CN104216488A - Microprocessor and processing equipment with the same - Google Patents
Microprocessor and processing equipment with the same Download PDFInfo
- Publication number
- CN104216488A CN104216488A CN201310217684.6A CN201310217684A CN104216488A CN 104216488 A CN104216488 A CN 104216488A CN 201310217684 A CN201310217684 A CN 201310217684A CN 104216488 A CN104216488 A CN 104216488A
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- Prior art keywords
- tube core
- microprocessor
- heating radiator
- heat
- substrate
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Abstract
The invention discloses a microprocessor and processing equipment with the same. The microprocessor comprises a substrate, a pipe core, a radiator and a heat conducting piece. The pipe core is placed on the upper surface of the substrate and protrudes out of the upper surface. The radiator is placed on the pipe core and is used for carrying out radiating on the pipe core. The heat conducting piece surrounds the pipe core and is arranged on the substrate in a covering mode, and the heat conducting piece is in heat contact with the radiator. According to the microprocessor, the heat conducting piece is arranged, so that the contacting area between the radiator, the substrate and the pipe core is increased, and radiating efficiency is improved.
Description
Technical field
The present invention relates to electricity field, be specifically related to a kind of microprocessor and there is the treatment facility of this microprocessor.
Background technology
The microprocessor of such as GPU, CPU etc. generally includes substrate and is arranged on the tube core on substrate.Microprocessor also comprises heating radiator usually, for dispelling the heat to microprocessor.But at present, thermolysis is all concentrated and is carried out tube core, and have ignored the heat radiation to substrate.Although tube core is main heat generating components, the heat that tube core produces can be passed to substrate and cause substrate temperature to raise.So not only can affect the electronic component work on substrate, also can reduce the radiating efficiency of tube core.
Summary of the invention
Therefore, need a kind of microprocessor and there is the treatment facility of this microprocessor, to solve problems of the prior art.
In order to solve the problem, according to one embodiment of present invention, a kind of microprocessor is provided.This microprocessor comprises substrate, tube core, heating radiator and conducting strip.Described tube core is positioned at the upper surface of described substrate and protrudes from described upper surface.Described heating radiator is positioned on described tube core, for dispelling the heat to described tube core.Described conducting strip covers on the substrate around described tube core, and contacts with described radiator heat.
Preferably, described heating radiator at least covers described conducting strip and described tube core.
Preferably, described conducting strip is in compressive state between described heating radiator and described substrate.
Preferably, the size of described conducting strip and the size not arranging the region of described tube core of described substrate match.
Preferably, described conducting strip is solid conductive heat sheet.
Preferably, described microprocessor also comprises heat-conducting layer, and described heat-conducting layer is between described tube core and described heating radiator.
Preferably, described heat-conducting layer is the heat-conducting layer of viscous fluid shape.
Preferably, the side close contact of described conducting strip and described tube core.
Preferably, described heating radiator comprises cooling base and is positioned at the radiating component of upper surface of described cooling base, and the lower surface of described cooling base is plane, and the described lower surface of described cooling base is towards described substrate.
Preferably, described heating radiator comprises the installation component for described heating radiator being fixed to circuit board, and described circuit board is by circuit board mounted thereto for described microprocessor.
The present invention also provides a kind for the treatment of facility.Described treatment facility comprises circuit board and any one microprocessor as above.Described microprocessor is arranged on described circuit board.
Microprocessor provided by the invention with the thermocontact area increasing heating radiator and substrate and tube core, improves radiating efficiency by arranging conducting strip.
Below in conjunction with accompanying drawing, describe advantages and features of the invention in detail.
Accompanying drawing explanation
In order to make advantage of the present invention be easier to understand, concise and to the point the present invention described above will be described in more detail by reference to specific embodiment illustrated in the accompanying drawings.Be appreciated that these accompanying drawings depict only exemplary embodiments of the present invention, therefore should do not think the restriction to its protection domain, described and explanation the present invention with additional characteristic and details by accompanying drawing.
Fig. 1 is the cut-open view of microprocessor according to an embodiment of the invention; And
Fig. 2 is the vertical view of microprocessor according to an embodiment of the invention, and wherein the heating radiator of microprocessor is removed.
Embodiment
In discussion hereafter, give details to provide more thorough understanding of the invention.But those skilled in the art can understand, the present invention can be implemented without the need to these details one or more.In specific example, in order to avoid obscuring with the present invention, technical characteristics more well known in the art are at large described.
The invention provides a kind of microprocessor.Fig. 1 shows microprocessor 100 according to an embodiment of the invention.As shown in Figure 1, microprocessor 100 comprises substrate 110, tube core 120, heating radiator 130 and conducting strip 140.In order to be clearly shown that the position relationship between conducting strip 140 and tube core 120, Fig. 2 shows the microprocessor removed by heating radiator 130.Below in conjunction with Fig. 1-2, microprocessor 100 provided by the invention is described in detail.Microprocessor 100 is not limited to GPU or CPU, as long as can process data and within the protection scope of the present invention that all comprises of parts needing heat radiation.
Tube core 120 is positioned at the upper surface of substrate 110.Substrate 110 for carrying tube core 120, and as required substrate 110 is also provided with the pin etc. of wiring and/or the extraction be electrically connected with tube core mounted thereto 120.After tube core 120 is mounted to substrate 110, usually can protrude from the upper surface of substrate 110.Heating radiator 130 is positioned on tube core 120.Heating radiator 130 contacts with tube core 120, for dispelling the heat to tube core 120.Heating radiator 130 can for having various structure, such as heat radiator, radiating tube, turbofan or above-mentioned multiple combination etc.In the embodiment illustrated in fig. 1, the size of heating radiator 130 is greater than the size of substrate 110, the tube core 130 that heating radiator 130 covers whole substrate 110 and is located thereon.In other embodiments, the size of heating radiator 130 can be less than the size of substrate 110, and only covers a part for tube core 130 and substrate 110.The size of heating radiator 130 even can be less than the size of tube core 120.
Conducting strip 140 covers on substrate 110 around tube core 120, as shown in Figure 2.Further, conducting strip 140 and heating radiator 130 thermo-contact, be passed to heating radiator 130 to make the heat on substrate 110 by conducting strip 130.The thermocontact area of heating radiator 130 and substrate 110 and tube core 120 can be increased like this, improve radiating efficiency.In a preferred embodiment, the size of conducting strip 140 and the size not arranging the region of tube core 120 of substrate 110 match, and occupy limited space to avoid unnecessary conducting strip 140 while having compared with high cooling efficiency.In other embodiment unshowned, the size of conducting strip 140 can be greater than or less than the size not being provided with the region of tube core 120 of substrate 110.
In a preferred embodiment, heating radiator 130 at least covers conducting strip 140 and tube core 120.Conducting strip 140 and tube core 120 are clipped between heating radiator 130 and substrate 110.The heat of tube core 120 can directly be passed to heating radiator 130, and the heat accumulated in all regions that substrate 110 is not covered by tube core 120 can be passed to heating radiator 130 by conducting strip 140.Like this, heating radiator 130 can maximize with the thermocontact area of conducting strip 140 and tube core 120, therefore improves radiating efficiency further.
Further preferably, conducting strip 140 is in compressive state between heating radiator 130 and substrate 110.By in situation, heating radiator 130 can select the higher metallic copper of coefficient of heat conductivity or metallic aluminium to make, the coefficient of heat conductivity of copper can reach about 400 watts/(rice * Kelvin), the coefficient of heat conductivity of aluminium be about 236 watts/(rice * Kelvin).But the coefficient of heat conductivity of air be only 0.02 watt/(rice * Kelvin).Conducting strip 140 is in compressive state and air between the two all can be discharged between heating radiator 130 and substrate 110, alternatively, filling by having the conducting strip 140 of coefficient of heat conductivity higher than air, this improves the heat conduction efficiency of substrate 110 to heating radiator 130.
In a preferred embodiment, the side close contact of conducting strip 140 and tube core 120.The upper surface of tube core 120 contacts with heating radiator 130.The side close contact of conducting strip 140 and tube core 120, to play booster action to the heat radiation of tube core 120.
Conducting strip 140 can be made up of any Heat Conduction Material with high thermal conductivity, such as conventional in electron device heat-conducting interface material.As described previously, in a preferred embodiment, conducting strip 140 is between heating radiator 130 and substrate 110, and protrude from the upper surface of substrate 110 due to tube core 120, therefore, require that conducting strip 140 has fixing shape, namely conducting strip 140 is solid conductive heat sheet 140, to fill the space between heating radiator 130 and substrate 110.In other embodiments, because the upper surface of heat radiator 140 or side only partly contact with heating radiator 130, now, still require that conducting strip 140 has fixing shape.The TP series that the material of solid conductive heat sheet 140 such as can provide for Ao Chuan scientific & technical corporation or the serial heat-conducting silica gel sheet of UTP, the Tpli that can also provide for laird (Laird) company
tM200, Tflex
tM200V0, Tflex
tMhR200, Tflex
tM300, Tflex
tM300TG, Tflex
tMhR400, Tflex
tMxS400, Tflex
tM500, Tflex600, Tflex
tMhR600, Tflex
tMsF600, Tflex
tMsF600DF, Tflex
tMthe heat-conducting silica gel sheet of 700 series such as grade.
Applicant finds, heating radiator 130 is not definitely smooth with the surface in contact of tube core 120, can there is a large amount of small defects on these surfaces.This causes there is the gap of being filled by air between heating radiator 130 and tube core 120.Mention above, the coefficient of heat conductivity of air is low-down, in order to improve the heat conduction efficiency of tube core 120 to heating radiator 130, preferably, microprocessor 100 also comprises the heat-conducting layer (due to the thinner thickness of heat-conducting layer, therefore not shown) between tube core 120 and heating radiator 130.Heat-conducting layer can be made up of any Heat Conduction Material with high thermal conductivity, such as conventional in electron device heat-conducting interface material.The fundamental purpose of this heat-conducting layer fills the minim gap existed due to surface imperfection between heating radiator 130 and tube core 120, and therefore, preferably, heat-conducting layer is the heat-conducting layer of viscous fluid shape.Before heating radiator 130 being installed on tube core 120, can first at the surperficial coated with thermally conductive layer contacted with heating radiator 130 of tube core 120, because heat-conducting layer is flow-like, after therefore heating radiator 130 being mounted to tube core 120, heat-conducting layer can flow to gap location, and then is discharged by air.In addition, because heat-conducting layer has viscosity, therefore can remain between heating radiator 130 and tube core 120.
Exemplarily, the X23-7762 type heat-conducting interface material that the material of the heat-conducting layer of viscous fluid shape can provide for Shin-Etsu MicroSi company, the TG300 type heat-conducting silicone grease that can also provide for Ao Chuan scientific & technical corporation.
In one embodiment, heating radiator 130 can comprise cooling base 131 and be positioned at the radiating component 132 of upper surface of cooling base 131.The lower surface of cooling base 131 is plane, and the lower surface of cooling base 131 is arranged towards substrate 110 ground.Like this, the surface contacted with tube core 120 of heating radiator 130 or be plane with the surface that tube core 120 contacts with conducting strip 140, therefore can reduce the gap between them, reduce the air capacity between them.
In addition, heating radiator 130 also comprises the installation component (not shown) for heating radiator 130 being fixed to circuit board, and the circuit board mentioned here is by circuit board mounted thereto for microprocessor 100.When microprocessor is mounted to circuit board, heating radiator 130 and being fixedly connected with between circuit board can be realized by installation component.
The present invention also provides a kind for the treatment of facility, and this treatment facility comprises circuit board and any one microprocessor as above.Microprocessor can be installed on circuit boards in conventional manner, and this instructions is no longer described in detail the installation method of this routine.In one embodiment, microprocessor is GPU, and treatment facility can be video card.In another embodiment, microprocessor is CPU, and treatment facility can be mainboard.The present invention does not limit the type of circuit board, as long as can install aforesaid microprocessor.
Microprocessor provided by the invention with the thermocontact area increasing heating radiator and substrate and tube core, improves radiating efficiency by arranging conducting strip.
In order to be described, aforementioned description have references to specific embodiment and is described.But exemplary discussion above is also not intended to be without omitting ground or limiting the present invention to disclosed in form clear and definite.In view of above instruction, also likely there is a lot of modification and change.Select and describe embodiment, to explain principle of the present invention and practical application best, utilize the present invention best to make others skilled in the art and there are the various embodiments of various modification, so that the special-purpose expected can be applicable to.
Be thus described according to embodiments of the invention.Although the disclosure is described in a particular embodiment, should understand, the present invention should not be construed as and limited by these embodiments, and should understand according to claim.
Claims (20)
1. a microprocessor, comprising:
Substrate;
Tube core, described tube core is positioned at the upper surface of described substrate and protrudes from described upper surface;
Heating radiator, described heating radiator is positioned on described tube core, for dispelling the heat to described tube core; And
Conducting strip, described conducting strip covers on the substrate around described tube core, and contacts with described radiator heat.
2. microprocessor as claimed in claim 1, it is characterized in that, described heating radiator at least covers described conducting strip and described tube core.
3. microprocessor as claimed in claim 2, it is characterized in that, described conducting strip is in compressive state between described heating radiator and described substrate.
4. microprocessor as claimed in claim 1, it is characterized in that, the size of described conducting strip and the size not arranging the region of described tube core of described substrate match.
5. microprocessor as claimed in claim 1, it is characterized in that, described conducting strip is solid conductive heat sheet.
6. microprocessor as claimed in claim 1, it is characterized in that, described microprocessor also comprises heat-conducting layer, and described heat-conducting layer is between described tube core and described heating radiator.
7. microprocessor as claimed in claim 6, it is characterized in that, described heat-conducting layer is the heat-conducting layer of viscous fluid shape.
8. microprocessor as claimed in claim 1, is characterized in that, the side close contact of described conducting strip and described tube core.
9. microprocessor as claimed in claim 1, it is characterized in that, described heating radiator comprises cooling base and is positioned at the radiating component of upper surface of described cooling base, and the lower surface of described cooling base is plane, and the described lower surface of described cooling base is towards described substrate.
10. microprocessor as claimed in claim 1, it is characterized in that, described heating radiator comprises the installation component for described heating radiator being fixed to circuit board, and described circuit board is by circuit board mounted thereto for described microprocessor.
11. 1 kinds for the treatment of facilities, described treatment facility comprises:
Circuit board;
Microprocessor, described microprocessor is arranged on described circuit board, and comprises:
Substrate;
Tube core, described tube core is positioned at the upper surface of described substrate and protrudes from described upper surface;
Heating radiator, described heating radiator is positioned on described tube core, for dispelling the heat to described tube core; And
Conducting strip, described conducting strip covers on the substrate around described tube core, and contacts with described radiator heat.
12. treatment facilities as claimed in claim 11, it is characterized in that, described heating radiator at least covers described conducting strip and described tube core.
13. treatment facilities as claimed in claim 12, it is characterized in that, described conducting strip is in compressive state between described heating radiator and described substrate.
14. treatment facilities as claimed in claim 11, is characterized in that, the size of described conducting strip and the size not arranging the region of described tube core of described substrate match.
15. treatment facilities as claimed in claim 11, it is characterized in that, described conducting strip is solid conductive heat sheet.
16. treatment facilities as claimed in claim 11, it is characterized in that, described microprocessor also comprises heat-conducting layer, and described heat-conducting layer is between described tube core and described heating radiator.
17. treatment facilities as claimed in claim 16, it is characterized in that, described heat-conducting layer is the heat-conducting layer of viscous fluid shape.
18. treatment facilities as claimed in claim 11, is characterized in that, the side close contact of described conducting strip and described tube core.
19. treatment facilities as claimed in claim 11, it is characterized in that, described heating radiator comprises cooling base and is positioned at the radiating component of upper surface of described cooling base, and the lower surface of described cooling base is plane, and the described lower surface of described cooling base is towards described substrate.
20. treatment facilities as claimed in claim 11, is characterized in that, described heating radiator comprises the installation component for described heating radiator being fixed to described circuit board, so that described heating radiator is fixed to described circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310217684.6A CN104216488A (en) | 2013-06-03 | 2013-06-03 | Microprocessor and processing equipment with the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310217684.6A CN104216488A (en) | 2013-06-03 | 2013-06-03 | Microprocessor and processing equipment with the same |
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| Publication Number | Publication Date |
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| CN104216488A true CN104216488A (en) | 2014-12-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310217684.6A Pending CN104216488A (en) | 2013-06-03 | 2013-06-03 | Microprocessor and processing equipment with the same |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090072382A1 (en) * | 2007-09-18 | 2009-03-19 | Guzek John S | Microelectronic package and method of forming same |
| CN102110660A (en) * | 2009-12-29 | 2011-06-29 | 台湾积体电路制造股份有限公司 | Semiconductor flip chip package and forming method thereof |
-
2013
- 2013-06-03 CN CN201310217684.6A patent/CN104216488A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090072382A1 (en) * | 2007-09-18 | 2009-03-19 | Guzek John S | Microelectronic package and method of forming same |
| CN101785098A (en) * | 2007-09-18 | 2010-07-21 | 英特尔公司 | Microelectronic package and method of forming same |
| CN102110660A (en) * | 2009-12-29 | 2011-06-29 | 台湾积体电路制造股份有限公司 | Semiconductor flip chip package and forming method thereof |
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Application publication date: 20141217 |