CN103943619A - LED (Light Emitting Diode) COB (Chip On Board) inverted packaging structure with large power for automotive lighting - Google Patents
LED (Light Emitting Diode) COB (Chip On Board) inverted packaging structure with large power for automotive lighting Download PDFInfo
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- CN103943619A CN103943619A CN201410191968.7A CN201410191968A CN103943619A CN 103943619 A CN103943619 A CN 103943619A CN 201410191968 A CN201410191968 A CN 201410191968A CN 103943619 A CN103943619 A CN 103943619A
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Abstract
The invention discloses an LED (Light Emitting Diode) COB (Chip On Board) inverted packaging structure with large power for automotive lighting. The LED COB inverted packaging structure comprises a support (1), an ESD (Electronic Static Discharge) protector (2), an LED chip (3), a ceramic fluorescent piece (4), a box dam (5), a printing circuit (6) and an electrode (7), wherein the printing circuit (6) is located at the upper part of the support (1) and is welded with the electrode (7) needed by power supply, the LED chip (3) is packaged on the printing circuit (6) of the support (1), and the ceramic fluorescent piece (4) is fixed on the box dam (5); the ceramic fluorescent piece (4) is serially connected on the electrode (7), and the ESD protector (2) and the LED chip (3) are connected in parallel. The LED COB inverted packaging structure provided by the invention is good in lighting effect, and the LED chip in a light source structure adopts an inverted packaging method, so that the performances including the cooling effect, the optical output efficiency and the like are excellent.
Description
Technical field
The invention belongs to technical field of semiconductor illumination, be specifically related to a kind of great power LED COB encapsulating structure of automobile lighting.
Background technology
The rise gradually in illumination market as novel illumination light source along with LED at present, its scope of application has covered the various aspects from home lightings such as desk lamps to public illuminations such as street lamps.Have benefited from the advantages such as the high light efficiency of LED illuminating source, small size, low-power consumption, make its illuminating effect in multiple illumination occasion surmount conventional light source far away.Especially in automotive lighting industry, it has been inundant trend that LED replaces conventional light source.But being limited by the requirement of GB for car headlamp design, the LED lighting source of common encapsulating structure can not well meet design requirement.
At present, encapsulate for adopt directly of encapsulation of general lighting light source both at home and abroad more, then coat the packaging technology of fluorescent glue, this structure &processes range of application is very extensive, but in Special use occasion, in the bright design of vehicle front lighting, there is following problem in this encapsulating structure: 1. the power of automotive lighting list chips can be got to 2 ∽ 3W, in the time adopting COB encapsulation, heat density is very high, and directly the Sapphire Substrate of packaged chip has affected hot transmission; 2. automotive lighting light source is the very high a kind of occasion of light efficiency utilization, and directly the light extraction efficiency of packaged chip is lower more than 20% than flip-chip, has affected the direct utilization of light; 3. because the heat density of automotive lighting light source is very high, use for a long time fluorescent glue can cause its ageing failure.
Summary of the invention
For above-mentioned defect; the object of the present invention is to provide a kind of high-power LE encapsulating structure of automobile lighting; this structure can adopt COB flip-chip packaged, coordinates ceramic flourescent sheet and esd protection circuit, realizes the COB encapsulation of efficient, stable high-power LED chip.
Technical scheme of the present invention is achieved in the following ways: a kind of great power LED COB flip-chip packaged structure of automobile lighting, formed by support, esd protection device, LED chip, ceramic flourescent sheet, box dam, printed circuit and electrode, described printed circuit is positioned at the top of support, on printed circuit, be welded with the electrode that power supply station needs, LED chip is packaged on the printed circuit of support, and ceramic flourescent sheet is mounted on the top of LED chip and is fixed on box dam; It is characterized in that: described LED chip is connected in series on electrode, esd protection device and LED chip group are connected in parallel.
The material of described support is aluminium nitride ceramics, and thickness is 0.5-1.6mm.
Described printed circuit is positioned at the top of support, for the upside-down mounting eutectic welding of LED chip and the connection of electrode, and is LED chip power supply.
Described LED chip is to be connected in series by multiple chips, and four chips are 2 × 1,3 × 1,4 × 1,5 × 1,6 × 1 modes to be arranged, and between every two, is spaced apart 0.1-0.5mm.
On described LED chip, mount ceramic flourescent sheet, and fixed by box dam.
Described esd protection device is in parallel with COB LED chip.
The present invention, with LED, as light source, power is little, and system energy consumption is little, and the life-span is long; Can be for upside-down mounting and two kinds of packaged types of formal dress; LED chip, good heat dissipation effect, light extraction efficiency is high; By multiple LED chip Series Packages, there is stronger novelty; Adopt the COB encapsulation mode of N × 1, for illuminator before and after automobile.
Brief description of the drawings
Fig. 1 is 4 × 1 COB encapsulating structure figure of automobile lighting LED chip of the present invention.
Fig. 2 is 4 × 1 COB circuit diagram of automobile lighting LED chip of the present invention.
Embodiment
The great power LED COB flip-chip packaged structure of automobile lighting is made up of support 1, esd protection device 2, LED chip 3, ceramic flourescent sheet 4, box dam 5, printed circuit 6 and electrode 7; support 1 is aluminium nitride ceramics; printed circuit 6 is positioned at support 1 top; on printed circuit 6, be welded with the electrode 7 that power supply station needs; LED chip 3 is positioned at printed circuit 6 tops of support 1, and ceramic flourescent sheet 4 is mounted on LED chip 3 tops and is fixed on box dam 5.LED chip 4 is connected in series on electrode 7, and esd protection device 2 is connected in parallel with LED chip 3 modules.Form the great power LED COB flip-chip packaged structure of automobile lighting with this.
Embodiment 1:
As shown in Figure 1 and Figure 2, be the present invention for 4 × 1 COB encapsulating structure schematic diagram of car headlamp LED chip, support 1 is aluminium nitride ceramics, thickness is 0.6mm.Upper width is 10mm, is highly 8mm; Printed circuit 6 is positioned at the top of support 1, for fixed electrode 7, and powers for esd protection device 2 and LED chip 3; Esd protection device 2 is connected in parallel by printed circuit 2 and LED chip 3, and LED chip 3 is that four chips are 4 × 1 modes to be arranged by 4 CREE DA1000 chips flip-chip packaged that is in series, and between every two, is spaced apart 0.2mm; Electrode 7 is positioned on printed circuit board (PCB) 1, for connecting external electric supply installation; Pottery flourescent sheet 4 is mounted on LED chip 3 tops and is fixed on box dam 5.
Claims (6)
1. a great power LED COB flip-chip packaged structure for automobile lighting, is made up of support (1), esd protection device (2), LED chip (3), ceramic flourescent sheet (4), box dam (5), printed circuit (6) and electrode (7); Described printed circuit (6) is positioned at the top of support (1), on printed circuit (6), be welded with the electrode (7) that power supply station needs, LED chip (3) is packaged on the printed circuit (6) of support (1), and ceramic flourescent sheet (4) is mounted on the top of LED chip (3) and is fixed on box dam (5); It is characterized in that: it is upper that described LED chip (4) is connected in series in electrode (7), esd protection device (2) is connected in parallel with LED chip (3) group.
2. the great power LED COB flip-chip packaged structure of a kind of automobile lighting according to claim 1, is characterized in that: described support (1) is aluminium nitride ceramics, and thickness is 0.5-1.6mm.
3. the great power LED COB flip-chip packaged structure of a kind of automobile lighting according to claim 1, it is characterized in that: described printed circuit (6) is positioned at the top of support (1), for the upside-down mounting eutectic welding of LED chip (3) and with being connected of electrode (7), and be that LED chip (3) is powered.
4. the great power LED COB flip-chip packaged structure of a kind of automobile lighting according to claim 1, it is characterized in that: described LED chip (3) is to be connected in series by multiple chips, four chips are 2 × 1,3 × 1,4 × 1,5 × 1,6 × 1 modes to be arranged, and between every two, is spaced apart 0.1-0.5mm.
5. the great power LED COB flip-chip packaged structure of a kind of automobile lighting according to claim 1, is characterized in that: on described LED chip (3), mount ceramic flourescent sheet (4), and fixing by box dam (5).
6. the great power LED COB flip-chip packaged structure of a kind of automobile lighting according to claim 1, is characterized in that: it is upper that described electrode (7) is positioned at printed circuit (6), for connecting external electric supply installation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410191968.7A CN103943619B (en) | 2014-05-08 | 2014-05-08 | A kind of great power LED COB flip-chip packaged structure of automobile lighting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410191968.7A CN103943619B (en) | 2014-05-08 | 2014-05-08 | A kind of great power LED COB flip-chip packaged structure of automobile lighting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103943619A true CN103943619A (en) | 2014-07-23 |
| CN103943619B CN103943619B (en) | 2016-11-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410191968.7A Active CN103943619B (en) | 2014-05-08 | 2014-05-08 | A kind of great power LED COB flip-chip packaged structure of automobile lighting |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119386A (en) * | 2018-08-06 | 2019-01-01 | 扬州虹扬科技发展有限公司 | Diode package structure and diode with its structure |
Citations (6)
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| US20090190277A1 (en) * | 2007-09-28 | 2009-07-30 | Super Talent Electronics, Inc. | ESD Protection For USB Memory Devices |
| CN102214652A (en) * | 2011-05-25 | 2011-10-12 | 映瑞光电科技(上海)有限公司 | LED (light emitting diode) packaging structure and preparation method thereof |
| CN102214649A (en) * | 2011-05-25 | 2011-10-12 | 映瑞光电科技(上海)有限公司 | LED (light-emitting diode) packaging structure and manufacturing method thereof |
| US20130070507A1 (en) * | 2011-09-19 | 2013-03-21 | Tae-Young Yoon | Semiconductor memory device |
| US20140078440A1 (en) * | 2009-09-24 | 2014-03-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| CN203883000U (en) * | 2014-05-08 | 2014-10-15 | 江苏洪昌科技股份有限公司 | Large power LED COB inverted packaging structure for automotive lighting |
-
2014
- 2014-05-08 CN CN201410191968.7A patent/CN103943619B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090190277A1 (en) * | 2007-09-28 | 2009-07-30 | Super Talent Electronics, Inc. | ESD Protection For USB Memory Devices |
| US20140078440A1 (en) * | 2009-09-24 | 2014-03-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| CN102214652A (en) * | 2011-05-25 | 2011-10-12 | 映瑞光电科技(上海)有限公司 | LED (light emitting diode) packaging structure and preparation method thereof |
| CN102214649A (en) * | 2011-05-25 | 2011-10-12 | 映瑞光电科技(上海)有限公司 | LED (light-emitting diode) packaging structure and manufacturing method thereof |
| US20130070507A1 (en) * | 2011-09-19 | 2013-03-21 | Tae-Young Yoon | Semiconductor memory device |
| CN203883000U (en) * | 2014-05-08 | 2014-10-15 | 江苏洪昌科技股份有限公司 | Large power LED COB inverted packaging structure for automotive lighting |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119386A (en) * | 2018-08-06 | 2019-01-01 | 扬州虹扬科技发展有限公司 | Diode package structure and diode with its structure |
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| CN103943619B (en) | 2016-11-16 |
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