CN103974607B - 使用柔性墨的emi替代工艺 - Google Patents

使用柔性墨的emi替代工艺 Download PDF

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Publication number
CN103974607B
CN103974607B CN201310399184.9A CN201310399184A CN103974607B CN 103974607 B CN103974607 B CN 103974607B CN 201310399184 A CN201310399184 A CN 201310399184A CN 103974607 B CN103974607 B CN 103974607B
Authority
CN
China
Prior art keywords
silver paste
psr
emi
ink
mentioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310399184.9A
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English (en)
Chinese (zh)
Other versions
CN103974607A (zh
Inventor
郑上镐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Si Is Simon Rex Co Ltd Not
Original Assignee
Si Is Simon Rex Co Ltd Not
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Si Is Simon Rex Co Ltd Not filed Critical Si Is Simon Rex Co Ltd Not
Publication of CN103974607A publication Critical patent/CN103974607A/zh
Application granted granted Critical
Publication of CN103974607B publication Critical patent/CN103974607B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201310399184.9A 2013-01-30 2013-09-05 使用柔性墨的emi替代工艺 Active CN103974607B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0010384 2013-01-30
KR1020130010384A KR101285278B1 (ko) 2013-01-30 2013-01-30 연성 잉크를 이용한 ｅｍｉ 대처 공법

Publications (2)

Publication Number Publication Date
CN103974607A CN103974607A (zh) 2014-08-06
CN103974607B true CN103974607B (zh) 2017-07-11

Family

ID=48997196

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310399184.9A Active CN103974607B (zh) 2013-01-30 2013-09-05 使用柔性墨的emi替代工艺

Country Status (2)

Country Link
KR (1) KR101285278B1 (ko)
CN (1) CN103974607B (ko)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101330803A (zh) * 2007-06-18 2008-12-24 比亚迪股份有限公司 一种印刷线路板的辅助加工方法
CN101588677A (zh) * 2008-05-19 2009-11-25 比亚迪股份有限公司 一种柔性印制电路板的制作方法
CN101646307A (zh) * 2008-08-04 2010-02-10 比亚迪股份有限公司 一种fpc制作方法及fpc

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100778665B1 (ko) * 2006-08-09 2007-11-23 주식회사 심텍 박판 리지드 인쇄회로기판의 퍼리미터 공법
JP2011138935A (ja) 2009-12-28 2011-07-14 Hitachi Cable Ltd 半導体装置用配線基板の製造方法
KR20120027958A (ko) * 2010-09-14 2012-03-22 (주)와이에스썸텍 불연속적 절연패턴을 갖는 인쇄회로기판 및 이의 제조방법
KR20120048983A (ko) * 2010-11-08 2012-05-16 에스케이하이닉스 주식회사 인쇄회로기판 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101330803A (zh) * 2007-06-18 2008-12-24 比亚迪股份有限公司 一种印刷线路板的辅助加工方法
CN101588677A (zh) * 2008-05-19 2009-11-25 比亚迪股份有限公司 一种柔性印制电路板的制作方法
CN101646307A (zh) * 2008-08-04 2010-02-10 比亚迪股份有限公司 一种fpc制作方法及fpc

Also Published As

Publication number Publication date
CN103974607A (zh) 2014-08-06
KR101285278B1 (ko) 2013-07-11

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