CN104112815B - Light emitting diode device and manufacturing method thereof - Google Patents

Abstract

The invention provides a light emitting diode device, which comprises a substrate, a first light emitting diode, a second light emitting diode, an insulating layer, a wire layer, a reflecting layer, a first connecting pad and a second connecting pad. The first light emitting diode is arranged on the substrate and comprises a first electrode and a first light emitting area. The second light emitting diode is arranged on the substrate and has a gap with the first light emitting diode. The second light emitting diode includes a second electrode and a second light emitting region. The wire layer is electrically connected with the first and the second light emitting diodes. The reflecting layer is positioned between the first light-emitting area and the first connecting pad and between the second light-emitting area and the second connecting pad. The insulating layer is filled in the gap and positioned between the wire layer and the reflecting layer. The insulating layer contacts the first and second light emitting diodes. The first pad and the second pad are respectively arranged on the first electrode and the second electrode.

Description

Light emitting diode device and manufacturing method thereof

technical field

The present invention relates to a light-emitting diode device and its manufacturing method, and in particular to a high-voltage light-emitting diode device and its manufacturing method.

Background technique

Light-emitting diodes have advantages such as long life, small size, high shock resistance, low heat generation, and low power consumption, so they have been widely used as indicators or light sources in households and various equipment. In recent years, due to the continuous improvement of the luminous efficiency of light-emitting diodes, light-emitting diodes have gradually replaced fluorescent lamps and incandescent bulbs in some fields, such as scanner light sources that require high-speed response, backlights for liquid crystal displays, or dashboard lighting for front lights. , traffic lights, and general lighting installations. The light-emitting principle of light-emitting diodes is to convert electrical energy into light, that is, to apply current to the light-emitting diodes, and release them in the form of light through the combination of electrons and holes, thereby achieving the effect of light.

It is known that the technical means of packaging high-voltage LED light sources is to first produce a single LED chip, then bond multiple LED chips on the packaging substrate, and use wire bonding to complete the electrical connection. In detail, the manufacturing process of the high-voltage LED package is generally to mount a plurality of LED chips on a carrier, such as a printed circuit board carrier, substrate or sub-mount. Then, a plurality of wires are formed between the contacts of the LED chip and the carrier to electrically connect the LED chip to the carrier. The light-emitting diode chip mainly makes the light-emitting active layer of the light-emitting diode chip emit light by applying a voltage difference to the wires, and the light-emitting active layer also generates heat energy.

In this way, the high-voltage LED package will generate more heat energy than the general LED package with only one LED chip, and its heat dissipation is carried out through the growth substrate with extremely poor thermal conductivity (such as a sapphire substrate). Thermal energy is conducted to the outside. Therefore, if the heat generated by the light-emitting active layer of the light-emitting diode chip cannot be effectively discharged, especially when driven by high current, the light-emitting diode chip is often easily damaged due to overheating.

Contents of the invention

The invention provides a light emitting diode device, which can improve the heat dissipation efficiency of the device, and further increase the power of each light emitting diode.

The light emitting diode device of the present invention includes a substrate, a first light emitting diode, a second light emitting diode, an insulating layer, a wire layer, a reflective layer, a first pad and a second pad. The first light emitting diode is disposed on the surface of the substrate and includes a first electrode and a first light emitting area. The second light emitting diode is arranged on the surface and has a gap with the first light emitting diode. The second light emitting diode includes a second electrode and a second light emitting region. The wire layer is disposed in the gap and is electrically connected to the first and second light emitting diodes. The reflective layer is continuously disposed on the first light emitting diode and the second light emitting diode, and is located between the first light emitting area and the first pad and between the second light emitting area and the second pad. The first pad and the second pad are respectively disposed on the first electrode and the second electrode and are electrically connected to the first electrode and the second electrode.

The manufacturing method of the LED device of the present invention includes the following steps. Firstly, a light emitting diode chip structure is provided, which includes a substrate, a first light emitting diode, a second light emitting diode and a wiring layer, wherein the first light emitting diode is arranged on a surface of the substrate, and includes a first electrode and a first light-emitting area. The second light emitting diode is arranged on the surface and has a gap with the first light emitting diode. The second light emitting diode includes a second electrode and a second light emitting area. The wire layer is connected to the first LED and the second LED. Next, a first insulating layer is formed to cover the LED chip structure. Next, a reflective layer is formed, covering the first insulating layer, and located on the first light-emitting region and the second light-emitting region. Next, a second insulating layer is formed to cover the reflective layer. Next, respectively disposing a first pad and a second pad on the first electrode and the second electrode.

In an embodiment of the present invention, the above-mentioned first light-emitting diode includes a first semiconductor layer, a first light-emitting layer and a second semiconductor layer stacked sequentially from the surface. The first light emitting layer defines a first light emitting region. The first electrode is disposed on the second semiconductor layer. The second light emitting diode includes a third semiconductor layer, a second light emitting layer and a fourth semiconductor layer stacked sequentially from the surface. The second light emitting layer defines a second light emitting region. The second electrode is disposed on the third semiconductor layer.

In an embodiment of the present invention, the above-mentioned wire layer is connected to the first semiconductor layer and the fourth semiconductor layer.

In an embodiment of the present invention, the above-mentioned insulating layer is in contact with the first semiconductor layer, the second semiconductor layer, the third semiconductor layer and the fourth semiconductor layer, and covers the surface of the reflective layer.

In an embodiment of the present invention, the above-mentioned first semiconductor layer and the third semiconductor layer are N-type semiconductor layers. The second semiconductor layer and the fourth semiconductor layer are P-type semiconductor layers.

In an embodiment of the present invention, the above-mentioned first semiconductor layer and the third semiconductor layer are N-type semiconductor layers. The second semiconductor layer and the fourth semiconductor layer are P-type semiconductor layers.

In an embodiment of the present invention, the above-mentioned first light-emitting layer and the second light-emitting layer include multiple quantum wells (multiple quantum wells, MQW).

In an embodiment of the present invention, the above light emitting diode device further includes a reflective layer disposed in the gap, and the insulating layer covers the surface of the reflective layer.

In an embodiment of the present invention, after the above-mentioned step of forming the second insulating layer, a step of exposing the top surfaces of the first electrode and the second electrode is further included, and the step includes: first, after forming the first insulating layer, Part of the first insulating layer is removed to expose top surfaces of the first electrode and the second electrode. Next, after the reflective layer is formed, part of the reflective layer is removed to expose the top surfaces of the first electrode and the second electrode. Next, after forming the second insulating layer, part of the second insulating layer is removed to expose the top surfaces of the first electrode and the second electrode.

Based on the above, pads are provided on the surface of the light emitting diode device of the present invention away from the substrate, and the electrical properties of the electrodes are extended to the pads, so that the light emitting diode device can be connected to the carrier by flip-chip welding. In this way, the thermal energy generated by the LED device can be conducted to the carrier through the pad with high thermal conductivity, without dissipating heat through the substrate with poor thermal conductivity, thereby improving the heat dissipation efficiency of the LED device. Furthermore, since the heat dissipation efficiency of the LED device is improved, the driving current that the LED can carry can also be increased accordingly, thereby reducing the number of LEDs in the LED device, thereby reducing the production cost. In addition, the reflective layer is disposed between the light-emitting layer and the contact pad of the light-emitting diode device to reflect the light emitted by the light-emitting layer, thereby improving the light extraction efficiency of the light-emitting diode device.

Description of drawings

In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, wherein:

1A to 1H are schematic cross-sectional views of a fabrication process of a light emitting diode device according to an embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view of a light emitting diode device according to an embodiment of the present invention.

Explanation of component numbers in the figure:

100: LED device

110: Substrate

112: surface

120: First LED

122: first semiconductor layer

124: The first luminescent layer

126: Second semiconductor layer

128: first electrode

130: Second LED

132: The third semiconductor layer

134: Second light-emitting layer

136: Fourth semiconductor layer

138: second electrode

140: insulating layer

140a: first insulating layer

140b: second insulating layer

150: wire layer

160: first pad

170: Second pad

190: reflective layer

200: Carrier

G: Gap

detailed description

1A to 1H are schematic cross-sectional views of a fabrication process of a light emitting diode device according to an embodiment of the present invention. The manufacturing method of the light emitting diode device of this embodiment includes the following steps: first, provide a light emitting diode chip structure as shown in FIG. 1A, which includes a substrate 110, a first light emitting diode 120, a second light emitting diode 130 and a wire layer 150 . In this embodiment, the substrate 110 may be a growth substrate for semiconductor growth, such as a sapphire substrate. The first light emitting diode 120 is disposed on a surface 112 of the substrate 110 and includes a first electrode 128 and a first light emitting layer 124 , wherein the first light emitting layer 124 defines a first light emitting region. In detail, the first light-emitting diode 120 includes a first semiconductor layer 122, a first light-emitting layer 124 and a second semiconductor layer 126 stacked in sequence from the surface 112 to a direction away from the surface 112, and the first light-emitting layer 124 defines out of the above-mentioned first light-emitting region. The first light emitting diode 120 further includes a first electrode 128 and a third electrode (not shown in the figure), the first electrode 128 is disposed on the second semiconductor layer 126 , and the third electrode is disposed on the first semiconductor layer 122 .

According to the above, the second LED 130 is disposed on the surface 112 with a gap G between the second LED 120 and the first LED 120 . The second light emitting diode 130 includes a second electrode 138 and a second light emitting layer 134, wherein the second light emitting layer 134 defines a second light emitting region. Specifically, the second light-emitting diode 130 includes a third semiconductor layer 132, a second light-emitting layer 134 and a fourth semiconductor layer 136, which are respectively stacked in sequence from the surface 112 to a direction away from the surface 112, and the second light-emitting layer 134 defines the above-mentioned second light emitting area. The second light emitting diode 130 further includes a fourth electrode (not shown in the figure), the second electrode 138 is disposed on the third semiconductor layer 132 , and the fourth electrode is disposed on the fourth semiconductor layer 136 . Specifically, the first semiconductor layer 122 and the third semiconductor layer 132 in this embodiment are N-type semiconductor layers, while the second semiconductor layer 126 and the fourth semiconductor layer 136 are P-type semiconductor layers. In addition, the first light-emitting layer 124 and the second light-emitting layer 134 are, for example, multiple quantum wells (MQW).

Following the above, in the present invention, a wire layer 150 is disposed on the surface of the substrate 110 and located in the gap G, as shown in FIG. 1A , to electrically connect the first LED 120 and the second LED 130 . More specifically, the wire layer 150 is electrically connected to the third electrode of the first light emitting diode 120 and the fourth electrode of the second light emitting diode 130 . The material of the wire layer 150 includes but is not limited to nickel (Ni), gold (Au), rhodium (Rh), silver (Ag), titanium (Ti), aluminum (Al), tantalum (Ta), vanadium (V), etc. Conductive material or combination thereof. Next, as shown in FIG. 1B, a first insulating layer 140a is formed, which covers the LED chip structure shown in FIG. 1A, that is, the first insulating layer 140a covers the first LED 120, the second LED 130 and the wires. layer 150 surface. In this embodiment, the first insulating layer 140a is in contact with the first semiconductor layer 122, the second semiconductor layer 126, the third semiconductor layer 132 and the fourth semiconductor layer 136, and its material is oxide, including but not limited to silicon dioxide. (SiO ₂ ), titanium dioxide (TiO ₂ ) and other insulating materials. Next, as shown in FIG. 1C , a part of the first insulating layer 140 a on the top surfaces of the first electrode 128 and the second electrode 138 is removed to expose the top surfaces of the first electrode 128 and the second electrode 138 . In this embodiment, the method of removing part of the first insulating layer 140a is, for example, etching. It should be noted that, since the first insulating layer 140a of the present invention is formed between the wire layer 150 and the subsequently formed reflective layer, and contacts the first semiconductor layer 122, the second semiconductor layer 126, the third semiconductor layer 132 and the second semiconductor layer Four semiconductor layers 136, therefore, the first insulating layer 140a of the present invention not only has the property of electrical isolation, but also prevents metal atoms in the reflective layer from diffusing into the semiconductor layer, thereby affecting the luminous efficiency of the LED chip.

Referring to FIG. 1D and FIG. 1E at the same time, a reflective layer 190 is subsequently formed to cover the first insulating layer 140 a so that the first insulating layer 140 a is located between the wire layer 150 and the reflective layer 190 . In this embodiment, the reflective layer 190 is a material with high reflectivity, including but not limited to materials with high reflectivity such as silver (Ag), and the reflective layer 190 is continuously formed in the first light emitting region, the second light emitting region region and the wiring layer 150, and between the first light emitting layer 124 and the first pad 160 and between the second light emitting layer 134 and the second pad 170, so as to reflect the first light emitting layer 124 and the second light emitting layer 134 emitted light. The reflective layer 190 is, for example, formed on the top surfaces of the first insulating layer 140a, the first electrode 128 and the second electrode 138 by electroplating as shown in FIG. 1D , and then removed by, for example, an etching process as shown in FIG. 1E The partial reflective layer 190 on the top surfaces of the first electrode 128 and the second electrode 138 exposes the top surfaces of the first electrode 128 and the second electrode 138 as shown in FIG. 1E . It should be noted that since the reflective layer 190 of the present invention is arranged on the first light-emitting diode 120 and the second light-emitting diode 130, the reflective layer 190 of the present invention can simultaneously reflect light from the first light-emitting layer 124 and the second light-emitting layer. 134 light, in this way, the overall luminous efficiency of the light emitting diode chip of the present invention is improved.

Please refer to FIG. 1F and FIG. 1G at the same time. Next, a second insulating layer 140 b is formed to cover the reflective layer 190 . Therefore, the first insulating layer 140 a and the second insulating layer 140 b cover the reflective layer 190 . In this embodiment, the material of the second insulating layer 140b includes but not limited to insulating materials such as silicon dioxide (SiO ₂ ), titanium dioxide (TiO ₂ ), and covers the reflective layer 190 and the first electrode 128 as shown in FIG. 1F and the top surface of the second electrode 138 . Next, as shown in FIG. 1E , a portion of the second insulating layer 140b located on the top surfaces of the first electrode 128 and the second electrode 138 is removed by using, for example, an etching process, so as to expose the first electrode 128 and the second electrode 138 as shown in FIG. 1G . the top surface of the second electrode 138 . Next, referring to FIG. 1H , a first pad 160 and a second pad 170 are respectively disposed on the first electrode 128 and the second electrode 138 and are electrically connected to the first electrode 128 and the second electrode 138 . In this embodiment, the materials of the first pad 160 and a second pad 170 include but not limited to gold-tin alloy (Gold-Tin) and other solder materials. In this way, the manufacturing process of the light emitting diode device 100 of this embodiment is substantially completed.

FIG. 2 is a schematic cross-sectional view of a light emitting diode device according to an embodiment of the present invention. Please refer to FIG. 2 , as shown in FIG. 2 , the light emitting diode device 100 completed according to the above manufacturing method includes a substrate 110, a first light emitting diode 120, a second light emitting diode 130, an insulating layer 140 (140a, 140b), A wire layer 150 , a first pad 160 and a second pad 170 . The first LED 120 is disposed on a surface 112 of the substrate 110 . The first light emitting diode 120 includes a first electrode 128 , a third electrode (not shown in the figure) and a first light emitting region. The second light emitting diode 130 is also disposed on the surface 112 and has a gap G between the first light emitting diode 120 and the second light emitting diode 130 . The second light emitting diode 130 includes a second electrode 138 , a fourth electrode (not shown in the figure) and a second light emitting region. In detail, the first light emitting diode 120 may include a first semiconductor layer 122 , a first light emitting layer 124 , and a second semiconductor layer 126 to be stacked sequentially from the surface 112 to the direction away from the surface 112 as mentioned above. The first light emitting layer 124 defines a first light emitting region, the first electrode 128 is disposed on the second semiconductor layer 126 , and the third electrode is disposed on the first semiconductor layer 122 . The second light-emitting diode 130 can also include a third semiconductor layer 132, a second light-emitting layer 134 and a fourth semiconductor layer 136 stacked in sequence from the surface 112 to a direction away from the surface 112 as described above, wherein the second light-emitting layer 134 defines the first Two light emitting regions, the second electrode 138 is disposed on the third semiconductor layer 132 , and the fourth electrode is disposed on the fourth semiconductor layer 136 .

Based on the above, the wire layer 150 is disposed in the gap G and electrically connected to the first light emitting diode 120 and the second light emitting diode 130, more specifically, the wire layer 150 is electrically connected to the third electrode of the first light emitting diode 120 and the second electrode of the first light emitting diode 120. The fourth electrode of the second LED 130 . The insulating layer 140 is located between the wire layer 150 and the reflective layer 190 to electrically isolate the wire layer 150 from the reflective layer 190 . In this embodiment, the reflective layer 190 is continuously disposed on the first light-emitting diode 120 and the second light-emitting diode 130 , and is located between the first light-emitting layer 124 and the first pad 160 and between the second light-emitting layer 134 and the second light-emitting layer 134 . between pads 170 . The insulating layer 140 is disposed between the wire layer 150 and the first pad 160 and the second pad 170, and is in contact with the first semiconductor layer 122, the second semiconductor layer 126, the third semiconductor layer 132, and the fourth semiconductor layer 136. The surface of the reflective layer 190 is covered to prevent the reflective layer 190 from diffusing into the first semiconductor layer 122 , the second semiconductor layer 126 , the third semiconductor layer 132 and the fourth semiconductor layer 136 .

With such a configuration, the LED device 100 can be electrically connected to the carrier 200 through the first pad 160 and the second pad 170 . That is to say, the LED device 100 of this embodiment can be electrically connected to the carrier 200 through flip-chip bonding. Therefore, the light-emitting diode device 100 can conduct the heat generated by it to the carrier through the first pad 160 and the second pad 170 with high thermal conductivity, without dissipating heat through the substrate 110 with poor thermal conductivity. Therefore, the heat dissipation efficiency of the LED device 100 can be improved. The reflective layer 190 can reflect the light emitted by the first light emitting layer 124 and the second light emitting layer 134 at the same time, so as to increase the light extraction efficiency of the light emitting diode device 100 .

In an embodiment, the number of layers of the first insulating layer may be a single layer or multiple layers, and the material may be one or more. The number of layers of the second insulating layer can be single layer or multiple layers, and the material can be one or more. The first insulating layer and the second insulating layer may have the same or different layers and materials. In an embodiment, the number of layers of the reflective layer may be a single layer or multiple layers, and the material may be one or more. The reflective layer does not have to be formed entirely on the electrode region, and may be formed partially on the electrode region. The reflective layer can be metal or insulating material. In one embodiment, the substrate is not limited to sapphire, and may also be an insulating substrate, a plastic substrate, a glass substrate, a gallium nitride (Gallium Nitride, GaN) substrate, a silicon carbide (Silicon Carbide, SiC) substrate, a silicon (Silicon, Si) substrate or metal substrate. Indium Tin Oxide (ITO) transparent electrode patterns can also be formed on the electrodes. In one embodiment, the pads can be completed through a planarization process. In an embodiment, a superlattice structure may be further included between the active layer and the semiconductor layer. In one embodiment, the light emitting diode device is disposed on the carrier by flip chip bonding.

To sum up, in the light emitting diode device of the present invention, pads are provided on the surface away from the substrate, and the electrical properties of the electrodes are extended to the pads, so that the light emitting diode device can be connected to the carrier by flip-chip welding. In this way, the thermal energy generated by the LED device can be conducted to the carrier through the pad with high thermal conductivity, without dissipating heat through the substrate with poor thermal conductivity, thereby improving the heat dissipation efficiency of the LED device. Furthermore, since the heat dissipation efficiency of the LED device is improved, the driving current that the LED can carry can also be increased accordingly, thereby reducing the number of LEDs in the LED device, and further reducing the production cost. In addition, the reflective layer is disposed between the light-emitting layer and the contact pad of the light-emitting diode device to reflect the light emitted by the light-emitting layer, thereby improving the light extraction efficiency of the light-emitting diode device.

Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection should be defined by the claims.

Claims (8)

1. A light emitting diode device comprising: a substrate having a surface; A first light emitting diode, disposed on the surface, the first light emitting diode includes a first electrode and a first light emitting region; A second light emitting diode, arranged on the surface and having a gap with the first light emitting diode, the second light emitting diode includes a second electrode and a second light emitting region; a wire layer, disposed in the gap and electrically connected to the first light emitting diode and the second light emitting diode; A first pad and a second pad are respectively arranged on the first electrode and the second electrode and electrically connected with the first electrode and the second electrode; and A reflective layer is continuously arranged on the first light-emitting diode and the second light-emitting diode, and is located between the first light-emitting region and the first pad and between the second light-emitting region and the second pad . 2. The light emitting diode device according to claim 1, wherein the first light emitting diode comprises a first semiconductor layer, a first light emitting layer and a second semiconductor layer stacked sequentially from the surface, the first The light-emitting layer defines the first light-emitting region, the first electrode is disposed on the second semiconductor layer, and the second light-emitting diode includes a third semiconductor layer, a second light-emitting layer and a fourth semiconductor layer depending from the surface stacked sequentially, the second light emitting layer defines the second light emitting region, and the second electrode is disposed on the third semiconductor layer. 3. The light emitting diode device according to claim 2, wherein the wire layer is electrically connected to a third electrode of the first light emitting diode and a fourth electrode of the second light emitting diode; Wherein, the third electrode is disposed on the first semiconductor layer, and the fourth electrode is disposed on the fourth semiconductor layer. 4. The LED device according to claim 2, wherein the first semiconductor layer and the third semiconductor layer are N-type semiconductor layers, and the second semiconductor layer and the fourth semiconductor layer are P-type semiconductor layers . 5. The LED device as claimed in claim 2, further comprising an insulating layer disposed between the wire layer and the first pad, and between the wire layer and the second pad. 6. The LED device according to claim 5, wherein the insulating layer contacts the first semiconductor layer, the second semiconductor layer, the third semiconductor layer, and the fourth semiconductor layer, and covers the reflective layer. Floor. 7. A method of manufacturing a light emitting diode device, comprising: Provide a light emitting diode chip structure, which includes a substrate, a first light emitting diode, a second light emitting diode and a wiring layer, wherein the first light emitting diode is arranged on a surface of the substrate, and includes a first electrode and A first light-emitting area, the second light-emitting diode is arranged on the surface and has a gap with the first light-emitting diode, the second light-emitting diode includes a second electrode and a second light-emitting area, the wire layer is connected to the the first light emitting diode and the second light emitting diode; forming a first insulating layer covering the LED chip structure; forming a reflective layer covering the first insulating layer and located on the first light emitting region and the second light emitting region; forming a second insulating layer covering the reflective layer; and A first pad and a second pad are respectively disposed on the first electrode and the second electrode. 8. The method of manufacturing a light emitting diode device according to claim 7, after the step of forming the second insulating layer, further comprising the step of exposing the top surfaces of the first electrode and the second electrode, wherein the step comprises: After forming the first insulating layer, removing part of the first insulating layer to expose the top surfaces of the first electrode and the second electrode; After forming the reflective layer, removing part of the reflective layer to expose the top surfaces of the first electrode and the second electrode; and After forming the second insulating layer, part of the second insulating layer is removed to expose top surfaces of the first electrode and the second electrode.