCB plate contact pin welding
CN202585783U (en) Pin adapter assembly of electronic component
CN203984774U (en) A kind of printed circuit board (PCB)
CN107734873B (en) Circuit board assembly and manufacturing method thereof, circuit board jointed board and mobile terminal
CN207199868U (en) Light fixture for surface-pasted push type electric connector and using the push type electric connector
CN104588814B (en) A kind of wave-soldering fixture makes the method for specification
CN204652780U (en) A kind of pcb board
CN104955272A (en) Printed circuit board
CN100499293C (en) A making method for electric connector
CN105428953A (en) Plug-in mounting and welding process for Micro-USB plug and data line
CN201238087Y (en) Conducting terminal for electric connector

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 518057 A, B, C, D, E, F1, 8 Building, Financial Services Technology Innovation Base, No. 8 Kefa Road, Nanshan District, Shenzhen City, Guangdong Province

Patentee after: Shenzhen jiangbolong electronic Limited by Share Ltd

Address before: 518057 A, B, C, D, E, F1, 8 Building, Financial Services Technology Innovation Base, No. 8 Kefa Road, Nanshan District, Shenzhen City, Guangdong Province

Patentee before: Shenzhen jiangbolong Electronic Co., Ltd.