CN104037114A - Mechanical hand capable of automatically taking and placing wafer - Google Patents
Mechanical hand capable of automatically taking and placing wafer Download PDFInfo
- Publication number
- CN104037114A CN104037114A CN201310070328.6A CN201310070328A CN104037114A CN 104037114 A CN104037114 A CN 104037114A CN 201310070328 A CN201310070328 A CN 201310070328A CN 104037114 A CN104037114 A CN 104037114A
- Authority
- CN
- China
- Prior art keywords
- plate
- drive unit
- vertical lift
- horizontal stretching
- mechanical arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 25
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Abstract
The invention discloses a mechanical hand capable of automatically taking and placing a wafer. A mechanical arm can linearly slide back and forth in a horizontal plane and be positioned on a horizontal extension positioning plate. The horizontal extension positioning plate can rotate around a vertical axis and be positioned on a vertical lifting plate. The vertical lifting plate can go up and down linearly along a vertical direction and be positioned on a base. A horizontal extension drive device, a horizontal rotation drive device and a vertical lifting drive device respectively drive the mechanical arm, the horizontal extension positioning plate and the vertical lifting plate to move. The mechanical arm is provided with at least one sucking disc. A controller respectively causes the horizontal extension drive device, the horizontal rotation drive device, the vertical lifting drive device and a sucking disc vacuum suction device to move. By adopting the mechanical hand of the invention, a wafer can be quickly placed in or taken out of a wafer box, full-automatic control is achieved, no human assistance is needed, the taking and placing speeds are high, and the taking and placing positions are accurate.
Description
Technical field
The present invention relates to a kind of manipulator, particularly a kind of wafer automatic clamping and placing manipulator.
Background technology
In wafer one side striping is produced, wafer striping processing mode is the artificial manual wafer operation of placing, and operating efficiency is very low, to company, increases larger human cost, and manual work also exists some accident potential simultaneously.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of wafer automatic clamping and placing manipulator, this wafer automatic clamping and placing manipulator is picked and placeed wafer to carry out striping action to assigned address to realize automated job automatically, and its to pick and place wafer speed fast, pick and place position accurate.
The present invention for the technical scheme that solves its technical problem and adopt is: a kind of wafer automatic clamping and placing manipulator, comprises the substrate being fixedly installed on wafer striping equipment rack, horizontal stretching drive unit, horizontally rotate drive unit, vertical lift drive unit, horizontal stretching location-plate, vertical lift plate, mechanical arm and controller, mechanical arm can be positioned on horizontal stretching location-plate in horizontal plane in linear reciprocation slip, horizontal stretching location-plate can be positioned on vertical lift plate around the rotation of vertical direction axis, the vertically straight line lifting of vertical lift plate is positioned on pedestal, described horizontal stretching drive unit, horizontally rotate drive unit and vertical lift drive unit driving device arm respectively, horizontal stretching location-plate and the action of vertical lift plate, and described mechanical arm is provided with at least one sucker, controller difference level of control stretching, extension drive unit, horizontally rotate drive unit, the vacuum suction device action of vertical lift drive unit and sucker.
As a further improvement on the present invention, the structure that described horizontal stretching location-plate can be positioned on vertical lift plate around the rotation of vertical direction axis is: be provided with and horizontally rotate positioning seat and feathering axis, feathering axis can be located in positioning seat around vertical direction axle rotary insertion, horizontally rotating positioning seat is fixedly mounted on vertical lift plate, horizontally rotate drive unit and drive feathering axis to rotate, horizontal stretching location-plate is fixed on feathering axis upper end.
As a further improvement on the present invention, the structure that the vertically straight line lifting of described vertical lift plate is positioned on pedestal is: be also provided with vertical lift locating rack, described vertical lift locating rack fixing with substrate on, on vertical lifting locating rack, can rotate the screw mandrel that is provided with, screw axis is to vertically placing, on screw mandrel, engaging sleeve is provided with a nut, and described nut and vertical lift plate are connected, and vertical lift drive unit drives screw mandrel rotation.
As a further improvement on the present invention, on described vertical lift locating rack, be also provided with vertical guide pin bushing, vertical lift plate is provided with line slideway, and described line slideway slides and is inserted in guide pin bushing.
As a further improvement on the present invention, described mechanical arm can be in horizontal plane the linear reciprocation structure being positioned on horizontal stretching location-plate of sliding be: on horizontal stretching location-plate, can slide in the same way and be provided with a horizontal stretching platform with mechanical arm, described horizontal stretching drive unit is fixed on this horizontal stretching platform, horizontal stretching drive unit is the twin shaft motor that two ends all have output shaft, the output shaft at these twin shaft motor two ends is respectively equipped with a gear and a drive pulley, on horizontal stretching location-plate, be installed with a tooth bar along mechanical arm glide direction, described gear and this tooth bar engaged transmission, water product extending table is provided with negative pulley wheel, also be provided with belt, described belt sleeve is located at master, negative pulley wheel outside, and belt is connected with mechanical arm stop.
As a further improvement on the present invention, the vacuum suction device on described sucker is vacuum generator.
As a further improvement on the present invention, described in, horizontally rotate drive unit and vertical lift drive unit is motor.
The invention has the beneficial effects as follows: the present invention is rotated and realized manipulator horizontal stretching, rotation and lifting action by motor, then by the suction nozzle on mechanical arm, hold to do to specify after wafer and pick and place, carry action; This manipulator mechanism can be put into wafer or take out wafer cassette fast, and Automatic Control, without human assistance, picks and places speed fast, picks and places position accurate.
Accompanying drawing explanation
Fig. 1 is front view of the present invention;
Fig. 2 is vertical view of the present invention;
Fig. 3 is left view of the present invention;
Fig. 4 is right view of the present invention;
Fig. 5 is the longitudinal lifting structure principle schematic of the present invention;
Fig. 6 is the first stereogram of the present invention;
Fig. 7 is the second stereogram of the present invention;
Fig. 8 is use view of the present invention.
Embodiment
Embodiment: a kind of wafer automatic clamping and placing manipulator, comprise the substrate 1 being fixedly installed on wafer striping equipment rack, horizontal stretching drive unit 2, horizontally rotate drive unit 3, vertical lift drive unit 4, horizontal stretching location-plate 5, vertical lift plate 9, mechanical arm 10 and controller, mechanical arm 10 can be positioned on horizontal stretching location-plate 5 in horizontal plane in linear reciprocation slip, horizontal stretching location-plate 5 can be positioned on vertical lift plate 9 around the rotation of vertical direction axis, vertically straight line lifting of vertical lift plate 9 is positioned on pedestal, described horizontal stretching drive unit 2, horizontally rotate drive unit 3 and vertical lift drive unit 4 driving device arm 10 respectively, horizontal stretching location-plate 5 and 9 actions of vertical lift plate, and described mechanical arm 10 is provided with at least one sucker 11, controller respectively level of control stretches drive unit 2, horizontally rotate drive unit 3, the vacuum suction device action of vertical lift drive unit 4 and sucker 11, manipulator is arranged on a side of wafer striping equipment rack, by 10 rotations of driving device arm, lifting, stretch, and then drive sucker 11 to enter wafer cassette, hold wafer and retreat wafer is taken out, then wafer carrying is placed on to other desired location, contrary mechanical arm 10 also can be got wafer from other desired location, is then placed in the wafer cassette of appointment, this has just realized the action of mechanical arm 10 carrying wafers, and its transporting velocity is fast, and carrying position is accurate, does not damage wafer.
The structure that described horizontal stretching location-plate 5 can be positioned on vertical lift plate 9 around the rotation of vertical direction axis is: be provided with and horizontally rotate positioning seat 6 and feathering axis 7, feathering axis can be located in positioning seat around vertical direction axle rotary insertion, horizontally rotating positioning seat is fixedly mounted on vertical lift plate 9, horizontally rotating drive unit 3 drives feathering axis to rotate, horizontal stretching location-plate 5 is fixed on feathering axis upper end, by feathering axis, transfer and drive 5 rotations of horizontal stretching location-plate horizontally rotating positioning seat inward turning, and then realize the spinning movement of mechanical arm 10, 5 rotations of motor driving horizontal stretching location-plate can certainly be directly set on vertical lift plate 9.
The structure that the vertically straight line lifting of described vertical lift plate 9 is positioned on pedestal is: be also provided with vertical lift locating rack 8, described vertical lift locating rack fixing with substrate 1 on, on vertical lifting locating rack, can rotate the screw mandrel that is provided with, screw axis is to vertically placing, on screw mandrel, engaging sleeve is provided with a nut, described nut and vertical lift plate 9 are connected, vertical lift drive unit 4 drives screw mandrel rotation, the vertical lifting that drives leading screw and nut mechanism to realize vertical lift plate 9 by motor moves, its transmission is stable, position is accurate, except this kind of structure, can also pass through driving-belt or gear 12 rack structures, also or slider-crank mechanism realize, be all those skilled in the art according to this patent, be easy to expect be equal to replacement.
On described vertical lift locating rack, be also provided with vertical guide pin bushing, vertical lift plate 9 is provided with line slideway, and described line slideway slides and is inserted in guide pin bushing, plays vertical guide and limit effect.
Described mechanical arm 10 can be in horizontal plane the linear reciprocation structure being positioned on horizontal stretching location-plate 5 of sliding be: on horizontal stretching location-plate 5, can slide in the same way and be provided with a horizontal stretching platform with mechanical arm 10, described horizontal stretching drive unit 2 is fixed on this horizontal stretching platform, horizontal stretching drive unit 2 is the twin shaft motor that two ends all have output shaft, the output shaft at these twin shaft motor two ends is respectively equipped with a gear 12 and a drive pulley 13, on horizontal stretching location-plate 5, be installed with a tooth bar along mechanical arm 10 glide directions, described gear 12 and this tooth bar engaged transmission, water product extending table is provided with negative pulley wheel, also be provided with belt 14, described belt 14 is sheathed on master, negative pulley wheel outside, and belt 14 is connected with mechanical arm 10 stop, this mechanism can move the displacement that doubles gear 12 girths by driving device arm 10 when a perimeter locations of gear 12 swing offsets, the drive pulley 13 that mechanical arm 10 horizontal stretching amounts can be different from gear 12 diameters by replacing in the situation that motor torsional moment and mechanism size allows changes, and its private space is little, and producing cost is low, and translational speed is fast.
Vacuum suction device on described sucker 11 is vacuum generator.
Describedly horizontally rotate drive unit 3 and vertical lift drive unit 4 is motor.
Claims (7)
1. a wafer automatic clamping and placing manipulator, it is characterized in that: comprise the substrate (1) being fixedly installed on wafer striping equipment rack, horizontal stretching drive unit (2), horizontally rotate drive unit (3), vertical lift drive unit (4), horizontal stretching location-plate (5), vertical lift plate (9), mechanical arm (10) and controller, mechanical arm (10) can be positioned on horizontal stretching location-plate (5) in horizontal plane in linear reciprocation slip, horizontal stretching location-plate (5) can be positioned on vertical lift plate (9) around the rotation of vertical direction axis, vertically straight line lifting of vertical lift plate (9) is positioned on pedestal, described horizontal stretching drive unit (2), horizontally rotate drive unit (3) and vertical lift drive unit (4) driving device arm (10) respectively, horizontal stretching location-plate (5) and vertical lift plate (9) action, and described mechanical arm (10) is provided with at least one sucker (11), controller respectively level of control stretches drive unit (2), horizontally rotate drive unit (3), the vacuum suction device action of vertical lift drive unit (4) and sucker (11).
2. wafer automatic clamping and placing manipulator according to claim 1, it is characterized in that: the structure that described horizontal stretching location-plate (5) can be positioned on vertical lift plate (9) around the rotation of vertical direction axis is: be provided with and horizontally rotate positioning seat (6) and feathering axis (7), feathering axis can be located in positioning seat around vertical direction axle rotary insertion, horizontally rotating positioning seat is fixedly mounted on vertical lift plate (9), horizontally rotate drive unit (3) and drive feathering axis to rotate, horizontal stretching location-plate (5) is fixed on feathering axis upper end.
3. wafer automatic clamping and placing manipulator according to claim 1, it is characterized in that: the structure that vertically straight line lifting of described vertical lift plate (9) is positioned on pedestal is: be also provided with vertical lift locating rack (8), described vertical lift locating rack fixing with substrate (1) on, on vertical lifting locating rack, can rotate the screw mandrel that is provided with, screw axis is to vertically placing, on screw mandrel, engaging sleeve is provided with a nut, described nut and vertical lift plate (9) are connected, and vertical lift drive unit (4) drives screw mandrel rotation.
4. wafer automatic clamping and placing manipulator according to claim 3, is characterized in that: on described vertical lift locating rack, be also provided with vertical guide pin bushing, vertical lift plate (9) is provided with line slideway, and described line slideway slides and is inserted in guide pin bushing.
5. wafer automatic clamping and placing manipulator according to claim 1, it is characterized in that: described mechanical arm (10) can be in horizontal plane the linear reciprocation structure being positioned on horizontal stretching location-plate (5) of sliding be: on horizontal stretching location-plate (5), can slide in the same way and be provided with a horizontal stretching platform with mechanical arm (10), described horizontal stretching drive unit (2) is fixed on this horizontal stretching platform, horizontal stretching drive unit (2) is the twin shaft motor that two ends all have output shaft, the output shaft at these twin shaft motor two ends is respectively equipped with a gear (12) and a drive pulley (13), on horizontal stretching location-plate (5), be installed with a tooth bar along mechanical arm (10) glide direction, described gear (12) and this tooth bar engaged transmission, water product extending table is provided with negative pulley wheel, also be provided with belt (14), described belt (14) is sheathed on master, negative pulley wheel outside, and belt (14) is connected with mechanical arm (10) stop.
6. wafer automatic clamping and placing manipulator according to claim 1, is characterized in that: the vacuum suction device on described sucker (11) is vacuum generator.
7. wafer automatic clamping and placing manipulator according to claim 1, is characterized in that: described in horizontally rotate drive unit (3) and vertical lift drive unit (4) is motor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310070328.6A CN104037114B (en) | 2013-03-06 | 2013-03-06 | Wafer automatic clamping and placing manipulator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310070328.6A CN104037114B (en) | 2013-03-06 | 2013-03-06 | Wafer automatic clamping and placing manipulator |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104037114A true CN104037114A (en) | 2014-09-10 |
CN104037114B CN104037114B (en) | 2018-05-18 |
Family
ID=51467835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310070328.6A Expired - Fee Related CN104037114B (en) | 2013-03-06 | 2013-03-06 | Wafer automatic clamping and placing manipulator |
Country Status (1)
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CN (1) | CN104037114B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111354668A (en) * | 2018-12-24 | 2020-06-30 | 上海微电子装备(集团)股份有限公司 | Silicon wafer transmission system and method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101045294A (en) * | 2006-03-29 | 2007-10-03 | 旺矽科技股份有限公司 | Multi-direction type grab |
CN101383313A (en) * | 2008-10-24 | 2009-03-11 | 陈百捷 | Manipulator for fetching and delivering silicon chip |
CN101409245A (en) * | 2008-11-20 | 2009-04-15 | 陈百捷 | Automatic control silicon chip check system |
CN102064127A (en) * | 2010-10-11 | 2011-05-18 | 北京自动化技术研究院 | Mechanical hand for fetching and delivering silicon wafers |
CN203218245U (en) * | 2013-03-06 | 2013-09-25 | 昆山富利瑞电子科技有限公司 | Mechanical hand capable of automatically taking and placing wafer |
-
2013
- 2013-03-06 CN CN201310070328.6A patent/CN104037114B/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101045294A (en) * | 2006-03-29 | 2007-10-03 | 旺矽科技股份有限公司 | Multi-direction type grab |
CN101383313A (en) * | 2008-10-24 | 2009-03-11 | 陈百捷 | Manipulator for fetching and delivering silicon chip |
CN101409245A (en) * | 2008-11-20 | 2009-04-15 | 陈百捷 | Automatic control silicon chip check system |
CN102064127A (en) * | 2010-10-11 | 2011-05-18 | 北京自动化技术研究院 | Mechanical hand for fetching and delivering silicon wafers |
CN203218245U (en) * | 2013-03-06 | 2013-09-25 | 昆山富利瑞电子科技有限公司 | Mechanical hand capable of automatically taking and placing wafer |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111354668A (en) * | 2018-12-24 | 2020-06-30 | 上海微电子装备(集团)股份有限公司 | Silicon wafer transmission system and method |
CN111354668B (en) * | 2018-12-24 | 2023-09-29 | 上海微电子装备(集团)股份有限公司 | Silicon wafer transmission system and method |
Also Published As
Publication number | Publication date |
---|---|
CN104037114B (en) | 2018-05-18 |
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Granted publication date: 20180518 |