CN104241178A - 一种基于三气缸驱动的ic料条连续上料装置 - Google Patents

一种基于三气缸驱动的ic料条连续上料装置 Download PDF

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Publication number
CN104241178A
CN104241178A CN201410427771.9A CN201410427771A CN104241178A CN 104241178 A CN104241178 A CN 104241178A CN 201410427771 A CN201410427771 A CN 201410427771A CN 104241178 A CN104241178 A CN 104241178A
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strip
feeding
belt support
conveying belt
air
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卢冬青
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SHANGHAI GONGYUAN AUTOMATION TECHNOLOGY Co Ltd
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SHANGHAI GONGYUAN AUTOMATION TECHNOLOGY Co Ltd
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Priority to CN201410427771.9A priority Critical patent/CN104241178A/zh
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773Conveying cassettes, containers or carriers

Abstract

本发明提供一种基于三气缸驱动的IC料条连续上料装置。其包括:上料料盒、上料料盒底板、料盒固定块、内侧输送带支架、外侧输送带支架、输送带、输送马达、导轨有料传感器、料条压轮、前导轨、后导轨、料条阻挡机构、料条方向判别传感器、分料气缸、分料片、分料片固定板、料条托板、托料气缸,料盒固定块固定在内侧输送带支架和外侧输送带支架上,上料料盒放置在料盒固定块之间,输送马达与输送带相连,导轨有料传感器安装在内侧输送带支架上,料条方向判别传感器安装在后导轨上,分料气缸通过分料片固定板与分料片相连并共同固定在内侧输送带支架和外侧输送带支架上,料条托板固定在托料气缸上。本发明具有结构稳定,操作、维修安全方便。

Description

—种基于三气缸驱动的IC料条连续上料装置
技术领域
[0001] 本发明涉及一种IC料条上料装置,尤其涉及一种基于三气缸驱动的IC料条连续上料装置。
[0002]
背景技术
IC料条是由若干芯片粘贴在导线架或基板上并用银胶粘着固定组合而成的板料。IC料条上的芯片封装后对封装芯片进行打标时,需要将料条放置到往复运动的载料台或输送轨道上,然后输送到激光下进行打标。将料条放置到往复运动的载料台上或输送轨道上的过程称为“上料”。
[0003]目前上料的方式主要有两种,第一种是人工将料条放置到载料台或输送轨道上,第二种是采用抓手或真空吸盘将料条从料盒中取出再放置到往复运动的载料台或输送轨道上。上述方式中第一种方式是人工操作存在着随意性强,定位困难,重复性差,效率低下,人力资源浪费等缺点;第二种方式虽然一定程度上解决了第一种方式的缺点,但结构复杂和无料条方向判别功能,并且需要定时停机更换空料盒,无法做到连续上料。
发明内容
[0004] 本发明的目的是为了解决上述上料装置的局限,提供一种基于三气缸驱动的IC料条连续上料装置。
[0005] 本发明的目的可以通过以下技术方案来实现:
本发明包括:上料料盒、上料料盒底板、料盒固定块、内侧输送带支架、外侧输送带支架、输送带、输送马达、导轨有料传感器、料条压轮、前导轨、后导轨、料条阻挡机构、料条方向判别传感器、分料气缸、分料片、分料片固定板、料条托板、托料气缸,料盒固定块固定在内侧输送带支架和外侧输送带支架上,上料料盒放置在料盒固定块之间,输送马达与输送带相连,导轨有料传感器安装在内侧输送带支架上,料条方向判别传感器安装在后导轨上,分料气缸通过分料片固定板与分料片相连并共同固定在内侧输送带支架和外侧输送带支架上,料条托板固定在托料气缸上。
[0006] 本发明的优势在于,
1.可以实现连续上料,在不停机的情况下可随时对上料料盒添加料条;
2.具有料条方向判别功能,防止反向的料条进入打标工位,减少不良品的广生。
[0007] 3.结构稳定,操作、维修安全方便。
[0008]
附图说明
[0009] 图1为本发明的一种基于三气缸驱动的IC料条连续上料装置结构示意图具体实施方法
下面结合附图1和具体实施方式来对本发明进行详细说明: 如附图1示,一种基于三气缸驱动的IC料条连续上料装置,包括上料料盒1、上料料盒底板2、料盒固定块3、内侧输送带支架4、外侧输送带支架5、输送带6、输送马达7、导轨有料传感器8、料条压轮9、前导轨10、后导轨11、料条阻挡机构12、料条方向判别传感器13、分料气缸14、分料片15、分料片固定板16、料条托板17、托料气缸18,所述的料盒固定块3、分料片15、分料片固定板16为4件,所述的输送带6、料条压轮9、分料气缸14为2件。
[0010] 本发明的工作过程如下:
1.将上料料盒底板2插入上料料盒1,然后一起放置在料盒固定块3之间,分料气缸14通过分料片固定板16带动分料片15闭合。
[0011] 2.放置料条到上料料盒I中,抽出上料料盒底板2,料条下降至分料片15上。
[0012] 3.托料气缸18带动料条托板17上升到位,分料气缸14通过分料片固定板16带动分料片15打开,料条下降至料条托板17上。
[0013] 4.分料气缸14通过分料片固定板16带动分料片15再次闭合,托料气缸18带动料条托板17下降到位,料盒中的料条下降至分料片15上,料条托板17上的料条下降至输送带6上。
[0014] 5.导轨有料传感器8检测到输送带6上托有料条,输送马达7驱动输送带6前进,将料条送入前导轨10、后导轨11之间至料条阻挡机构12处。
[0015] 6.料条方向判别传感器13对料条进行检测,料条方向正确,料条阻挡机构12打开,料条进入下一个工位,料条方向错误,输送马达7驱动输送带6后退将反向的料条从输送带6另一端剔除。
[0016] 7.重复3飞的步骤,将下一条料条送入下一个工位。

Claims (2)

1.一种基于三气缸驱动的IC料条连续上料装置,包括:上料料盒1、上料料盒底板2、料盒固定块3、内侧输送带支架4、外侧输送带支架5、输送带6、输送马达7、导轨有料传感器8、料条压轮9、前导轨10、后导轨11、料条阻挡机构12、料条方向判别传感器13、分料气缸14、分料片15、分料片固定板16、料条托板17、托料气缸18。
2.如权利I所述的一种基于三气缸驱动的IC料条连续上料装置,其特征在于:可以实现连续上料,在不停机的情况下可随时对上料料盒添加料条;其特征还在于:具有料条方向判别功能,防止反向的料条进入打标工位。
CN201410427771.9A 2014-08-27 2014-08-27 一种基于三气缸驱动的ic料条连续上料装置 Pending CN104241178A (zh)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104692107A (zh) * 2015-03-04 2015-06-10 昆山平成电子科技有限公司 一种自动换料机构
CN104908457A (zh) * 2015-06-15 2015-09-16 苏州石丸英合精密机械有限公司 键盘激光自动打标机的气动上料机构
CN105314393A (zh) * 2015-11-20 2016-02-10 江苏艾科瑞思封装自动化设备有限公司 不停机上料装置
CN109192685A (zh) * 2018-10-10 2019-01-11 曾繁洪 一种芯片加工用贴装机

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104692107A (zh) * 2015-03-04 2015-06-10 昆山平成电子科技有限公司 一种自动换料机构
CN104908457A (zh) * 2015-06-15 2015-09-16 苏州石丸英合精密机械有限公司 键盘激光自动打标机的气动上料机构
CN105314393A (zh) * 2015-11-20 2016-02-10 江苏艾科瑞思封装自动化设备有限公司 不停机上料装置
CN109192685A (zh) * 2018-10-10 2019-01-11 曾繁洪 一种芯片加工用贴装机

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