CN103974564A - Method for manufacturing PCB coaxial cable and PCB coaxial cable - Google Patents
Method for manufacturing PCB coaxial cable and PCB coaxial cable Download PDFInfo
- Publication number
- CN103974564A CN103974564A CN201310027419.1A CN201310027419A CN103974564A CN 103974564 A CN103974564 A CN 103974564A CN 201310027419 A CN201310027419 A CN 201310027419A CN 103974564 A CN103974564 A CN 103974564A
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- China
- Prior art keywords
- dielectric layer
- metal
- groove
- heart yearn
- coaxial cable
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- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 121
- 229910052751 metal Inorganic materials 0.000 claims abstract description 121
- 239000000758 substrate Substances 0.000 claims description 34
- 238000005530 etching Methods 0.000 claims description 33
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 description 9
- 239000004020 conductor Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011536 re-plating Methods 0.000 description 1
- 238000004826 seaming Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Abstract
The invention provides a method for manufacturing a PCB coaxial cable and the PCB coaxial cable. The method comprises the following steps that a medium layer used for wrapping a core wire is manufactured, and two linear metal connectors located in the medium layer and on the two sides of the core wire are manufactured, wherein the metal connectors and the core wire do not cross; the surface of the medium layer is etched to form at least two grooves through which the two metal connectors are exposed; the core wire is located in the part, between the grooves, of the medium layer; the grooves and the surface of the part, between the grooves, of the medium layer are metallized, so that a metal shielding layer wrapping the part, between the grooves, of the medium layer is formed, and the PCB coaxial cable is obtained. By the adoption of the processes that the medium layer is etched to form the two grooves, the grooves are filled, and the part, between the grooves, of the medium layer is metallized, the metal shielding layer can be easily and rapidly formed around the core wire, and the coaxial cable with the shielding layer is obtained. Compared with the prior art, the number of processes is small, and processing efficiency is high.
Description
Technical field
The present invention relates to PCB and make field, in particular to a kind of manufacture method and PCB coaxial cable of PCB coaxial cable.
Background technology
In PCB field, need to adopt coaxial cable signal transmission.At the outer surface of coaxial cable, coated metal paper tinsel, to shield the interference of outer signals.
Prior art, in making the process of coaxial cable, adopts and first makes metallized groove, then fills the mode of heart yearn and insulator, in metallized groove, forms coaxial cable.After repeatedly metallizing and repeatedly filling, obtained wrapping up the coaxial cable of metal forming.This manufacturing process, need to repeatedly fill, and processing step is more loaded down with trivial details, and make efficiency is lower.
Summary of the invention
The present invention aims to provide a kind of manufacture method and PCB coaxial cable of PCB coaxial cable, loaded down with trivial details to solve the manufacturing process technique of above-mentioned coaxial cable, the problem that make efficiency is low.
The manufacture method that the invention provides a kind of PCB coaxial cable, comprising:
Make the dielectric layer of parcel heart yearn, and be produced on two the linear metal connectors that are positioned at described heart yearn both sides in described dielectric layer; Wherein, on PCB forms plane projection, described metal connector with described heart yearn without intersecting;
From the surface etching of described dielectric layer, form at least two grooves of exposed described two metal connectors; Wherein, in the dielectric layer of described heart yearn between described groove;
The dielectric layer surface of metallizing between described groove and described groove, forms the metal screen layer that wraps up the dielectric layer between described groove, obtains PCB coaxial cable.
The present invention also provides a kind of manufacture method of PCB coaxial cable, comprising:
On the surface of metal forming substrate, make the dielectric layer of parcel heart yearn;
From the surface etching of described dielectric layer, form two grooves of exposed described metal forming; Wherein, described heart yearn is between described two grooves in dielectric layer;
The dielectric layer surface of metallizing between described groove and described groove, forms the metal screen layer that wraps up the dielectric layer between described groove, obtains PCB coaxial cable.
The present invention also provides a kind of PCB coaxial cable, the dielectric layer that comprises heart yearn and parcel heart yearn, further comprise: the linear metal connector of described heart yearn both sides, with the groove communicating with described metal connector and described dielectric layer surface, dielectric layer surface coverage metal between described groove and groove, forms the metal screen layer that wraps up the dielectric layer between described groove.
The present invention also provides a kind of PCB coaxial cable, comprises the dielectric layer of heart yearn and parcel heart yearn, and the metal forming substrate of described dielectric layer one side, and at least respectively there is a groove described heart yearn both sides, are communicated with the opposite side of metal forming substrate and described dielectric layer; Dielectric layer surface coverage metal between described groove and groove, forms the metal screen layer that wraps up the dielectric layer between described groove.
The present invention is due to the technique adopting at dielectric layer etching two grooves, filling grooves the dielectric layer between groove of metallizing, can be simply, at heart yearn, form metal screen layer around fast, obtain having the coaxial cable of screen.Compared with prior art, technique is few, working (machining) efficiency is high.
Accompanying drawing explanation
Accompanying drawing described herein is used to provide a further understanding of the present invention, forms the application's a part, and schematic description and description of the present invention is used for explaining the present invention, does not form inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 shows the flow chart of embodiment;
Fig. 2 shows the schematic cross-section that forms heart yearn and metal connector in embodiment in dielectric layer;
Fig. 3 shows the schematic diagram that in embodiment, metal connector L is fabricated into dielectric layer bottom;
Fig. 4 A shows in embodiment and offers the schematic cross-section groove from dielectric layer surface;
Fig. 4 B shows the schematic cross-section that obtains screen in embodiment after metallization;
Fig. 5 shows in embodiment the schematic cross-section at dielectric layer middle etch heart yearn and metal connector;
Fig. 6 shows the schematic cross-section after pressing dielectric layer in embodiment;
Fig. 7 shows the schematic cross-section from the etched recesses of positive and negative two sides in embodiment;
Fig. 8 shows the schematic cross-section metallizing after groove in embodiment;
Fig. 9 shows the metal forming substrate of selecting in embodiment;
Figure 10 shows embodiment and at metal forming substrate, processes the schematic cross-section of heart yearn and metal connector;
Figure 11 shows the schematic cross-section after embodiment pressing dielectric layer and metal forming;
Figure 12 shows the schematic cross-section of offering the opening of groove in embodiment two metal foil surface;
Figure 13 shows and in embodiment, offers the schematic cross-section after groove;
Figure 14 shows in embodiment the schematic cross-section at PCB coaxial cable electroplating surface metal layer S2;
Figure 15 shows in embodiment the schematic cross-section of coaxial cable after etching;
Figure 16 shows in embodiment at the schematic cross-section of processing double wired conductor;
Figure 17 shows the schematic cross-section of the coaxial cable of double wired conductor in embodiment;
Figure 18 shows the front schematic view that double wired conductor in embodiment forms criss-cross coaxial cable;
Figure 19 shows the front schematic view after the PCB metallization groove of Figure 18 in embodiment;
Figure 20 shows the flow chart of another embodiment;
Figure 21 shows the schematic cross-section of making heart yearn in embodiment on single-side metal foil substrate;
Figure 22 shows and in embodiment, offers the schematic cross-section after groove;
Figure 23 shows the schematic cross-section that embodiment metallizes after groove;
Figure 24 shows the schematic cross-section that forms heart yearn in embodiment in the dielectric layer between two-side metal foil;
Figure 25 shows the schematic cross-section of in embodiment, the PCB of Figure 24 being offered to groove.
Embodiment
Below with reference to the accompanying drawings and in conjunction with the embodiments, describe the present invention in detail.The flow chart of embodiment shown in Figure 1, comprises the following steps:
S11: make the dielectric layer of parcel heart yearn, and be produced on two the linear metal connectors that are positioned at described heart yearn both sides in described dielectric layer; Wherein, on PCB forms plane projection, described metal connector with described heart yearn without intersecting;
S12: from the surface etching of described dielectric layer, form at least two grooves of exposed described two metal connectors; Wherein, in the dielectric layer of described heart yearn between described groove;
S13: the dielectric layer surface of metallizing between described groove and described groove, form the metal screen layer that wraps up the dielectric layer between described groove, obtain PCB coaxial cable.
In above-described embodiment, due to the technique adopting at dielectric layer etching two grooves, filling grooves the dielectric layer between groove of metallizing, can be simply, at heart yearn, form metal screen layer around fast, obtain having the coaxial cable of screen.Compared with prior art, technique is few, working (machining) efficiency is high.
Preferably, can adopt the coaxial cable in one side substrate manufacture embodiment.One side substrate is the PCB with a dielectric layer and layer of metal paper tinsel.One side at one side substrate etches after heart yearn K, and surface makes the dielectric layer that covers heart yearn K, in the dielectric layer surface of another side stamped metal layer, for making follow-up metal connector L.Form structure as shown in Figure 2.
By carrying out etching for making the metal level of connector L, etch two metal connector L.After etching metal connector L, cladding thickness is no more than the dielectric layer of metal connector L thickness, forms structure as shown in Figure 3.
Also can adopt double-sided substrate to make, first on substrate, making one side figure is heart yearn part K, again at heart yearn one side coating resin layer or compacting one deck prepreg, the structure of formation as shown in 2, carry out again graphic making and go out connector L, after etching metal connector L, cladding thickness is no more than the dielectric layer of metal connector L thickness, forms structure as shown in Figure 3.
Certainly, except these two kinds of techniques, also have multiple implementation metal connector L can be embedded in dielectric layer, exposed surface, or embed a part of degree of depth, exposed another part.
In the process of machined grooves, can go out two grooves by laser-induced thermal etching, as shown in Figure 4 A.
By after two groove metallization, form the screen of the dielectric layer between parcel groove.As shown in Figure 4 B.
In another embodiment, heart yearn K and metal connector L can be positioned at the centre position of dielectric layer simultaneously.
Can in the centre position of dielectric layer, form heart yearn K and metal connector L in the following manner.
Referring to Fig. 5, in the metal forming of one side substrate surface, etch described heart yearn and described metal connector;
In described one side substrate surface compacting, cover the dielectric layer of described heart yearn and described metal connector.The formation centre position at dielectric layer as shown in Figure 6 forms the structure of heart yearn K and metal connector L.
Preferably, in an embodiment, the process of described formation groove comprises:
The positive and negative two sides of the one side substrate after described pressing medium layer, adopts laser-induced thermal etching to go out four grooves as shown in Figure 7.Then, behind the dielectric layer surface between metallization groove and groove, form PCB coaxial cable as shown in Figure 8.
In another embodiment, except making PCB coaxial cable, can also on metal forming substrate, make PCB coaxial cable on one side substrate.Like this, when etched recesses, both can adopt laser-induced thermal etching, also can using plasma (PLASMA) etching.In the etching process of plasma, the dielectric layer outside groove needs the protection of metal forming.Although increased the technique of making metal forming, the time of the etched recesses of plasma is less than the time of laser-induced thermal etching, still can improve the efficiency of making PCB coaxial cable.
Preferably, also can adopt metal forming substrate to make PCB coaxial cable, referring to Fig. 9, select the substrate of a two-side metal foil.Manufacturing process is as follows:
Referring to Figure 10, in one side metal foil surface, etch heart yearn K and metal connector L.
Referring to Figure 11, in heart yearn surface coverage dielectric layer and metal forming, form the substrate that positive and negative two sides has metal forming.
Referring to Figure 12, according to the position of described groove and width, at the metal forming S1 on described positive and negative two sides surface etching, exposed dielectric layer.
Referring to Figure 13, according to the position of described groove, the dielectric layer that using plasma or laser-induced thermal etching are exposed, forms four grooves.
Referring to Figure 14, metallization groove, meanwhile, the metal forming S1 of metallized groove and substrate surface forms the metal screen layer of PCB coaxial cable.
Preferably, in the position contacting, can there is the untight seam of coarse connection after merging in metallized groove and metal forming S1.In order to eliminate the rough surface of these seaming positions, also comprise, on the positive and negative two sides of described PCB coaxial cable, plated metal paper tinsel S2.
For the PCB coaxial cable in Fig. 4 in embodiment or Fig. 8, also can, at two sides difference re-plating layer of metal paper tinsel, form PCB coaxial cable as shown in figure 14.
Preferably, according to the interval between groove, coaxial cable is carried out to etching, form PCB coaxial cable as shown in figure 15.
Preferably, in above-described embodiment, the quantity of described heart yearn is one or more; Between many heart yearns, both can be parallel to each other, also can have joint, also can either way have.
By the method for the above embodiments, obtain PCB coaxial cable, comprise: the dielectric layer of heart yearn and parcel heart yearn, further comprise: the linear metal connector of described heart yearn both sides, with the groove communicating with described metal connector and described dielectric layer surface, dielectric layer surface coverage metal between described groove and groove, forms the metal screen layer that wraps up the dielectric layer between described groove.
As shown in Figure 16, Figure 17, in the process of etching heart yearn, etch two heart yearns that are parallel to each other.
Referring to Figure 18, etched heart yearn K is the heart yearn that two intersections have joint.Thereby form the input that signal transmits, the transfer mode of a plurality of outputs.Certainly, can be also the heart yearn of three intersections, the figure with two joints of formation, as the heart yearn of a level and two vertical two joints of heart yearns formation, has the end points of 6 heart yearns like this, can form an input, five outputs.
After heart yearn in Figure 18 completes, blanket dielectric layer, after offering groove metallization, forms the figure shown in Figure 19, and its surface is screen S1.
In the above embodiments, manufacturing process is simple, and the PCB coaxial cable yields obtaining is high.In the above embodiments, adopt the form that metal connector is set, offer groove, this mode, is of value to the darker PCB of depth of groove, due to the existence of metal connector, can face metal connector etched recesses from positive and negative two.For more shallow groove, also can adopt the following examples to make PCB coaxial cable.
Referring to Figure 20, this embodiment comprises the following steps:
S21: on the surface of metal forming substrate, make the dielectric layer of parcel heart yearn;
S22: from the surface etching of described dielectric layer, form two grooves of exposed described metal forming; Wherein, described heart yearn is between described two grooves in dielectric layer;
S23: the dielectric layer surface of metallizing between described groove and described groove, form the metal screen layer that wraps up the dielectric layer between described groove, obtain PCB coaxial cable.
Adopt the step in this embodiment, can realize not etching metal connector, also can etched recesses, make PCB coaxial cable, reduced technical process, improved make efficiency.
Referring to Figure 21, after making the dielectric layer of parcel heart yearn, the surface at dielectric layer described in the employing laser-induced thermal etching of the surface of dielectric layer, forms two grooves as described in Figure 22;
Metallization groove is also electroplated the dielectric layer between groove, forms the PCB coaxial cable shown in Figure 23.
For improving the efficiency of etched recesses, also can using plasma etched recesses, but need to, as the scheme in aforesaid embodiment, increase the metal forming protective dielectric layer of electroplating and not be damaged in plasma etching process.
Referring to Figure 24, after making the dielectric layer of parcel heart yearn, at this dielectric layer surface, plated metal paper tinsel; Form the two-sided substrate that has metal forming.
According to the position of described groove and width, at the metal foil surface etching of described plating, exposed dielectric layer;
According to the position of described groove, using plasma or laser-induced thermal etching go out described groove, obtain the groove shown in Figure 25.Then the groove that metallizes, obtains PCB coaxial cable.
By the method step in the above embodiments, the PCB coaxial cable obtaining comprises: the dielectric layer of heart yearn and parcel heart yearn, and the metal forming substrate of described dielectric layer one side, at least respectively there is a groove described heart yearn both sides, are communicated with the opposite side of metal forming substrate and described dielectric layer; Dielectric layer surface coverage metal between described groove and groove, forms the metal screen layer that wraps up the dielectric layer between described groove.
Preferably, also comprise: at the positive and negative two sides of described PCB coaxial cable, plated metal paper tinsel; As increased metal forming S2 in previous embodiment.Coaxial cable after plating, can eliminate matsurface and gap surperficial in groove metallization processes, is convenient to follow-up making figure.
The quantity of the heart yearn in this embodiment is one or more; Between many heart yearns, both can be parallel to each other, also can have joint, also can either way have.
Preferably, in the above embodiments, the substrate section with metal forming adopts the materials such as various resin-coated substrates (RCC), copper clad laminate (CCL).
Preferably, in the above embodiments, dielectric layer can adopt the modes such as compacting prepreg, coated with resins layer to make.
Preferably, in the above embodiments, groove metallization can adopt plating mode, fill out copper mode, electroplate in conjunction with plug resin, electroplate in conjunction with the modes such as tin cream all can, or directly the mode such as filled conductive material is made.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (12)
1. a manufacture method for PCB coaxial cable, is characterized in that, comprising:
Make the dielectric layer of parcel heart yearn, and be produced on two the linear metal connectors that are positioned at described heart yearn both sides in described dielectric layer; Wherein, on PCB forms plane projection, described metal connector with described heart yearn without intersecting;
From the surface etching of described dielectric layer, form at least two grooves of exposed described two metal connectors; Wherein, in the dielectric layer of described heart yearn between described groove;
The dielectric layer surface of metallizing between described groove and described groove, forms the metal screen layer that wraps up the dielectric layer between described groove, obtains PCB coaxial cable.
2. manufacture method according to claim 1, is characterized in that, the described making parcel dielectric layer of heart yearn and the process of described metal connector comprise:
Metal forming at one side substrate surface etches described heart yearn and described metal connector;
At described one side substrate surface, cover the dielectric layer of described heart yearn and described metal connector.
3. manufacture method according to claim 2, is characterized in that, the process of described formation groove comprises:
The positive and negative two sides of the one side substrate after described pressing medium layer, adopts laser-induced thermal etching to go out four grooves.
4. manufacture method according to claim 1, is characterized in that, the position of described metal connector is between the bottom of the dielectric layer of described parcel heart yearn;
The process of described formation groove comprises:
In the one side of described dielectric layer, adopt laser-induced thermal etching to go out two grooves.
5. manufacture method according to claim 1, is characterized in that, adopts metal forming substrate to make dielectric layer and the described metal connector of described parcel heart yearn;
Dielectric layer electroplating surface metal paper tinsel in described making, forms the substrate that positive and negative two sides has metal forming;
The process of described formation groove comprises:
According to the position of described groove and width, the metal foil surface etching on described positive and negative two sides, exposed dielectric layer;
According to the position of described groove, the dielectric layer that using plasma or laser-induced thermal etching are exposed, forms four grooves.
6. according to the manufacture method described in claim 1,3,4 or 5, it is characterized in that, also comprise:
At the positive and negative two sides of described PCB coaxial cable, plated metal paper tinsel.
7. manufacture method according to claim 1, is characterized in that, the quantity of described heart yearn is one or more;
Between described many heart yearns, be parallel to each other, or, one or more joints there are.
8. a manufacture method for PCB coaxial cable, is characterized in that, comprising:
On the surface of metal forming substrate, make the dielectric layer of parcel heart yearn;
From the surface etching of described dielectric layer, form two grooves of exposed described metal forming; Wherein, described heart yearn is between described two grooves in dielectric layer;
The dielectric layer surface of metallizing between described groove and described groove, forms the metal screen layer that wraps up the dielectric layer between described groove, obtains PCB coaxial cable.
9. manufacture method according to claim 8, is characterized in that, adopts the surface of dielectric layer described in laser-induced thermal etching, forms described two grooves;
Or, after the dielectric layer of described making parcel heart yearn, at this dielectric layer surface, plated metal paper tinsel;
According to the position of described groove and width, at the metal foil surface etching of described plating, exposed dielectric layer;
According to the position of described groove, using plasma or laser-induced thermal etching go out described groove.
10. manufacture method according to claim 9, is characterized in that, also comprises:
At the positive and negative two sides of described PCB coaxial cable, plated metal paper tinsel;
The quantity of described heart yearn is one or more;
Between described many heart yearns, be parallel to each other, or, one or more joints there are.
11. 1 kinds of PCB coaxial cables, the dielectric layer that comprises heart yearn and parcel heart yearn, it is characterized in that, further comprise: the linear metal connector of described heart yearn both sides, with the groove communicating with described metal connector and described dielectric layer surface, dielectric layer surface coverage metal between described groove and groove, forms the metal screen layer that wraps up the dielectric layer between described groove.
12. 1 kinds of PCB coaxial cables, comprise heart yearn and the dielectric layer that wraps up heart yearn, and the metal forming substrate of described dielectric layer one side, it is characterized in that, at least respectively there is a groove described heart yearn both sides, are communicated with the opposite side of metal forming substrate and described dielectric layer; Dielectric layer surface coverage metal between described groove and groove, forms the metal screen layer that wraps up the dielectric layer between described groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310027419.1A CN103974564B (en) | 2013-01-24 | 2013-01-24 | The production method and PCB coaxial cables of PCB coaxial cables |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310027419.1A CN103974564B (en) | 2013-01-24 | 2013-01-24 | The production method and PCB coaxial cables of PCB coaxial cables |
Publications (2)
| Publication Number | Publication Date |
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| CN103974564A true CN103974564A (en) | 2014-08-06 |
| CN103974564B CN103974564B (en) | 2018-11-06 |
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| CN201310027419.1A Expired - Fee Related CN103974564B (en) | 2013-01-24 | 2013-01-24 | The production method and PCB coaxial cables of PCB coaxial cables |
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| US20020075104A1 (en) * | 1998-12-28 | 2002-06-20 | Dynamic Solutions International, Inc. A Seoul, Republic Of Korea Corporation | Coaxial type signal line and manufacturing method thereof |
| US20020101723A1 (en) * | 1999-03-09 | 2002-08-01 | International Business Machines Corporation | Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality |
| US20040040739A1 (en) * | 2000-05-18 | 2004-03-04 | Eiji Yoshimura | Multilayer wiring board and method of manufacturing the same |
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| CN102123560A (en) * | 2011-03-01 | 2011-07-13 | 梅州博敏电子有限公司 | Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof |
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|---|---|---|---|---|
| US4845311A (en) * | 1988-07-21 | 1989-07-04 | Hughes Aircraft Company | Flexible coaxial cable apparatus and method |
| US5357138A (en) * | 1991-02-22 | 1994-10-18 | Nec Corporation | Coaxial wiring pattern structure in a multilayered wiring board |
| US20020075104A1 (en) * | 1998-12-28 | 2002-06-20 | Dynamic Solutions International, Inc. A Seoul, Republic Of Korea Corporation | Coaxial type signal line and manufacturing method thereof |
| US20020101723A1 (en) * | 1999-03-09 | 2002-08-01 | International Business Machines Corporation | Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality |
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| CN1347278A (en) * | 2000-10-03 | 2002-05-01 | 日本胜利株式会社 | Printed wiring board and method for mfg. same |
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| CN1981349A (en) * | 2004-06-30 | 2007-06-13 | 索尼化学&信息部件株式会社 | Transmission cable and process for producing same |
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| CN103974564B (en) | 2018-11-06 |
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