CN104010450B - The manufacture method and coverlay transfer sheet of the substrate with coverlay - Google Patents
The manufacture method and coverlay transfer sheet of the substrate with coverlay Download PDFInfo
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- CN104010450B CN104010450B CN201410064749.2A CN201410064749A CN104010450B CN 104010450 B CN104010450 B CN 104010450B CN 201410064749 A CN201410064749 A CN 201410064749A CN 104010450 B CN104010450 B CN 104010450B
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- coverlay
- substrate
- stripping
- adhesive member
- releasing sheet
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Abstract
The present invention provides a kind of manufacture method and coverlay transfer sheet of substrate with coverlay that can without any problems by multiple covering membrane disposable configurations on substrate.By coverlay transfer sheet（100）Each coverlay be pasted onto integrated substrate via each adhesive member（50）Each substrate on.Then, by releasing sheet（120）From integrated substrate（50）Peel off, make stripper wire（HL）In peeling direction（H）Upper advance, and while gradually expand stripping area.Herein, in stripper wire（HL）Positioned at from stripping starting position to initial and releasing sheet（120）Peeling-off coverlay（185）Till in the range of when, in multiple coverlays, respectively from adhesive portion and stripper wire（HL）Beeline be assisted parts and stripper wire（HL）Beeline below direction, gradually to expand stripping area.And, releasing sheet（120）It is weaker with the bonding force of adhesive member than coverlay with the bonding force of coverlay.
Description
Technical field
The present invention relates to have adhesive member and band covering the adhesive member coverlay substrate manufacture method and
Coverlay transfer sheet used in the manufacture method.
Background technology
In the electronic equipments such as smart mobile phone, mobile phone, in order to components and parts are fixed on substrate, or by the substrate
On motherboard etc., sometimes using the substrate with adhesive members such as splicing tapes.
For example, the base having in Patent Document 1 discloses the electronic equipments such as a kind of smart mobile phone, mobile phone
Plate.Being provided with the substrate has carried out the electronic devices and components such as the semiconductor packages of resin seal.
And, the manufacture method of patent documentation 1 includes：By double-sided adhesive tape（Adhesive member）The stickup being pasted onto on substrate
Operation；Installation procedure electronic devices and components being installed to via double-sided adhesive tape on substrate；And will be had in electronic devices and components
The welding sequence welded with the electrode being formed on substrate by some electrodes.
Prior art literature
Patent documentation
Patent documentation 1：Japanese Patent Laid-Open 5-21946 publication
The content of the invention
Invent technical problem to be solved
After the adhering processes of the adhesive member terminate to installation procedure during, in order to prevent being pasted onto each base
Adhesive member on plate is pasted on other components or undesirable thing（Dirt, dust etc.）Paste and be pasted on each base
On the adhesive member of plate, and consider multiple coverlays to be pasted on the adhesive member of each substrate under integrated state, to cover
The adhesive member.
Thus, for example, the coverlay with adhesive member is pasted onto on substrate（Adhering processes）, and with by integrated substrate point
Be cut into the state of a structure base board or the state shipment of integrated substrate state maintained to user, on by user installation to motherboard etc.
（Installation procedure）When peel off coverlay being installed.In order to be easy in installation procedure operation, coverlay be preferably with than
Adhesive member wants big profile.
Can consider viscous to carry out the band to unify to multiple substrates to have been carried out each substrate under integrated integrated state
The adhering processes of the coverlay of connection member.However, the multiple coverlays with adhesive member are pasted integrated shape one by one
Uprise can deterioration of efficiency, manufacturing cost on each substrate of state.
Therefore, it can consider following manufacture method：That is, prepare coverlay transfer sheet, the coverlay transfer sheet will be
Another interarea of multiple coverlays that one interarea is provided with adhesive member is pasted on releasing sheet；By coverlay transfer sheet
Each coverlay paste the assigned position of each substrate under integrated state；Then, it is releasing sheet is each under integrated state
Strippable substrate, so as to multiple covering membrane disposables with adhesive member are configured on each substrate.
However, in the manufacture method, multiple coverlays are not only pasted onto on adhesive member, releasing sheet is also pasted onto
On.Therefore, in the manufacture method, when peeling off on each substrate by releasing sheet under integrated state, according to stripping means
Difference, it some times happens that the problems such as coverlay is also peeled off together with releasing sheet from each substrate.That is, coverlay with than
Adhesive member wants big part（Assisted parts）In the case of, it some times happens that as being peeled off from the assisted parts of non-binding
Problem.
Therefore, it is an object of the invention to provide one kind can configure multiple covering membrane disposables in substrate without any problems
On the substrate with coverlay manufacture method and coverlay transfer sheet.
Solve the technical scheme adopted by technical problem
The present invention the substrate with coverlay manufacture method in order to solve above-mentioned technical problem and including following operation.
（1）Including：Preparatory process, prepares a kind of coverlay transfer sheet in the preparatory process, the coverlay transfer sheet
Material includes：Multiple coverlays, the plurality of coverlay are bonded with the adhesive portion of adhesive member and described with an interarea respectively
Part beyond adhesive portion is assisted parts；And releasing sheet, the releasing sheet be bonded in the plurality of coverlay with institute
State on the interarea of adhesive member opposite side, the bonding force between the releasing sheet and the coverlay than the coverlay with
Bonding force between the adhesive member is weak；
Adhering processes, in the adhering processes, by the adhesive portion of the coverlay transfer sheet via the bonding
Component is pasted onto on substrate；And
Stripping process, in the stripping process, the releasing sheet is peeled off from the substrate, is made from described
The part peeled off on substrate is advanced with the portion boundary line do not peeled off from the substrate i.e. stripper wire, and while gradually expands
Stripping area,
In the stripping process, the stripper wire positioned at from peel off starting position to initially with the releasing sheet send out
When in the range of till the raw coverlay peeled off, in the plurality of coverlay, respectively from the adhesive portion and the stripping
Beeline between offline is the direction of below the beeline between the assisted parts and the stripper wire, gradually to expand
The stripping area.
In the manufacture method, each coverlay of coverlay transfer sheet is pasted onto on substrate via adhesive member, so
Afterwards, releasing sheet is peeled off from substrate.Stripper wire is the line orthogonal with the peeling direction that releasing sheet is peeled off from substrate.Stripping
It is the position for starting releasing sheet is peeled off from substrate from starting position.
In the manufacture method, when releasing sheet is peeled off from substrate and stripping area is gradually expanded, cover multiple
In epiphragma, respective stripper wire passes through assisted parts or while by adhesive portion and assisted parts after first passing through adhesive portion.And,
Bonding force between releasing sheet and coverlay is weaker than the bonding force between the adhesive portion and adhesive member of coverlay.
Therefore, it is in the manufacture method, when releasing sheet is peeled off from substrate and stripping area is gradually expanded, multiple
Coverlay will not be peeled off together with releasing sheet from substrate, but the state residual to be pasted onto via adhesive member on substrate
On substrate.Therefore, in the manufacture method, can prevent coverlay also together with releasing sheet from substrate peel off the problems such as
Occur.
Therefore, according to this manufacture method, without any problems multiple coverlays disposably can be configured on substrate.
（2）Preferably in the stripping process, in the profile that the adhesive member is polygonal shape, the coverlay
In the case of at least coinciding on three sides with the profile of the adhesive member, by the releasing sheet from the substrate
When the while angle that i.e. true edge is constituted of the peeling direction peeled off and this three between is set to Θ, to meet 0 °≤Θ
≤ 180 ° of mode gradually expands the stripping area.
In the manufacture method, peeling direction is set to meet the direction of 0 °≤Θ≤180 °.Thus, by releasing sheet
Peel off from substrate and when stripping area is gradually expanded, with least coinciding on three sides with the profile of adhesive member
Profile coverlay in, stripper wire first passes through adhesive portion again by assisted parts or while by adhesive portion and assisted parts.
（3）Preferably in the stripping process, in the profile that the adhesive member is polygonal shape, the coverlay
In the case of coinciding on two adjacent sides with the profile of the adhesive member, by the releasing sheet from the substrate
On the peeling direction peeled off with this two any bars in while the angle that constituted be set to Θ, by the peeling direction with
When the angle constituted by another a line is set to Φ, gradually expand described in the way of meeting 0 °≤Θ≤90 °, 0 °≤Φ≤90 °
Stripping area.
In the manufacture method, peeling direction is set to meet the direction of 0 °≤Θ≤90 °, 0 °≤Φ≤90 °.Thus,
When stripping area is gradually expanded releasing sheet is peeled off from substrate, with the profile of adhesive member on two sides
On in the coverlay of profile that coincides, stripper wire first pass through after adhesive portion by assisted parts or while by adhesive portion and
Assisted parts.
（4）Preferably in the stripping process, in the profile that the adhesive member is polygonal shape, the coverlay
In the case of coinciding in a line with the profile of the adhesive member, the releasing sheet is being carried out from the substrate
When the peeling direction of stripping is set to Θ with the angle constituted by a line, gradually expand described in the way of meeting Θ=90 °
Stripping area.
In the manufacture method, peeling direction is set to meet the direction of Θ=90 °.Thus, by releasing sheet from base
When peeling off on plate and stripping area is gradually expanded, in the profile coincided in a line with the profile with adhesive member
In coverlay, stripper wire passes through adhesive portion and assisted parts simultaneously.
Additionally, the coverlay transfer sheet of the present invention in order to solve above-mentioned technical problem and including following structure.
（5）Including：Multiple coverlays, the plurality of coverlay is respectively with the bonding that adhesive member is bonded with an interarea
Part beyond portion and the adhesive portion is assisted parts, and covers each adhesive member；And
Releasing sheet, the releasing sheet are bonded in the master with the adhesive member opposite side in the plurality of coverlay
On face,
Bonding force between the releasing sheet and the coverlay is than between the coverlay and the adhesive member
Bonding force is weak,
The adhesive portion of the plurality of coverlay is pasted onto on substrate via the adhesive member, by the stripping film
When material is peeled off from the substrate, the releasing sheet produce the part peeled off from the substrate with not from the substrate
The portion boundary line of stripping is stripper wire,
The releasing sheet the stripper wire positioned at from peel off starting position to initially with the releasing sheet occur
When in the range of till the coverlay peeled off, in the plurality of coverlay, have in the respective stripping starting position
Have stripping start position mark so that the beeline between the adhesive portion and the stripper wire than the assisted parts with it is described
Beeline between stripper wire is short.
The coverlay transfer sheet is used for described（1）Manufacture method.Accordingly, it is capable to play with it is described（1）Identical effect.
Additionally, the strip operation personnel of releasing sheet can easily carry out the stripping without error.
（6）Preferably described beginning position mark of peeling off is the arrow using the direction orthogonal with the stripper wire as axial direction
Labelling.
The effect of invention
According to the present invention, without any problems multiple coverlays disposably can be configured on substrate.
Description of the drawings
Fig. 1 is the main view of the integrated substrate 50 for pasting the coverlay transfer sheet 100 involved by embodiments of the present invention
Figure.
Fig. 2 is the front view of the coverlay transfer sheet 100 involved by embodiments of the present invention.
Fig. 3 is 111 institute of coverlay configuration section that the coverlay transfer sheet 100 shown in Fig. 2 is only observed from the direction of arrow P
The side view of the coverlay configuration section 111 for obtaining.
Fig. 4 is the main view for being pasted onto the coverlay transfer sheet 100 shown on the integrated substrate 50 shown in Fig. 1, Fig. 2
Figure.
Fig. 5 is the covering when releasing sheet 120 of the coverlay transfer sheet 100 shown in Fig. 4 is peeled off from integrated substrate 50
The front view of epiphragma transfer sheet 100 and integrated substrate 50.
Fig. 6（A）It is the coverlay configuration section 111 and the front view of substrate 61 of coverlay transfer sheet 100 shown in Fig. 5.
Fig. 6（B）It is the coverlay configuration section 111 and substrate that the coverlay transfer sheet 100 shown in Fig. 5 is only observed from the direction of arrow P
The side view of coverlay configuration section 111 and substrate 61 obtained by 61.
Fig. 7（A）It is the side view of the substrate 61 when the releasing sheet 120 shown in Fig. 5 is peeled off from substrate 61.Fig. 7（B）It is
The releasing sheet 120 of the coverlay transfer sheet 100 shown in Fig. 5 peel off from substrate 61 after substrate 61 side view.Fig. 7
（C）It is the main view of the substrate 61 after the releasing sheet 120 of coverlay transfer sheet 100 shown in Fig. 5 is peeled off from substrate 61
Figure.
Fig. 8 is that the 1st i.e. coverlay of variation of the coverlay configuration section 111 of the coverlay transfer sheet 100 shown in Fig. 5 is matched somebody with somebody
Put the front view of portion 191 and substrate 61.
Fig. 9 is the side view of the substrate 61 when the releasing sheet 120 shown in Fig. 8 is peeled off from substrate 61.
Figure 10 is integrated after the releasing sheet 120 of the coverlay transfer sheet 100 shown in Fig. 5 is peeled off from substrate 50
The front view of substrate 50.
Figure 11（A）It is the main view of major part releasing sheet 120 peeled off from substrate 61 with the 1st stripping means
Figure.Figure 11（B）It is the side view of major part releasing sheet 120 peeled off from substrate 61 with the 1st stripping means.
Figure 12（A）It is the main view of major part releasing sheet 120 peeled off from substrate 61 with the 2nd stripping means
Figure.Figure 12（B）It is the side view of major part releasing sheet 120 peeled off from substrate 61 with the 2nd stripping means.
Figure 13（A）It is the main view of major part releasing sheet 120 peeled off from substrate 61 with the 3rd stripping means
Figure.Figure 13（B）It is the side view of major part releasing sheet 120 peeled off from substrate 61 with the 3rd stripping means.
Figure 14 is the 2nd variation i.e. coverlay of the coverlay configuration section 111 of the coverlay transfer sheet 100 shown in Fig. 5
The front view of configuration section 211.
Figure 15 is the 3rd variation i.e. coverlay of the coverlay configuration section 111 of the coverlay transfer sheet 100 shown in Fig. 5
The front view of configuration section 311.
Figure 16 is the 4th variation i.e. coverlay of the coverlay configuration section 111 of the coverlay transfer sheet 100 shown in Fig. 5
The front view of configuration section 411.
Figure 17 is the 5th variation i.e. coverlay of the coverlay configuration section 111 of the coverlay transfer sheet 100 shown in Fig. 5
The front view of configuration section 511.
Figure 18 is the 1st variation i.e. master of coverlay 631 of the coverlay 131 of the coverlay transfer sheet 100 shown in Fig. 5
View.
Figure 19 is the 2nd variation i.e. master of coverlay 731 of the coverlay 131 of the coverlay transfer sheet 100 shown in Fig. 5
View.
Figure 20 is the 3rd variation i.e. master of coverlay 831 of the coverlay 131 of the coverlay transfer sheet 100 shown in Fig. 5
View.
Figure 21 is the 4th variation i.e. master of coverlay 931 of the coverlay 131 of the coverlay transfer sheet 100 shown in Fig. 5
View.
Figure 22 is the 5th variation i.e. coverlay 1031 of the coverlay 131 of the coverlay transfer sheet 100 shown in Fig. 5
Front view.
Figure 23 is the 6th variation i.e. coverlay 1131 of the coverlay 131 of the coverlay transfer sheet 100 shown in Fig. 5
Front view.
Figure 24 is the 7th variation i.e. coverlay 1231 of the coverlay 131 of the coverlay transfer sheet 100 shown in Fig. 5
Front view.
Figure 25 is the 8th variation i.e. coverlay 1331 of the coverlay 131 of the coverlay transfer sheet 100 shown in Fig. 5
Front view.
Figure 26（A）It is the 9th variation i.e. coverlay 1431 of the coverlay 131 of coverlay transfer sheet 100 shown in Fig. 5
Front view.Figure 26（B）It is the 10th variation i.e. coverlay of the coverlay 131 of coverlay transfer sheet 100 shown in Fig. 5
1531 front view.
Reference
H ... peeling directions
HL ... stripper wires
50 ... integrated substrates
61 ... substrates
68 ... holes
100 ... coverlay transfer sheets
102 ... middle sections
103 ... outer region
109 ... arrow marks
111 ... coverlay configuration sections
120 ... releasing sheets
131 ... coverlays
132 ... adhesive portion
133 ... assisted parts
135 ... coverlays
136 ... adhesive portion
137 ... assisted parts
141st, 145 ... adhesive members
150 ... protection sheet materials
168 ... holes
185 ... coverlays
191 ... coverlay configuration sections
193rd, 194 ... breach
211st, 311,411,511 ... coverlay configuration section
231st, 331 ... coverlays
233rd, 333 ... assisted parts
531 ... coverlays
532A, 532B, 532C ... adhesive portion
533 ... assisted parts
631 ... coverlays
632A, 632B ... adhesive portion
633 ... assisted parts
731 ... coverlays
732A, 732B ... adhesive portion
733 ... assisted parts
831 ... coverlays
832A, 832B ... adhesive portion
833 ... assisted parts
931 ... coverlays
932A, 932B ... adhesive portion
933 ... assisted parts
1031 ... coverlays
1032A, 1032B ... adhesive portion
1033 ... assisted parts
1131 ... coverlays
1132A, 1132B ... adhesive portion
1133 ... assisted parts
1231 ... coverlays
1232A, 1232B ... adhesive portion
1233 ... assisted parts
1331 ... coverlays
1332A, 1332B ... adhesive portion
1333 ... assisted parts
1431st, 1531 ... coverlays
Specific embodiment
Referring to the drawings the manufacture method of the substrate with coverlay involved by embodiments of the present invention is illustrated.
Fig. 1 is the main view of the integrated substrate 50 for pasting the coverlay transfer sheet 100 involved by embodiments of the present invention
Figure.Fig. 2 is the front view of the coverlay transfer sheet 100 involved by embodiments of the present invention.
First, as shown in figure 1, preparing integrated substrate 50.Integrated substrate 50 is by the multiple substrates comprising substrate 61
（It is 9 × 8 substrates in present embodiment）Integrated substrate is carried out.The structure of each substrate is identical with the structure of substrate 61.Collection
For example it is made up of insulative resin or ceramics etc. into substrate 50.Quilt when being provided with cutting around each substrate in integrated substrate 50
The cutting surplus of cutting.Each substrate is the substrate having in the electronic equipments such as smart mobile phone, mobile phone, for example, is printing
Substrate, flexible base board.On each substrate, via adhesive member described later, being provided with has carried out the semiconductor packages of resin seal
Deng electronic devices and components.
Additionally, hole 68,69 is formed with integrated substrate 50.Hole 68,69 is for insertion into steady pin（It is not shown）Hole,
The steady pin carries out positioning to the coverlay transfer sheet 100 being pasted onto on integrated substrate 50, and be fixed.
Next, as shown in Fig. 2 preparing coverlay transfer sheet 100.Coverlay transfer sheet 100 is divided into：Central area
Domain 102, the middle section 102 is by the multiple coverlay configuration sections comprising coverlay configuration section 111（In present embodiment it is
9 × 8 coverlay configuration sections）Constituted；And outer region 103, outside of the outer region 103 in middle section 102.
Each coverlay configuration section of middle section 102 is configured with the coverlay of each substrate of the integrated substrate 50 shown in Fig. 1
Region is corresponding.The structure of each coverlay configuration section is identical with the structure of coverlay configuration section 111.
Additionally, outer region 103 be formed with the hole 168 corresponding with the hole 68,69 of the integrated substrate 50 shown in Fig. 1,
169.Hole 168,169 is also for insertion into steady pin（It is not shown）Hole, the steady pin is to being pasted onto covering on integrated substrate 50
Epiphragma transfer sheet 100 carries out positioning, and be fixed.And, expression is printed with the stripping starting position of outer region 103
The direction peeled off by releasing sheet 120 described later（Hereinafter referred to as " peeling direction "）Arrow mark 109.Peel off start bit
It is the position for starting releasing sheet 120 is peeled off from integrated substrate 50 to put.
Hereinafter, the structure of coverlay transfer sheet 100 is illustrated with reference to Fig. 2, Fig. 3.
Fig. 3 is 111 institute of coverlay configuration section that the coverlay transfer sheet 100 shown in Fig. 2 is only observed from the direction of arrow P
The side view of the coverlay configuration section 111 for obtaining.In addition, as described above, the structure of each coverlay configuration section is configured with coverlay
The structure in portion 111 is identical, therefore, in Fig. 3, illustrate only coverlay configuration section 111.
The middle section 102 of coverlay transfer sheet 100 includes：Protection sheet material 150；Exist comprising adhesive member 141,145
Interior multiple adhesive members；Multiple coverlays comprising coverlay 131,135；And be bonded in multiple coverlays with
Releasing sheet 120 on the interarea of adhesive member opposite side, above-mentioned middle section 102 is with the knot for being laminated them
Structure.On the other hand, the outer region 103 of coverlay transfer sheet 100 does not have coverlay and adhesive member, but by screening glass
Material 150 and releasing sheet 120 are constituted.
Releasing sheet 120 is bonded on the interarea with adhesive member opposite side of multiple coverlays.Releasing sheet 120
Material is, for example, PET（Polyethyleneterephthalate：Polyethylene terephthalate）Resin.
Multiple coverlays are the films for covering each adhesive member, so that in respectively covering coverlay transfer sheet 100
Epiphragma is pasted onto on above-mentioned integrated substrate 50 via adhesive member, and after releasing sheet 120 is peeled off from integrated substrate 50,
Undesirable thing can be prevented（Dirt, dust etc.）Paste on the adhesive member of each substrate for being pasted on integrated substrate 50.It is many
The material of individual coverlay is, for example, PET（Polyethyleneterephthalate：Polyethylene terephthalate）Resin.
Coverlay 131 with the adhesive portion 132 mutually bonding with adhesive member 141 interarea, and adhesive portion 132 with
Outer part is assisted parts 133.And, stripping is bonded with the interarea with 141 opposite side of adhesive member of coverlay 131
Sheet material 120.The profile of adhesive member 141 is configured to overlap on three sides with the profile of coverlay 131, remaining a line into
It is the boundary line with assisted parts 133.The bonding force of releasing sheet 120 and coverlay 131 is than coverlay 131 and adhesive member 141
Bonding force it is weak.The structure of other each coverlays is all identical with the structure of coverlay 131.
Herein, although details will be described later, in stripper wire HL positioned at from stripping starting position to most
When in the range of till just peeling-off with releasing sheet 120 coverlay 185（With reference to Fig. 5 described later）, in multiple coverlays
In each coverlay in, the beeline between adhesive portion and stripper wire HL is than the beeline between assisted parts and stripper wire HL
It is short.
Fig. 4 is the main view for being pasted onto the coverlay transfer sheet 100 shown on the integrated substrate 50 shown in Fig. 1, Fig. 2
Figure.
Next, peeling off protection sheet material 150 from coverlay transfer sheet 100.Then, integrated substrate 50 is inserted into and is not schemed
In the hole 68,69 of the steady pin for showing.Then, as shown in figure 4, carrying out adhering processes, by respectively covering for coverlay transfer sheet 100
Epiphragma is inserted in the hole 168,169 of steady pin (not shown), and via each adhesive member pasting each base of integrated substrate 50
On the assigned position of plate, so as to coverlay transfer sheet 100 is fixed on integrated substrate 50.
Thus, for example, in coverlay configuration section 111, coverlay 131,135 is pasted onto via adhesive member 141,145
On substrate 61.
Fig. 5 be the coverlay transfer sheet 100 shown in Fig. 4 releasing sheet 120 from integrated substrate 50 peel off when covering
The front view of film transfer sheet 100 and integrated substrate 50.Fig. 6（A）It is the coverlay of the coverlay transfer sheet 100 shown in Fig. 5
The front view of configuration section 111 and substrate 61.Fig. 6（B）It is that the coverlay transfer sheet shown in Fig. 5 is only observed from the direction of arrow P
The side view of coverlay configuration section 111 and substrate 61 obtained by 100 coverlay configuration section 111 and substrate 61.Fig. 7（A）It is
The side view of the substrate 61 when the releasing sheet 120 of the coverlay transfer sheet 100 shown in Fig. 5 is peeled off from substrate 61.Fig. 7
（B）It is the substrate 61 after the releasing sheet 120 of coverlay transfer sheet 100 shown in Fig. 5 is peeled off from substrate 61
Side view.Fig. 7（C）It is the base after the releasing sheet 120 of coverlay transfer sheet 100 shown in Fig. 5 is peeled off from substrate 61
The front view of plate 61.Fig. 8 is that the 1st variation of the coverlay configuration section 111 of the coverlay transfer sheet 100 shown in Fig. 5 is covered
The front view of epiphragma configuration section 191 and substrate 61.Fig. 9 is the substrate when releasing sheet 120 shown in Fig. 8 is peeled off from substrate 61
61 side view.Figure 10 is that the releasing sheet 120 of the coverlay transfer sheet 100 shown in Fig. 5 peels off it from integrated substrate 50
The front view of integrated substrate 50 afterwards.
Next, as shown in figure 5, carrying out along the arrow mark 109 for representing peeling direction（With reference to Fig. 4）, will peel off
The stripping process that sheet material 120 is peeled off from integrated substrate 50.Stripper wire HL is made to go forward into expansion in peeling direction H in stripping process
Big stripping area.Stripper wire HL is the part peeled off from integrated substrate 50 and the part do not peeled off from integrated substrate 50
Boundary line.Stripper wire HL is orthogonal with peeling direction H.
Herein, in stripper wire HL positioned at from stripping starting position to initially peeling-off with releasing sheet 120 coverlay
When in the range of till 185, in stripping process, in each coverlay of multiple coverlays, from adhesive portion and stripper wire HL it
Between beeline rise for the direction below beeline between assisted parts and stripper wire HL, expand stripping area.The party
To peeling direction H e.g. shown in Fig. 5.
In the manufacture method, when releasing sheet 120 is peeled off from integrated substrate 50 and stripping area is gradually expanded,
In each coverlay of multiple coverlays, stripper wire HL passes through assisted parts or while by bonding after first passing through adhesive portion
Portion and assisted parts.And, the bonding force between releasing sheet 120 and coverlay is than the bonding force between coverlay and adhesive member
It is weak.
For example, such as Fig. 6（A）Shown, in coverlay 131, stripper wire HL first passes through adhesive portion 132 and passes through assisted parts again
133.And, adhesive portion 132 and adhesive member of the bonding force between releasing sheet 120 and coverlay 131 than coverlay 131
Bonding force between 141 is weak（With reference to Fig. 6（A）(B)）.
Equally, such as Fig. 6（A）Shown, in coverlay 135, stripper wire HL first passes through adhesive portion 136 and passes through assisted parts again
137.And, adhesive portion 136 and adhesive member of the bonding force between releasing sheet 120 and coverlay 135 than coverlay 135
Bonding force between 145 is weak（With reference to Fig. 6（A）(B)）.
Therefore, in the manufacture method, peel off from integrated substrate 50 in releasing sheet 120 and stripping area is gradually expanded
When big, multiple coverlays will not be peeled off together with releasing sheet 120 from each substrate, but to be pasted onto base via adhesive member
State on plate is remained on each substrate.
For example, such as Fig. 7（A）~（C）Shown, coverlay 131 will not be peeled off together with releasing sheet 120 from substrate 61,
But remained on substrate 61 with the state being pasted onto on substrate 61 via adhesive member 141.
Equally, such as Fig. 7（A）~（C）Shown, coverlay 135 will not be peeled off together with releasing sheet 120 from substrate 61,
But remained on substrate 61 with the state being pasted onto on substrate 61 via adhesive member 145.
On the other hand, as shown in figure 8, in the configuration for changing coverlay 135 so that assisted parts 137 and stripper wire HL it
Between beeline it is shorter than the beeline between adhesive portion 136 and stripper wire HL in the case of, in coverlay 135, stripping
Offline HL first passes through assisted parts 133 and passes through adhesive portion 132 again.In the case, releasing sheet 120 is being peeled off from substrate 61
When, as shown in figure 9, coverlay also can be peeled off together with releasing sheet 120 from each substrate.That is, due to assisted parts 133 and substrate
No bonding force between 61, therefore, even if the bonding force between releasing sheet 120 and coverlay 135 is weaker, coverlay sometimes
135 also can peel off from substrate 61 by starting point of assisted parts 133.
As described above, in the manufacture method, can prevent coverlay from also peeling off from each substrate together with releasing sheet 120
The problems such as generation.
Therefore, according to this manufacture method, without any problems multiple coverlays disposably can be configured on each substrate（Ginseng
According to Figure 10）.Additionally, by using coverlay transfer sheet 100, the strip operation personnel of releasing sheet easily can be carried out without mistake
Stripping by mistake.
Thus, the substrate with coverlay with adhesive member can be obtained.Each coverlay covers each adhesive member, to prevent
Undesirable thing（Dirt, dust etc.）Paste on the adhesive member of each substrate for being pasted on integrated substrate 50.
In addition, hereafter, starting to carry out peace is installed etc. by electronic devices and components such as the semiconductor packages for carrying out resin seal
Before dress operation, installation procedure is carried out by catching each assisted parts that multiple coverlays are peeled off from each substrate.In the installation
In operation, for example, electronic devices and components are installed on each substrate via the adhesive member, or by substrate sticking to other components
On be fixed.
Hereinafter, above-mentioned stripping process is described in detail with reference to Figure 11～Figure 13.Stripping process is according in stripping work
The coincidence system of the profile of the coverlay used in sequence and the profile of adhesive member and adopt following three kinds of stripping means.
Figure 11（A）It is the main view of major part releasing sheet 120 peeled off from substrate 61 with the 1st stripping means
Figure.Figure 11（B）It is the side view of major part releasing sheet 120 peeled off from substrate 61 with the 1st stripping means.Figure 12
（A）It is the front view of major part releasing sheet 120 peeled off from substrate 61 with the 2nd stripping means.Figure 12（B）Be with
The side view of by the 2nd stripping means from substrate 61 major part peeled off by releasing sheet 120.Figure 13（A）It is to peel off with the 3rd
The front view of by method from substrate 61 major part peeled off by releasing sheet 120.Figure 13（B）Being will with the 3rd stripping means
The side view of the major part peeled off from substrate 61 by releasing sheet 120.
In addition, in Figure 11（A）, Figure 12（A）, Figure 13（B）In, for convenience of description, eliminate the figure of releasing sheet 120
Show.Additionally, Figure 12（A）, the coverlay 231 shown in (B) be which has and adhesive member with the difference of coverlay 131
The profile that 141 profile overlaps on two sides.The other structures of coverlay 231 are identical with the structure of coverlay 131.Equally,
Figure 13（A）, the coverlay 331 shown in (B) with the difference of coverlay 131 be, with existing with the profile of adhesive member 141
The profile overlapped in a line.The other structures of coverlay 331 are identical with the structure of coverlay 131.
Firstly, for the 1st stripping means, such as Figure 11（A）, shown in (B), be quadrangle form, cover in adhesive member 141
In the case that the profile of film 131 and the profile of adhesive member 141 coincide on three sides, by releasing sheet 120 from substrate
The peeling direction peeled off on 61 be set to H, by this three between while i.e. true edge be set to L1, by peeling direction H and base
When the angle constituted by quasi- side L1 is set to Θ, gradually expand stripping area in the way of meeting 0 °≤Θ≤180 °.True edge L1
It is a line being clipped between other two sides.
In the 1st stripping means, peeling direction H is set to meet the direction of 0 °≤Θ≤180 °.Thus, in releasing sheet
120 peel off from integrated substrate 50 and when stripping area is gradually expanded, with the profile of adhesive member 141 on three sides
On in the coverlay 131 of profile that coincides, stripper wire HL first passes through adhesive portion 132 again by assisted parts 133 or while logical
Cross adhesive portion 132 and assisted parts 133.
For the 2nd stripping means, such as Figure 12（A）, shown in (B), be quadrangle form, coverlay 231 in adhesive member 141
Profile coincide on two adjacent sides with the profile of adhesive member 141 in the case of, by releasing sheet 120 from substrate
The peeling direction peeled off on 61 is set to H, by this two any bars in while be set to L1, by peeling direction H and this two
During any bar in the angle constituted by L1 is set to Θ, and the angle constituted with another a line L2 by peeling direction H is set to
During Φ, gradually expand stripping area in the way of meeting 0 °≤Θ≤90 °, 0 °≤Φ≤90 °.°
In the 2nd stripping means, peeling direction H is set to meet the direction of 0 °≤Θ≤90 °, 0 °≤Φ≤90 °.By
This, when releasing sheet 120 is peeled off from integrated substrate 50 and stripping area is gradually expanded, with adhesive member 141
The coverlay 231 of profile that coincides on two sides of profile in, stripper wire HL first passes through adhesive portion 132 and passes through assisted parts again
233 or while pass through adhesive portion 132 and assisted parts 233.
For the 3rd stripping means, such as Figure 13（A）, shown in (B), be quadrangle form, coverlay 331 in adhesive member 141
Profile and adhesive member 141 profile coincide in a line in the case of, releasing sheet 120 is enterprising from substrate 61
When the peeling direction that row is peeled off is set to H, this line is set to L3, the angle constituted by peeling direction H and side L3 is set to Θ,
Gradually expand stripping area in the way of meeting Θ=90 °.
In the 3rd stripping means, peeling direction H is set to meet the direction of Θ=90 °.Thus, releasing sheet 120 from
Peel off on integrated substrate 50 and when stripping area is gradually expanded, with the profile of adhesive member 141 in a line phase
In the coverlay 331 of the profile of coincidence, stripper wire HL passes through adhesive portion 132 and assisted parts 333 simultaneously.
More than the 1st, the 2nd, in the 3rd stripping means, the respective and releasing sheet 120 of coverlay 131,231,331
Between bonding force it is all weak than the bonding force between adhesive portion 132 and adhesive member 141.
Therefore, in the 1st, the 2nd, the 3rd stripping means, each coverlay 131,231,331 will not be together with releasing sheet 120
Peel off from substrate 61, but remained on substrate 61 with the state being pasted onto on substrate 61 via adhesive member 141.Therefore,
In the 1st, the 2nd, the 3rd stripping means, can prevent each coverlay 131,231,331 together with releasing sheet 120 from each substrate
The generation of the problems such as stripping.
Therefore, according to the 1st, the 2nd, the 3rd stripping means, without any problems multiple coverlays disposably can be configured each
On substrate（With reference to Figure 10）.
Hereinafter, the various modifications example of coverlay transfer sheet 100 is illustrated.
Figure 14 is the 2nd variation i.e. coverlay of the coverlay configuration section 111 of the coverlay transfer sheet 100 shown in Fig. 5
The front view of configuration section 211.Figure 15 is the 3rd deformation of the coverlay configuration section 111 of the coverlay transfer sheet 100 shown in Fig. 5
Example is the front view of coverlay configuration section 311.Figure 16 is the coverlay configuration section 111 of the coverlay transfer sheet 100 shown in Fig. 5
The 4th variation be coverlay configuration section 411 front view.Figure 17 is the coverlay of the coverlay transfer sheet 100 shown in Fig. 5
5th variation of configuration section 111 is the front view of coverlay configuration section 511.
Herein, in each coverlay configuration section of the coverlay configuration section 211,311,411 shown in Figure 14, Figure 15, Figure 16, cover
The bonding site of epiphragma 135 is different from coverlay configuration section 111.And, the coverlay configuration section 311 and coverlay shown in Figure 15
The difference of configuration section 111 is, more a piece of coverlay 135.Respective other knots of coverlay configuration section 211,311,411
Structure is identical with the structure of coverlay configuration section 111.Additionally, the coverlay configuration section 511 and coverlay configuration section 111 shown in Figure 17
Difference be with coverlay 531, the coverlay 531 have multiple adhesive portion 532A～532C.Coverlay configuration section
511 other structures are identical with the structure of coverlay configuration section 111.
In addition, the arrow on coverlay 131,135,531 in Figure 14～Figure 17 is represented releasing sheet 120 respectively from covering
The peeling direction peeled off on epiphragma 131,135,531.
In the coverlay 131 shown in Figure 14, stripper wire HL first passes through adhesive portion 132 and passes through assisted parts 133 again.Additionally,
In coverlay 135, stripper wire HL first passes through adhesive portion 136 and passes through assisted parts 137 again.Therefore, in coverlay 131, peel off
Sheet material 120 starts to peel off from the adhesive portion 132 of coverlay 131, and stripping area gradually expands to assisted parts 133.Equally, covering
In film 135, releasing sheet 120 starts to peel off from the adhesive portion 136 of coverlay 135, and stripping area gradually expands to assisted parts 137
Greatly.
That is, in the coverlay configuration section 211 shown in Figure 14, from adhesive portion in all of coverlay 131,135
132nd, 136 start to peel off.
Equally, in the coverlay configuration section 311 shown in Figure 15, and from bonding in all of coverlay 131,135
Portion 132,136 starts to peel off.
Next, in the coverlay 131 shown in Figure 16, stripper wire HL passes through assisted parts 133 and adhesive portion 132 simultaneously.
Additionally, in coverlay 135, stripper wire HL passes through assisted parts 137 and adhesive portion 136 simultaneously.Therefore, the coverlay shown in Figure 16
In configuration section 411, and start to peel off from adhesive portion 132,136 in all of coverlay 131,135.
Next, in the coverlay 531 shown in Figure 17, stripper wire HL passes through assisted parts 533 and adhesive portion 532A simultaneously.
Therefore, in the coverlay configuration section 511 shown in Figure 17, and from adhesive portion 532A～532C in all of coverlay 531
Start to peel off.
Herein, adhesive portion 132 and bonding structure of the bonding force between releasing sheet 120 and coverlay 131 than coverlay 131
Bonding force between part 141 is weak.Adhesive portion of the bonding force between releasing sheet 120 and coverlay 135 than coverlay 131
Bonding force between 136 and adhesive member 145 is weak.Equally, in the 5th variation, releasing sheet 120 and coverlay 531 it
Between bonding force also than the adhesive portion 532A～532C and adhesive member of coverlay 531（It is not shown）Between bonding force it is weak.
Therefore, in the 2nd～the 5th variation, each coverlay 131,135,531 also will not together with releasing sheet 120 from
Peel off on substrate 61, but remained on substrate 61 with the state being pasted onto on substrate 61 via adhesive member 141,145.Cause
This, can prevent generation of each coverlay 131,135,531 together with releasing sheet 120 from each substrate the problems such as stripping.
Therefore, according to the 2nd～the 5th variation, also without any problems multiple coverlays disposably can be configured in each base
On plate.
Then, below the various modifications example of coverlay transfer sheet 100 is illustrated.
Figure 18 is the 1st variation i.e. master of coverlay 631 of the coverlay 131 of the coverlay transfer sheet 100 shown in Fig. 5
View.Figure 19 is the 2nd variation i.e. main view of coverlay 731 of the coverlay 131 of the coverlay transfer sheet 100 shown in Fig. 5
Figure.Figure 20 is the 3rd variation i.e. front view of coverlay 831 of the coverlay 131 of the coverlay transfer sheet 100 shown in Fig. 5.
Figure 21 is the 4th variation i.e. front view of coverlay 931 of the coverlay 131 of the coverlay transfer sheet 100 shown in Fig. 5.Figure
22 is the 5th variation i.e. front view of coverlay 1031 of the coverlay 131 of the coverlay transfer sheet 100 shown in Fig. 5.Figure 23
It is the 6th variation i.e. front view of coverlay 1131 of the coverlay 131 of coverlay transfer sheet 100 shown in Fig. 5.Figure 24 is
7th variation of the coverlay 131 of the coverlay transfer sheet 100 shown in Fig. 5 is the front view of coverlay 1231.Figure 25 is figure
8th variation of the coverlay 131 of the coverlay transfer sheet 100 shown in 5 is the front view of coverlay 1331.
Coverlay 631 has multiple adhesive portion 632A, 632B and assisted parts 633.Coverlay 731 has multiple adhesive portion
732A, 732B and assisted parts 733.Coverlay 831 has multiple adhesive portion 832A, 832B and assisted parts 833.Coverlay 931 has
There are multiple adhesive portion 932A, 932B and assisted parts 933.Coverlay 1031 has multiple adhesive portion 1032A, 1032B and assisted parts
1033.Coverlay 1131 has multiple adhesive portion 1132A, 1132B and assisted parts 1133.Coverlay 1231 has multiple adhesive portion
1232A, 1232B and assisted parts 1233.Coverlay 1331 has multiple adhesive portion 1332A, 1332B and assisted parts 1333.
That is, each coverlay 631,731,831,931,1031,1131,1231,1331 is divided with the difference of coverlay 131
It is not with multiple adhesive portion.Other structures are identical with the structure of coverlay 131.
Therefore, it is viscous between each coverlay 631,731,831,931,1031,1131,1231,1331 and releasing sheet 120
Relay all than each adhesive portion 632A, 632B, 732A, 732B, 832A, 832B, 932A, 932B, 1032A, 1032B, 1132A,
1132B, 1232A, 1232B, 1332A, 1332B and adhesive member（It is not shown）Between bonding force it is weak.
Herein, it is respective in the coverlay 631,731,831,931,1031,1131,1231,1331 shown in Figure 18～Figure 25
Around show represent peeling direction arrow and expression successful mark whether is peeled off in the peeling direction（Zero or
×）.
According to Figure 18～Figure 25, as long as peeling direction is to start the direction of stripping from adhesive portion, just can be to releasing sheet 120
Successfully peeled off without any problems.On the other hand, according to Figure 18～Figure 25, as long as peeling direction is to start stripping from assisted parts
From direction, the stripping of releasing sheet 120 is possible to be peeling the problem that sheet material peeled off from assisted parts and causes failure.
Therefore, as shown in Figure 18～Figure 25, if shelled from the peeling direction for being labelled with "○" to releasing sheet 120
From then each coverlay 631,731,831,931,1031,1131,1231,1331 will not be together with releasing sheet 120 from substrate 61
Upper stripping, but remained on substrate 61 with the state being pasted onto on substrate 61 via adhesive member.Accordingly, it is capable to prevent each covering
The problems such as film 631,731,831,931,1031,1131,1231,1331 is peeled off together with releasing sheet 120 from each substrate
Occur.
Therefore, the 1st～the 8th variation according to Figure 18～Figure 25, also can without any problems by multiple coverlays one
It is configured on each substrate to secondary property.
In addition, in the above-described embodiment, having used the coverlay of rectangular shape, but it is not limited to this.When implementing,
For example, such as Figure 26（A）, shown in (B), it is also possible to be used in the covering that assisted parts 133 is formed with the breach 193 of rectangular shape
Film 1431 or be formed with assisted parts 133 R shapes breach 194 coverlay 1531.In coverlay 1431,1531, i.e.,
Stripper wire HL is made relative to the 133 parallel advance of adhesive portion 132 and assisted parts, stripper wire HL also can be using breach 193,194 come first
Assisted parts 133 is passed through again by adhesive portion 132 rather than passes through adhesive portion 132 simultaneously with assisted parts 133.That is, due to stripping film
Material 120 starts to peel off from adhesive portion 132, accordingly, it is capable to suppress releasing sheet 120 to peel off from assisted parts 133.
Additionally, in the above-described embodiment, adhesive member is shaped as tetragon, but is not limited to this.When implementing, glue
The shape of connection member can also be other shapes（For example, the polygon such as triangle, pentagon or circle）.
Additionally, in the above-described embodiment, arrow mark 109 has been used as beginning position mark is peeled off, but do not limited
In this.Start position mark when implementing, or using the stripping beyond arrow mark 109（For example, " peel off from here "
Character）.
Finally, the explanation of above-mentioned embodiment should be regarded as being illustration in all respects and not limiting.The model of the present invention
Enclose by the scope of claim to represent, and not by above-mentioned embodiment representing.And, the scope of the present invention also include with
Being had altered in the meaning and scope of the scope equivalent of claim.
Claims (6)
1. a kind of manufacture method of the substrate with coverlay, it is characterised in that include：
Preparatory process, prepares coverlay transfer sheet in the preparatory process, and the coverlay transfer sheet includes：Multiple coverings
Film, the plurality of coverlay is respectively with the part beyond being bonded with the adhesive portion and the adhesive portion of adhesive member in an interarea
That is assisted parts；And releasing sheet, the releasing sheet is bonded in the plurality of coverlay contrary with the adhesive member one
On the interarea of side, the bonding force between the releasing sheet and the coverlay is than between the coverlay and the adhesive member
Bonding force it is weak；
Adhering processes, in the adhering processes, by the adhesive portion of the coverlay transfer sheet via the adhesive member
It is pasted onto on substrate；And
Stripping process, in the stripping process, the releasing sheet is peeled off from the substrate, is made from the substrate
The part of upper stripping is advanced with the portion boundary line do not peeled off from the substrate i.e. stripper wire, and peels off while gradually expanding
Region,
In the stripping process, the stripper wire positioned at from peel off starting position to initially with the releasing sheet occur shell
From the coverlay till in the range of when, in the plurality of coverlay, respectively from the adhesive portion and the stripper wire
Between beeline be below the beeline between the assisted parts and the stripper wire direction, expand the stripping
Region.
2. the manufacture method of the substrate with coverlay as claimed in claim 1, it is characterised in that
In the stripping process, it is polygonal shape, the profile of the coverlay and the bonding structure in the adhesive member
The profile of part at least adjacent three while it is upper coincide, and it is described adjacent three while in by other two clamped by while
I.e. true edge with and its side it is adjacent while angulation be 90 °, and the true edge with and the adjacent while institute of its opposite side
Into angle be 90 ° in the case of, in peeling direction that the releasing sheet is peeled off from the substrate and the benchmark
When the angle constituted by side is set to Θ, gradually expand the stripping area in the way of meeting 0 °≤Θ≤180 °.
3. the manufacture method of the substrate with coverlay as claimed in claim 1, it is characterised in that
In the stripping process, it is polygonal shape, the profile of the coverlay and the bonding structure in the adhesive member
The profile of part coincides on two adjacent sides, and in the case that the adjacent both sides angulation is 90 °, by institute
The angle constituted when stating peeling direction that releasing sheet peeled off from the substrate with this two any bars in sets
By Θ, the angle that the peeling direction is constituted with another a line is set to into Φ when, with meet 0 °≤Θ≤90 °, 0 °≤Φ≤
90 ° of mode gradually expands the stripping area.
4. the manufacture method of the substrate with coverlay as claimed in claim 1, it is characterised in that
In the stripping process, it is polygonal shape, the profile of the coverlay and the bonding structure in the adhesive member
In the case that the profile of part coincides in a line, in the stripping side that the releasing sheet is peeled off from the substrate
When Θ is set to the angle constituted with a line, gradually expand the stripping area in the way of meeting Θ=90 °.
5. a kind of coverlay transfer sheet, it is characterised in that include：
Multiple coverlays, the plurality of coverlay is respectively with the adhesive portion and the bonding that adhesive member is bonded with an interarea
Part beyond portion is assisted parts, and covers each adhesive member；And
Releasing sheet, the releasing sheet are bonded in the interarea with the adhesive member opposite side in the plurality of coverlay
On,
Bonding force between the releasing sheet and the coverlay is than bonding between the coverlay and the adhesive member
Power is weak,
The adhesive portion of the plurality of coverlay is pasted onto on substrate via the adhesive member, by the releasing sheet from
When peeling off on the substrate, the releasing sheet produces the part and the not stripping from the substrate peeled off from the substrate
Portion boundary line be stripper wire,
The releasing sheet the stripper wire positioned at from peeling off starting position to initially peeling-off with the releasing sheet
The coverlay till in the range of when, in the plurality of coverlay, the respective stripping starting position have stripping
Beginning position mark is left, so that the beeline between the adhesive portion and the stripper wire is than the assisted parts and the stripping
Beeline between line is short.
6. coverlay transfer sheet as claimed in claim 5, it is characterised in that
The beginning position mark of peeling off is as axial arrow mark using the direction orthogonal with the stripper wire.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013035347A JP2014165351A (en) | 2013-02-26 | 2013-02-26 | Method of manufacturing substrate with coating film, and coating film transfer sheet |
| JP2013-035347 | 2013-02-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104010450A CN104010450A (en) | 2014-08-27 |
| CN104010450B true CN104010450B (en) | 2017-04-05 |
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ID=51370898
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410064749.2A Active CN104010450B (en) | 2013-02-26 | 2014-02-25 | The manufacture method and coverlay transfer sheet of the substrate with coverlay |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2014165351A (en) |
| CN (1) | CN104010450B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007214389A (en) * | 2006-02-09 | 2007-08-23 | Nippon Mektron Ltd | Manufacturing device and manufacturing method of flexible printed circuit board |
| CN201450666U (en) * | 2009-05-26 | 2010-05-05 | 常州安泰诺特种印制板有限公司 | Printing circuit board |
| CN102487577A (en) * | 2010-12-01 | 2012-06-06 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board with combination of flexible circuit board and hard circuit board |
| CN102530295A (en) * | 2010-11-16 | 2012-07-04 | 拉碧斯半导体株式会社 | Apparatus and method for packaging chip components and cover tape |
-
2013
- 2013-02-26 JP JP2013035347A patent/JP2014165351A/en active Pending
-
2014
- 2014-02-25 CN CN201410064749.2A patent/CN104010450B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007214389A (en) * | 2006-02-09 | 2007-08-23 | Nippon Mektron Ltd | Manufacturing device and manufacturing method of flexible printed circuit board |
| CN201450666U (en) * | 2009-05-26 | 2010-05-05 | 常州安泰诺特种印制板有限公司 | Printing circuit board |
| CN102530295A (en) * | 2010-11-16 | 2012-07-04 | 拉碧斯半导体株式会社 | Apparatus and method for packaging chip components and cover tape |
| CN102487577A (en) * | 2010-12-01 | 2012-06-06 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board with combination of flexible circuit board and hard circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014165351A (en) | 2014-09-08 |
| CN104010450A (en) | 2014-08-27 |
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