CN103973947A - Shutter for thermal imaging camera - Google Patents

Shutter for thermal imaging camera Download PDF

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Publication number
CN103973947A
CN103973947A CN201410020064.8A CN201410020064A CN103973947A CN 103973947 A CN103973947 A CN 103973947A CN 201410020064 A CN201410020064 A CN 201410020064A CN 103973947 A CN103973947 A CN 103973947A
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CN
China
Prior art keywords
shutter
section
thermal imaging
imaging camera
matrix
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Granted
Application number
CN201410020064.8A
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Chinese (zh)
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CN103973947B (en
Inventor
K·R·约翰逊
J·M·希尔德
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FOLUC CORP
Fluke Corp
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FOLUC CORP
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Publication of CN103973947A publication Critical patent/CN103973947A/en
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B9/00Exposure-making shutters; Diaphragms
    • G03B9/08Shutters
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/10Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
    • H04N23/11Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths for generating image signals from visible and infrared light wavelengths
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/70Circuitry for compensating brightness variation in the scene
    • H04N23/75Circuitry for compensating brightness variation in the scene by influencing optical camera components

Abstract

Various embodiments of shutters for thermal imaging cameras, cameras comprising such shutters, and methods for providing such shutters are disclosed. The shutter may include a substrate with various layers and components thereon, such as a temperature sensor. The shutter may resemble a printed circuit board (PCB), utilizing efficient, cost-effective materials and methods known in the art.

Description

For the shutter of Thermal Imaging Camera
Background technology
Thermal Imaging Camera is for various occasions.For example, Thermal Imaging Camera uses with hot checkout facility during the maintenance overhaul of being everlasting.Exemplary equipment can comprise the equipment of the other types such as rotary machine, distribution panelboard or circuit breaker in a row.Heat inspection can be detected such as overheated machinery or electronic building brick equipment focus, contributes to periodically to keep in repair or changed overheated equipment before more significant problem development.
Depend on the structure of camera, Thermal Imaging Camera also can produce the visible image of same object.Camera can for example show infrared image and visible image, the thermal imagery being produced by Thermal Imaging Camera to contribute to operator to understand in the mode of coordinating.The visible image of good contrast between different objects is different from providing substantially, compares real-world scene and in thermal imagery, is often difficult to identification and distinguishes different features.For this reason, operator can be dependent on visible image to help thermal imagery explanation and to pay close attention to.
Be configured to not only produce thermal imagery but also produce in the application of visible image at Thermal Imaging Camera, camera can comprise two groups of opticses that separate: visible ray is focused on for generation of the visible ray optics on the visible light sensor of visible image, and infrared radiation is focused on for generation of the IR optical component on the infrared sensor of infrared image.
Thermal Imaging Camera can additionally comprise the shutter for various application.Shutter can be used to the sensing element of incident infrared radiation and camera to intercept, for calibration and/or calculate object, such as the scene that uniform scene and/or known temperature are provided to camera for Nonuniformity Correction (NUC).For these objects, what often expect is the temperature of knowing shutter.Can be other functions expense cost and that can affect negatively shutter in conjunction with temperature sensor.Additionally, traditional metal shutter is easily bending and be difficult to remain smooth surface.And such metal shutter often needs spray treatment to form the shutter surface of appropriate emissivity.
Summary of the invention
Generally, the present invention relates to the shutter for Thermal Imaging Camera, and comprised the camera of this shutter, described shutter comprises matrix, and described matrix has multiple layers thereon.Each on shutter layer can be used as various objects and has the various characteristics such as high or low emissivity or heat conduction and/or conductivity or resistivity.
The whole bag of tricks and equipment fall within the scope of the invention.Specific implementations of the present invention comprises shutter, and described shutter comprises the matrix of flat, thermal insulation and electric insulation, and described matrix is with the first side and the second side, and shutter comprises the first section and the second section that are connected with the first side and second side of matrix.The first section and the second section be intended to respectively towards with the transducer that deviates from Thermal Imaging Camera.The first section is configured to present uniform thermal field scape to camera, and can comprise respectively that heat conduction and conductive layer and high emissivity layer are to promote uniform temperature and internal reflection is minimized.
The first section of shutter can additionally comprise temperature sensor, and described temperature sensor can be used for the calibration of associated hot imaging camera; And conductive channel is so that the output of relaying temperature sensor.This structure of assembly (temperature sensor), matrix and layer can be similar to the structure of printed circuit board (PCB).Additionally, the second section of shutter can comprise the low emissivity coatings for the energy being incident on shutter is reflected away.
The additional aspect of embodiments of the present invention can be included in heat in each layer of shutter discharge otch (thermal relief cut) in case prevent heat or electric current through the each several part of shutter or flow through between the each several part of shutter.Other execution modes can be included in shutter, be intended to incoming signal is weakened but not the hole that intercepts incoming signal completely.
According to an aspect of the present invention, a kind of shutter for Thermal Imaging Camera is provided, it is for optionally covering at least a portion of infrared sensor elements, described shutter comprises: matrix flat, thermal insulation and electric insulation, described matrix has the first side and the second side, and described the second side is contrary with the first side substantially; The first section, it is operatively connected to the first side of matrix, described the first section comprises: not only heat conduction but also the ground floor that conducts electricity, electric insulation and there is the second layer of high emissivity, and temperature sensor, described temperature sensor has for the sensing element of sensing temperature and output device for exporting the signal of telecommunication corresponding with institute sensing temperature, described sensing element and ground floor hot link; And second section, it is operatively connected to the second side of matrix, and described the second section comprises low emissivity coatings.
According to another aspect of the present invention, a kind of shutter is provided, it is at least a portion of the infrared sensor elements of cover heating imaging camera optionally, described Thermal Imaging Camera provides the thermal imagery of high temperature scene, described shutter comprises: matrix flat, thermal insulation and electric insulation, and described matrix has the first side and second side contrary with the first side substantially; The first section, it is operatively connected to the first side of matrix, described the first section comprises: not only heat conduction but also the ground floor that conducts electricity, electric insulation and there is the second layer of high emissivity, first area, with the second area of first area thermal insulation and electric insulation, and temperature sensor, described temperature sensor has for the senser element of sensing temperature and output device for exporting the signal of telecommunication corresponding with institute sensing temperature, described sensing element in first area with described ground floor hot link; The second section, it is operatively connected to the second side of matrix; And hole, do not sensed by Thermal Imaging Camera to only intercept a part for incident IR radiation.
According to a further aspect of the invention, a kind of shutter is provided, it is for optionally covering at least a portion of infrared sensor elements, and described shutter comprises: matrix flat, thermal insulation and electric insulation, and described matrix has the first side and second side contrary with the first side substantially; The first section, it is operatively connected to the first side of matrix, described the first section comprises: not only heat conduction but also the layer that conducts electricity, first area, second area with first area thermal insulation and electric insulation, and temperature sensor, described temperature sensor has for the sensing element of sensing temperature and output device for exporting the signal of telecommunication corresponding with institute sensing temperature, described sensing element in described first area with the hot link of described layer; And second section, it is operatively connected to the second side of matrix, and described the second section comprises low emissivity coatings.
Preferably, described shutter also comprises the flag portion for optionally covering infrared sensor elements, and the bar portion of contiguous flag portion location, wherein, the border that the first heat conduction and conductive layer are crossed between flag portion and bar portion is discontinuous at least partly because the first heat discharges otch.
Preferably, described first area is defined for the flag portion of selectivity covering infrared sensor elements, and described second area comprises the bar portion of contiguous flag portion location, wherein, to cross border between flag portion and bar portion be discontinuous at least partly because the first heat discharges otch for heat conduction and conductive layer.
Preferably, described hole is arranged in the flag portion of shutter.
Preferably, the first heat conduction and conductive layer are fully discontinuous between the flag portion of shutter and bar portion.
Preferably, the senser element of temperature sensor in the flag portion of shutter with ground floor hot link, and the output device of temperature sensor is electrically connected with ground floor in bar portion.
Preferably, described shutter also comprises attachment, and the contiguous bar of described attachment portion location is for being attached to Thermal Imaging Camera by shutter.
Preferably, described second area also comprises attachment, and the contiguous bar of described attachment portion location is for being attached to Thermal Imaging Camera by shutter.
Preferably, by the second heat discharge otch make the first heat conduction and conductive layer cross border between bar portion and attachment at least major part be discontinuous.
Preferably, the second section of described shutter comprises at least one heat release otch, and first and second hot at least one that discharge otch that described at least one heat discharges in otch and the first section are relatively located substantially.
Preferably, the low emissivity coatings of described the second section is gold plating.
Preferably, described the second section also comprises the intermediate buffering layer between matrix and low emissivity coatings.
Preferably, described intermediate buffering layer is copper layer.
Preferably, the high emissivity second layer comprises welding mask coating.
Preferably, the first heat conduction and conductive layer by moulding to form and isolation, the conduction pathway of the output device telecommunication of temperature sensor.
Preferably, described shutter also comprises contact pins, and described contact pins is for relaying to by the signal of telecommunication of the output device from temperature sensor the assembly separating with shutter.
According to a further aspect of the invention, provide a kind of Thermal Imaging Camera, it has the shutter of at least a portion for optionally covering infrared sensor elements, and described shutter is shutter as defined above.
Preferably, described Thermal Imaging Camera also comprises motor, and described electrical mechanisms causes and shutter moved and attached via attachment and described shutter.
Preferably, described motor is piezoelectric motor.
Preferably, described Thermal Imaging Camera also comprises groove, described groove be used for receiving temperature sensor and in the time that shutter moves allowable temperature transducer advance at groove.
Also drop in protection scope of the present invention for the Thermal Imaging Camera that the method for this shutter is provided and combines this shutter.The details of one or more embodiment of the present invention and execution mode proposes in the following drawings and explanation.Other features, object and advantage will be that appearance is intelligible from claims of the present invention from specification and accompanying drawing in addition.
One or more embodiments of the detail propose in the following drawings and explanation.Other features, object and advantage from specification and accompanying drawing and accessory rights claim will be hold intelligible.
Brief description of the drawings
Fig. 1 is the front perspective view of exemplary hot imaging camera.
Fig. 2 is the perspective back view of the exemplary hot imaging camera of Fig. 1.
Fig. 3 shows the functional block diagram of the example components of the Thermal Imaging Camera of Fig. 1 and 2.
Fig. 4 is the plan view of shutter embodiment.
Fig. 5 is the generalized section that shutter embodiment obtains at Fig. 4 center line A place.
Fig. 6 shows the plan view of the shutter embodiment of heat release otch.
Fig. 7 is for Thermal Imaging Camera, with the plan view of the embodiment of the shutter of the temperature sensor of combination.
Fig. 8 is that the shutter of Fig. 7 obtains at B place and the profile that comprised insulate conduction passage.
Fig. 9 A is the plan view that is positioned at the shutter of contiguous installation elements.
Fig. 9 B is the profile that Fig. 9 A obtains at C place.
Figure 10 is the plan view that also comprises the alternate embodiment of the shutter of the present invention in hole.
Embodiment
Detailed specification is exemplary in essence and is not intended in any case limit scope of the present invention, applicability or structure below.On the contrary, be below illustrated as enforcement example of the present invention the explaination of some practicalities is provided.Provide the example of structure, material, size and manufacture method for selected element, and every other element adopts known structure, material, size and the manufacture method of field of the present invention those of ordinary skill.Those skilled in the art will recognize that many examples of pointing out have various suitable alternative forms.
Thermal Imaging Camera can be used for detecting the thermal image of the whole scene of being observed.Thermal Imaging Camera can detect the infrared radiation being sent by scene and infrared radiation be changed into the infrared image that shows as thermal image.In certain embodiments, Thermal Imaging Camera also can catch from the visible ray of scene and by described visible light transformation and become visible image.Depend on the structure of Thermal Imaging Camera, camera can comprise that IR optical component is so that infrared radiation is focused on infrared sensor, and visible ray optics is to focus on visible ray on visible light sensor.
Shutter can be used for the multiple application in Thermal Imaging Camera.These application include but not limited to the impact of radiation-inhibiting to sensor element, Thermal Imaging Camera are provided uniform scene or Thermal Imaging Camera provided to the scene of known temperature.Specific implementations of the present invention comprises the shutter that is designed to carry out better compared to existing technology at least one this application, and/or has comprised the Thermal Imaging Camera of this shutter.
Fig. 1 and Fig. 2 show respectively front perspective view and the rear view of exemplary hot imaging camera 100, and described Thermal Imaging Camera comprises housing 102, infrared lens assembly 104, visible light lens assembly 106, display 108, laser 110 and trigger controller 112.Housing 102 holds the various assemblies of Thermal Imaging Camera 100.The bottom of Thermal Imaging Camera 100 comprises the handle that carries for camera being gripped and operated through one hand.Infrared lens assembly 104 receives from the infrared radiation of scene and by this radiation and focuses on the infrared sensor for generation of scene infrared image.Visible light lens assembly 106 receives from the visible ray of scene and by this visible ray and focuses on the visible light sensor for generation of the visible image of Same Scene.In response to pressing trigger controller 112, Thermal Imaging Camera 100 catches visible image and/or infrared image.In addition, Thermal Imaging Camera 100 is controlled display 108 to show the infrared image and the visible image that are produced by camera, for example, to help operator to check scene heat.Thermal Imaging Camera 100 also can comprise the focusing being connected with infrared lens assembly 104, and described focusing is configured at least one lens of mobile infrared lens assembly to regulate the focusing of the infrared image being produced by Thermal Imaging Camera.
In operation, Thermal Imaging Camera 100 is by receiving the energy sending in the infrared wavelength spectrum from scene and infrared energy being processed to produce thermal imagery and detect the thermal image in scene.Thermal Imaging Camera 100 also can be by receiving energy in visible wavelength spectrum and visible light energy being processed to produce visible image and produced the visible image of Same Scene.As described in more detail below, Thermal Imaging Camera 100 can comprise the visible light camera module that is configured to catch the infrared camera module of scene infrared image and is configured to catch Same Scene visible image.Infrared camera module can receive the infrared radiation penetrating through infrared lens assembly 104 and therefrom produce infrared image data.Visible light camera module can receive the light penetrating through visible light lens assembly 106 and therefrom produce visible data.
In certain embodiments, Thermal Imaging Camera 100 substantially synchronously (for example side by side) to collect or catch infrared energy and visible light energy be the Same Scene in same time substantially with the visible image that makes to be produced by camera and infrared image.In these embodiments, the infrared image being produced by Thermal Imaging Camera 100 is illustrated in the local temperature in special time period scene, is the Same Scene in same time section and the visible image being produced by camera represents.In other embodiments, Thermal Imaging Camera can catch infrared energy and visible light energy from scene in the different time periods.
Visible light lens assembly 106 comprises at least one lens, and described at least one lens focus on visible light energy on the visible light sensor for generation of visible image.Visible light lens assembly 106 defines visible ray optical axis, and described visible ray optical axis is through the center of curve of at least one lens of assembly.Visible light energy penetrated lens above and on the opposition side of lens, focus on.Visible light lens assembly 106 can comprise single lens or the lens of multiple arranged in series (for example two, three or more lens).In addition, visible light lens assembly 106 can have the focal length setting mechanism that fixing focal length maybe can comprise the focal length for changing visible ray optics.Comprise in the embodiment of focal length setting mechanism at visible light lens assembly 106, focal length setting mechanism can be manual adjustment means or automatic adjusting mechanism.
Infrared lens assembly 104 also comprises at least one lens, and described at least one lens focus on infrared energy on the infrared sensor for generation of thermal imagery.Infrared lens assembly 104 defines infrared optical axis, and described infrared light beam warp is crossed the center of curve of the lens of assembly.During operation, infrared energy be guided through lens above and on the opposition side of lens, focus on.Infrared lens assembly 104 can comprise single lens or the lens of multiple arranged in series (for example two, three or more lens).
As briefly described, Thermal Imaging Camera 100 comprises focusing, and described focusing is for regulating the focal length by the infrared image of captured by camera.In the embodiment shown in Fig. 1 and Fig. 2, Thermal Imaging Camera 100 comprises focusing ring 114.Focusing ring 114 is operatively connected at least one lens of (for example mechanically and/or being electronically connected to) infrared lens assembly 104 and is configured to described at least one lens to move to various focal positions to the infrared image being caught by Thermal Imaging Camera 100 is focused on.Focusing ring 114 can be rotated so that at least one lens that focusing ring is operatively connected to move by least a portion around housing 102 manually.In certain embodiments, focusing ring 114 is also operatively connected to display 108 to make the rotation of focusing ring 114 cause that at least a portion of visible image and at least a portion of infrared image of showing relative to each other move on display 108 simultaneously.In different embodiment, Thermal Imaging Camera 100 can comprise and being implemented to and the heteroid Manual focusing governor motion of focusing ring 114.
In the operating period of Thermal Imaging Camera 100, operator can wish to observe the thermal imagery of the scene being produced by camera and/or the visible image of Same Scene.For this reason, Thermal Imaging Camera 100 can comprise display.In the embodiment of Fig. 1 and Fig. 2, Thermal Imaging Camera 100 comprises display 108, and described display is positioned at the rear side contrary with visible light lens assembly 106 with infrared lens assembly 104 of housing 102.Display 108 can be configured to show visible image, infrared image and/or be the synthetic image that visible image and infrared image show simultaneously.In different embodiment, display 108 can be with the infrared lens assembly 104 of Thermal Imaging Camera 100 and visible light lens assembly 106 for example, away from (separating), or display 108 can be in different space layouts with respect to infrared lens assembly 104 and/or visible light lens assembly 106.Therefore although display 108 is shown as after infrared lens assembly 104 and visible light lens assembly 106 in Fig. 2, but for display 108, can be, other positions.
Thermal Imaging Camera 100 can comprise various for controlling camera operation and regulating the user of camera different set to input medium.Exemplary control function can comprise the focal length, the shutter that regulate infrared and/or visible ray optics opening/closing, catch infrared and/or visible image etc.In the embodiment of Fig. 1 and Fig. 2, Thermal Imaging Camera 100 comprises for catching infrared and depressible trigger controller 112 visible image, and comprise forming section user interface, for controlling the otherwise button 116 of camera operation.Varying number or the different user who arranges input medium and are fine, and are understood that and are openly not limited to aspect this.For example, Thermal Imaging Camera 100 can comprise touch screen displays 108, receives user's input by pressing touch screen displays described in the different piece of screen.
Fig. 3 shows the functional block diagram of the assembly of the embodiment of Thermal Imaging Camera 100.Thermal Imaging Camera 100 comprises IR camera module 200, front-end circuit 202.IR camera module 200 and front-end circuit 202 are sometimes combined and are called front-end stage or the front end assemblies 204 of infrared camera 100.Thermal Imaging Camera 100 also can comprise visible light camera module 206, display 108, user interface 208 and output/control device 210.
Infrared camera module 200 can be configured to receive the infrared energy being sent by target scene and infrared energy is focused on the infrared sensor for generation of infrared energy data, and described infrared energy data for example can be presented on display 108 and/or be stored in memory with the form of infrared image.Infrared camera module 200 can comprise any suitable assembly that is assigned to the function of module at this for carrying out.In the embodiments of figure 3, infrared camera module 200 is illustrated as and comprises infrared lens assembly 104 and infrared sensor 220.As above, about as described in Fig. 1 and Fig. 2, infrared lens assembly 104 comprises at least one lens, and described at least one lens obtain the infrared energy being sent by target scene and infrared energy is focused on infrared sensor 220.By produce the signal of telecommunication that can be converted and show as infrared image on display 108, infrared sensor 220 responds to the infrared energy being focused.
Infrared sensor 220 can comprise one or more focal-plane array (FPA)s, and described focal plane array responds the infrared energy receiving by infrared lens assembly 104 and produces the signal of telecommunication.Each FPA can comprise multiple infrared sensor elements, for example, comprise thermal radiometer, photon detector or other applicable infrared sensor elements.In operation, each sensor element (can be called as separately sensor pixel) can change electrical feature (for example voltage or resistance) in response to absorbing the infrared energy receiving from target scene.Then, the change of electrical feature can provide the signal of telecommunication, and the described signal of telecommunication can receive and be processed into the infrared image showing on display 108 by processor 222.
Irrelevant with the particular type that is included in the infrared sensor elements in the FPA of infrared sensor 220, FPA array can limit any applicable size and dimension.In certain embodiments, infrared sensor 220 comprises multiple infrared sensor elements of arranging with lattice, for example, to be vertically listed as the array of the sensor element of arranging with horizontal line.In various embodiments, infrared sensor 220 can comprise that for example 16 × 16,50 × 50,160 × 120,120 × 160 or 640 × 480 vertical row are multiplied by the array of horizontal line.In other embodiments, infrared sensor 220 can comprise the vertical row of the vertical row of smallest number more and horizontal line (for example 1 × 1), larger quantity and horizontal line (for example 1000 × 1000) or different ranks ratio.In a particular embodiment, reading integrated circuit (ROIC) is integrated on IR transducer 220.ROIC is for exporting the signal corresponding with each pixel.
Front-end circuit 202 comprises for circuit mutual with IR camera module 200 and that it is controlled.In addition, front-end circuit 202 at first to the infrared image data processing of collecting and via and processor between be connected infrared image transfer of data to processor 222.More specifically, the signal being produced by IR transducer 220 depends on the front-end circuit 202 of Thermal Imaging Camera 100 at first.In specific implementations, as directed, front-end circuit 202 comprises bias generator 224 and preamplifier/integrator 226.Except providing detector bias, bias generator 224 can increase or reduce average bias current from the total current producing for each suitching type detector element alternatively.Average bias current can change to (i) compensate the deviation of the whole electric resistance array of the detector element being caused by the change of Thermal Imaging Camera 100 interior environment temperature; And (ii) compensate the variation to array of array in the average detected device element of IR transducer 220.This bias compensation can automatically be controlled by Thermal Imaging Camera 100 or software, or can be controlled via the input to output/control device 210 or processor 222 by user.Follow the optional regulation that reduces or increase of detector biasing and average bias current, signal can be through the preamplifier/integrator 226 for regulating.Subsequently, the signal being conditioned is sent in the processor 222 of Thermal Imaging Camera 100 downstream.
In some embodiments, front-end circuit 202 can comprise one or more additional elements, for example transducer 228 or ADC230.
In some embodiments, front end assemblies can further comprise shutter 240.Shutter 240 can be with respect to externally or internally location and the visual field being provided by IR camera lens assembly 104 with opening and closing can be provided of lens.As known in the art, shutter 240 can mechanically be located, or can be by activating such as DC motor or solenoidal electromechanical assembly.The specific implementations of Thermal Imaging Camera comprises the shutter that is configured to intercept IR radiation arrival FPA.Additionally, some embodiments of the present invention can comprise and utilize shutter 240 to think that each detector element sets up suitable bias stage and else implement calibration or method or the setting of setting software.
The assembly (comprising processor 222) that is described to processor in Thermal Imaging Camera 100 can be set to one or more processors, such as one or more microprocessors, digital signal processor (DSP), application-specific integrated circuit (ASIC) (ASIC), field programmable gate array (FPGA), Programmable Logic Device etc., or independent or any applicable combination.Processor 222 also can comprise the memory of storage programming instruction and related data, and described programming instruction and related data can make Thermal Imaging Camera 100 and processor 222 complete the function of distributing in this manual them in the time being carried out by processor 222.Processor 222 also can be set to all component of computer or other electronic systems to be integrated into the SOC (system on a chip) in one chip.These elements are handled the scene image data that are conditioned that transmit from front-end stage 204 can be shown or store the output contextual data for user to provide.Subsequently, processor 222(treatment circuit) data of processing are sent to display 108 or other output/control device 210.
In the operating period of Thermal Imaging Camera 100, processor 222 can be controlled infrared camera module 200 to produce the infrared image data that are used to form infrared image.Processor 222 can produce the numeral " frame " of the infrared image data of target scene at some preset time.
The signal of telecommunication that processor 222 can be included in the each infrared sensor elements in the FPA of infrared sensor 220 by one-shot measurement catches " the fast phase " of single infrared image or target scene.Alternately, processor 222 can be included in the signal of telecommunication of the each infrared sensor elements in the FPA of infrared sensor 220 and multiple infrared images of captured target scene by measuring repeatedly.Processor 222 can be carried out other operations catching when infrared image, for example, one after the other activate shutter 240 to open and close the fenestra etc. of infrared lens assembly 104.Processor 222 can be carried out and calculate so that unprocessed infrared image data are changed into scene temperature (radiation measurement), comprises in certain embodiments the color corresponding with scene temperature.
Thermal Imaging Camera 100 comprises visible light camera module 206.Visible light camera module 206 can be configured to receive and focus on the visible light sensor for generation of visible light energy data from the visible light energy of target scene and by visible light energy, and for example described visible light energy data can be presented on display 108 and/or be stored in memory with the form of visible image.Visible light camera module 206 can comprise any applicable for carrying out the assembly that is assigned to the function of this module at this.In the embodiments of figure 3, visible light camera module 206 is illustrated as and comprises visible light lens assembly 106 and visible light sensor 242.
In these and other embodiment, processor 222 can be controlled display 108 at least a portion with the infrared image that shows at least a portion of the visible image being caught by Thermal Imaging Camera 100 and caught by Thermal Imaging Camera 100 simultaneously.In various embodiments, processor 222 can control display 108 being arranged side by side, one of them image arranges around the picture-in-picture of another image or shows visible image and infrared image with any other the applicable arrangement that shows visible image and infrared image simultaneously.
For example, processor 222 can be controlled display 108 visible image and infrared image are shown with the form of synthetic image.In synthetic image, visible image and infrared image can overlap top of each other.Operator can be with user interface 208 alternately to be controlled at one of them or all transparency or the opacity of images that show on display 108.For example, operator can and user interface 208 alternately with by infrared image completely transparent and completely opaque between regulate and also by visible image completely transparent and completely opaque between regulate.
Additionally, in some embodiments, the order from user interface 208, output/control device 210 can be explained and carry out to processor 222.This can comprise process various input signals and by those signals via and front-end circuit between be connected and transfer to front-end circuit 202.The assembly (for example motor or solenoid) of adjacent front end circuit 202 can activated the control function of expectation.Exemplary control function can comprise focuses, opening/closing shutter, trigger sensor reading, regulates bias etc.And input signal can be used to change the processing of the image data occurring in processor 222.
In many execution modes of Thermal Imaging Camera, shutter can be used for multiple application.These application include but not limited to the impact of radiation-inhibiting to sensor element, Thermal Imaging Camera are provided uniform scene or Thermal Imaging Camera provided to the scene of known temperature.Can be following situation, user wish at special time, the sensor element of Thermal Imaging Camera is exposed to incident radiation and thereby may engages shutter.(for example the radiation measurement in camera calculates or makes transducer setover to provide thermal field scape to represent more accurately) is provided for other can need calibration, and in this calibration, shutter has advantageously provided the scene of uniform thermal field scape and/or known temperature.Specific implementations of the present invention comprises that comparing currently available technology has been applicable to the shutter such as these tasks better.
Fig. 4 shows the profile diagram of embodiment of the present invention.Shutter 401 comprises three part-flag portions (flag portion) 402, bar portion (stem portion) 403 and attachment (attachmentportion) 404, described three parts are separated by a dotted line in Fig. 4, and flag portion 402 is designed in the time that shutter 401 is in the closed position IR sensor array and incident IR energy barrier.In specific execution mode, in the time that shutter 401 is closed, flag portion 402 is positioned at the minimum distance on structure below it, because this structure makes to minimize around the amount of the IR energy of the outer ledge process of shutter 401.Attachment 404 is designed to operatively be connected to the device (for example motor, described motor can comprise piezoelectric motor) that shutter 401 is activated.Installing hole 405 is set for operatively attachment 404 being connected with actuator.Bar portion 403 separates flag portion 402 with attachment 404, when flag portion is fixed on to a distance with convenient shutter close, flag portion 402 is positioned at rightly on IR sensing element and in the time that shutter is opened, flag portion to be moved to be enough to get out of the way.Various execution mode of the present invention can comprise flag portion, bar portion and the attachment of various relative shape and size, or the functional of two or more these parts can be incorporated in single part.
The generalized section that the line A place of the embodiment that Fig. 5 shows shutter in Fig. 4 obtains.The relative thickness of shown each layer is not drawn in proportion, but is only schematically to show.Additionally, illustrated layer be exemplary and and nonessential the present invention is shown with full details, this is that layer can have otch, fracture or other nonuniformity structures because run through shutter.In this embodiment, the flag portion of shutter is included as shutter provides the matrix 575 of base construction.That matrix 575 can comprise is smooth, the material of rigidity, lightweight, thermal insulation and electric insulation, such as FR-4, and the inexpensive materials that one is for example often used in the structure of printed circuit board (PCB) (PCB).This material can contribute to prevent that shutter is bending or prevent from allowing heat or electricity conducts to opposite side from a side of shutter.
Along with the matrix using or other materials change, resistance and adiabatic number range can change for different shutters.Conducting base can be used, but can provide at the signal of telecommunication along the challenge aspect shutter transmission.Also can use heat conduction substrate, but the temperature of shutter can be more prone to affected by external heat in this case.
Matrix can comprise the first side and second side contrary with the first side substantially.As shown in Figure 5, shutter also can comprise the first section and the second section that are operatively connected with the first side and second side of matrix respectively.In this embodiment, the first section of shutter is substantially towards the IR of camera sensor element, and the second section is located on the contrary with the first section substantially and deviate from substantially IR sensor element, towards thermal field scape.Although be shown as in Fig. 5 in the flag portion that is present in shutter, but the first section 571 of aforementioned substrates and the second section 581 can extend to the gamut of shutter.
As previously discussed, in Thermal Imaging Camera, shutter can be used to set up suitable biasing grade for sensor element.By closing shutter, incident IR radiation being intercepted and guarantees that each sensor element reads identical signal from shutter with sensor element, this is to realize.Certainly,, for this processing is worked, shutter preferably presents uniform thermal field scape to sensor element.Otherwise each sensor element of setovering will be to introducing inaccuracy but not reduce inaccuracy device to make them all read same signal from shutter.
In order to contribute to present uniform thermal field scape to IR sensing element, the first section 571 of shutter can comprise the ground floor 574 of conduction and/or heat conduction.The thermal conductivity of ground floor 574 impels any heat being present in this layer to give out fast and equably, manufactures by this more uniform heating curve being observed by IR sensor element, makes it possible to set up suitable biasing grade for sensor element.In some embodiments, this ground floor directly contacts with the first side 570 of matrix 575.
Various materials are contemplated to for ground floor, but some metals are attractive owing to having high substantially thermal conductivity and conductivity.Realizing in the trial of shutter thermal uniformity, it can be the material being more suitable for of high-termal conductivity.
During to hot scene imaging, may increasing during operation temperature by Thermal Imaging Camera for IR sensing element.While doing like this, sensing element can be launched the IR radiation that represents that this temperature increases.If this occurs shutter close simultaneously, advantageously can absorb for shutter the IR signal being sent by sensing element so.Otherwise if shutter reflects some IR energy by sensing element incident, so described element is more discernable self to be reflected, thereby causes the reading that is visualized as the uniform heat-field scape being represented by the first section 571 of shutter to be offset.Therefore the part of the first section 571 that, some embodiments of the present invention are made as high emissivity coating 573 at shutter is so that the absorption that these are made potentially to the reflection minimized of data-bias and promote spuious IR signal.Coating as can be provided in the standard welding mask coating of finding on the circuit board of being everlasting (solder maskcoating).For emissivity, can use changing value, however some execution modes comprise have 0.9 or more the high emissivity coating of high emissivity so that reflection minimized.
Turn to now the second section 581 of shutter, in the time of shutter close described in the second section deviate from IR sensing element, this is conducive to reflection IR radiation that the second section 581 of shutter is impacted, this is can cause the less desirable heating of shutter because absorb.Reason for this reason, the execution mode shown in Fig. 5 comprises the low emissivity coatings 577 as a part for the second section 581 of shutter; The low-launch-rate of material contributes to the reflection of incident IR energy.In some embodiments of the present invention, low emissivity coatings can comprise gold plating, and described gold plating tends to not be oxidized and therefore keep its low-launch-rate easily.For emissivity, can use changing value, however some execution modes comprise have 0.2 or more the low emissivity coatings of low-launch-rate value to reflect energy as much as possible.Realize low emissivity coatings with adopt the balance of low-cost technologies can determine can be favourable to this coating material.Additionally, depend on the material for matrix 575 and low emissivity coatings 577, coating can not adhere to the second side 580 of matrix well.In this case, maybe advantageously resilient coating 576 is being set to form better and to adhere between low emissivity coatings 577 and matrix 575 between matrix 575 and coating 577.For example, the shutter that comprises FR-4 matrix and low-launch-rate gold plating can further be included in the copper resilient coating between FR-4 and gold.Those skilled in the art will recognize that and can use other materials, on the second section 581 of shutter, low emissivity coatings is set.
Fig. 5 additionally shows shutter and is divided into two regions, is shown as substantially the first area 502 and the second area 503 that separate by cut-off rule 599.First area 502 and second area 503 are corresponding with the two-dimentional borderline phase as lower component that can be used for describing shutter substantially, and described parts are surrounded by this border in any or all layers.For example, special section (for example the first section 571) can comprise the subdivision that limit and that be called as first area by two-dimentional border of this section.The quantity in region and relative size can change in embodiments of the present invention.In some embodiments, as shown in Figure 4, the border being limited by first area 502 and second area 503 can be corresponding with the borderline phase of the flag portion 402 of shutter and bar portion 403.Alternately, second area can additionally seal the border of attachment 404, by this not only encircles rod portion but also surround attachment.
As previously discussed, attachment 404 can be connected to device, for example motor for activating shutter.The first heat-conducting layer on the first section 571 of shutter is for providing at motor or near any heat producing in other elements of attachment the chance being transmitted in shutter.Most important ground, preferably prevents that this additional heat from advancing in the flag portion 402 of shutter, and this is because the part that this flag portion is observed by IR sensor element in the time of shutter close.In addition, the additional heating of flag portion has jeopardized the following ability of shutter, represents uniform thermal field scape or allows the enough calibrations of situation lower sensor element of calculating at radiation measurement.Thereby, for the flag portion that protects shutter avoids less desirable heating, can in the first heat-conducting layer, manufacture heat and discharge otch to make flag portion and the isolation of attachment heat.
Fig. 6 shows the heat of implementing in certain embodiments of the invention and discharges otch 610,611.In this embodiment, heat discharges at least the first heat-conducting layer of otch 610 and 611 in the first side of matrix and manufactures.As directed, heat discharges otch 611 and manufactures to suppress the hot-fluid between them between attachment 604 and bar portion 603.Additional heat discharge otch 610 between bar portion 603 and flag portion 602 further to reduce the hot-fluid that enters flag portion 602.In some embodiments, these otch can be arranged so that the border that the first heat-conducting layer is crossed between flag portion 602 and bar portion 603 is discontinuous, and the remainder of ground floor is excellent between bar portion 603 and attachment 604.Although discharging otch, so-called heat can mean that the otch of making continuous material discharges otch to realize heat, but also in the scope of the invention, heat discharges otch and also can for example, be formed by the part that two have been cut (flag portion 602 and bar portion 603) adjacent positioned.
The position that heat shown in Fig. 6 discharges otch is exemplary and can be positioned at other places on shutter so that identical substantially function to be provided.In some embodiments, the second section of shutter can comprise that additional heat discharges otch to prevent the additional hot-fluid through part second section of shutter.Thereby according to the embodiments of the present invention, heat discharges otch can be arbitrarily or whole manufacture in lower component: resilient coating and the low emissivity coatings of the first heat conduction of the first section of shutter and conductive layer and high emissivity coating and the second section.
In some embodiments of the present invention, maybe advantageously measure the temperature of shutter such as in being used in for radiometric calibration process time.In order to complete this measurement, can be incorporated in the present invention such as the temperature sensor of thermistor or thermocouple.Fig. 7 shows for Thermal Imaging Camera, with the embodiment of the shutter of integrated temperature sensor 720.Temperature sensor 720 comprises the senser element 721 for sensing temperature, and output device 722, and described output device is for exporting the signal of telecommunication of the temperature based on by senser element 721 sensings.
Because in the time of shutter close, the flag portion of the first section of shutter is to the visible part of IR sensing element, so the senser element 721 of the temperature sensor 720 shown in Fig. 7 is configured to and the first heat-conducting layer thermo-contact of shutter.Because this layer is heat conduction, so measure its temperature and likely provided the rationally accurate temperature survey of the whole flag portion of the first section of shutter.For the heterogeneity that makes the flag portion causing due to enforcement temperature sensor minimizes, the remainder of temperature sensor 720 assemblies can be turned up the soil and locates and discharge otch and flag portion thermal isolation via heat with flag part.In some embodiments, the output device 722 of temperature sensor can be electrically connected with contact pins to the signal of telecommunication is relayed to the other places camera from shutter.In the execution mode of Fig. 7, contact pins 724 is positioned in the attachment of shutter and is electrically connected with the output device 722 of temperature sensor 720 via conducting path 723.Although be illustrated as single circuit in Fig. 7, but conducting path 723 can comprise multiple conduction pathways that separate, and described conduction pathway can cross or can not cross the route identical with path shown in Fig. 7.
In specific implementations of the present invention, the conducting path between output element and the contact pins of temperature sensor can be made via the first conductive layer in the first side of matrix.But for this can work, it can not be totally continuous that ground floor is crossed shutter.The conduction pathway that therefore, can form isolation in ground floor is thought from the signal of telecommunication of temperature sensor conducting path is provided.Fig. 8 shows the cutaway view of the execution mode conduction pathway that obtain at B place and that comprise isolation of the shutter of Fig. 7.Fig. 8 shows the similar hierarchy with Fig. 5, the first section 871 that wherein matrix 875 is arranged in shutter 801 in its first side 870 is coated with ground floor 874 and high emissivity coating 873, and the second section 881 that is arranged in shutter 801 in the second side 880 of matrix is coated with resilient coating 876 and low emissivity coatings 877.In this embodiment, the high emissivity coating 873 in the first side 870 of matrix is additionally electric insulation.But contrary with Fig. 5, ground floor 874 is discontinuous through described section.Alternatively, ground floor is removed in the region for the treatment of the conduction pathway 890 of isolating along matrix manufacture.These passages 890 can use standard etching or other manufacturing technologies that is applied to the first conductive layer 874 to make, and are surrounded by the high emissivity coating 873 of electric insulation, further these passages 890 are isolated from each other and isolate with remaining first conductive layer 874.For clarity sake, the high emissivity coating 873 of Fig. 8 is stamped gray shade and the first conducting shell 874 is shown as the retiform pattern of tool.Be apparent that, conduction pathway 890 is made up of the conductive material of the first conducting shell 874, but is separated by the insulation of high emissivity coating 873, high emissivity material.Although Fig. 8 shows the conduction pathway 890 of two isolation, but those skilled in the art will recognize that and can manufacture the passage of any amount and for conducting the various signals of telecommunication.
In some embodiments, the conduction pathway of these isolation can cross and the one or more heat of bridge joint discharge otch so as to provide between the assembly on described otch opposite side, telecommunication between for example temperature sensor and contact pins.Correspondingly, in some embodiments, heat discharges otch can not form discontinuity feature completely between two sections of the first conducting shell.For example, in Fig. 7, the heat showing between attachment and the bar portion of shutter discharges otch 711.But, from the signal of telecommunication of output device 722 via conducting path 723 from the length of the downward travel rod of temperature sensor 720 portion, through attachment and be connected with contact pins 724 in the end of shutter.If heat discharges otch 711, the ground floor of the ground floor of attachment and bar portion is isolated completely, so contact pins 724 will be not can with temperature sensor 720 telecommunications.For example, thereby it can be that to cross shutter self discontinuous that heat discharges otch (711 in Fig. 7), this is because heat discharges conducting path that incision design becomes to allow to comprise the first conducting shell and crosses described heat and discharge otch in specific implementations.But, discharge in order to maintain by for example 711 heat the desired characteristic that otch reaches, otch should make conducting shell discharged on the separated region of otch at least mostly discontinuously by heat, only allows the conduction through the region of segregate conducting path.Other execution modes of the present invention can provide alternative device, and described device is for providing the telecommunication of crossing heat release otch.
In Thermal Imaging Camera, advantageously shutter is configured so that in the time of shutter close, this shutter leaves minimum space between the adjacent part that holds IR sensing element of itself and camera, allow by this minimized radiation around the outer ledge of shutter through and photo-sensitive cell is impacted.The temperature sensor being included in the first section of shutter can increase the significant height tolerance of shutter, suggestion shutter may away from sensing element move taking when shutter to various positions or in the time that move various positions as temperature sensor slot milling.But in some embodiments of the present invention, groove is incorporated in the adjacent part of camera, allowable temperature transducer keeps closely close adjacent assembly to intercept more efficiently incident IR energy groove expert and then shutter self.
Fig. 9 A and Fig. 9 B illustrate the aforementioned grooves about specific implementations of the present invention.Fig. 9 A show shutter, be positioned at adjacent with installation elements and look down the plane graph on the second section of shutter.The element that is intercepted visual field by shutter is shown in broken lines.For example, in this embodiment, temperature sensor 920 is in the first section of shutter 901, locates on the contrary substantially and thereby intercepted visual field by the second section and matrix with the second section.Correspondingly, temperature sensor 920 is illustrated by the broken lines.In Fig. 9 A, also show installation elements 950, the attachment 904(of shutter is in this embodiment via installing hole 905) be attached to described installation elements.Those skilled in the art will recognize that shutter also can be attached to installation elements by other elements.Installation elements 950 can comprise the motor or other the mobile parts that allow shutter at least between open mode and closed condition, to change.In this embodiment, temperature sensor is positioned in the periphery of installation elements.Correspondingly, as shown in Fig. 9 A, in installation elements 950 inscribes fluted 951 to make temperature sensor 920 can be positioned at the restricted area of groove 951.
In this embodiment, shutter can be via path 960 change states, and wherein shutter rotates and flag portion 902 follows path 960 in semicircle mode around attachment 904.Because shutter crossed path 960, so must be that temperature sensor 920 also crossed identical path (at this by 952 demonstrations).Correspondingly, groove 951 also follows path 952 substantially so that proper temperature sensor 920 while advancing with shutter, and temperature sensor can remain in the restricted area of groove.This structure allows not cause when shutter moves that temperature sensor 920 and installation elements 950 collide makes shutter 901 be positioned at more close (unshowned) IR sensing element place.
Fig. 9 B shows the profile that Fig. 9 A obtains at C place.The element illustrating is with the shutter 901 of flag portion 902, bar portion 903 and attachment 904 and temperature sensor 920.In this embodiment, be attached to installation elements 950, described installation elements also comprises groove 951 shutter operation.Groove 951 is configured to receive temperature sensor 920 while operatively connection with installation elements 950 with convenient shutter 901, allows shutter 901 to be positioned at more close installation elements and also has (unshowned) IR sensing element place.
In view of aforementioned certain preferred embodiments of the present invention as described below: comprise smooth matrix and also comprise flag portion, bar portion and attachment for the shutter of Thermal Imaging Camera, described matrix has the first side and second side contrary with the first side, is made up of smooth FR-4 material.Flag cage structure becomes to cover in the time of shutter close IR sensing element, attachment is configured to be attached to the motor for locating shutter, and bar cage structure becomes to connect attachment and flag portion, the two is separated by a distance so that when proper shutter close flag portion be enough to the IR sensing element of cover heating imaging camera.
Shutter has the first section, described the first section be operatively attached to the first side of matrix and in the time of shutter close towards IR sensing element.The first section comprises the copper layer that applies FR-4 material, and this copper layer provides the first heat conduction and conductive layer.Heat discharge otch to make copper layer cross border between flag portion and bar portion be discontinuous and cross border between bar portion and attachment be similar to discontinuous.The first section also comprises temperature sensor, described temperature sensor be arranged in bar portion and have temperature sensor, with flag portion on the hot linked senser element of copper.Copper in bar portion and attachment is the conduction pathway with manufacture isolation by moulding, described conduction pathway is electrically connected with the output device of temperature sensor, the heat of crossing continuously between bar portion and attachment discharges otch, and is electrically connected with the contact pins being positioned in attachment.The first section also comprise electric insulation, high emissivity welding mask coating.
Shutter has the second section contrary with the first section and that be operatively connected to shutter the second side, and described the second section has flag portion, bar portion and the attachment of similar restriction.The second section is included in copper resilient coating on FR-4 material and the low-launch-rate gold plating on copper.These metal levels comprise the heat release otch of crossing border between bar portion and flag portion and between bar portion and attachment, make described layer discontinuous between all three parts.
As those skilled in the art can notice, this exemplary shutter, the especially structure of the first section are very similar to the structure of printed circuit board (PCB) (PCB).FR-4 material, be all the common element finding in PCB by the conducting shell of moulding and welding mask coating, allow well-known and cost-saving PCB manufacturing technology to be applicable to the unique application of Thermal Imaging Camera shutter.Correspondingly, the technology that can be realized by those skilled in the art and the advantage of other PCB also can be implemented in the present invention, and fall within the scope of the invention.Also it should be pointed out that conducting shell on insulating body not only can structure property ground but also can manufacture devastatingly., expect that the conducting shell of pattern can be built from the teeth outwards by methods known in the art, or alternately, conducting shell can optionally be removed to form the expectation pattern of conducting shell completely substantially.Additionally, it is across the well-known method of many subjects that layer and material coating are applied to matrix, and can complete by many technology.Because matrix and a layer structure can be contemplated to, so the technology of these subjects and advantage can realize being applicable to the present invention by those skilled in the art.
Figure 10 shows the alternate embodiments of shutter of the present invention, also comprises hole.Be similar to aforesaid execution mode, shutter 1001 comprises flag portion 1002, bar portion 1003 and attachment 1004, and the first section and the second section that are operatively connected with the first side and second side of matrix respectively.The same with the situation of aforementioned embodiments, the first section comprises that the first heat conduction and conductive layer and high emissivity coating and the second section comprise low emissivity coatings.But, and being designed to intercept all incident IR radiation and IR sensing element being impacted contrary, the shutter of Figure 10 comprises hole 1030, described hole is configured to allow a part for IR radiation to pass and intercepts simultaneously/reflect remaining projectile energy, makes incident IR radiation falloff.Compare the shutter words not in place projectile energy still less of IR sensing element sensing in Thermal Imaging Camera so if this has caused, and thereby measure the temperature lower than the true temperature of scene.The calculating that camera inside or external device (ED) are carried out can compensate and calculate for the minimizing in this projectile energy correct, the real temperature of scene.The advantage of this design is that it allows optical system measuring for example due to the restriction of equipment otherwise the thermal field scape that cannot measure.
Owing to having comprised that the shutter 1001 in hole 1030 of Figure 10 means that intercepting the unprocessed IR signal of at least a portion arrives IR sensor element, be that the parts that shutter 1001 surrounds hole 1030 will be in the region of IR sensor element observation so passable.Correspondingly, advantageously represented uniform thermal field scape for the first section of this shutter (again, towards that section of IR sensor element that is connected to matrix the first side), described expression has been subject to the assistance of the first heat-conducting layer.In radiometric situation, usefully know that the temperature of shutter is to make knowing the better impact of shutter on IR sensor element reading.Similarly, comprised temperature sensor 1020, described transducer comprises senser element and output device again.In this embodiment, heat discharges otch 1010 remainder of senser element and temperature sensor 1020 is separated, senser element 1021 be positioned in the side identical with hole of heat release otch 1010 in case accurately measure shutter, in view of the temperature of IR sensing element.In this embodiment, output device is not electrically connected with the contact pins 1024 in attachment, and therefore between bar portion and attachment, discharges the insulate conduction passage of otch 1011 without the need for crossing heat.So, Figure 10 shows the another kind in some possibility execution modes of the present invention, and wherein position, shape and the continuity of heat release otch can change together with the position of temperature sensor and contact pins.Additional heat discharges otch and also can be present in the second section of shutter, can arrange with mode identical in the first section.
Turn to now the hole 1030 of Figure 10, advantageously there is in the time that shutter is in place sharp-pointed knife-edge 1031 towards thermal field scape to the reflection, interference or other the less desirable optical effects that are caused by root face are minimized.For making it to realize, hole 1030 is formed by conical butt boring 1032, and wherein the aperture in shutter the first section is larger than the aperture in the second section on diameter, and boring 1032 is shaped to and is similar to truncated cone.But, by hole 1032 enforcement of conical butt, possible, shutter in conical butt boring 1032 (as shown in shade in Figure 10), can be by the visible part of IR sensing element not by the coating of the high emissivity coating of the first section but can comprise the basis material such as FR-4.This can make the reflection of the aforementioned IR energy being caused by IR sensing element more may turn back in IR sensing element self, makes dsc data deviation.In order to repair this situation, shutter can further comprise that the second additional high emissivity coating that is applied to this region is to make reflection minimized.The second high emissivity coating can comprise the material identical with original high emissivity coating, or the second high emissivity coating can be to have comprised solder mask, spray paint or different, the possible coating of other high emissivity materials.
In some embodiments, the shutter of Figure 10 can be combined with all shutters as shown in Figure 7.In specific implementations, these two shutters are attached dividually in Thermal Imaging Camera, and each shutter has the device such as motor, by described device, shutter is located.In different execution modes, two shutters can be closed simultaneously and be independent of each other and be moved.Also can expect the single shutter for two kinds of objects, wherein single attachment and bar portion cause two flag portions (has if the hole in Figure 10 and is not as having hole in Fig. 7) of shutter.Additional execution mode of the present invention can comprise two flag portions, and each flag portion comprises the hole of different size.The execution mode that has comprised multiple flag portion of the present invention can be arranged so that flag portion substantially side by side, and wherein shutter rotates to select which flag portion to use around the point such as attachment.Additional execution mode can be configured so that shutter translation and move to select which flag portion to use.As the skilled person will recognize, can be also other structures.
Some technology of describing in this manual also can for example, arrange or encode in computer readable medium (holding the non-provisional computer readable storage medium of instruction).The instruction embedding in computer readable storage medium or encode can cause for example programmable processor or other processor manners of execution in the time that instruction is performed.Computer readable storage medium can comprise random-access memory (ram), read-only memory (ROM), hard disk, optical medium or other computer readable mediums.Such technology can comprise that this computer readable medium of employing combines with above-mentioned shutter to carry out calibration and/or the calculating about Thermal Imaging Camera, calculates such as carrying out transducer biasing or radiation.
Describe shutter and can comprise various embodiment and the advantage of the Thermal Imaging Camera of shutter.These descriptions are exemplary in essence and have not defined restriction of the present invention.On the contrary, embodiment described herein comprises the execution mode in the scope that is in following claims together with other embodiment.

Claims (22)

1. for a shutter for Thermal Imaging Camera, it is for optionally covering at least a portion of infrared sensor elements, and described shutter comprises:
Matrix flat, thermal insulation and electric insulation, described matrix has the first side and the second side, and described the second side is contrary with the first side substantially;
The first section, it is operatively connected to the first side of matrix, and described the first section comprises:
Not only heat conduction but also the ground floor that conducts electricity,
Electric insulation and there is the second layer of high emissivity, and
Temperature sensor, described temperature sensor has for the sensing element of sensing temperature and output device for exporting the signal of telecommunication corresponding with institute sensing temperature, described sensing element and ground floor hot link; And
The second section, it is operatively connected to the second side of matrix, and described the second section comprises low emissivity coatings.
2. a shutter, it is at least a portion of the infrared sensor elements of cover heating imaging camera optionally, and described Thermal Imaging Camera provides the thermal imagery of high temperature scene, and described shutter comprises:
Matrix flat, thermal insulation and electric insulation, described matrix has the first side and second side contrary with the first side substantially;
The first section, it is operatively connected to the first side of matrix, and described the first section comprises:
Not only heat conduction but also the ground floor that conducts electricity,
Electric insulation and there is the second layer of high emissivity,
First area,
With the second area of first area thermal insulation and electric insulation, and
Temperature sensor, described temperature sensor has for the senser element of sensing temperature and output device for exporting the signal of telecommunication corresponding with institute sensing temperature, described sensing element in first area with described ground floor hot link;
The second section, it is operatively connected to the second side of matrix; And
Hole, is not sensed by Thermal Imaging Camera to only intercept a part for incident IR radiation.
3. a shutter, it is for optionally covering at least a portion of infrared sensor elements, and described shutter comprises:
Matrix flat, thermal insulation and electric insulation, described matrix has the first side and second side contrary with the first side substantially;
The first section, it is operatively connected to the first side of matrix, and described the first section comprises:
Not only heat conduction but also the layer that conducts electricity,
First area,
With the second area of first area thermal insulation and electric insulation, and
Temperature sensor, described temperature sensor has for the sensing element of sensing temperature and output device for exporting the signal of telecommunication corresponding with institute sensing temperature, described sensing element in described first area with the hot link of described layer; And
The second section, it is operatively connected to the second side of matrix, and described the second section comprises low emissivity coatings.
4. according to the shutter described in any one in claims 1 to 3, also comprise the flag portion for optionally covering infrared sensor elements, and the bar portion of contiguous flag portion location, wherein, to cross border between flag portion and bar portion be discontinuous at least partly because the first heat discharges otch for the first heat conduction and conductive layer.
5. according to the shutter of claim 2 or 3, it is characterized in that, described first area is defined for the flag portion of selectivity covering infrared sensor elements, and described second area comprises the bar portion of contiguous flag portion location, wherein, to cross border between flag portion and bar portion be discontinuous at least partly because the first heat discharges otch for heat conduction and conductive layer.
6. the shutter in the time quoting claim 2 according to claim 4 or 5, is characterized in that, described hole is arranged in the flag portion of shutter.
7. according to the shutter described in any one in claim 4 to 6, it is characterized in that, the first heat conduction and conductive layer are fully discontinuous between the flag portion of shutter and bar portion.
8. according to the shutter described in any one in claim 4 to 7, it is characterized in that, the senser element of temperature sensor in the flag portion of shutter with ground floor hot link, and the output device of temperature sensor is electrically connected with ground floor in bar portion.
9. according to the shutter described in any one in claim 4 to 8, it is characterized in that, described shutter also comprises attachment, and the contiguous bar of described attachment portion location is for being attached to Thermal Imaging Camera by shutter.
Shutter according to claim 5 or according to any one in claim 6 to 8 shutter in the time quoting claim 5, it is characterized in that, described second area also comprises attachment, and the contiguous bar of described attachment portion location is for being attached to Thermal Imaging Camera by shutter.
11. according to the shutter described in claim 9 or 10, it is characterized in that, by the second heat discharge otch make the first heat conduction and conductive layer cross border between bar portion and attachment at least major part be discontinuous.
12. shutters according to claim 11, it is characterized in that, the second section of described shutter comprises at least one heat release otch, and first and second hot at least one that discharge otch that described at least one heat discharges in otch and the first section are relatively located substantially.
13. according to the shutter described in any one in claim 1 to 12, it is characterized in that, the low emissivity coatings of described the second section is gold plating.
14. according to the shutter described in any one in claim 1 to 13, it is characterized in that, described the second section also comprises the intermediate buffering layer between matrix and low emissivity coatings.
15. shutters according to claim 14, is characterized in that, described intermediate buffering layer is copper layer.
16. according to the shutter described in any one in claim 1 to 15, it is characterized in that, the high emissivity second layer comprises welding mask coating.
17. according to the shutter described in any one in claim 1 to 16, it is characterized in that, the first heat conduction and conductive layer be isolation, the conduction pathway with the output device telecommunication of formation and temperature sensor by moulding.
18. according to the shutter described in any one in claim 1 to 17, also comprises contact pins, and described contact pins is for relaying to by the signal of telecommunication of the output device from temperature sensor the assembly separating with shutter.
19. 1 kinds of Thermal Imaging Cameras, it has the shutter of at least a portion for optionally covering infrared sensor elements, and described shutter is the shutter as any one limited in claim 1 to 18.
20. according to claim 19 being at least subordinated to the Thermal Imaging Camera of claim 9 or at 10 o'clock, also comprise motor, described electrical mechanisms causes and shutter is moved and attached via attachment and described shutter.
21. Thermal Imaging Cameras according to claim 20, is characterized in that, described motor is piezoelectric motor.
22. according to claim 19 to the Thermal Imaging Camera described in any one in 21, also comprises groove, described groove be used for receiving temperature sensor and in the time that shutter moves allowable temperature transducer advance at groove.
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