CN103928588B - A kind of metal material belt, LED support, LED support structure and LED - Google Patents

A kind of metal material belt, LED support, LED support structure and LED Download PDF

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Publication number
CN103928588B
CN103928588B CN201410126081.XA CN201410126081A CN103928588B CN 103928588 B CN103928588 B CN 103928588B CN 201410126081 A CN201410126081 A CN 201410126081A CN 103928588 B CN103928588 B CN 103928588B
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China
Prior art keywords
leg
electrodes
metal material
material belt
led
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CN201410126081.XA
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Chinese (zh)
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CN103928588A (en
Inventor
张铁钟
刘君宏
郭伦春
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Shenzhen Jiuzhou Optoelectronics Technology Co Ltd
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Shenzhen Jiuzhou Optoelectronics Technology Co Ltd
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Priority to CN201410126081.XA priority Critical patent/CN103928588B/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71Means for bonding not being attached to, or not being formed on, the surface to be connected
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/71Means for bonding not being attached to, or not being formed on, the surface to be connected

Abstract

The invention discloses a kind of metal material belt, including conductive framework, some electrode legs are provided with conductive pane body, the bending of electrode leg is in Z-shaped shape, and it includes the first bending part, the second bending part and the 3rd bending part, and the first bending part is connected with conductive framework.Also disclose a kind of LED support, including two panels metal material belt, metal material belt includes left side metal material belt and right side metal material belt, left side metal material belt is provided with left electrodes leg, right side metal material belt is provided with right electrodes leg, and left side metal material belt is overlapped mutually rear left electrodes leg and right electrodes leg corresponding matching with right side metal material belt.Also disclose a kind of LED support structure and LED.The present invention uses the LED support of bimetallic material strip, and not only air-tightness, thermal diffusivity are good, and dependable performance, greatly reduce production cost.

Description

A kind of metal material belt, LED support, LED support structure and LED
Technical field
The present invention relates to LED, more particularly to a kind of metal material belt, LED support, LED support structure and LED.
Background technology
In the prior art, it is typically in the plate of individual layer, only letter to make metal material belt, the LED support that LED uses Single distinguishes positive and negative two opposed polarities, due to for single layer structure, causing the electrode leg and PPA pedestals on metal material belt It is too short to contact path, as shown in figure 1, electrode leg 100 is connected with the straight line of LED wafer 200 on pedestal, is not added with any blocks moisture Structural design idea, poor air-tightness, moisture is caused to be easy to enter in cavity along metal material belt, so as to cause packaging plastic to exist LED lamp bead easily departs from the environment of lighting for a long time with electrode leg so that the gold thread being welded on electrode leg disconnects, so as to shape Disconnected into circuit, cause product failure.And the height H of the electrode leg in high cup LED product in the market is too high, is pasting In plate application process, lamp bead surrounding casting glue is too high, can cause to waste glue first, secondly lamp bead stress can be caused excessive, dissipated Heat is bad.
The content of the invention
The present invention the first purpose be:A kind of metal material belt is provided, it is used for the LED support for making bilayer, not only electric The length of pole leg is longer, and adds contact path of the electrode leg with pedestal.
The present invention second of purpose be:A kind of LED support and LED support structure is provided, not only the length of electrode leg It is longer, and increase contact path of the electrode leg with pedestal.
The present invention the third purpose be:A kind of LED is provided, not only air-tightness, thermal diffusivity are good, and properties of product can Lean on, greatly reduce production cost, solve the problems, such as that electrode leg is too high.
In order to solve the above technical problems, the present invention proposes a kind of metal material belt, including conductive framework, the conductive framework Interior to be provided with some electrode legs, the electrode leg bending is in Z-shaped shape, it include the first bending part, the second bending part with And the 3rd bending part, first bending part are connected with conductive framework.
Further, the 3rd bending part is provided with breach.
Further, the inwall of the conductive framework is provided with boss.
Further, first bending part is provided with some through holes.
In order to solve the above technical problems, the invention also provides a kind of LED support, including the metal material belt described in two panels, The metal material belt is divided into left side metal material belt and right side metal material belt, the left side metal material belt are provided with left electrodes branch Pin, the right side metal material belt are provided with right electrodes leg, and the left side metal material belt is overlapped mutually with right side metal material belt The left electrodes leg and right electrodes leg corresponding matching afterwards.
In order to solve the above technical problems, the invention also provides a kind of LED support structure, including rack body, in addition to LED support described in several, the LED support array are laid on the rack body.
In order to solve the above technical problems, the invention also provides in a kind of LED, including pedestal and above-mentioned LED support Left electrodes leg and right electrodes leg, the pedestal upper surface is recessed a cavity, and the side wall of pedestal, which is provided with, to be connected Lead to the cavity through hole, supported after the 3rd bending part hermetically passing through hole of the left electrodes leg and right electrodes leg It is connected in cavity, the LED wafer being connected with left electrodes leg and right electrodes leg is provided with the cavity.
Further, the 3rd bending part of the left electrodes leg and right electrodes leg is exposed in the bottom surface of cavity On.
Further, the bottom of the pedestal is provided with groove, and the first of the left electrodes leg and right electrodes leg The equal bending of bending part and it is embedded in groove.
Further, the side wall of the pedestal is provided with the shrinkage pool matched with boss.
Above-mentioned technical proposal at least has the advantages that:The present invention uses the LED support of bimetallic material strip, can make Make longer electrode leg, add contact path of the electrode leg with pedestal, and electrode leg will be carried out in base interior Bending, the contact area of moisture and pedestal, the infiltration of moisture are reduced, while when pedestal expands with heat and contract with cold, LED support does not produce shifting Position;LED can be fabricated to high cup low electrode leg, solve the problems, such as that electrode leg is too high, not only air-tightness, dissipate It is hot good, and dependable performance, greatly reduce production cost.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention, And can be practiced according to the content of specification, and in order to allow the above and other objects, features and advantages of the present invention can Become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, describe in detail as follows.
Brief description of the drawings
Fig. 1 is electrode leg of the prior art and the structure sectional view of LED lamp base installation.
Fig. 2 is the structural representation of metal material belt embodiment one of the present invention.
Fig. 3 is the structural representation of metal material belt embodiment two of the present invention.
Fig. 4 is the schematic diagram of left side metal material belt and right side metal material belt when mounted in LED support of the present invention.
Fig. 5 is the structural representation of LED support of the present invention.
Fig. 6 is the structure sectional view of LED of the present invention.
Fig. 7 is the structure sectional view one of pedestal in LED of the present invention.
Fig. 8 is the structure sectional view two of pedestal in LED of the present invention.
Embodiment
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the application can phase Mutually combination.The present invention is described further below in conjunction with the accompanying drawings.
Embodiment one
As shown in Figure 2 and Figure 3, the metal material belt of the embodiment of the present invention, including the copper conductive pane body 1 of sheet and with conduction 3 copper electrodes legs 2 that framework 1 is formed integrally, for electrode leg 2 to be in the structure of Z-shaped shape after bending, it includes the first folding Turn of bilge 21, the second bending part 22 and the 3rd bending part 23, the first bending part 21 are connected on the inwall of conductive framework 1, so Compared to the LED support of single-layer metal material strip making, the electrode leg 2 in metal material belt of the invention can make longer, increasing Contact path of the electrode leg 2 with pedestal 40 is added;Breach 231 is provided with the 3rd bending part 23, and in the first bending part 21 are provided with several through holes 211, and when making LED, the pedestal 40 that epoxy resin makes can penetrate into the He of breach 231 In through hole 211 so that electrode leg 2 is not easy to be pulled, and prevents from departing between electrode leg 2 and pedestal 40;Conductive framework 1 Inwall is provided with boss 11, and when being molded pedestal 40, boss 11 can be caught in pedestal 40, when the first bending part 21 of cut-out is with leading During connection between electric framework 1, prevent pedestal 40 from being come off in conductive framework 1.
Embodiment two
As shown in Figure 4, Figure 5, the LED support of the embodiment of the present invention includes the above-mentioned metal material belt of two panels, a piece of left side gold Belong to material strip 10 and a piece of right side metal material belt 20, accordingly, left side metal material belt 10 is provided with left electrodes leg 101, right side Metal material belt 20 is provided with right electrodes leg 201, and left side metal material belt 10 is described after being overlapped mutually with right side metal material belt 20 Left electrodes leg 101 and the corresponding matching of right electrodes leg 201.The LED support so made compared to single-layer metal material strip, by In using double-deck metal material belt of two panels, often the electrode leg 2 on a piece of metal material belt can make longer, increase electrode The contact path of leg 2 and pedestal 40.
Embodiment three
The LED support structure of the embodiment of the present invention includes rack body, in addition to several above-mentioned LED supports, LED branch Frame array is laid on the rack body, and the LED support of array laying, production effect are directly stamped out on sheet stent body Rate is higher.
Example IV
As shown in Fig. 6, Fig. 7, Fig. 8, the left side in the LED of the embodiment of the present invention, including pedestal 40 and above-mentioned LED support Lateral electrode leg 101 and right electrodes leg 201, the upper surface of pedestal 40 are recessed a cavity 401, set in the side wall of pedestal 40 There is a through hole 402 for connecting the cavity 401, the 3rd bending part 23 of left electrodes leg 101 and right electrodes leg 201 is close Envelope is provided with and left electrodes leg 101 and right electrodes in cavity 401 through exposed on the bottom surface of cavity 401 after through hole 402 The LED wafer 50 that leg 201 connects, the present embodiment is using double-deck metal material belt of two panels, left electrodes leg 101 and right side electricity Pole leg 201 is encapsulated integrally by pedestal 40, and often the electrode leg 2 on a piece of metal material belt can make longer, not only Increase contact path of the electrode leg 2 with pedestal 40, at the same the second bending part 22 of the electrode leg 2 after bending form it is damp proof The ledge structure design of gas, reduces the infiltration of moisture.The bottom of pedestal 40 is provided with groove 403, left electrodes leg 101 and right side First bending part 21 of electrode leg 201 and the equal bending in the conductive connection end of framework 1 and it is embedded in groove 403, effectively solves The problem of electrode leg 2 is too high, in pasting board application process, pedestal 40 surrounding casting glue is not required to too high, saves glue, prevents Lamp bead stress is excessive, simultaneously because glue quantity is few so that better heat-radiation effect;It is provided with and boss 11 in the side wall of pedestal 40 The shrinkage pool 404 of matching, during LED is made, boss 11 can be caught in the shrinkage pool 404 of pedestal 40, when cut-out first During connection between bending part 21 and conductive framework 1, prevent pedestal 40 from being come off in conductive framework 1.
The LED support being combined into one that the present invention is made using bimetallic material strip, is molded after being overlapped into a plate rack, Longer electrode leg 2 can be made, adds contact path of the electrode leg 2 with pedestal 40, and will be electrode leg 2 in base The progress bending of the inside of seat 40, the contact area of reduction moisture and pedestal 40, the infiltration of moisture, while when pedestal 40 expands with heat and contract with cold When, LED support does not produce displacement;LED can be fabricated to high cup low electrode leg 2, it is too high to efficiently solve electrode leg 2 The problem of, not only air-tightness, thermal diffusivity are good, and dependable performance, greatly reduce production cost.
Described above is the embodiment of the present invention, it is noted that for those skilled in the art For, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as Protection scope of the present invention.

Claims (8)

1. a kind of LED support, including:Metal material belt, it is characterised in that the metal material belt includes left side metal material belt and right side Metal material belt, the left side metal material belt are provided with left electrodes leg, and the right side metal material belt is provided with right electrodes branch Pin, it is corresponding that the left side metal material belt with right side metal material belt is overlapped mutually rear the left electrodes leg and right electrodes leg Coordinate;The left side metal material belt and right side metal material belt include conductive framework, the left electrodes leg and right side electricity respectively Pole leg difference bending is in Z-shaped shape, and the left electrodes leg and right electrodes leg include the first bending part, second respectively Bending part and the 3rd bending part;First bending part of the left electrodes leg connects with the conductive framework of left electrodes leg Connect;First bending part of the right electrodes leg is connected with the conductive framework of right electrodes leg;The left electrodes leg Some through holes are provided with the first bending part of right electrodes leg.
2. LED support as claimed in claim 1, it is characterised in that the 3rd bending part is provided with breach.
3. LED support as claimed in claim 1, it is characterised in that the inwall of the conductive framework is provided with boss.
4. a kind of LED support structure, including rack body, it is characterised in that also as claimed in claim 1 including several LED support, the LED support array are laid on the rack body.
5. a kind of LED, it is characterised in that including the left electrodes leg in pedestal and LED support as claimed in claim 1 With right electrodes leg, the pedestal upper surface is recessed a cavity, and the cavity insertion is communicated with the side wall of pedestal Hole, it is connected in cavity after the 3rd bending part hermetically passing through hole of the left electrodes leg and right electrodes leg, institute State the LED wafer for being provided with cavity and being connected with left electrodes leg and right electrodes leg.
6. LED as claimed in claim 5, it is characterised in that the 3rd of the left electrodes leg and right electrodes leg Bending part is exposed on the bottom surface of cavity.
7. LED as claimed in claim 5, it is characterised in that the bottom of the pedestal is provided with groove, the left electrodes branch The equal bending of the first bending part of pin and right electrodes leg and it is embedded in groove.
8. LED as claimed in claim 5, it is characterised in that the side wall of the pedestal is provided with the shrinkage pool matched with boss.
CN201410126081.XA 2014-03-31 2014-03-31 A kind of metal material belt, LED support, LED support structure and LED Active CN103928588B (en)

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CN201410126081.XA CN103928588B (en) 2014-03-31 2014-03-31 A kind of metal material belt, LED support, LED support structure and LED

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Application Number Priority Date Filing Date Title
CN201410126081.XA CN103928588B (en) 2014-03-31 2014-03-31 A kind of metal material belt, LED support, LED support structure and LED

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CN103928588B true CN103928588B (en) 2018-02-27

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101408286A (en) * 2008-09-16 2009-04-15 深圳市九洲光电子有限公司 White light LED for road illumination
CN103000620A (en) * 2012-12-05 2013-03-27 深圳市九洲光电科技有限公司 Damp-proof full-color surface mount device
CN203826425U (en) * 2014-03-31 2014-09-10 深圳市九洲光电科技有限公司 Metallic material band, LED support, LED support structure and LED lamp

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005197329A (en) * 2004-01-05 2005-07-21 Stanley Electric Co Ltd Surface-mounting semiconductor device and its lead-frame structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101408286A (en) * 2008-09-16 2009-04-15 深圳市九洲光电子有限公司 White light LED for road illumination
CN103000620A (en) * 2012-12-05 2013-03-27 深圳市九洲光电科技有限公司 Damp-proof full-color surface mount device
CN203826425U (en) * 2014-03-31 2014-09-10 深圳市九洲光电科技有限公司 Metallic material band, LED support, LED support structure and LED lamp

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