CN103824840B - 基于硅通孔的螺线管式差分电感 - Google Patents
基于硅通孔的螺线管式差分电感 Download PDFInfo
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- CN103824840B CN103824840B CN201210463015.2A CN201210463015A CN103824840B CN 103824840 B CN103824840 B CN 103824840B CN 201210463015 A CN201210463015 A CN 201210463015A CN 103824840 B CN103824840 B CN 103824840B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210463015.2A CN103824840B (zh) | 2012-11-16 | 2012-11-16 | 基于硅通孔的螺线管式差分电感 |
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CN201210463015.2A CN103824840B (zh) | 2012-11-16 | 2012-11-16 | 基于硅通孔的螺线管式差分电感 |
Publications (2)
Publication Number | Publication Date |
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CN103824840A CN103824840A (zh) | 2014-05-28 |
CN103824840B true CN103824840B (zh) | 2017-03-15 |
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CN201210463015.2A Expired - Fee Related CN103824840B (zh) | 2012-11-16 | 2012-11-16 | 基于硅通孔的螺线管式差分电感 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104409441B (zh) * | 2014-11-05 | 2017-02-22 | 杭州电子科技大学 | 运用多导体硅通孔的三维螺线管式电感与变压器结构 |
CN104517935A (zh) * | 2014-12-23 | 2015-04-15 | 阜阳师范学院 | 多路径螺旋电感 |
CN105226048B (zh) * | 2015-10-14 | 2017-11-28 | 西安理工大学 | 一种三维集成电感器及其制造方法 |
CN106449592B (zh) * | 2016-08-22 | 2018-12-07 | 杭州电子科技大学 | 一种高品质因数的差分电感器结构及其制作工艺 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6240622B1 (en) * | 1999-07-09 | 2001-06-05 | Micron Technology, Inc. | Integrated circuit inductors |
CN101866908A (zh) * | 2010-05-20 | 2010-10-20 | 复旦大学 | 一种用硅通孔互连形成的电感环 |
CN102800647A (zh) * | 2012-08-22 | 2012-11-28 | 上海宏力半导体制造有限公司 | 立体螺旋电感及其形成方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TW535176B (en) * | 2001-12-28 | 2003-06-01 | Winbond Electronics Corp | Inductor structure applied on a silicon substrate and the manufacturing method thereof |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6240622B1 (en) * | 1999-07-09 | 2001-06-05 | Micron Technology, Inc. | Integrated circuit inductors |
CN101866908A (zh) * | 2010-05-20 | 2010-10-20 | 复旦大学 | 一种用硅通孔互连形成的电感环 |
CN102800647A (zh) * | 2012-08-22 | 2012-11-28 | 上海宏力半导体制造有限公司 | 立体螺旋电感及其形成方法 |
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CN103824840A (zh) | 2014-05-28 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Tang Wanchun Inventor after: Chen Rushan Inventor after: Liu Sheng Inventor after: Shi Yongrong Inventor after: Wang Cheng Inventor after: Huang Cheng Inventor after: Shen Laiwei Inventor after: Zhu Jianping Inventor after: Wei Yifang Inventor before: Tang Wanchun Inventor before: Chen Rushan Inventor before: Liu Sheng Inventor before: Shi Yongrong Inventor before: Wang Cheng Inventor before: Huang Cheng Inventor before: Shen Laiwei Inventor before: Zhu Jianping |
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COR | Change of bibliographic data | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170315 Termination date: 20181116 |