CN104185382A - Installing base for manual installation of heat capacity tooth sleeve on circuit board - Google Patents

Installing base for manual installation of heat capacity tooth sleeve on circuit board Download PDF

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Publication number
CN104185382A
CN104185382A CN201410437536.XA CN201410437536A CN104185382A CN 104185382 A CN104185382 A CN 104185382A CN 201410437536 A CN201410437536 A CN 201410437536A CN 104185382 A CN104185382 A CN 104185382A
Authority
CN
China
Prior art keywords
supporting bracket
circuit board
base plate
manual installation
supporting plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410437536.XA
Other languages
Chinese (zh)
Inventor
黄掌飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Wuzhong District Xukou Guangbo Mold Processing Factory
Original Assignee
Suzhou Wuzhong District Xukou Guangbo Mold Processing Factory
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Wuzhong District Xukou Guangbo Mold Processing Factory filed Critical Suzhou Wuzhong District Xukou Guangbo Mold Processing Factory
Priority to CN201410437536.XA priority Critical patent/CN104185382A/en
Publication of CN104185382A publication Critical patent/CN104185382A/en
Pending legal-status Critical Current

Links

Abstract

The invention discloses an installing base for manual installation of a heat capacity tooth sleeve on a circuit board. The installing base for manual installation of the heat capacity tooth sleeve on the circuit board comprises an L-shaped base plate, a supporting plate, a lower positioning barrier strip and upper positioning strips, wherein the supporting plate is obliquely installed on the L-shaped base plate, the lower edge of the supporting plate is fixed to the lower side face of the L-shaped base plate, a rear plane of the supporting plate is fixed to the upper edge of the upper side face of the L-shaped base plate, the lower positioning barrier strip is arranged on the portion, close to the lower edge of the supporting plate, of the lower side face of the L-shaped base plate, the lower positioning barrier strip is parallel to the lower edge of the supporting plate, and the upper positioning strips are arranged on the upper half of the left lateral side and the upper half of the right lateral side of the front plane of the supporting plate. Due to the mode, the installing base is simple in structure, convenient and fast to use, low in manufacturing cost, low in cost of secondary reinstallation, and convenient for workers to operate and use.

Description

A kind of mount pad of circuit board manual installation thermal capacitance facing
Technical field
The present invention relates to frock clamp field, particularly relate to a kind of mount pad of circuit board manual installation thermal capacitance facing.
Background technology
During in modern industry is manufactured, especially the detection of electronic product and assembling are produced, what needs were a lot of manually completes various complex work flow processs, so overall streamline production operation is brought the interference of a lot of human factors, cause the waste of certain production time, especially the installation of the tiny parts of some little circuit boards, especially thermal capacitance facing bury dress, the circuit board of some small lot batch manufactures is as adopted the words of automatically burying installation, cost is too high, once back no longer produces, this thermal capacitance facing buries installation automatically so, just need repacking, otherwise will use, will produce like this waste.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of mount pad of circuit board manual installation thermal capacitance facing, and it is simple in structure, easy to use, and cost of manufacture is lower, and the cost that secondary changes the outfit is lower, and the operation of being also convenient to workman is simultaneously used.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: the mount pad that a kind of circuit board manual installation thermal capacitance facing is provided, the mount pad of this circuit board manual installation thermal capacitance facing comprises " L " shape base plate, supporting bracket, lower positioning retaining strip and upper positioning strip, described supporting bracket tilts to be installed on " L " shape base plate, the downside of " L " shape base plate is fixed in the lower edge of supporting bracket, the back plane of supporting bracket is fixed on the upper side upper edge of " L " shape base plate, on the downside of " L " shape base plate, be provided with lower positioning retaining strip near supporting bracket lower edge place, lower positioning retaining strip is parallel to supporting bracket lower edge, the left and right sides edge of the top portion of supporting bracket frontal plane is provided with positioning strip,
Preferably, the left and right sides edge of described supporting bracket is equipped with the semi-circular opening that picks and places circuit board, is also provided with nine thermal capacitance facings installations and dodges hole in supporting bracket.
The invention has the beneficial effects as follows: the mount pad of a kind of circuit board manual installation of the present invention thermal capacitance facing, it is simple in structure, easy to use, and cost of manufacture is lower, and the cost that secondary changes the outfit is lower, and the operation of being also convenient to workman is simultaneously used.
Brief description of the drawings
Fig. 1 is the structure enlarged diagram of the mount pad of a kind of circuit board manual installation of the present invention thermal capacitance facing.
Embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present invention is described in detail, thereby so that the advantage of invention and feature can be easier to be it will be appreciated by those skilled in the art that, protection scope of the present invention is made to more explicit defining.
Refer to Fig. 1, the embodiment of the present invention comprises:
A kind of mount pad of circuit board manual installation thermal capacitance facing, the mount pad of this circuit board manual installation thermal capacitance facing comprises " L " shape base plate 1, supporting bracket 2, lower positioning retaining strip 3 and upper positioning strip 4, described supporting bracket 2 tilts to be installed on " L " shape base plate 1, the downside of " L " shape base plate 1 is fixed in the lower edge of supporting bracket 2, the back plane of supporting bracket 2 is fixed on the upper side upper edge of " L " shape base plate 1, on the downside of " L " shape base plate 1, be provided with lower positioning retaining strip 3 near supporting bracket 2 lower edge places, lower positioning retaining strip 3 is parallel to supporting bracket 2 lower edges, the left and right sides edge of the supporting bracket 2 top portions of frontal plane is provided with positioning strip 4, the left and right sides edge of described supporting bracket 2 is equipped with the semi-circular opening 5 that picks and places circuit board, is also provided with nine thermal capacitance facings installations and dodges hole 6 in supporting bracket 2.
The mount pad of a kind of circuit board manual installation of the present invention thermal capacitance facing, it is simple in structure, easy to use, and cost of manufacture is lower, and the cost that secondary changes the outfit is lower, and the operation of being also convenient to workman is simultaneously used.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes specification of the present invention and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.

Claims (2)

1. the mount pad of a circuit board manual installation thermal capacitance facing, it is characterized in that: the mount pad of this circuit board manual installation thermal capacitance facing comprises " L " shape base plate, supporting bracket, lower positioning retaining strip and upper positioning strip, described supporting bracket tilts to be installed on " L " shape base plate, the downside of " L " shape base plate is fixed in the lower edge of supporting bracket, the back plane of supporting bracket is fixed on the upper side upper edge of " L " shape base plate, on the downside of " L " shape base plate, be provided with lower positioning retaining strip near supporting bracket lower edge place, lower positioning retaining strip is parallel to supporting bracket lower edge, the left and right sides edge of the top portion of supporting bracket frontal plane is provided with positioning strip.
2. the mount pad of a kind of circuit board manual installation thermal capacitance facing according to claim 1, is characterized in that: the left and right sides edge of described supporting bracket is equipped with the semi-circular opening that picks and places circuit board, is also provided with nine thermal capacitance facings installations and dodges hole in supporting bracket.
CN201410437536.XA 2014-09-01 2014-09-01 Installing base for manual installation of heat capacity tooth sleeve on circuit board Pending CN104185382A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410437536.XA CN104185382A (en) 2014-09-01 2014-09-01 Installing base for manual installation of heat capacity tooth sleeve on circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410437536.XA CN104185382A (en) 2014-09-01 2014-09-01 Installing base for manual installation of heat capacity tooth sleeve on circuit board

Publications (1)

Publication Number Publication Date
CN104185382A true CN104185382A (en) 2014-12-03

Family

ID=51966017

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410437536.XA Pending CN104185382A (en) 2014-09-01 2014-09-01 Installing base for manual installation of heat capacity tooth sleeve on circuit board

Country Status (1)

Country Link
CN (1) CN104185382A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050185407A1 (en) * 2004-02-20 2005-08-25 Innolux Display Corp. Assembling apparatus for liquid crystal displays
CN201299273Y (en) * 2008-09-27 2009-09-02 何欣然 Near-sightedness prevention book rack
CN201841451U (en) * 2010-10-19 2011-05-25 广西晶联光电材料有限责任公司 Edging and chamfering fixture for planar ceramic target
CN204031621U (en) * 2014-09-01 2014-12-17 苏州市吴中区胥口广博模具加工厂 A kind of mount pad of circuit board manual installation thermal capacitance facing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050185407A1 (en) * 2004-02-20 2005-08-25 Innolux Display Corp. Assembling apparatus for liquid crystal displays
CN201299273Y (en) * 2008-09-27 2009-09-02 何欣然 Near-sightedness prevention book rack
CN201841451U (en) * 2010-10-19 2011-05-25 广西晶联光电材料有限责任公司 Edging and chamfering fixture for planar ceramic target
CN204031621U (en) * 2014-09-01 2014-12-17 苏州市吴中区胥口广博模具加工厂 A kind of mount pad of circuit board manual installation thermal capacitance facing

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20141203