CN104209864A - Polishing pad finisher, polishing pad finishing device and polishing system - Google Patents
Polishing pad finisher, polishing pad finishing device and polishing system Download PDFInfo
- Publication number
- CN104209864A CN104209864A CN201310217195.0A CN201310217195A CN104209864A CN 104209864 A CN104209864 A CN 104209864A CN 201310217195 A CN201310217195 A CN 201310217195A CN 104209864 A CN104209864 A CN 104209864A
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- China
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- polishing pad
- abradant surface
- central
- grinding face
- trimmer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
Abstract
Provided are a polishing pad finisher, a polishing pad finishing device and a polishing system. The finisher comprises abrasive particles and a base body with a grinding face, wherein the abrasive particles firmly solidify on the grinding face, the grinding face comprises an edge grinding face and a central grinding face which are connected, and the edge grinding face surrounds the central grinding face. The central grinding face is a plane and is higher than the edge grinding face. When a polishing pad is finished and due to the fact that the central grinding face of the grinding face is higher than the edge grinding face, the abrasive particles on the edge grinding face are higher than the abrasive particles on the central grinding face. Therefore, when the pressing depth of the polishing pad finisher extending into the polishing pad is small, most of the abrasive particles on the edge grinding face do not perform grinding, the using frequency of the abrasive particles located at the edge position is reduced, and scaling possibility of the abrasive particles located at the edge position is reduced. In addition, the possibility that the abrasive particles located at the edge position bump with the edge of the polishing pad is further reduced.
Description
Technical field
The invention belongs to chemically mechanical polishing (CMP) technical field, particularly relate to a kind of polishing pad trimmer, comprise the trimming device for polishing cushion of this polishing pad trimmer and comprise the polishing system of this trimming device for polishing cushion.
Background technology
Chemically mechanical polishing (CMP) technology is one of key technology of semiconductor wafer surface processing, and surface flattening for each stage of ic manufacturing process, is used widely in recent years.In CMP process, polishing pad (polishing pad) has storage, transport polishing fluid, removes residual processing material, transmits mechanical load and maintain the functions such as polishing environment.Along with constantly carrying out of CMP process, the physics of polishing pad and chemical property can change, show as pad interface and produce residual substance, volume-diminished, the quantity of micropore reduce, surface roughness reduces, there is molecular recombination phenomenon in surface, forms certain thickness glazing layer, cause the reduction of polishing speed and quality of finish.Therefore, must carry out suitable finishing to polishing pad, suitable finishing not only can improve polishing effect, can also improve the service life of polishing pad, reduce polishing cost.
The dressing tool of existing most extensive use is diamond truer, Fig. 1 is the cross-sectional view of existing a kind of diamond truer, as shown in Figure 1, trimmer 1 comprises matrix 2 and diamond abrasive particles 3, wherein, matrix 2 has abradant surface S1 and non-abrasive side S2, non-abrasive side S2 abradant surface S1 projection be in the plane polished face S1 and surround, and abradant surface S1 is higher than non-abrasive side S2, diamond abrasive particles 3 is cemented on abradant surface S1.In the process utilizing trimmer 1 pair of polishing pad to repair, trimmer 1 is pressed in pad interface with certain pressure, diamond abrasive particles 3 is contacted with pad interface, and trimmer 1 rotates simultaneously and moves back and forth, thus realize the finishing to pad interface.But, the diamond abrasive particles 3 being arranged in outward flange position (shown in Fig. 1 dashed circle A position) of this trimmer 1, and the diamond abrasive particles 3 being arranged in inward flange position (shown in Fig. 1 dashed circle B position) all easily peels off, not only reduce the service life of trimmer 1, and the diamond abrasive particles 3 peeled off can cause scuffing to silicon chip polished above polishing pad.
Summary of the invention
The technical problem to be solved in the present invention is: the abrasive grains being positioned at marginal position of existing polishing pad trimmer easily peels off.
For solving the problem, the invention provides a kind of polishing pad trimmer, comprising:
Abrasive grains;
Matrix, has abradant surface, and described abrasive grains is cemented on described abradant surface, and described abradant surface comprises: the edge grinding face be connected and central abradant surface, and described edge grinding face is looped around around central abradant surface;
Described central abradant surface is plane, and described central abradant surface is higher than edge grinding face.
Optionally, described edge grinding face is convex-shaped arc surface;
Or described edge grinding face is connected by multiple and forms, and described multiple face comprises: at least one convex-shaped arc surface, the plane not parallel with described central abradant surface with at least one.
Optionally, when described edge grinding face is convex-shaped arc surface, described edge grinding face and central abradant surface tangent;
When described edge grinding face by multiple be connected form time, the face that described edge grinding face is connected with central abradant surface is: the convex-shaped arc surface tangent with central abradant surface.
Optionally, described cambered surface is arc surface.
Optionally, described abradant surface distributes on the matrix in the form of a ring, and described edge grinding face comprises inward flange abradant surface and outward flange abradant surface, and described central abradant surface is between inward flange abradant surface and outward flange abradant surface;
Described matrix also has non-abrasive side, described non-abrasive side described central abradant surface projection in the plane, by described abradant surface described central abradant surface projection in the plane surround;
Described non-abrasive side is lower than abradant surface.
Optionally, described matrix is in the form of annular discs.
Optionally, described abrasive grains is diamond particles or cubic boron nitride particle.
Optionally, described polishing pad trimmer is electrodeposition-type polishing pad trimmer, chemical soldering type polishing pad trimmer, metal sintering type polishing pad trimmer or chemical vapor deposition type polishing pad trimmer.
In addition, present invention also offers a kind of trimming device for polishing cushion, comprising: above-mentioned arbitrary described polishing pad trimmer.
Optionally, also comprise: the drives structure driving described polishing pad trimmer.
In addition, present invention also offers a kind of polishing system, comprising:
Burnishing device, comprises polishing pad;
Above-mentioned arbitrary described trimming device for polishing cushion, for repairing described polishing pad.
Compared with prior art, technical scheme of the present invention has the following advantages:
When repairing polishing pad, for base bottom, because the central abradant surface of abradant surface is higher than edge grinding face, make the abrasive grains on edge grinding face higher than the abrasive grains on central abradant surface, therefore when the compression distance that polishing pad trimmer enters polishing pad is less, abrasive grains on major part edge grinding face can not grind, and thus decrease the frequency of utilization of the abrasive grains being positioned at marginal position, what reduce the abrasive grains being positioned at marginal position peels off possibility; In addition; because the abrasive grains on edge grinding face is higher than the abrasive grains on central abradant surface; when polishing pad trimmer is along when moving near the direction of polishing pad center gradually; the abrasive grains that major part is positioned at marginal position can be positioned at above pad interface; reduce the possibility that the abrasive grains that is positioned at marginal position and polishing pad edge collide, so reduce the abrasive grains that is positioned at marginal position peel off possibility.
Further, abradant surface can be to be connected with the outward flange abradant surface in convex shaped arc face by the central abradant surface in plane, inward flange abradant surface in convex shaped arc face to form, and two arc surfaces are all tangent with central abradant surface, on the one hand, make abradant surface be a smooth surface, avoid in abradant surface and there is the generation that stress concentrates situation; On the other hand, make the processing technology of abradant surface more simple.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of existing a kind of diamond truer;
Fig. 2 is the cross-sectional view existing diamond truer being made improvements to rear proposed the second diamond truer;
Fig. 3 is the cross-sectional view existing diamond truer being made improvements to rear the third proposed diamond truer;
Fig. 4 is the cross-sectional view of polishing pad trimmer in one embodiment of the present of invention;
Fig. 5 is the elevational schematic view of polishing pad trimmer in one embodiment of the present of invention, and Fig. 4 is the profile along AA direction in Fig. 5;
Fig. 6 is the partial enlarged drawing at Q position in polishing pad trimmer shown in Fig. 4, and in order to the shape of the clearer display abradant surface of energy, this enlarged drawing does not show the abrasive grains be cemented on abradant surface;
Fig. 7 is the cross-sectional view of polishing pad trimmer in an alternative embodiment of the invention;
Fig. 8 is the elevational schematic view of polishing pad trimmer in an alternative embodiment of the invention, and Fig. 7 is the profile along BB direction in Fig. 8;
Fig. 9 is the structural representation of polishing system in one embodiment of the present of invention.
Detailed description of the invention
Inventor finds through research, the diamond abrasive particles being positioned at marginal position holds one of flaky reason and is: as shown in Figure 1, in the process utilizing trimmer 1 pair of polishing pad to repair, the diamond abrasive particles 3 of outward flange position (in Fig. 1 position shown in dashed circle A) has larger linear velocity, is thus easily subject to larger shearing force; In addition, because the abradant surface S1 being consolidated with diamond abrasive particles 3 of trimmer 1 is plane, therefore, when utilizing trimmer 1 pair of polishing pad to repair, the compression distance entering polishing pad regardless of trimmer 1 is how many, all diamond abrasive particles 3 on abradant surface S1 all can grind polishing pad, add the frequency of utilization of the diamond abrasive particles 3 of outward flange position, cause the diamond abrasive particles 3 of outward flange position easily to peel off.
The diamond abrasive particles being positioned at marginal position holds two of flaky reason and is: continue with reference to shown in Fig. 1, when utilizing trimmer 1 pair of polishing pad to repair, trimmer 1 rotates simultaneously and moves back and forth, when trimmer 1 is along when moving near the direction of polishing pad center gradually, such as, when trimmer 1 moves along the direction shown in arrow C, because abradant surface S1 is plane, the diamond abrasive particles 3 of inward flange and outward flange position all can collide with the edge of polishing pad, the diamond abrasive particles 3 of inward flange and outward flange position is caused easily to peel off.
In order to solve the above-mentioned technical problem existing for existing polishing pad trimmer, inventor has and makes improvements existing polishing pad trimmer, provide the second polishing pad trimmer, as shown in Figure 2, the second trimmer 4 comprises matrix 5 and is cemented in the diamond abrasive particles 6 on matrix 5 abradant surface S1, and abradant surface S1 is convex shaped arc face (namely the center of circle of arc surface is positioned at the top of abradant surface S1).
Because abradant surface S1 is convex shaped arc face, therefore when utilizing trimmer 4 pairs of polishing pads to repair, when the compression distance that trimmer 4 enters polishing pad is less, the diamond abrasive particles 6 only having fraction to be positioned at abradant surface S1 middle position can grind polishing pad, the diamond abrasive particles 6 being positioned at abradant surface S1 outward flange and inward flange position can not grind, thus decrease the frequency of utilization of the diamond abrasive particles 6 of outward flange and inward flange position, what reduce the diamond abrasive particles 6 of outward flange and inward flange position peels off possibility.
In addition, when trimmer 4 is along when moving near the direction of polishing pad center gradually, because abradant surface S1 is convex shaped arc face, thus the diamond abrasive particles 6 of inward flange and outward flange position all can be positioned at above pad interface, the frequency that the diamond abrasive particles 6 reducing inward flange and outward flange position collides with polishing pad edge, what thus decrease the diamond abrasive particles 6 of inward flange and outward flange position peels off possibility.
But, inventor finds, above-mentioned the second polishing pad trimmer 4 can bring following problem again: the abradant surface S1 due to trimmer 4 is convex shaped arc face, therefore when utilizing trimmer 4 pairs of polishing pads to repair, trimmer 4 is less with the contact area of polishing pad, make only have part diamond abrasive particles 6 to grind, cause on average comparatively large to the load on every diamond abrasive particles 6, the possibility that the diamond abrasive particles 6 adding middle position peels off.
In addition, in order to the diamond abrasive particles solving outward flange position holds flaky technical problem, inventor has and makes another kind of improvement to existing polishing pad trimmer, provide the third polishing pad trimmer, as shown in Figure 3, the third trimmer 7 comprises matrix 8 and is cemented in the diamond abrasive particles 9 on matrix 8 abradant surface S1, and abradant surface S1 is by a plane, and being connected forms with a convex shaped arc face (namely the center of circle of arc surface is positioned at above abradant surface S1).Wherein, arc surface is looped around around the outward flange of plane, and that is only have the external boundary of plane to be connected with arc surface, the inner boundary of plane is not connected with arc surface, and namely the outward flange of abradant surface is arc surface, and inward flange is plane.
Arc surface due to abradant surface S1 is convex, therefore when utilizing trimmer 7 pairs of polishing pads to repair, when the compression distance that trimmer 7 enters polishing pad is less, only there is the diamond abrasive particles 9 on plane and fraction arc surface can grind polishing pad, most of diamond abrasive particles 9 of outward flange position can not grind, thus decrease the frequency of utilization of the diamond abrasive particles 9 of outward flange position, what reduce the diamond abrasive particles 9 of outward flange position peels off possibility.
Meanwhile, compared with above-mentioned the second trimmer 4, part face due to abradant surface S1 is plane, therefore when utilizing trimmer 7 pairs of polishing pads to repair, trimmer 7 increases to some extent with the contact area of polishing pad, make on average to reduce to some extent to the load on every diamond abrasive particles 9, reduce the possibility that diamond abrasive particles 9 peels off.But inventor finds, the third polishing pad trimmer 7 above-mentioned still exists the diamond abrasive particles 9 being positioned at inward flange position and holds flaky technical problem, and concrete reason can refer to noted earlier, does not repeat them here.
In order to solve the problem existing for above-mentioned the second and the third polishing pad trimmer, inventor has carried out again large quantity research, and ultimately providing polishing pad trimmer of the present invention, the abrasive grains being positioned at marginal position solving existing polishing pad trimmer holds flaky technical problem.
For enabling above-mentioned purpose of the present invention, feature and advantage more become apparent, and are described in detail specific embodiments of the invention below in conjunction with accompanying drawing.
Shown in composition graphs 4 to Fig. 6, the polishing pad trimmer 100 of the specific embodiment of the invention comprises: abrasive grains 110; Matrix 120.Matrix 120 has abradant surface S1, and abrasive grains 110 is cemented on abradant surface S1, and abradant surface S1 comprises: the edge grinding face S12 be connected and central abradant surface S11.Wherein, edge grinding face S12 is looped around around central abradant surface S11, and all borders of central abradant surface S11 are all connected with edge grinding face S12, edge grinding face S12 central abradant surface S11 projection in the plane central abradant surface S11 is surrounded.Central authorities abradant surface S11 is plane, and central abradant surface S11 is higher than edge grinding face S12.
In the present invention, central abradant surface S11 refers to so a kind of plane: when polishing pad trimmer 100 pairs of polishing pads are repaired, this plane is parallel with pad interface.Central authorities abradant surface S11 refers to higher than edge grinding face S12: when polishing pad trimmer 100 pairs of polishing pads are repaired, central abradant surface S11 is more first than edge grinding face S12 to be contacted with pad interface.In other words, abradant surface S1 is convex.
Because central abradant surface S11 is the plane parallel with pad interface, when polishing pad is repaired, no matter polishing pad trimmer 100 enters the compression distance of polishing pad is how many, the abrasive grains 110 be cemented on central abradant surface S11 all can be repaired, compared with being the polishing pad trimmer in convex shaped arc face with above-mentioned the second abradant surface, polishing pad trimmer in the present invention and the contact area of polishing pad increase to some extent, make on average to reduce to some extent to the load on every abrasive grains 110, the possibility that the abrasive grains 110 reducing middle position peels off.
Because abradant surface S1 is convex, when utilizing polishing pad trimmer 100 pairs of polishing pads to repair, abrasive grains 110 on the S12 of edge grinding face is higher than the abrasive grains 110 on central abradant surface S11, therefore when the compression distance that polishing pad trimmer 100 enters polishing pad is less, only there is the abrasive grains 110 on central abradant surface S11 and fraction edge grinding face S12 can grind polishing pad, abrasive grains 110 on major part edge grinding face S12 can not grind, thus the frequency of utilization of the abrasive grains 110 being positioned at marginal position is decreased, what reduce the abrasive grains 110 being positioned at marginal position peels off possibility.
In addition, because abradant surface S1 is convex, when utilizing polishing pad trimmer 100 pairs of polishing pads to repair, the abrasive grains 110 being positioned at marginal position can higher than the abrasive grains 110 on central abradant surface S11, when polishing pad trimmer 100 is along when moving near the direction of polishing pad center gradually, the abrasive grains 110 being positioned at marginal position can be positioned at above pad interface, reduces the possibility that the abrasive grains 110 that is positioned at marginal position collides with polishing pad edge.
In the present embodiment, matrix 120 also has non-abrasive side S2, and abradant surface S1, higher than non-abrasive side S2, makes when utilizing polishing pad trimmer 100 pairs of polishing pads to repair, only have abradant surface S1 can contact with pad interface, and non-abrasive side S2 can not contact with pad interface, abradant surface S1 is distributed on matrix 120 in the form of a ring, edge grinding face S12 comprises outward flange abradant surface S121 and inward flange abradant surface S122, outward flange abradant surface S121 and inward flange abradant surface S122 is all connected with central abradant surface S11, wherein, central authorities abradant surface S11 is between outward flange abradant surface S121 and inward flange abradant surface S122, and non-abrasive side S2 central abradant surface S11 projection in the plane, polished face S1 is in the projection encirclement in the plane of central abradant surface S11 institute, in other words, in an embodiment, non-abrasive side S2 is arranged in the annular space that abradant surface S1 limits, and for base bottom non-abrasive side S2 lower than abradant surface S1.
In the present embodiment, the shape of inward flange abradant surface S122 and outward flange abradant surface S121 is convex shaped arc face, and inward flange abradant surface S122 and outward flange abradant surface S121 is all tangent with central abradant surface S11, be all smoothly connected with central abradant surface S11 with outward flange abradant surface S121 to make inward flange abradant surface S122.Described convex shaped arc face refers to: when utilizing polishing pad trimmer 100 pairs of polishing pads to repair, the center of circle of arc surface is positioned at the top of abradant surface S1.
Because abradant surface S1 is convex, when utilizing polishing pad trimmer 100 pairs of polishing pads to repair, abrasive grains 110 on outward flange abradant surface S121 and inward flange abradant surface S122 is all higher than the abrasive grains 110 on central abradant surface S11, therefore when the compression distance that polishing pad trimmer 100 enters polishing pad is less, only there is central abradant surface S11, abrasive grains 110 on fraction outward flange abradant surface S121 and inward flange abradant surface S122 can grind polishing pad, the abrasive grains 110 of major part outward flange and inward flange position can not grind, thus the frequency of utilization of the abrasive grains 110 of outward flange and inward flange position is decreased, what reduce the abrasive grains 110 of outward flange and inward flange position peels off possibility.
In addition, because abradant surface S1 is convex, when utilizing polishing pad trimmer 100 pairs of polishing pads to repair, abrasive grains 110 on inward flange abradant surface S122 can higher than the abrasive grains 110 on central abradant surface S11, when polishing pad trimmer 100 is along when moving near the direction of polishing pad center gradually, the abrasive grains 110 of inward flange position can be positioned at above pad interface, the possibility that the abrasive grains 110 reducing inward flange position collides with polishing pad edge.
As shown in Figure 6, central authorities abradant surface S11 should have suitable width W, on the one hand, the width W of central authorities abradant surface S11 should be as far as possible larger, make there are enough contacts area between polishing pad trimmer 100 and polishing pad, and then the frequency that on average, reduction abrasive grains 110 moderate to the load on every abrasive grains 110 is peeled off; On the other hand, the width W of central authorities abradant surface S11 again can not be excessive, to avoid the oversize of polishing pad trimmer 100, and avoids the abrasive grains 110 being positioned at outward flange position on central abradant surface S11 to peel off, concrete reason is analyzed before can refer to, and does not repeat them here.In one embodiment, the width W of central abradant surface S11 is 1mm to 30mm, when the size of polishing pad trimmer 100 is larger, can select the width W of relatively large central abradant surface S11, otherwise, the width W of relatively little central abradant surface S11 can be selected.
When the shape of outward flange abradant surface S121 is arc surface, outward flange abradant surface S121 should have suitable radius R 1, on the one hand, the radius R 1 of arc surface should be as far as possible larger, make, between polishing pad trimmer 100 and polishing pad, there is enough contacts area, and then the frequency that on average, reduction abrasive grains 110 moderate to the load on every abrasive grains 110 is peeled off; On the other hand, the radius R 1 of arc surface again can not be excessive, to avoid the contact area between outward flange abradant surface S121 and polishing pad excessive, the abrasive grains 110 outward flange abradant surface S121 being positioned at outward flange position (comparatively away from central abradant surface S11) is caused easily to peel off, concrete reason is analyzed before can refer to, and does not repeat them here.Such as, if the width W of central abradant surface S11 is less, and when the radius R 1 of arc surface is less, the contact area between polishing pad trimmer 100 and polishing pad can be caused less, easily cause abrasive grains 110 to peel off.In one embodiment, the radius R 1 of outward flange abradant surface S121 is 15mm to 25mm.
When the shape of inward flange abradant surface S122 is arc surface, inward flange abradant surface S122 should have suitable radius R 2, on the one hand, the radius R 2 of arc surface should be as far as possible larger, make, between polishing pad trimmer 100 and polishing pad, there is enough contacts area, and then the frequency that on average, reduction abrasive grains 110 moderate to the load on every abrasive grains 110 is peeled off; On the other hand, the radius R 2 of arc surface again can not be excessive, to avoid inward flange abradant surface S122 close to plane, make polishing pad trimmer 100 along when moving near the direction of polishing pad center gradually, the abrasive grains 110 being positioned at inward flange position (closer non-abrasive side S2) on inward flange abradant surface S122 and the distance between pad interface less, the possibility that the abrasive grains 110 adding inward flange position collides with polishing pad edge.In one embodiment, the radius R 2 of inward flange abradant surface S122 is 15mm to 25mm.
In the present embodiment, abradant surface S1 forms by being connected with the outward flange abradant surface S121 in convex shaped arc face in the central abradant surface S11 of plane, the inward flange abradant surface S122 in convex shaped arc face, and two arc surfaces are all tangent with central abradant surface S11, on the one hand, make abradant surface S1 be a smooth surface, avoid in abradant surface S1 and there is the generation that stress concentrates situation; On the other hand, make the processing technology of abradant surface S1 more simple.
But the shape of abradant surface S1 China and foreign countries edge grinding face S121 and inward flange abradant surface S122 only can not be confined to the present embodiment.
In other embodiments, the outward flange abradant surface S121 in arc surface and inward flange abradant surface S122 also can not be tangent with central abradant surface S11.
In other embodiments, the shape of outward flange abradant surface S121 and inward flange abradant surface S122 also can be other cambered surfaces.
In other embodiments, outward flange abradant surface S121 and inward flange abradant surface S122 also can be connected by multiple and form, and described multiple face comprises: at least one convex-shaped arc surface, and at least one plane, and this plane is not parallel with central abradant surface S11.In order to make outward flange abradant surface S121 be a smooth curved surface, the face be connected with central abradant surface S11 of outward flange abradant surface S121 is: the convex-shaped arc surface tangent with central abradant surface S11.Similarly, in order to make inward flange abradant surface S122 be a smooth curved surface, the face be connected with central abradant surface S11 of inward flange abradant surface S122 is: the convex-shaped arc surface tangent with central abradant surface S11.In this case, in order to make the processing technology of outward flange abradant surface S121 and inward flange abradant surface S122 more simple, the cambered surface that outward flange abradant surface S121 and inward flange abradant surface S122 comprises is arc surface, and the center of circle of arc surface is positioned at the top of abradant surface S1.
Such as, outward flange abradant surface S121 and inward flange abradant surface S122 can be connected with a plane by an arc surface and to form, and this arc surface is connected with central abradant surface S11 and tangent, and this plane is not parallel with central abradant surface S11, and this plane and arc surface tangent.Again such as, outward flange abradant surface S121 and inward flange abradant surface S122 can be connected with a plane by two arc surfaces and to form, this plane is with two arc surfaces tangent between two arc surfaces, and this plane is not parallel with central abradant surface S11, one of them arc surface is connected with central abradant surface S11 and tangent.
When outward flange abradant surface S121 and inward flange abradant surface S122 is the smooth surface be made up of arc surface and plane, abradant surface S1 can be made equally to be a smooth surface, to avoid in abradant surface S1 and there is the generation that stress concentrates situation.
Certainly, the shape of outward flange abradant surface S121 and inward flange abradant surface S122 can not only be confined to above-mentioned given embodiment, and those skilled in the art can make corresponding adjustment or change on the basis of given embodiment.
In the present embodiment, shown in composition graphs 4 and Fig. 5, matrix 120 is in the form of annular discs, and the radius of matrix 120 can be 100mm to 300mm.Certainly, matrix 120 also can be arranged to other shape being suitable for repairing polishing pad, only should not be confined to the present embodiment.The material of matrix 120 can be stainless steel.
Abrasive grains 110 can be diamond particles or cubic boron nitride (CBN) particle.In a particular embodiment, abrasive grains 110 is diamond particles.Certainly, other also can be selected to be suitable for the abrasive grains 110 repaired polishing pad, to should not be limited to given embodiment.
Polishing pad trimmer 100 also comprises bonding agent 130, utilizes bonding agent 130 abrasive grains 110 can be cemented on the abradant surface S1 of matrix 120.Abrasive grains 110 method be cemented on matrix 120 has multiple, be cemented in the method on matrix 120 according to abrasive grains 110, polishing pad trimmer 100 can be electrodeposition-type polishing pad trimmer, chemical soldering type polishing pad trimmer, metal sintering type polishing pad trimmer or chemical vapor deposition type polishing pad trimmer.
It should be noted that, the distribution of abradant surface S1 on matrix 120 can not only be confined to above-mentioned given embodiment, and those skilled in the art can make corresponding adjustment or change on the basis of given embodiment.Such as, in another embodiment of the present invention, shown in composition graphs 7 to Fig. 8, abradant surface S1 is rounded to be distributed on matrix 120, edge grinding face S12 central abradant surface S11 projection in the plane central abradant surface S11 is surrounded.Because abradant surface S1 is distributed on matrix 120 in the mode of other than ring type, whole edge grinding face S12 is all positioned at the outward flange of matrix 120.Central authorities abradant surface S11 is plane, and central abradant surface S11 is higher than edge grinding face S12.In a particular embodiment, edge grinding face S12 is convex-shaped arc surface.Certainly, edge grinding face S12 also can be connected by multiple and form, and described multiple face comprises: at least one convex-shaped arc surface, the plane not parallel with central abradant surface S11 with at least one.Further, when edge grinding face S12 is convex-shaped arc surface, edge grinding face S12 and central abradant surface S11 is tangent; When edge grinding face S12 by multiple be connected form time, the face that edge grinding face S12 is connected with central abradant surface S11 is: the convex-shaped arc surface tangent with central abradant surface S11.
In addition, present invention also offers a kind of trimming device for polishing cushion, it comprises the polishing pad trimmer 100 in any one embodiment above-mentioned.In one embodiment, as shown in Figure 9, trimming device for polishing cushion 200 also comprises: the drives structure driving polishing pad trimmer 100.In the present embodiment, described drives structure comprises: the driving shaft 210 be connected with polishing pad trimmer 100, rotates for driving polishing pad trimmer 100; The swing arm 220 be rotationally connected with driving shaft 210; Support the swinging axle 230 of swing arm 220, and under the effect of swinging axle 230, swing arm 220 can be ordered about and move; Finishing fluid injector 240.Wherein, motor (not shown) is arranged in swing arm 220, and this motor is connected to driving shaft 230, rotates to order about driving shaft 210, thus drives polishing pad trimmer 100 to rotate; Swinging axle 230 is connected to oscillating motor (not shown), and wobbling motor can drive swinging axle 230 to swing, and then drives polishing pad trimmer 100 substantially to move on the surface of polishing pad 310 along the radial direction of pad interface.When trimming polished pad 310, polishing pad trimmer 100 is pressed on polishing pad 310, and polishing block 320 and polishing pad trimmer 100 rotate, and repairs liquid and be supplied on the polished surface of polishing pad 310.
In other embodiments, trimming device for polishing cushion 200, except comprising polishing pad trimmer 100, can also comprise other structure, only can not be confined to the present embodiment.
In addition, continue with reference to shown in Fig. 9, present invention also offers a kind of polishing system 300, comprising: burnishing device, burnishing device comprises polishing pad 310; Trimming device for polishing cushion 200 in any one embodiment above-mentioned, for repairing polishing pad 310.
In the present embodiment, described burnishing device also comprises: the polishing block 320 supporting polishing pad 310; The bistrique 330 of polishing pad 310 upper surface is pressed in for fixing silicon chip and by silicon chip; Be connected to the rotating shaft 340 of bistrique 330 upper surface; Abrasive jet 350; The swing arm 360 be rotationally connected with rotating shaft 340; Support the swinging axle 370 of swing arm 360.Wherein, motor (not shown) is arranged in swing arm 360, and this motor is connected to rotating shaft 340, rotates to order about rotating shaft 340, thus band rotary bistrique 330 is rotated.Swinging axle 370 is connected to oscillating motor (not shown), and wobbling motor can drive swinging axle 370 to swing, and then band rotary bistrique 330 moves on the surface of polishing pad 310 along the radial direction of pad interface substantially.
Although the present invention discloses as above, the present invention is not defined in this.Any those skilled in the art, without departing from the spirit and scope of the present invention, all can make various changes or modifications, and therefore protection scope of the present invention should be as the criterion with claim limited range.
Claims (11)
1. a polishing pad trimmer, is characterized in that, comprising:
Abrasive grains;
Matrix, has abradant surface, and described abrasive grains is cemented on described abradant surface, and described abradant surface comprises: the edge grinding face be connected and central abradant surface, and described edge grinding face is looped around around central abradant surface;
Described central abradant surface is plane, and described central abradant surface is higher than edge grinding face.
2. polishing pad trimmer as claimed in claim 1, it is characterized in that, described edge grinding face is convex-shaped arc surface;
Or described edge grinding face is connected by multiple and forms, and described multiple face comprises: at least one convex-shaped arc surface, the plane not parallel with described central abradant surface with at least one.
3. polishing pad trimmer as claimed in claim 2, is characterized in that, when described edge grinding face is convex-shaped arc surface, described edge grinding face and central abradant surface tangent;
When described edge grinding face by multiple be connected form time, the face that described edge grinding face is connected with central abradant surface is: the convex-shaped arc surface tangent with central abradant surface.
4. polishing pad trimmer as claimed in claim 3, it is characterized in that, described cambered surface is arc surface.
5. polishing pad trimmer as claimed in claim 1, it is characterized in that, described abradant surface distributes on the matrix in the form of a ring, and described edge grinding face comprises inward flange abradant surface and outward flange abradant surface, and described central abradant surface is between inward flange abradant surface and outward flange abradant surface;
Described matrix also has non-abrasive side, described non-abrasive side described central abradant surface projection in the plane, by described abradant surface described central abradant surface projection in the plane surround;
Described non-abrasive side is lower than abradant surface.
6. polishing pad trimmer as claimed in claim 1, it is characterized in that, described matrix is in the form of annular discs.
7. polishing pad trimmer as claimed in claim 1, it is characterized in that, described abrasive grains is diamond particles or cubic boron nitride particle.
8. polishing pad trimmer as claimed in claim 1, it is characterized in that, described polishing pad trimmer is electrodeposition-type polishing pad trimmer, chemical soldering type polishing pad trimmer, metal sintering type polishing pad trimmer or chemical vapor deposition type polishing pad trimmer.
9. a trimming device for polishing cushion, is characterized in that, comprising: the polishing pad trimmer described in any one of claim 1 to 8.
10. trimming device for polishing cushion as claimed in claim 9, is characterized in that, also comprise: the drives structure driving described polishing pad trimmer.
11. 1 kinds of polishing systems, is characterized in that, comprising:
Burnishing device, comprises polishing pad;
Trimming device for polishing cushion according to claim 9, for repairing described polishing pad.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310217195.0A CN104209864B (en) | 2013-06-03 | Polishing pad trimmer, trimming device for polishing cushion and polishing system | |
| TW102131608A TWI510332B (en) | 2013-06-03 | 2013-09-03 | Polishing pad dresser, polishing pad dressing device and polishing system |
| JP2013215332A JP2014233831A (en) | 2013-06-03 | 2013-10-16 | Abrasive pad dresser, abrasive pad dresser device, and polishing system |
| KR1020130124681A KR20140142120A (en) | 2013-06-03 | 2013-10-18 | Polishing pad dresser, polishing pad dressing device and polishing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310217195.0A CN104209864B (en) | 2013-06-03 | Polishing pad trimmer, trimming device for polishing cushion and polishing system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104209864A true CN104209864A (en) | 2014-12-17 |
| CN104209864B CN104209864B (en) | 2018-02-09 |
Family
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Cited By (5)
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| CN107662159A (en) * | 2017-09-15 | 2018-02-06 | 清华大学 | Repair control method, device, trimmer and the polissoir of polishing pad |
| CN110450046A (en) * | 2018-05-07 | 2019-11-15 | 中芯国际集成电路制造（天津）有限公司 | Abrasive disk and chemical mechanical polishing device |
| CN112497089A (en) * | 2020-12-15 | 2021-03-16 | 蚌埠中光电科技有限公司 | Method for processing edge of processing surface of grinding pad |
| CN113478392A (en) * | 2021-08-03 | 2021-10-08 | 北京烁科精微电子装备有限公司 | Diamond collator and grinding machine table with same |
| CN114523366A (en) * | 2022-04-21 | 2022-05-24 | 成都市鸿侠科技有限责任公司 | Burnishing machine is used in fine machining of aircraft wing flap slide rail |
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| JP2007268666A (en) * | 2006-03-31 | 2007-10-18 | Noritake Super Abrasive:Kk | Cmp pad conditioner |
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| JPH10277919A (en) * | 1997-04-01 | 1998-10-20 | Asahi Diamond Ind Co Ltd | Conditioner and its manufacture |
| CN1286158A (en) * | 1999-09-01 | 2001-03-07 | 三菱综合材料株式会社 | Abrasive tool having metal bound phase |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107662159A (en) * | 2017-09-15 | 2018-02-06 | 清华大学 | Repair control method, device, trimmer and the polissoir of polishing pad |
| CN107662159B (en) * | 2017-09-15 | 2019-04-02 | 清华大学 | Modify control method, device, trimmer and the polissoir of polishing pad |
| CN110450046A (en) * | 2018-05-07 | 2019-11-15 | 中芯国际集成电路制造（天津）有限公司 | Abrasive disk and chemical mechanical polishing device |
| CN112497089A (en) * | 2020-12-15 | 2021-03-16 | 蚌埠中光电科技有限公司 | Method for processing edge of processing surface of grinding pad |
| CN113478392A (en) * | 2021-08-03 | 2021-10-08 | 北京烁科精微电子装备有限公司 | Diamond collator and grinding machine table with same |
| CN114523366A (en) * | 2022-04-21 | 2022-05-24 | 成都市鸿侠科技有限责任公司 | Burnishing machine is used in fine machining of aircraft wing flap slide rail |
| CN114523366B (en) * | 2022-04-21 | 2022-07-15 | 成都市鸿侠科技有限责任公司 | Burnishing machine is used in fine machining of aircraft wing flap slide rail |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014233831A (en) | 2014-12-15 |
| KR20140142120A (en) | 2014-12-11 |
| TW201446413A (en) | 2014-12-16 |
| TWI510332B (en) | 2015-12-01 |
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