CN104066290B - 外壳及具有该外壳的电源模块 - Google Patents
外壳及具有该外壳的电源模块 Download PDFInfo
- Publication number
- CN104066290B CN104066290B CN201310247131.5A CN201310247131A CN104066290B CN 104066290 B CN104066290 B CN 104066290B CN 201310247131 A CN201310247131 A CN 201310247131A CN 104066290 B CN104066290 B CN 104066290B
- Authority
- CN
- China
- Prior art keywords
- fastening
- shell
- elastic
- substrate
- heat
- Prior art date
Links
- 239000000758 substrates Substances 0.000 claims abstract description 84
- 239000011257 shell materials Substances 0.000 claims description 72
- 238000005452 bending Methods 0.000 claims description 14
- -1 Wherein Substances 0.000 claims description 2
- 230000001808 coupling Effects 0.000 abstract 3
- 238000010168 coupling process Methods 0.000 abstract 3
- 238000005859 coupling reactions Methods 0.000 abstract 3
- 239000000463 materials Substances 0.000 description 6
- 229910052751 metals Inorganic materials 0.000 description 6
- 239000002184 metals Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 230000001070 adhesive Effects 0.000 description 4
- 239000000853 adhesives Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000203 mixtures Substances 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound 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- 229910002027 silica gel Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound 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O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4338—Pistons, e.g. spring-loaded members
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
外壳及具有该外壳的电源模块
[0001 ] 本申请要求于2013年3月21日提交到韩国知识产权局的第10-2013-0030169号韩国专利申请的优先权,该申请的公开通过引用被包含于此。
技术领域
[0002]本发明涉及一种外壳及具有该外壳的电源模块,更具体地说,涉及这样一种外壳及具有该外壳的电源模块,该外壳能够均勾地分布在外壳装配时产生的压力。
背景技术
[0003]就电源模块而言,由于包括在电源模块中的元件小型化和集成化的趋势以及能量消耗的增加,导致由此产生的热量增加,所以已经出现对于提高电源模块的冷却效率的需要。
[0004]由于在电源模块中产生的热可由于结构热变形而极大地影响电源模块的元件的寿命,所以已经对提高冷却性能的结构进行大量研究。
[0005]然而,由于效率提高了的相对复杂的结构可导致在大规模生产时制造成本增加,所以需要能够简单化且容易制造的高效率的结构。
[0006]除此之外,由于具有不同热膨胀系数的多种材料的结合产生翘曲可导致传热速率减小,所以可增加热阻,由此可降低冷却性能。因此存在对于提高基板的结构平整度的方法的需要。
[0007]同时,根据现有技术的电源模块以这样的方式制造,S卩,外壳结合到用于冷却的散热器,其上安装有半导体器件的基板设置在外壳和散热器之间。
[0008]在这种情况下,主要使用这样一种方法,S卩,通过直接将螺钉插入到形成在外壳中的孔中而将外壳紧固到散热器。
[0009]然而,根据现有技术的电源模块存在的问题在于:由于螺钉紧固导致压力可集中施加到外壳的设置了螺钉的那部分。此外,前述问题可导致外壳损坏,并降低基板和外壳之间的接触可靠性,从而降低电源模块的效率。
[0010][现有技术文件]
[0011](专利文件I)第1999-012187号韩国专利特许公布
发明内容
[0012]本发明的一方面提供一种外壳及具有该外壳的电源模块,该外壳能够均匀地分布在外壳装配时在外壳中产生的压力。
[0013]本发明的另一方面提供一种外壳及具有该外壳的电源模块,在该外壳中,可最小化对外壳的紧固部分的损坏。
[0014]根据本发明的一方面,提供一种用于电源模块的外壳,该外壳包括:主体部分,在主体部分中形成有空间,所述空间容纳模块基板,在模块基板上安装了电子器件;多个紧固部分,从主体部分的侧部突出;紧固构件,具有片簧的形式,紧固构件的两端分别结合到所述多个紧固部分中的两个紧固部分,其中,紧固构件包括:结合部分,结合到固定构件;弹性部分,从结合部分的两个边缘延伸以结合到所述多个紧固部分,当结合部分紧固到热辐射基板时,弹性部分弹性地变形以给所述多个紧固部分提供弹性力。
[0015] 紧固构件的弹性部分可包括至少一个弯折部分或至少一个弯曲部分。
[0016]紧固构件的两端可设置有尺寸扩张了的固定部分,固定部分可限制紧固构件的变形。
[0017]紧固构件的结合部分可设置为比主体部分的下表面高。
[0018]紧固部分可设置有安装槽,弹性部分插入到安装槽中。
[0019]主体部分可具有长方体形状,紧固部分可形成在主体部分的侧部中的至少两个侧部上,主体部分的侧部中的所述至少两个侧部中的一个侧部可设置有两个紧固部分,这两个紧固部分以对称的方式设置。
[0020]主体部分可包括至少一个或多个通孔,安装在模块基板上的外部连接端子穿过所述至少一个或多个通孔而暴露到外部。
[0021]根据本发明的另一方面,提供一种用于电源模块的外壳,该外壳包括:多个紧固部分,从主体部分的侧部突出;紧固构件,紧固构件的两端分别结合到所述多个紧固部分中的两个紧固部分,紧固构件的中部通过固定构件而紧固到热辐射基板。
[0022]根据本发明的另一方面,提供一种电源模块,该电源模块包括:热辐射基板;模块基板,设置在热辐射基板上,在模块基板上安装有至少一个电子器件;外壳,容纳模块基板并紧固到热辐射基板,其中,外壳包括:多个紧固部分,从外壳的侧部突出;紧固构件,具有片簧的形式,紧固构件的两端分别结合到所述多个紧固部分中的两个紧固部分。
[0023]紧固构件可包括:结合部分,通过固定构件与热辐射基板表面接触,以固定地结合到热辐射基板;弹性部分,分别从结合部分的两个边缘延伸以结合到所述多个紧固部分,当结合部分紧固到热辐射基板时,弹性部分弹性地变形以给所述多个紧固部分提供弹性力。
[0024]所述紧固部分可设置有安装槽,弹性部分插入到安装槽中,弹性部分可在安装槽内弹性地变形。
附图说明
[0025]通过下面结合附图进行的详细描述,本发明的上述和其他方面、特点和其他优点将会被更加清楚地理解,在附图中:
[0026]图1是示意性地示出根据本发明的实施例的电源模块的透视图;
[0027]图2是仅仅示出了在图1中示出的电源模块的外壳和基板的透视图;
[0028]图3是图2的分解透视图;
[0029]图4是示意性地示出图2的外壳的俯视图;
[0030]图5是示意性地示出图2的外壳的仰视透视图;
[0031 ]图6是沿着图4的A方向获得的侧视图;
[0032]图7是沿着图1的B方向获得的侧视图;
[0033]图8是图7的C部分的局部放大视图。
具体实施方式
[0034]在下文中,将参照附图详细描述本发明的实施例。
[0035]然而,本发明可以以多种不同的形式实施,且不应该被解释为限于在此阐述的实施例。相反,提供这些实施例以使本公开将是彻底的和完全的,并将本发明的范围充分地传达给本领域的技术人员。
[0036]在附图中,为了清楚起见,可夸大元件的形状和尺寸,且相同的标号将始终用于指示相同或相似的元件。
[0037]图1是示意性地示出根据本发明的实施例的电源模块的透视图,图2是仅仅示出了在图1中示出的电源模块的外壳和基板的透视图,图3是图2的分解透视图。
[0038]此外,图4是示意性地示出图2的外壳的俯视图,图5是示意性地示出图2的外壳的仰视透视图,图6是沿着图4的A方向获得的侧视图。
[0039]参照图1至图6,根据本发明的实施例的电源模块100可包括模块基板10、电子器件
11、外部连接端子60、热辐射基板70和外壳30。
[0040 ]模块基板1可以是印刷电路板(PCB ),陶瓷基板、预成型基板、直接结合铜(DBC)S板或者绝缘金属基板(HS)。
[0041]如图3所示,模块基板10可设置有:安装电极(未示出),用于使电子器件11(下面将描述)安装在安装电极上;布线图案13,用于电连接这些电极等。
[0042]布线图案13可利用普通的层形成方法(例如,化学汽相淀积(CVD)和物理汽相淀积(PVD))形成,或者可通过电镀工艺或非电镀工艺形成。此外,布线图案13可包括导电材料(例如,金属)。例如,布线图案13可包括铝、铝合金、铜、铜合金或者它们的组合。
[0043] 此外,可在模块基板10的一个表面上安装至少一个或多个电子器件11。
[0044]根据本发明的实施例的电子器件11可包括功率装置和控制装置。
[0045]功率装置可以是用于转换功率或者用于控制功率的电源电路装置,例如,伺服驱动器、逆变器、功率调节器、转换器等。
[0046] 例如,功率装置可包括功率MOSFET、双极结型晶体管(BJT)、绝缘栅双极型晶体管(IGBT)、二极管或者它们的组合。即,在本发明的实施例中,功率装置可包括上述的所有装置或者仅仅包括这些装置中的一部分装置。
[0047]具体地说,根据本发明的实施例的功率装置可由成对的绝缘栅双极型晶体管(IGBT)和二极管构成。然而,这仅仅是一个示例,因此,本发明不一定限于此。
[0048] 控制装置可通过布线图案13、结合线14等电连接到功率装置,因此控制装置可控制功率装置的操作。
[0049] 例如,控制装置可以是微处理器,除了微处理器之外,控制装置还可包括无源装置(例如,电阻器、逆变器、电容器等)或有源装置(例如,晶体管等)。
[0050]同时,对于单个功率装置,可设置单个控制装置或多个控制装置。即,根据功率装置的类型和数量,可适当地选择设置的控制装置的类型和数量。
[0051]当电子器件11通过结合线14电连接到模块基板10时,电子器件11可通过粘合构件(未示出)结合到模块基板10的一个表面。这里,粘合构件可具有导电特性或不导电特性。另夕卜,粘合构件可以是导电焊料、导电膏或带。此外,焊料、金属氧化物、金属膏、环氧树脂、或具有优良耐热性的粘合带等可用作粘合构件。
[0052]然而,本发明不限于此。例如,电子器件11可通过各种方法(例如,倒装芯片结合方法、焊接球等)电连接到模块基板1。
[0053]外部连接端子60包括多个引脚(lead),其中,这些单独的引脚可被分类成连接到外部基板(图7中的90)的外引脚和紧固到模块基板10的内引脚。即,外引脚可指的是暴露到外壳30外部的引脚,内引脚可指的是位于外壳30中的引脚。
[0054]在本发明的实施例中,外部连接端子60可通过形成在模块基板10上的布线图案13或结合线14等电连接到电子器件11。
[0055]外部连接端子60可由铜(Cu)、铝(Al)等制成,但是外部连接端子的材料不限于此。
[0056]外壳30形成电源模块100的外壳体,并保护电子器件11和模块基板10不受外部环境影响。
[0057]根据本发明的实施例的外壳30可包括:主体部分32,在主体部分32中形成有容纳空间(图5中的S),该容纳空间容纳模块基板10;多个紧固部分34,从主体部分32向外突出;紧固构件40。
[0058]在主体部分32中容纳有模块基板10。因此,如图5所示,可在主体部分32中形成有容纳空间S,容纳空间S的尺寸对应于其上安装了电子器件11的模块基板10的尺寸。
[0059]在本发明的实施例中,主体部分32形成为具有(例如)六面体形状,但是不限于此,因此,如果有必要的话,主体部分32可形成为具有各种形状,例如,圆筒形形状、多棱柱形状等。
[0060]此外,在主体部分32的一个表面上,S卩,在主体部分32的上表面上可形成有多个通孔33。安装在模块基板10上的外部连接端子60插入到通孔33中,外部连接端子60的外引脚可从外壳30穿过通孔33而暴露到外部。
[0061 ]通孔33的数量可对应于外部连接端子60的数量,通孔33的位置可对应于外部连接端子60的位置,但是本发明不限于此,因此,根据本发明的实施例,多个通孔33可形成在主体部分32的上表面内,如果有必要的话,可选择性地使用多个通孔33。
[0062]多个紧固部分34可从主体部分32的侧部突出。在本发明的实施例中,紧固部分34从具有六面体形状的主体部分32的两侧向外突出。即,紧固部分34可形成在主体部分32的平行地设置的两侧上,且可以以对称的方式突出。
[0063]此外,在主体部分32的两侧中的每一侧上可形成两个紧固部分34。在这种情况下,这两个紧固部分34可彼此隔开预定距离。此外,下面将描述的紧固构件40的结合部分42可设置在两个紧固部分34之间。
[0064]各个紧固部分34设置有安装槽35和固定槽36。安装槽35和固定槽36用作紧固构件40的部分安装在其中的空间,因此,安装槽35和固定槽36可形成为具有与紧固构件40的形状对应的形状。
[0065]安装槽35可使得紧固构件40的弹性部分44插入到安装槽35中。因此,安装槽35可形成为具有与弹性部分44的厚度对应的尺寸,且可形成为具有与弹性部分44的形状对应的延长槽形状,该延长槽包括弯曲或弯折部分。
[ΟΟόό]固定槽36可形成在安装槽35的端部,以连接到安装槽35。固定槽36可容纳插入到其中的紧固构件40的固定部分45。因此,固定槽36可形成为具有比安装槽35的空间宽的空间。
[0067]紧固构件40插入到紧固部分34中以完成根据本发明的实施例的外壳30。紧固构件40通常可通过弯曲平坦金属板而形成,详细地说,紧固构件40可形成为具有金属片簧的形式,如图3所示。
[0068]此外,紧固构件40可包括:结合部分42,结合到固定构件,例如固定螺钉(图1中的80);弹性部分44,提供弹性力。
[0069]结合部分42设置在两个弹性部分44之间,且设置有紧固孔43,紧固孔43形成在结合部分42中,固定螺钉80插入到紧固孔43中。结合部分42可结合到紧固部分34,以大致平行于热辐射基板(图1中的70)的上表面。因此,当结合部分42紧固到热辐射基板70时,结合部分42的下表面可表面接触热辐射基板70的上表面。
[0070]如图6所示,当紧固构件40结合到紧固部分34时,结合部分42的下表面可设置为比主体部分32的下表面或紧固部分34的下表面高。此外,当外壳30紧固到热辐射基板70时,由于固定螺钉80和热辐射基板70的结合力,使得紧固构件40的结合部分42以弹性的方式向下运动。在该过程期间,弹性部分44可在紧固部分34内弹性地变形,并给结合部分42提供弹性力。
[0071 ]弹性部分44可形成在结合部分42的两个边缘,以相对于彼此对称地设置。弹性部分44可以以从结合部分42的两个边缘延伸这样的方式形成,并插入到从外壳30突出的紧固部分34的安装槽35中。因此,弹性部分44的总体形状可形成为类似于安装槽35的形状。
[0072]通过以圆筒的形式卷曲弹性部分44的端部的预定部分,可使弹性部分44的端部形成为固定部分45,从而具有扩张的尺寸。固定部分45设置为当固定螺钉80紧固到结合部分42时限制紧固构件40的运动。
[0073]即,当固定部分45插入到紧固部分34的固定槽36中时,紧固构件40的两端固定到固定槽36,结合部分42固定到热辐射基板70,由于在固定部分45和结合部分42之间的间隙中的弹性变形而产生弹性力。
[0074] 为此,如图3所示,弹性部分44可包括至少一个弯折部分46或至少一个弯曲部分47。在本发明的实施例中,一个弹性部分44可包括一个弯折部分46和两个弯曲部分47。这样意在当结合部分42紧固到热辐射基板70时给紧固部分34提供弹性力。
[0075]详细地说,当结合部分42紧固到热辐射基板70时,弹性部分44的弯折部分46或弯曲部分47可以以这样的方式变形,使得弯折表面或弯曲表面不弯曲(见图8)。因此,弹性部分44可产生保持弯折部分46或弯曲部分47处于各自原来的形式的力(S卩,弹性力),弹性力可提供给紧固部分34。
[0076]在紧固构件40紧固到热辐射基板70的状态下,持续产生弹性力。因此,根据本发明的实施例的外壳30可通过弹性力而持续保持与热辐射基板70粘合的力。
[0077]根据本发明的实施例,紧固构件40设置在主体部分32的两侧上。因此,利用结合到两个紧固构件40的两个固定螺钉80。即,即使根据本发明的实施例的外壳30利用两个固定螺钉80,力也可通过紧固构件40施加到总共四个紧固部分34,以在四个点(S卩,四个紧固部分)获得挤压效果。因此,外壳30可更加牢固地结合到热辐射基板70。
[0078]热福射基板70紧固到外壳30的下部,以将从电子器件11产生的热排放到外部。详细地说,其上紧固了电子器件11的模块基板10安放在热辐射基板70的上表面上,外壳30紧固到热辐射基板70的上表面,同时将模块基板1容纳在外壳30中。
[0079]热辐射基板70可以是由可有效地将热辐射到外部的金属形成的散热器。可容易相对廉价地使用且可具有优良导热性的铝(Al)或者铝合金可用作热辐射基板70的材料。然而,热辐射基板70的材料不限于此,可使用具有优良导热性的任何材料(例如,石墨等)。
[0080]此外,在热辐射基板70的外表面上可形成有多个突起或切口,以扩大外部区域。
[0081]同时,虽然未示出,但是在根据本发明的实施例的电源模块100中,可使成型部分形成在外壳30中。成型部分可以以这样的方式密封模块基板10和电子器件11,S卩,通过成型部分填充外壳30的内部空间。
[0082] S卩,成型部分可形成为覆盖和密封电子器件11、结合到模块基板10的外部连接端子60的内引脚,从而保护电子器件11不受外部环境影响。
[0083] 此外,通过成型部分包住电子器件11并固定电子器件11,安全地保护电子器件11不受外部冲击影响。
[0084]成型部分可由绝缘材料(例如,树脂等)形成。具体地说,可使用具有高的导热性的材料,例如,硅胶、导热环氧树脂、聚酰亚胺等。
[0085]接下来,将描述根据本发明的实施例的制造电源模块的方法。
[0086]图7是沿着图1的B方向获得的侧视图,图8是图7的C部分的局部放大视图。图7和图8示出了电源模块安装在外部基板上的状态。
[0087]将参照图7和图8描述根据本发明的实施例的制造电源模块100的方法,首先,制备结合了紧固构件40的外壳30、其上安装了电子器件11的模块基板10和热辐射基板70。
[0088]这里,如图6所示,外壳30的紧固构件40保持原来的形状,紧固构件40的结合部分42的下表面设置为比主体部分32的下表面高。
[0089]接下来,如图7所示,外壳30紧固到热辐射基板70,以使模块基板10容纳在外壳30中。
[0090]在这种情况下,固定螺钉80向下挤压紧固构件40的结合部分42,并紧固到热辐射基板70。因此,紧固构件40弹性地变形。即,结合部分42向下运动以表面接触热辐射基板70,由于结合部分42的运动导致弹性部分44的弯折部分46、弯曲部分47等发生变形(如图8所示),使得紧固构件40可给紧固部分34提供弹性力。
[0091] S卩,通过由紧固构件40的弹性变形所提供的弹性力使得根据本发明的实施例的外壳30可牢固地结合到热辐射基板70。
[0092]虽然根据本发明的实施例的如上所述那样构造的电源模块100利用两个固定螺钉,但是可通过紧固构件40和紧固部分34在四个点获得挤压效果。因此,外壳30可更加牢固地结合到热辐射基板70。
[0093]此外,根据本发明的实施例,由于从两个紧固构件40提供的弹性力均匀地施加到四个紧固部分34,所以压力可通过紧固部分34被均匀地分布到主体部分32,而不会集中在外壳30的任一部分或两个部分上。
[0094]结果,可防止由于压力集中在外壳30的一部分上而导致对外壳30的损坏。
[0095]电源模块不限于上述示例性实施例,而是可进行各种变型。例如,虽然在上述实施例中电源模块的外壳具有长方体形状,但是本发明不限于此。即,如果有必要的话,电源模块的外壳可具有各种形状,例如,圆筒形形状,多棱柱形状等。
[0096]此外,虽然在上述实施例中电源模块用作示例,但是本发明不限于此。因此,本发明构思可应用于其中封装了至少一个或多个功率装置的任何电子部件。
[0097]虽然已经结合实施例示出并描述了本发明,但是本领域的技术人员将清楚的是,在不脱离由权利要求限定的本发明的精神和范围的情况下,可进行变型和改变。
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CN105321898A (zh) * | 2014-06-03 | 2016-02-10 | 住友电木株式会社 | 金属基座安装基板以及金属基座安装基板安装部件 |
JP2016213314A (ja) * | 2015-05-08 | 2016-12-15 | 富士通株式会社 | 冷却モジュール及び電子機器 |
SG10201504274SA (en) * | 2015-05-29 | 2016-12-29 | Delta Electronics Int’L Singapore Pte Ltd | Package assembly |
CN207531242U (zh) * | 2017-07-29 | 2018-06-22 | 华为技术有限公司 | 一种浮动式散热器及其弹性支架 |
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- 2013-03-21 KR KR1020130030169A patent/KR101477378B1/ko active IP Right Grant
- 2013-05-29 US US13/904,710 patent/US20140285972A1/en not_active Abandoned
- 2013-06-20 CN CN201310247131.5A patent/CN104066290B/zh active IP Right Grant
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CN201336790Y (zh) * | 2008-12-05 | 2009-10-28 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
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US20140285972A1 (en) | 2014-09-25 |
KR101477378B1 (ko) | 2014-12-29 |
KR20140115548A (ko) | 2014-10-01 |
CN104066290A (zh) | 2014-09-24 |
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