CN103846646A - 拆卸装置 - Google Patents
拆卸装置 Download PDFInfo
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- CN103846646A CN103846646A CN201210521525.0A CN201210521525A CN103846646A CN 103846646 A CN103846646 A CN 103846646A CN 201210521525 A CN201210521525 A CN 201210521525A CN 103846646 A CN103846646 A CN 103846646A
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- 238000010438 heat treatment Methods 0.000 claims abstract description 25
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1858—Handling of layers or the laminate using vacuum
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Telephone Set Structure (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
本发明提供一种拆卸装置,用于分离一电子装置的基部和盖部,包括底座、承载架、驱动装置、吸附件和加热件;底座包一空腔和与空腔相通的抽气口,空腔被一支撑板覆盖,支撑板包括空腔相通的通孔,抽气口通过一连接管与一抽真空装置相连,空腔中的空气被抽走后,基部能够被吸附在吸附板上;驱动装置固定于承载架,驱动装置包括伸缩杆,伸缩杆能够相对于底座运动;吸附件固定在伸缩杆的末端,吸附件包括一腔体及与腔体相通的抽气口,腔体被一吸附板覆盖,吸附板包括与空腔相通的通孔,抽气口通过一连接管与抽真空装置相连,腔体中的空气被抽走后,电子装置的基部能够被吸附在吸附板上;加热件固定在吸附板,用于加热盖部与基部之间的背胶而使之软化。
Description
技术领域
本发明涉及一种将一电子装置的盖部和基部分离的拆卸装置。
背景技术
为了更加轻薄和美观,现有的一些便携式消费性电子产品(如手机)的盖部(主要包括显示屏)和基部(除显示屏的其他部分)通过背胶相连接。对于已经组装好的盖部和基部,维修或者返工时需要一种能将盖部和基部分离的拆卸装置。
发明内容
有鉴于此,本发明提供一种将一电子装置的盖部和基部分离的拆卸装置。
一种拆卸装置,用于分离一电子装置的基部和盖部,该拆卸装置包括底座、承载架、驱动装置、吸附件和加热件;底座包一空腔和与空腔相通的第一抽气口,空腔被一支撑板覆盖,支撑板用于放置该电子装置,支撑板包括多个与该空腔相通的通孔,该第一抽气口通过一连接管与一抽真空装置相连,该空腔中的空气被抽走后,该电子装置的基部能够被吸附在该吸附板上;承载架固定于该底座,驱动装置固定于该承载架,驱动装置包括伸缩杆,伸缩杆能够相对于底座运动;吸附件固定在伸缩杆的末端,吸附件包括一腔体及与该腔体相通的第二抽气口,腔体被一吸附板覆盖,吸附板包括多个与该空腔相通的通孔,第二抽气口通过一连接管与该抽真空装置相连,该腔体中的空气被抽走后,该电子装置的基部能够被吸附在该吸附板上;加热件固定在吸附板与该底座相对的表面,加热件用于加热被吸附在吸附板上的盖部与基部之间的背胶,使该背胶能够软化,从而允许盖部能与吸附板一起跟随伸缩杆移动,从而将基部和盖部分离。
本发明的拆卸装置能够将电子装置通过背胶相连接的基部和盖部分离,并且不会损伤基部和盖部。
附图说明
图1为本发明的拆卸装置的立体图。
图2为本发明的拆卸装置的分解图。
图3为本发明的拆卸装置的剖视图。
图4为图3中的IV部分的放大图。
主要元件符号说明
拆卸装置 | 100 |
电子装置 | 200 |
基部 | 210 |
底板 | 211 |
侧壁 | 213 |
承载片 | 215 |
凹槽 | 217 |
盖部 | 220 |
背胶 | 230 |
磁铁 | 250、270 |
底座 | 10 |
空腔 | 11 |
第一抽气口 | 13 |
支撑板 | 15 |
通孔 | 151 |
连接管 | 17 |
承载架 | 20 |
驱动装置 | 30 |
伸缩杆 | 31 |
吸附件 | 40 |
腔体 | 41 |
第二抽气口 | 43 |
吸附板 | 45 |
通孔 | 451 |
连接管 | 47 |
加热件 | 50 |
电热丝 | 51 |
导板 | 53 |
抽真空装置 | 60 |
磁铁 | 70 |
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
图1-2示出一种拆卸装置100,其用于分离一电子装置200的基部210和盖部220(图4可见)。如图4所示,基部210包括底板211、侧壁213和自侧壁213的顶端向内延伸的承载片215。承载片215与盖部220的内表面通过背胶230相连接。承载片215上设置有一凹槽217,该凹槽217中容纳有磁铁250,该磁铁250与盖部220的内表面上的磁铁270相互吸引。
请同时参阅图3,拆卸装置100包括底座10、承载架20、驱动装置30、吸附件40和加热件50。底座10包一空腔11和与空腔相通的第一抽气口13,空腔11被一支撑板15覆盖,支撑板15用于放置该电子装置200。支撑板15包括多个与该空腔11相通的通孔151,该第一抽气口13通过一连接管17与一抽真空装置60相连。该电子装置200的基部210放在支撑板15后将该通孔151堵住,该空腔11中的空气被抽走后,该空腔11处于真空状态,该基部210因而能够被吸附在该支撑板15上。
承载架20固定于该底座10,驱动装置30固定于该承载架20,驱动装置30包括伸缩杆31,伸缩杆31能够相对于底座运动。在本实施方式中,驱动装置30为汽缸。
吸附件40固定在伸缩杆31的末端,吸附件40包括一腔体41及与该腔体相通的第二抽气口43,腔体41被一吸附板45覆盖,吸附板45包括多个与该腔体相通的通孔451,第二抽气口43通过一连接管47与该抽真空装置60相连。该吸附件40在该驱动装置30的带动下能向底座10靠近,当吸附板45与该电子装置200的盖部220接触后,该多个通孔451被堵住,该腔体41中的空气被抽走后,该腔体41处于真空状态,该盖部220因而能够被吸附在该吸附板45上。
加热件50固定在吸附板45与该底座10相对的表面,加热件50用于加热盖部220与基部210之间的背胶230,使该背胶230能够软化,从而允许盖部220能与吸附板45一起跟随伸缩杆31向上移动,从而将基部210和盖部220分离。在本实施方式中,加热件50包括电热丝51和导板53,电热丝51嵌入该吸附板45与该底座10相对的表面,导板53固定在该吸附板45与该底座10相对的表面,导板53将电热丝51覆盖。电热丝51通电后产生的热量通过导板53传递至该盖部220。导板53具有和背胶230大致相同的宽度,当吸附板45与盖部220接触后,导板53恰好位于背胶230的上方。
在本实施方式中,拆卸装置100还包括磁铁70,磁铁70固定在吸附板45与该底座10相对的表面,当吸附板45与盖部220接触后,磁铁70恰好位于磁铁250的上方。吸附板45一起跟随伸缩杆31向上移动时,该磁铁70能够吸住磁铁250,使得磁铁250跟随吸附板45一起向上移动。
Claims (4)
1.一种拆卸装置,用于分离一电子装置的基部和盖部,其特征在于,该拆卸装置包括底座、承载架、驱动装置、吸附件和加热件;
底座包一空腔和与空腔相通的第一抽气口,空腔被一支撑板覆盖,支撑板用于放置该电子装置,支撑板包括多个与该空腔相通的通孔,该第一抽气口通过一连接管与一抽真空装置相连,该空腔中的空气被抽走后,该电子装置的基部能够被吸附在该吸附板上;
承载架固定于该底座,驱动装置固定于该承载架,驱动装置包括伸缩杆,伸缩杆能够相对于底座运动;
吸附件固定在伸缩杆的末端,吸附件包括一腔体及与该腔体相通的第二抽气口,腔体被一吸附板覆盖,吸附板包括多个与该腔体相通的通孔,第二抽气口通过一连接管与该抽真空装置相连,该腔体中的空气被抽走后,该电子装置的盖部能够被吸附在该吸附板上;
加热件固定在吸附板与该底座相对的表面,加热件用于加热被吸附在吸附板上的盖部与基部之间的背胶,使该背胶能够软化,从而允许盖部能与吸附板一起跟随伸缩杆移动,从而将基部和盖部分离。
2.如权利要求1所述的拆卸装置,其特征在于,该驱动装置为汽缸。
3.如权利要求1所述的拆卸装置,其特征在于,加热件包括电热丝和导板,电热丝通电后产生的热量通过导板传递至该盖部。
4.如权利要求1所述的拆卸装置,其特征在于,还包括磁铁,磁铁固定在吸附板与该底座相对的表面,磁铁用于吸引固定于该基部的内置磁铁。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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CN201210521525.0A CN103846646A (zh) | 2012-12-07 | 2012-12-07 | 拆卸装置 |
TW101149736A TW201424946A (zh) | 2012-12-07 | 2012-12-25 | 拆卸裝置 |
US13/973,980 US20140158306A1 (en) | 2012-12-07 | 2013-08-22 | Device for detaching a cover from a base |
JP2013240743A JP2014116937A (ja) | 2012-12-07 | 2013-11-21 | 取外し装置 |
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CN201210521525.0A CN103846646A (zh) | 2012-12-07 | 2012-12-07 | 拆卸装置 |
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CN103846646A true CN103846646A (zh) | 2014-06-11 |
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CN201210521525.0A Pending CN103846646A (zh) | 2012-12-07 | 2012-12-07 | 拆卸装置 |
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US (1) | US20140158306A1 (zh) |
JP (1) | JP2014116937A (zh) |
CN (1) | CN103846646A (zh) |
TW (1) | TW201424946A (zh) |
Cited By (4)
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CN105415278A (zh) * | 2015-11-28 | 2016-03-23 | 重庆元创自动化设备有限公司 | 铜套的抽取装置 |
CN108858032A (zh) * | 2018-07-12 | 2018-11-23 | 博众精工科技股份有限公司 | 一种电池拆除机构 |
CN109848897A (zh) * | 2019-03-18 | 2019-06-07 | 深圳市优界科技有限公司 | 一种带加热功能的真空吸盘 |
CN112207532A (zh) * | 2020-10-10 | 2021-01-12 | 安徽井利电子有限公司 | 一种扬声器回收用拆装装置及其实施方法 |
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CN104907993B (zh) * | 2015-06-23 | 2017-08-08 | 华东交通大学 | 一种触摸屏的拆卸装置及拆卸方法 |
CN206067049U (zh) * | 2016-07-29 | 2017-04-05 | 合肥鑫晟光电科技有限公司 | 膜材以及撕膜装置 |
US10170443B1 (en) * | 2017-11-28 | 2019-01-01 | International Business Machines Corporation | Debonding chips from wafer |
KR102505213B1 (ko) * | 2017-12-08 | 2023-03-03 | 삼성전자주식회사 | 분리용 전자 장치 및 이의 공정 방법 |
CN108356493B (zh) * | 2018-01-19 | 2019-08-16 | 蔡雅婷 | 一种手机电池拆卸装置 |
CN108296734B (zh) * | 2018-01-19 | 2019-07-19 | 贵港市瑞成科技有限公司 | 一种可快速吹软背胶的手机电池拆卸装置 |
CN108381154A (zh) * | 2018-01-19 | 2018-08-10 | 贵港市瑞成科技有限公司 | 一种手机电池背胶加热装置 |
CN113245826B (zh) * | 2021-07-01 | 2021-09-17 | 科圣达(苏州)智能科技有限公司 | 一种光伏组件接线盒的自动安装设备及其控制方法 |
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- 2012-12-07 CN CN201210521525.0A patent/CN103846646A/zh active Pending
- 2012-12-25 TW TW101149736A patent/TW201424946A/zh unknown
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2013
- 2013-08-22 US US13/973,980 patent/US20140158306A1/en not_active Abandoned
- 2013-11-21 JP JP2013240743A patent/JP2014116937A/ja active Pending
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CN105415278A (zh) * | 2015-11-28 | 2016-03-23 | 重庆元创自动化设备有限公司 | 铜套的抽取装置 |
CN108858032A (zh) * | 2018-07-12 | 2018-11-23 | 博众精工科技股份有限公司 | 一种电池拆除机构 |
CN109848897A (zh) * | 2019-03-18 | 2019-06-07 | 深圳市优界科技有限公司 | 一种带加热功能的真空吸盘 |
CN112207532A (zh) * | 2020-10-10 | 2021-01-12 | 安徽井利电子有限公司 | 一种扬声器回收用拆装装置及其实施方法 |
CN112207532B (zh) * | 2020-10-10 | 2022-02-22 | 安徽井利电子有限公司 | 一种扬声器回收用拆装装置的实施方法 |
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JP2014116937A (ja) | 2014-06-26 |
US20140158306A1 (en) | 2014-06-12 |
TW201424946A (zh) | 2014-07-01 |
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