CN104078429B - More spiral substrates and with its three-dimension packaging part - Google Patents
More spiral substrates and with its three-dimension packaging part Download PDFInfo
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- CN104078429B CN104078429B CN201310229576.0A CN201310229576A CN104078429B CN 104078429 B CN104078429 B CN 104078429B CN 201310229576 A CN201310229576 A CN 201310229576A CN 104078429 B CN104078429 B CN 104078429B
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- substrate
- tube cores
- cylindrical part
- dimension packaging
- packaging part
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- 239000000758 substrate Substances 0.000 title claims abstract description 55
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims abstract description 5
- 238000004519 manufacturing process Methods 0.000 claims abstract description 3
- 239000004020 conductor Substances 0.000 claims 1
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012612 commercial material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
The method of substrate and manufacture three-dimension packaging part the present invention relates to three-dimension packaging part, for three-dimension packaging part.Three-dimension packaging part includes：Substrate, including the cylindrical part with side wall；And the step or step set in the form of the multiple spirals spiraled by surrounding cylindrical part along the side wall of cylindrical part.Semiconductor integrated circuit (IC tube cores) is attached on one or two support surface of step.Cylindrical part, step and IC tube cores can be encapsulated with encapsulating material.
Description
Technical field
The present invention relates to semiconductor packages, and relate more specifically to a kind of substrate and the three-dimensional (3D) with the substrate
Packaging part.
Background technology
Recently, with the progress of integrated circuit (IC) technology, 3D packaging parts are had been developed for.3D encapsulation is related to single
Two or more integrated circuit (IC) tube cores (die) are stacked in packaging part or stacks and connects completed packaging part.With
Existing packaging part is compared, and 3D packaging parts provide significant size reduction because their plate face spaces every square centimeter and
Application space per cubic centimeter encapsulates more circuits.In view of these and many other advantages, 3D packaging parts occupy
The more and more shares in IC package market.However, traditional 3D is encapsulated using the IC tube cores of stacking or including stacking and connecting
The packaging part completed is more multi-functional to be combined in a packaging part.Therefore, for the IC tube cores in packaging part and external dress
The quantity of input/output (I/O) contact (contact) of electrical connection between putting and the quantity of the tube core of stacking are all limited
System.Therefore, it would be desirable to the 3D packaging parts of the IC tube cores of the stacking with more I/O contacts and more layers can be assembled.
Therefore, it is an object of the present invention to provide a kind of 3D with more I/O contacts and the tube core more stacked
The method of packaging part as packaging part and assembling, to solve the disadvantages mentioned above of existing 3D packaging parts.
The content of the invention
An embodiment provides a kind of substrates for three-dimensional (3D) packaging part.The substrate includes cylindrical portion
Part and multiple steps.Cylindrical part includes two end surfaces and side wall.Side wall of the multiple step along cylindrical part
It is set in the form of the multiple spirals spiraled by surrounding cylindrical part.
Another embodiment of the present invention provides a kind of three-dimension packaging part.The 3D packaging parts include the base with cylindrical part
Plate and the encapsulating material for encapsulating substrate.Cylindrical part includes two end surfaces and side wall.Multiple steps are to surround cylindrical portion
The form for multiple spirals that part spirals is set along the side wall of cylindrical part.At least one step includes support surface.At least one
A IC tube cores are bonded on the support surface of step.
Another embodiment of the present invention provides a kind of method for manufacturing three-dimension packaging part.The method comprising the steps of：Pass through
Depositing operation forms substrate, and wherein substrate includes the cylindrical part with side wall and to surround multiple spiral shells that cylindrical part spirals
Multiple steps that the form of rotation is set along side wall；At least one at least one IC tube cores are attached in the multiple step
It is a；And the substrate and IC tube cores are encapsulated with encapsulating material.
According to the present invention, the number of tube core in the unit space of packaging part is added, so that being encapsulated with existing 3D
Part is compared, and 3D packaging parts according to the present invention allow plate face space every square centimeter and application space per cubic centimeter more
It is multi-functional.In addition, also significantly increase the number of I/O contacts
Description of the drawings
Illustrating for the preferred embodiment of the present invention below when being read in conjunction with the figure will be better understood.It is logical
It crosses exemplary mode and the present invention is shown, and the present invention is not limited by the accompanying figures, and in the accompanying drawings, identical reference numeral represents class
As element.
Fig. 1 is the perspective view of the substrate for 3D packaging parts according to embodiments of the present invention；
Fig. 2 is the perspective view of 3D packaging parts according to embodiments of the present invention；
Fig. 3 is the stretching view according to the ladder (step) of the 3D packaging parts of embodiment shown in Fig. 2；
Fig. 4 is the flow chart for the method for showing assembling 3D packaging parts according to embodiments of the present invention；
Fig. 5 is the perspective view of the horizontal-extending substrate of its axis；
Fig. 6 A are the side cross-sectional views for showing IC tube cores according to embodiments of the present invention and step；
Fig. 6 B are the side cross-sectional views for showing IC tube cores and step according to another embodiment of the present invention；And
Fig. 6 C are the bottom views for showing IC tube cores according to embodiments of the present invention.
Specific embodiment
Intention is illustrated as the explanation to currently preferred embodiments of the present invention to attached drawing, it is not intended to which expression can
To practice only form in which the present invention.It should be appreciated that identical or equivalent function, meaning can be realized by different embodiments
These embodiments are also covered by within the spirit and scope of the present invention by figure.
Reference Fig. 1 shows the schematic diagram of the substrate 10 for 3D packaging parts according to embodiments of the present invention.Substrate 10 wraps
Cylindrical part 11 is included, cylindrical part 11 includes side wall 14, the first end surfaces 12 and the second end surfaces, the second end surfaces and first
End surfaces 12 are on the contrary and invisible in Fig. 1.
Substrate 10 further comprises multiple step/steps 151 and 152, is set along the side wall 14 of cylindrical part 11.
It is arranged in the form of the spiral that step/step 151 is spiraled by surrounding cylindrical part 11, and step 152 is arranged to another spiral shell
Rotation.From the point of view of aesthetics, substrate 10 looks like the tower of the step on outer side wall with two groups of coiling.It is only shown in Fig. 1
Several steps 151 and 152.It will be understood by those skilled in the art that can according to the design needs, IC tube cores in such as packaging part/
The number of section, to change the number of step 151 and 152.Each step 151 and 152 is compared with 11 outward radial of cylindrical part
Extension.In the shown embodiment, each step 151 abuts adjacent step 151, and each step 152 abuts adjacent step
152, and two spirals are mutually coiled and are separated from each other.Each step 151 and 152 includes being used to support semiconductor IC die
First support surface 16 and the second support surface (invisible in and Fig. 1 opposite with the first support surface 16) and leave column
The side surface 17 of shape component 11.Preferably, two spirals have uniform screw pitch, are defined as the overlapping of same spiral
The distance between step.As shown, screw pitch is " d " herein.
In one embodiment, the side surface 17 of step 151 or 152 include at least one first I/O contact 18, with
Being electrically connected between the IC tube cores in one of external device (ED) (not shown) and the first and second support surfaces for being attached to the step
It connects.Therefore, in one embodiment, step 151 or 152 include with wiring and weld pad wedge-shaped substrate, it is described wiring and
Weld pad allows to make (such as, wire bonding or inversed-chip lug) by known method, will be attached to the support surface of step
16 semiconductor IC die is connected to weld pad, and external connection weld pad is on side surface 17.
In some embodiments, substrate 10 is included on the first end surfaces 12 and/or the second end surfaces of cylindrical part 11
At least one 2nd I/O contact 19, for the electrical connection between IC tube cores and external device (ED).In this case, step
151 and 152 have contact on one or two support surfaces, so that wiring (route) can interconnect the 2nd I/O contacts
19 with IC tube cores.
Substrate 10 can be made of the material in the group being made of organic matter, ceramics, glass, silicon and GaAs.Column
Shape component 11 and step 151 and 152 are usually made of identical material, and are integrated into a workpiece together.For example, substrate
10 can be molded machine by means of 3D printer or 3D, and one layer forms with connecing one layer, while embedded internal circuit.Example
Property substrate include respectively with the 10-30 step 151 and 10-30 step 152, Mei Getai around cylindrical part 11 around 1~3
Rank 151 or 152 has from the radian in the range of 2 pi/2,0 to 2 π/6.It is also including other numbers and the substrate of the step of all numbers
It is possible.If necessary, each step 151 or 152 can have multiple layers of stepped construction.
In some other embodiments, substrate includes surrounding three, the four or even more a spiral shells that cylindrical part spirals
The step that the side wall of the form of rotation along cylindrical part is set.
With reference to figure 2, the perspective view of 3D packaging parts 20 according to embodiments of the present invention is shown.3D packaging parts 20, which remove, includes ginseng
It examines beyond the substrate 10 that Fig. 1 illustrates, further includes：At least one tube core 22, attachment or be bonded on substrate 10 step 151 or
On 152；And encapsulating material 24, encapsulate the substrate 10 and at least one IC tube cores 22.At least one IC
Tube core 22 can include various types of devices, such as, micro controller unit (MCU), system on chip (SOC), application-specific integrated circuit
(ASTC) etc..Encapsulating material 24 can include well known available commercial material, such as plastics or epoxy resin.Show at this
In example, 3D packaging parts 20 are with cylinder shape.However, in other embodiments, 3D packaging parts 20 can also be formed it
Its shape, such as cube.
Fig. 3 is according to the figure of the stretching of the step of the 3D packaging parts of embodiment illustrated in fig. 2, and shows IC tube cores 22
How first support surface 16 of step 151 or 152 is attached to.For example, IC tube cores 22 can by golden weld tabs, fall
Cartridge chip attachment, the engagement of protruded stigma convex block or any other appropriate means are bonded on the first support surface 16 of step 151.
In the embodiment, the junction between a step and step adjacent thereto, each step 151 or 152 has rounding
The corner 26 at angle.That is, the connection between step 151 or 152 has smooth surface, is wrapped so that working as with encapsulating material 24
When sealing substrate 10 and IC tube cores, encapsulating material 24 can easily be flowed along step 151 or 152.
As previously mentioned, the distance between step of overlapping of same spiral of substrate 10 is referred to as screw pitch " d ".Work as screw pitch
When " d " is significantly bigger than the thickness of IC tube core 22, known IC tube cores joint method can be used, such as flip-chip is attached.When
Screw pitch " d " close to IC tube cores thickness when, it is known that IC tube cores joint method may less facilitate.Below for this situation
Describe a kind of alternative method that IC tube cores 22 are attached to step 151 or 152.
Fig. 4 is flow chart, and it illustrates the methods of formation 3D packaging parts according to embodiments of the present invention.Fig. 5 is its axis water
The schematic diagram of the substrate of flat extension.Fig. 6 A are to show the IC for being attached to step 151 or 152 pipes according to embodiments of the present invention
The front view of core 22；Fig. 6 B are the side views for showing IC tube cores 22 according to embodiments of the present invention and step 151 or 152；And
Fig. 6 C are the bottom views of one shown in multiple IC tube cores 22 according to embodiments of the present invention.
With reference to Fig. 4, method 40 includes step 41,43 and 45.
In step 41, substrate 10 is formed.Substrate 10 includes the cylindrical part with side wall and to surround cylindrical part disk
Multiple steps that the form of multiple spirals of rotation is set along side wall.For example, substrate 10 can be by means of 3D printer or 3D
Machine is molded, is formed layer by layer, while embedded internal circuit.
In step 43, at least one IC tube cores are attached at least one in the multiple step.First, placement substrate 10
So that the central axes 50 of substrate 10 horizontally extend, this is typically the forward direction (forwarding direction) of assembly line,
As shown in Figure 5.Secondly, IC tube cores are moved to by substrate 10 perpendicular to central axes by flip-chip bond device (not shown)
On the first or second support surface of a step in step 151 or 152.Again, IC tube cores are bonded on substrate 10
On the first or second support surface of one step 151 or 152.
As shown in figs 6 a-6 c, IC tube cores are included in the multiple electrodes pin 62 on its table surface, and step 151 or 152
Including multiple grooves 64, the multiple electrodes pin 62 of IC tube cores 22 is accommodated on arrangements of grooves Cheng Qi support surfaces.Pass through engagement
The electrode pin 62 of IC tube cores 22 is inserted into corresponding groove 64 by device, so that IC tube cores 22 are bonded on step 151 or 152
Support surface on.
In one embodiment, each pin 62 is formed to have the cylindricality on trapezoidal section of surface, and each groove 64
With the occlusion section compared with pin 62, so as to by the way that groove 64 and IC tube cores 22 are slided or by IC tube cores 22
Pin 62 slid into from one side in groove 64, IC tube cores 22 are bonded to step 151 or 152.
In step 45, substrate and one or more IC tube cores are encapsulated with encapsulating material.It as it is known, can be in step 45
Carry out molding process.
Although illustrating several embodiments above for chip package, it will be understood by those skilled in the art that can also
The structure of the substrate is applied to other fields, such as, circuit board, electric equipment etc..
While there has been shown and described that the embodiment of the present invention, but it is clear that the present invention is not limited to only these implementations
Example.It will be appreciated by one of skill in the art that can there are many modification, change, modification, replacement and equivalent without departing from such as right
The spirit and scope of the present invention of interpellation.
Claims (18)
1. a kind of substrate for three-dimension packaging part, including：
Cylindrical part, including side wall；And
Multiple steps are set along the side wall in the form of the multiple spirals spiraled by surrounding the cylindrical part.
2. substrate according to claim 1, wherein, at least one step in the step includes being configured as receiving half
The support surface of conductor IC tube cores.
3. substrate according to claim 1, wherein, at least one step in the step is included away from the cylindrical portion
The side surface of part.
4. substrate according to claim 3 further comprises on the side surface of at least one step
At least one first I/O contacts.
5. substrate according to claim 4, further comprises conductive path, at least one step, with
Electrical connection between the support surface of the reception semiconductor IC die in the step is contacted with the first I/O.
6. substrate according to claim 1 further comprises at least one 2nd I/O contacts, positioned at the cylindrical part
Two end surfaces in it is at least one on.
7. substrate according to claim 6, further comprises conductive path, in the cylindrical part, for
At least one step contacted with the 2nd I/O between electrical connection.
8. substrate according to claim 1, wherein, the multiple step is set in the form of two spirals.
9. a kind of three-dimension packaging part, including：
Substrate, including：
Cylindrical part, including side wall；And
Multiple steps are set along the side wall in the form of the multiple spirals spiraled by surrounding the cylindrical part；And
Encapsulating material encapsulates the substrate.
10. three-dimension packaging part according to claim 9, wherein, at least one step in the step includes support table
Face, the three-dimension packaging part further comprise at least one IC pipes for being attached to the support surface of at least one step
Core.
11. three-dimension packaging part according to claim 10 further comprises in two end surfaces of the cylindrical part
It is at least one at least one first I/O contact, wherein at least one IC tube cores be electrically connected to it is described at least one
First I/O is contacted.
12. three-dimension packaging part according to claim 11, further comprises conductive path, in the cylindrical part,
For the electrical connection between being contacted at least one IC tube cores at least one first I/O.
13. three-dimension packaging part according to claim 10, wherein, at least one step in the step is included away from institute
State the side surface of cylindrical part.
14. three-dimension packaging part according to claim 13 further comprises at least one second on the side surface
I/O is contacted, wherein at least one IC tube cores are electrically connected at least one 2nd I/O contacts.
15. three-dimension packaging part according to claim 14, further comprises conductive path, described in the step
In at least one step, contacted for being electrically connected at least one IC tube cores at least one 2nd I/O.
16. three-dimension packaging part according to claim 10, wherein the multiple step is set in the form of two spirals.
17. a kind of method for manufacturing three-dimension packaging part, including step：
Substrate is formed, wherein the substrate includes：
Cylindrical part, including side wall；And
Multiple steps are set along the side wall in the form of the multiple spirals spiraled by surrounding the cylindrical part；
At least one IC tube cores are attached at least one in the multiple step；And
The substrate and IC tube cores are encapsulated with encapsulating material.
18. according to the method for claim 17, wherein, the attachment step includes：
The substrate is configured so that the central axes of the substrate horizontally extend；
IC tube cores are vertically moved to the first or second support of a step in the multiple step with the central axes
On surface；
The IC tube cores are bonded on the first or second support surface of one step.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310229576.0A CN104078429B (en) | 2013-03-29 | 2013-03-29 | More spiral substrates and with its three-dimension packaging part |
| US14/178,244 US9024427B2 (en) | 2013-03-22 | 2014-02-11 | Multiple helix substrate and three-dimensional package with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310229576.0A CN104078429B (en) | 2013-03-29 | 2013-03-29 | More spiral substrates and with its three-dimension packaging part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104078429A CN104078429A (en) | 2014-10-01 |
| CN104078429B true CN104078429B (en) | 2018-05-29 |
Family
ID=51599613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310229576.0A Expired - Fee Related CN104078429B (en) | 2013-03-22 | 2013-03-29 | More spiral substrates and with its three-dimension packaging part |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104078429B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6256203B1 (en) * | 1998-01-22 | 2001-07-03 | International Business Machines Corporation | Free standing, three dimensional, multi-chip, carrier package with air flow baffle |
| CN201868428U (en) * | 2010-11-20 | 2011-06-15 | 李光 | Luminous semiconductor curved surface encapsulated structure and luminous semiconductor light source device thereof |
| CN102782391A (en) * | 2010-02-12 | 2012-11-14 | 科锐公司 | Solid state lighting device, and method of assembling the same |
-
2013
- 2013-03-29 CN CN201310229576.0A patent/CN104078429B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6256203B1 (en) * | 1998-01-22 | 2001-07-03 | International Business Machines Corporation | Free standing, three dimensional, multi-chip, carrier package with air flow baffle |
| CN102782391A (en) * | 2010-02-12 | 2012-11-14 | 科锐公司 | Solid state lighting device, and method of assembling the same |
| CN201868428U (en) * | 2010-11-20 | 2011-06-15 | 李光 | Luminous semiconductor curved surface encapsulated structure and luminous semiconductor light source device thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104078429A (en) | 2014-10-01 |
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Address after: Texas in the United States Applicant after: NXP USA, Inc. Address before: Texas in the United States Applicant before: FREESCALE SEMICONDUCTOR, Inc. |
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Granted publication date: 20180529 |