CN103972091A - Semiconductor device and method for manufacturing the same - Google Patents

Semiconductor device and method for manufacturing the same Download PDF

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Publication number
CN103972091A
CN103972091A CN201310031785.4A CN201310031785A CN103972091A CN 103972091 A CN103972091 A CN 103972091A CN 201310031785 A CN201310031785 A CN 201310031785A CN 103972091 A CN103972091 A CN 103972091A
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semiconductor device
substrate
metal silicide
manufacture method
annealing
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CN201310031785.4A
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CN103972091B (en
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邓坚
罗军
赵超
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Institute of Microelectronics of CAS
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Institute of Microelectronics of CAS
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66568—Lateral single gate silicon transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28518—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table the conductive layers comprising silicides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45—Ohmic electrodes
    • H01L29/456—Ohmic electrodes on silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Thin Film Transistor (AREA)

Abstract

The invention discloses a semiconductor device and a manufacturing method thereof, comprising the following steps: forming a gate stack structure on a substrate including a silicon element; forming metal silicide in the substrate to be used as a source drain region; performing ion implantation to implant doping ions into the metal silicide; and performing drive annealing to form a dielectric layer at the interface of the metal silicide and the substrate. According to the semiconductor device and the manufacturing method thereof, the doping ions are injected into the low-resistance nickel-based metal silicide and then the annealing is carried out, so that the ultrathin dielectric layer is formed between the silicide and the substrate, the Schottky barrier height is effectively reduced, and the driving capability of the device is improved.

Description

Semiconductor device and manufacture method thereof
Technical field
The present invention relates to a kind of semiconductor device and manufacture method thereof, particularly relate to a kind of MOSFET and manufacture method thereof that can effectively reduce the schottky barrier height between metal silicide/silicon.
Background technology
Along with conventional MOS FET device continues scaled, source ohmic leakage do not dwindle with channel dimensions and in proportion reduce, particularly contact resistance approximate square of doubly increase along with size reduction, declines equivalent operating voltage, has greatly affected the performance of scaled device.Leak if traditional highly doped source/leakage is replaced with to metal suicide source in existing MOSFET manufacturing technology, can significantly reduce parasitic series resistance and contact resistance.
As shown in Figure 1, for existing metal suicide source/drain MOSFET (being also referred to as Schottky-barrier source/drain MOSFET) schematic diagram, 2AHuo2B both sides, channel region in body silicon substrate 1A or silicon-on-insulator (SOI) substrate 1B form metal silicide source-drain area 3A and 3B, on channel region, be formed with successively grid structure 4A/4B and grid curb wall 5A/5B, wherein metal silicide is by complete source/drain material as directly contacting raceway groove, without traditional ion injecting process that leak in highly doped source that is used to form.Shallow trench isolation can also be set from STI6A/6B in device substrate, in figure, STI, not directly between body silicon substrate and SOI substrate, and is only used to facilitate for the purpose of example, and two kinds of substrate reality are not connected.
In above-mentioned Schottky barrier source drain MOSFET, the driving force of device depends on the schottky barrier height (SBH) between metal suicide source leakage 3A/3B and channel region 2A/2B.Along with SBH reduces, drive current increases.The result demonstration of device simulation, in the time that SBH is reduced to about 0.1eV, metal silicide source drain MOSFET can reach the driving force identical with the highly doped source drain MOSFET of traditional large scale.
Metal silicide is nickel based metal silicide normally, for example, reacted NiSi, NiPtSi, NiPtCoSi of generating etc. with the Si in substrate channel region by Ni, NiPt, NiPtCo.For the contact between nickel based metal silicide and silicon, (or note is φ to SBH b) conventionally larger, for example 0.7eV, therefore the drive current of device is less, has restricted the application that reduces the Novel MOS FET of source ohmic leakage by nickel based metal silicide, therefore needs a kind of new unit and manufacture method thereof that can effectively reduce nickel based metal silicide source and leak the SBH between silicon raceway groove.
As shown in Fig. 2 A to 2D, for a kind of metal silicide is as the generalized section of the method step of SBH between the reduction nickel based metal silicide of doped source (SADS) and silicon.Wherein, first as shown in Figure 2 A, on substrate 1, form the gate stack structure 4A that comprises gate insulator 41, grid conducting layer 42, form grid curb wall 5A in gate stack structure 4A both sides.Secondly as shown in Figure 2 B, nickel deposited Base Metal layer on device, generally include Ni, NiPt, NiCo, NiTi or its ternary alloy three-partalloy, then carry out step self-aligned silicide (SALICIDE) technique (annealing at approximately 500 DEG C, form the low-resistance phase of nickel based metal silicide), or carry out two step SALICIDE techniques and (at approximately 300 DEG C, anneal for the first time, form the enrichment phase of Ni, remove after unreacted metal, annealing for the second time at approximately 500 DEG C, form the low-resistance phase of nickel based metal silicide), the Si that consumes thus part substrate 1 also forms the source-drain area 3A of nickel based metal silicide therein.Especially, current SALICIDE optimal process adopts double annealing method.Then as shown in Figure 2 C, nickel based metal silicide source-drain area 3A is carried out to Implantation, the p-type foreign ions such as B Implanted for pMOS (B) inject the N-shaped foreign ions such as arsenic (As) for nMOS.As shown in Figure 2 D finally, Execution driven annealing, the interface between source-drain area 3A and the channel region of substrate 1 is assembled, condensed in to the ion injecting for example, under the driving that drives annealing (approximately 450～850 DEG C), form the condensation region 7 of doping ion, thereby effectively reduce SBH, improved the driving force of device.
But, the above-mentioned SADS that utilizes reduces still Shortcomings of SBH method: the solubility of injecting the foreign ion that enters nickel based metal silicide source leakage 3A is very poor, a large amount of ions that inject cannot solid solution in nickel based metal silicide, therefore can be for the doping amount of ions deficiency that reduces SBH; Thereby the ion injecting spreads interface fractional condensation between nickel based metal silicide and silicon by crystal boundary forms condensation region 7, but the temperature that drives annealing to adopt is lower, is not enough to activate completely the impurity of fractional condensation, and the effect that reduces SBH is not remarkable.Therefore, be not enough to SBH to be reduced to the degree that is less than 0.1eV by the SADS method of above-mentioned routine.In a word, existing MOSFET cannot effectively reduce SBH, thereby cannot effectively reduce source ohmic leakage and effectively improve device drive ability simultaneously, have a strong impact on the electric property of semiconductor device, therefore need a kind of semiconductor device and manufacture method thereof that can effectively reduce SBH badly.
Summary of the invention
From the above mentioned, the object of the present invention is to provide a kind of method, semi-conductor device manufacturing method that can effectively reduce SBH.
For this reason, the invention provides a kind of manufacture method of semiconductor device, comprising: on the substrate that comprises element silicon, form gate stack structure; In substrate, form metal silicide, to be used as source-drain area; Carry out Implantation, to dopant implant ion in metal silicide; Execution driven annealing, makes metal silicide and substrate interface place form dielectric layer.
Wherein, substrate comprises body silicon, SOI, GeSi, SiC.
Wherein, the step of formation metal silicide further comprises: nickel deposited Base Metal layer on substrate and gate stack structure; Carry out the first annealing, make the silicon in substrate react the rich nickel phase metal silicide of formation with nickel based metal layer; Divest unreacted nickel based metal layer; Carry out the second annealing, make rich nickel phase metal silicide be converted into nickel based metal silicide, to be used as source-drain area.
Wherein, nickel based metal layer comprises Ni, Ni-Pt, Ni-Co, Ni-Pt-Co.
Wherein, in nickel based metal layer, nickel content is more than or equal to 90%.
Wherein, the thickness of nickel based metal layer is 1 to 100nm.
Wherein, rich nickel phase metal silicide comprises Ni 2si, Ni 3si, Ni 2ptSi, Ni 3ptSi, Ni 2coSi, Ni 3coSi, Ni 3ptCoSi.
Wherein, the first annealing carries out 10 to 300s at 200 to 350 DEG C of temperature.
Wherein, the second annealing carries out 5 to 300s at 400 to 600 DEG C of temperature.
Wherein, metal silicide comprises NiSi, NiPtSi, NiCoSi, NiPtCoSi.
Wherein, doping ion comprises O, N and combination thereof, and dielectric layer comprises silica, silicon nitride, silicon oxynitride and combination thereof.
Wherein, drive annealing to carry out 1 to 300s at 450～850 DEG C of temperature.
Wherein, thickness of dielectric layers is 0.1～2nm.
The present invention also provides a kind of semiconductor device, comprises containing the source-drain area of the gate stack structure on substrate, the substrate of element silicon, metal silicide in the substrate of gate stack structure both sides, it is characterized in that: between source-drain area and substrate, also have dielectric layer.
Wherein, substrate comprises body silicon, SOI, GeSi, SiC.
Wherein, metal silicide comprises NiSi, NiPtSi, NiCoSi, NiPtCoSi.
Wherein, dielectric layer comprises silica, silicon nitride, silicon oxynitride and combination thereof.
Wherein, thickness of dielectric layers is 0.1～2nm.
According to semiconductor device of the present invention and manufacture method thereof, by annealing again after dopant implant ion in low resistance nickel based metal silicide, between silicide and substrate, form ultra-thin medium layer, thereby effectively reduced schottky barrier height, improved the driving force of device.
Brief description of the drawings
Describe technical scheme of the present invention in detail referring to accompanying drawing, wherein:
Fig. 1 is the generalized section of the MOSFET of prior art;
The each step generalized section of reduction SBH method that Fig. 2 A to 2D is prior art; And
Fig. 3 to Fig. 8 is the generalized section according to each step of reduction SBH of the present invention.
Embodiment
The feature and the technique effect thereof that describe technical solution of the present invention in detail referring to accompanying drawing and in conjunction with schematic embodiment, disclose semiconductor device and the manufacture method thereof that can effectively reduce SBH.It is pointed out that structure like similar Reference numeral representation class, term " first " used in the application, " second ", " on ", D score etc. can be used for modifying various device architectures or manufacturing process.These modify the space, order or the hierarchical relationship that not imply unless stated otherwise institute's modification device architecture or manufacturing process.
First, as shown in Figure 3, form substrate and grid basic structure.For embodiments of the invention, can adopt conventional Semiconductor substrate, for example, can comprise body silicon substrate, or other basic semiconductor or compound semiconductors, such as Ge, SiGe, GaAs, InP or Si:C etc.For example, according to the known designing requirement of prior art (p-type substrate or N-shaped substrate), described substrate 100 comprises various doping configurations, can comprise epitaxial loayer, also can comprise semiconductor-on-insulator (SOI) structure, can also there is stress to strengthen the property.Leak as source in view of the present invention adopts metal silicide, therefore substrate preferably comprises element silicon.For embodiments of the invention, preferably adopt SOI substrate.Particularly, on channel region 200 or 210 in body silicon substrate 100 or silicon-on-insulator (SOI) substrate 110, form grid structure 300 or 310, wherein grid structure 300/310 comprises gate insulator 301/311, grid conducting layer 302/312 and gate cap 303/313; Around grid structure, be formed with grid curb wall 400 or 410, shallow trench isolation can also be set from STI500/510 (body silicon substrate 100 not must be connected or join by STI with SOI substrate 110, is only the similar or same structure schematically showing on two kinds of different substrates in figure) in device substrate in same accompanying drawing.Wherein, channel region 200/210 length is less than or equal to 20nm, is also that device is the Effect of Short-channel MOSFET of sub-20nm.Especially, SOI substrate 110 comprises the top silicon layer 113 on oxygen buried layer 112 and the oxygen buried layer 112 on silicon substrate 111, silicon substrate 111, and wherein the thickness of top silicon layer 113 can be less than or equal to 10nm.In the step of formation basic structure, not execution source is leaked and is injected, and also does not leak in activator metal silicide source.
Secondly, depositing metal layers.As shown in Figure 4, in whole basic structure, deposition is used to form the metal level 600/610 of metal silicide, covers substrate, grid structure and grid curb wall.Thin metal layer material can for Ni, Ni-Pt (content of Pt mole is less than or equal to 10%), Ni-Co (Co molar content is less than or equal to 10%) or Ni-Pt-Co, (Pt and Co molar content sum be less than or equal to 10%, in other words, in each thin metal layer, the molar content of Ni is more than or equal to 90% above) etc., thin metal layer thickness is about 1 to 100nm and preferred 1～30nm.
Subsequently, with reference to Fig. 5, carry out the first annealing, form rich nickel phase silicide.For example at 200 to 350 DEG C, anneal 10 to 300s, make the metal level 600/610 of deposition generate rich nickel phase silicide 700/710 with the pasc reaction in substrate 100/110.So-called rich nickel phase silicide, (atomicity content is higher than Si, and it can comprise Ni particularly to refer to nickel based metal in silicide 2si, Ni 3si, Ni 2ptSi, Ni 3ptSi, Ni 2coSi, Ni 3coSi, Ni 3ptCoSi etc.
Then, with reference to Fig. 6, divest unreacted metal level 600/610, and carry out the second annealing.At 400 to 850 DEG C and preferably carry out the second annealing under 400～600 DEG C of temperature ranges, rich nickel phase silicide 700/710 is changed into there is low-resistance nickel based metal silicide 701/711 (can comprise particularly NiSi, NiPtSi, NiCoSi, NiPtCoSi etc.) using the source-drain area as device.
Subsequently, with reference to Fig. 7, low-resistance nickel based metal silicide 701/711 is carried out to Implantation.For example, dosage is 1 × 10 14cm -2to 1 × 10 16cm -2.For p MOS, doping ion can be boron, aluminium Al, gallium Ga, indium In etc. and combination thereof, and for nMOS, doping ion can be nitrogen N, phosphorus P, arsenic As, oxygen O, sulphur S, selenium Se, tellurium Te, fluorine F, chlorine Cl, carbon C etc. and combination thereof.Preferably, doping ion is nonmetalloid, for example, be oxygen O or nitrogen N and combination thereof, to leak between substrate and form dielectric layer in silicide source.Injection process can be damaged nickel based metal silicide 701/711, and therefore Implantation Energy is unsuitable excessive.Implantation Energy is preferably enough low, to guarantee that most of doping ion injecting is limited in nickel based metal silicide.Especially, inject crystal structure that ion changed silicide and make in nickel based metal silicide solid solubility highlyer, thereby can increase the ion concentration of follow-up doping ion isolation condensing zone, thereby effectively reduce SBH.
Finally, with reference to Fig. 8, carry out the 3rd annealing (be also called and drive annealing), for example heat treated 1～300s at the temperature of 450～850 DEG C, drive doping ion (for example O or N) to form ultra-thin medium layer 800/810 in nickel based metal silicide 701/711 and the interface of substrate 100/110, can effectively reduce the schottky barrier height (SBH) between nickel based metal silicide 701/711 and substrate 100/110, thereby greatly improve the driving force of device.Especially, ultra-thin medium layer 800/810 is not only positioned at the lower surface of the source-drain area 701/711 of nickel based metal silicide formation, is also positioned at the side surface of source-drain area 701/711.The thickness of ultra-thin medium layer 800/810 is only 0.1～2nm preferably 1nm for example, and its material is for example silica, silicon nitride, silicon oxynitride and combination thereof.
According to semiconductor device of the present invention and manufacture method thereof, by annealing again after dopant implant ion in low resistance nickel based metal silicide, between silicide and substrate, form ultra-thin medium layer, thereby effectively reduced schottky barrier height, improved the driving force of device.
Although with reference to one or more exemplary embodiments explanation the present invention, those skilled in the art can know without departing from the scope of the invention device architecture is made to various suitable changes and equivalents.In addition, can make and manyly may be suitable for the amendment of particular condition or material and not depart from the scope of the invention by disclosed instruction.Therefore, object of the present invention does not lie in and is limited to as the disclosed specific embodiment for realizing preferred forms of the present invention, and disclosed device architecture and manufacture method thereof will comprise all embodiment that fall in the scope of the invention.

Claims (18)

1. a manufacture method for semiconductor device, comprising:
On the substrate that comprises element silicon, form gate stack structure;
In substrate, form metal silicide, to be used as source-drain area;
Carry out Implantation, to dopant implant ion in metal silicide;
Execution driven annealing, makes metal silicide and substrate interface place form dielectric layer.
2. the manufacture method of semiconductor device as claimed in claim 1, wherein, substrate comprises body silicon, SOI, GeSi, SiC.
3. the manufacture method of semiconductor device as claimed in claim 1, wherein, the step that forms metal silicide further comprises:
Nickel deposited Base Metal layer on substrate and gate stack structure;
Carry out the first annealing, make the silicon in substrate react the rich nickel phase metal silicide of formation with nickel based metal layer;
Divest unreacted nickel based metal layer;
Carry out the second annealing, make rich nickel phase metal silicide be converted into nickel based metal silicide, to be used as source-drain area.
4. the manufacture method of semiconductor device as claimed in claim 3, wherein, nickel based metal layer comprises Ni, Ni-Pt, Ni-Co, Ni-Pt-Co.
5. the manufacture method of semiconductor device as claimed in claim 3, wherein, in nickel based metal layer, nickel content is more than or equal to 90%.
6. the manufacture method of semiconductor device as claimed in claim 3, wherein, the thickness of nickel based metal layer is 1 to 100nm.
7. the manufacture method of semiconductor device as claimed in claim 3, wherein, rich nickel phase metal silicide comprises Ni 2si, Ni 3si, Ni 2ptSi, Ni 3ptSi, Ni 2coSi, Ni 3coSi, Ni 3ptCoSi.
8. the manufacture method of semiconductor device as claimed in claim 3, wherein, the first annealing carries out 10 to 300s at 200 to 350 DEG C of temperature.
9. the manufacture method of semiconductor device as claimed in claim 3, wherein, the second annealing carries out 5 to 300s at 400 to 600 DEG C of temperature.
10. the manufacture method of semiconductor device as claimed in claim 1, wherein, metal silicide comprises NiSi, NiPtSi, NiCoSi, NiPtCoSi.
The manufacture method of 11. semiconductor device as claimed in claim 1, wherein, doping ion comprises O, N and combination thereof, dielectric layer comprises silica, silicon nitride, silicon oxynitride and combination thereof.
The manufacture method of 12. semiconductor device as claimed in claim 1, wherein, drives annealing to carry out 1 to 300s at 450～850 DEG C of temperature.
The manufacture method of 13. semiconductor device as claimed in claim 1, wherein, thickness of dielectric layers is 0.1～2nm.
14. 1 kinds of semiconductor device, comprise containing the source-drain area of the gate stack structure on substrate, the substrate of element silicon, metal silicide in the substrate of gate stack structure both sides, it is characterized in that: between source-drain area and substrate, also have dielectric layer.
15. as the semiconductor device of claim 14, and wherein, substrate comprises body silicon, SOI, GeSi, SiC.
16. as the semiconductor device of claim 14, and wherein, metal silicide comprises NiSi, NiPtSi, NiCoSi, NiPtCoSi.
17. as the semiconductor device of claim 14, and wherein, dielectric layer comprises silica, silicon nitride, silicon oxynitride and combination thereof.
18. as the semiconductor device of claim 14, and wherein, thickness of dielectric layers is 0.1～2nm.
CN201310031785.4A 2013-01-28 2013-01-28 Semiconductor device and method for manufacturing the same Active CN103972091B (en)

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CN110828577A (en) * 2019-11-21 2020-02-21 海光信息技术有限公司 Semiconductor device and method for manufacturing the same

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US20110248343A1 (en) * 2010-04-07 2011-10-13 International Business Machines Corporation Schottky FET With All Metal Gate
CN102479818A (en) * 2010-11-29 2012-05-30 中国科学院微电子研究所 Semiconductor device and method for manufacturing the same
CN102593174A (en) * 2011-01-18 2012-07-18 中国科学院微电子研究所 Semiconductor device and method for manufacturing the same

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Publication number Priority date Publication date Assignee Title
CN101093857A (en) * 2003-09-05 2007-12-26 株式会社东芝 Field effect transistor and manufacturing method thereof
US20110241116A1 (en) * 2010-04-06 2011-10-06 International Business Machines Corporation FET with FUSI Gate and Reduced Source/Drain Contact Resistance
US20110248343A1 (en) * 2010-04-07 2011-10-13 International Business Machines Corporation Schottky FET With All Metal Gate
CN102479818A (en) * 2010-11-29 2012-05-30 中国科学院微电子研究所 Semiconductor device and method for manufacturing the same
CN102593174A (en) * 2011-01-18 2012-07-18 中国科学院微电子研究所 Semiconductor device and method for manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110828577A (en) * 2019-11-21 2020-02-21 海光信息技术有限公司 Semiconductor device and method for manufacturing the same
CN110828577B (en) * 2019-11-21 2023-09-26 海光信息技术(成都)有限公司 Semiconductor device and method for manufacturing the same

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