CN1038129A - Apparatus for forming films by evaporation in vacuum - Google Patents
Apparatus for forming films by evaporation in vacuum Download PDFInfo
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- CN1038129A CN1038129A CN 89103427 CN89103427A CN1038129A CN 1038129 A CN1038129 A CN 1038129A CN 89103427 CN89103427 CN 89103427 CN 89103427 A CN89103427 A CN 89103427A CN 1038129 A CN1038129 A CN 1038129A
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- evaporator room
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Abstract
Apparatus for forming films by evaporation in vacuum contains a depositing materials evaporator room (1) that wherein installs depositing materials (10), is arranging heating unit (2) in the outside of this chamber.Collimation chamber (3) and evaporator room (1) communications and liaison, and their structure is identical.Each chamber in this two Room (1,3) is all making two holes (4,5) that are arranged on the same horizontal center line (8).Adorn a tube stub (6,7) in the hole therein, the tube stub (6) of evaporator room (1) is contained in the hole (5) of collimation chamber (3), and evaporator room (1) itself has a sealing element (9) that is contained in another hole, this chamber (1) (4).
Description
The present invention relates to coating is applied to the technology of product, the vacuum evaporating device that relates to film of the present invention or rather.
Film (main plating as gold and silver, platinum, palladium, etc. precious materials) vacuum evaporating device making when finely tuning quartz resonator as unicircuit and spraymetal and vacuum, can be used on electronic technology, radiotelegraphy and the acoustics.
At present, with the technology future maximum of thin-film deposition on the substrate of vertically laying.Because compare with the substrate that level is laid, because the contaminated degree of substrate surface of vertically laying is slight, therefore this technology can guarantee the output maximum of qualified product.The basic demand that film vacuum deposition device is proposed is: device simple in structure, should guarantee that simultaneously the thickness height of film is even, and the loss of material is slight.
The boat-shaped vacuum deposition device (GB, B, 1517085) of film is widely known by the people.In the boat body, place deposition material, directly connect the electric current that supplies heating and evaporation deposition materials by the boat body.Base plate alignment boat body is the level of state and lays, but will maintain a certain distance with the boat body.
This apparatus features is: owing to lack the directed steam flow of evaporating materials, the deposition material loss is big; And can only be the level of state when laying at substrate, this kind device just can be used for deposition film.
In order to form the directed steam flow of evaporating materials, need to adopt nozzle.Directed steam flow is to form in the vaporizer of the vacuum unit (Su, A, 397567) of dress well heater.In vaporizer, adorn a crucible that is filled with evaporating materials therein, and nozzle is contained in the top of crucible.With the medullary ray of base plate alignment nozzle, being the level of state is placed in a distance from the nozzle ejiction opening.
The vaporizer of knowing altogether of behaving has its characteristics equally, promptly exists critical layer by in the nozzle wall steam flow nearby.Most of steam flow when the width of this critical layer is actual employing deposition rate.Because the molecule that discharges from critical layer moves, thereby has increased the loss of depositing materials out of orderly.
Utilize evaporated but do not fall the solid phase accumulation of heat principle of the material on the substrate as yet, can significantly reduce the loss of depositing materials.This point is to realize in apparatus for forming films by evaporation in vacuum (us, A, 4700660).This device has the evaporator room of a depositing materials, and heating unit is being arranged in the outside of evaporator room, evaporator room and collimation chamber communications and liaison; The structure of two Room is identical, and two holes that are arranged on the same medullary ray are all arranged separately.
Depositing materials evaporator room and collimation chamber are one and have symmetric transverse planar pipe.The bottom of evaporator room places crucible, places depositing materials in crucible.Two Room can separate with the dividing plate with holes that is positioned on the symmetrical plane.
Consumption and add-on according to depositing materials are regularly transferred pipe.The method of transferring places crucible with that end of sedimentation depositing materials (not falling on the substrate), makes this material obtain utilizing in next spraying plating circulation.
But because the point of attachment of the pipe bottom of formation evaporator room and crucible is not tight, the depositing materials that dissolves may flow out; The only suitable substrate that level is laid of said apparatus can be done the spraying plating of film.In addition, among some the simplest device schemes, when pipe is made into an integral body, and there is one in the middle part during with evaporator room and the separated annular recess in collimation chamber; Then no matter which kind of state pipe is in, and always has the position condensation of material to occur in the annular recess zone.So, the depositing materials that has dissolved that collects in the annular recess will overflow to another chamber from a chamber.This phenomenon can cause jug-handled change occurring from the intensity distribution of the effusive steam steam flow in collimation chamber, so that reduces the degree of uniformity of sputtered film thickness comprehensively.
In addition, the most easy a kind of scheme of this device is to large-area even be the substrate that level lays and do not guarantee that also the height of sputtered film thickness is even, and be contained in the pipe with several different dividing plates, cause the complicated of apparatus structure again. for this reason
When the thicker film of spraying plating, the condensation of material floor in the collimation chamber is changing from the intensity distribution of effusive vapour stream wherein, thereby causes the inhomogeneous of sputtered film thickness.
Moreover depositing materials evaporates from crucible that a fixed difference difference is arranged usually and evaporator room simultaneously, causes the variation of spraying plating process medium velocity: the beginning material at full speed evaporates from the surface (evaporator room) of heating higherly; Material evaporates with lower speed from the surface (crucible) of heating lowlyer then.For equilibrium vaporization speed, will carry out the hot-fluid in the spraying plating process and adjust, this point is also causing the complicated of device.
As basis of the present invention, its task is the apparatus for forming films by evaporation in vacuum that construction one possesses following requirement.Be the mutual arrangement relation of evaporator room and collimation chamber and their structure should be able to guarantee to obtain film spraying plating thickness on the vertical substrate of laying homogeneity, and the depositing materials loss is slight.
The approach of finishing of this task is: contain the evaporator room of a depositing materials in apparatus for forming films by evaporation in vacuum, arranging heating unit in the outside of this evaporator room; Evaporator room and collimation chamber communications and liaison, their structure is identical, and two holes that are arranged on the same medullary ray are all arranged separately; According to the present invention, the medullary ray in hole is the level of state; Depositing materials evaporator room and collimation chamber are equipped with a tube stub that is arranged in the hole wherein separately; The tube stub of depositing materials evaporator room is arranged in another hole of collimation chamber, and the depositing materials evaporator room has the sealing element in its another hole of packing into simultaneously; And depositing materials directly is placed in the depositing materials evaporator room.
Suitable is that this device contains the former of the directed steam steam flow of making the axle shape.This axle is arranged along the medullary ray in depositing materials evaporator room hole, and is fixed on the sealing element of evaporator room.
Reasonably be, the free end of axle is arranged in the tube stub of depositing materials evaporator room, and reserve and the tube stub internal surface between the gap.
Useful is that the free end weighing apparatus of axle is connected to the tube stub internal surface of depositing materials evaporator room; Axle itself is shaped on a centre hole, and is shaped on the one group of hole that communicates with this hole in the side of axle.
Suitable equally is that this device has an auxiliary heating element of arranging along the periphery of collimation chamber tube stub.
Be that sealing element has been made an integral body with main heating unit very easily.
The substrate that the apparatus for forming films by evaporation in vacuum that is provided can spraying plating be vertically laid can increase the uniformity of spraying plating tissue in this way and increase the output of quality products.Simultaneously, under the low consumed situation of material, guarantee the high homogeneity of sputtered film thickness; This device simple in structure used reliable.
Below, describe the present invention in detail by quoting explanation and the accompanying drawing of realizing its organization plan:
Fig. 1, be according to apparatus for forming films by evaporation in vacuum overall scheme (longitudinal sectional drawing) shown in the present.
Fig. 2, be according to the present invention, attached synoptic diagram as shown in Figure 1 with directed vapour stream former (longitudinal sectional drawing).
Fig. 3, be according to the present invention, synoptic diagram as shown in Figure 2.There is shown directed vapour stream former another organization plan, be made into the sealing element and the auxiliary heater (longitudinal sectional drawing) of an integral body with well heater.
Apparatus for forming films by evaporation in vacuum contains a depositing materials evaporator room 1(Fig. 1), the outside of this chamber arranging heating unit 2; Evaporator room and collimation chamber 3 communications and liaison, their structure is identical.Be shaped on hole 4,5 in two Room 1,3, and tube stub 6,7 is housed.Hole 4,5 and tube stub 6,7 are arranged on the same horizontal center line 8, and the symmetrical center line of medullary ray 8 a little higher than two Room 1,3 in the such scheme of apparatus structure.For making two Room 1 and 3 communications and liaison, the tube stub 6 of evaporator room 1 inserts in the hole 5 of collimation chamber 3.Evaporator room 1 for example is equipped with the screw thread (not shown in FIG.) and is screwed into sealing element 9 in the hole 4.
Depositing materials 10 is directly put into evaporator room 1.The height that material is placed should not be higher than the lower rim in hole 4.
In evaporator room 1, utilize heating unit 2 to keep the vaporization temperature of depositing materials 10.And in collimation chamber 3, temperature is remained on below the fusing point of depositing materials 10.The purposes of collimation chamber 3 is to evaporating, but as yet not the depositing materials 10 by tube stub 7 carry out the solid phase accumulation of heat.
To need the substrate 11 centering adjustment lines 8 of spraying plating protective membrane to be placed on apart from the certain distance part of tube stub 7 ejiction openings.
The homogeny of two Room 1,3 allows regularly to exchange their position, makes repeated evaporation so that the condensed material 10 in the assurance collimation chamber 3 is returned.
The tube stub 6 of evaporator room 1 is arranged in the method in the hole 5 of collimation chamber 3, has got rid of steam and entered connection position between two Room 1,3.Because this point has prevented the molten mass of depositing materials 10 two Room 1,3 that bond, and got rid of the loss of depositing materials.
In the said structure scheme, sealing element 9 usefulness are fixed in the pin 12(Fig. 2 on the bearing 13) set, and bearing 13 is arranged in the vacuum chamber (not shown in FIG.).Press on sealing element 9 by means of the spring 14 that screw 15 is fixed on the bearing 13 two Room 1,3, and this method is guaranteeing the positiver sealing in hole 4, the stopping property when wherein being also included within sealing element 9 and evaporator room 1 thermal expansion.
On sealing element 9, fixing and making directed vapour stream former axle 16 shapes, that arrange along medullary ray 8.The free end of axle 16 is arranged in the tube stub 6 and reserves gap 17.The vapour stream of discharging along annular gap 1 is guaranteeing that the thickness of the film of formation on substrate 11 has fabulous homogeneity.That works makes another kind of shape just as tube stub 6 for the end of axle 16, cone-shaped (not shown in FIG.) for example, and this method can guarantee that the thickness of the film on quite large-sized substrate 11 has homogeneity.
Two Room 1,3, sealing element 9 and axle 16 can be made with graphite, perhaps make with the refractory metal as molybdenum.Heating unit 2 also can be made with the refractory metal plate, and is connected in the electric current service wire (not shown in FIG.) of device.
In another apparatus structure scheme shown in Fig. 3, the free end of axle 16 is connected in the internal surface of the tube stub 6 of evaporator room 1.In the case, be shaped on a centre hole 18 and one group of hole 19 on axle 16 sides, that communicate with this hole on the axle 16.
In the said structure scheme of device, second heating unit 20 examining empty to arrange along tube stub 7 peripheries of collimation chamber 3.Electric current service wire (not shown in FIG.) be made and be connected in to this element also can with refractory metal.Heating unit 20 is guaranteeing that temperature with tube stub 7 regularly is raised to and is being higher than depositing materials 10(Fig. 1 in the spraying plating process) fusing point, thereby make depositing materials can flow to collimation chamber 3.So just, can be implemented in the thicker film of spraying plating on the substrate 11, and not reduce its quality.
Heating unit 2(Fig. 3 in such scheme) has been made into an integral body with sealing element 9, guaranteed that with this method element 9 obtains safe heating.The temperature of element 9 should be not less than the temperature in the evaporator room 1.
The film coating apparatus carries out work as follows:
With the depositing materials 10 evaporator room 1(Fig. 1 that packs into).Lay after the whole set in substrate 11 and the vacuum chamber (not shown), extract the air in the vacuum chamber out, make it to reach operating pressure, connect the power supply of heating unit 2 then.In the case, the temperature in the evaporator room 1 is raise, the material of putting well in the evaporator room 10 is heated to the necessary temperature of evaporation.The steam that produces is discharged from tube stub 6, and wherein a part is condensate on the internal surface that collimates chamber 3 by tube stub 7 and another part of being deposited on the substrate 11.
After the film spraying plating of desired thickness is to substrate 11, cut off the power supply of heating unit.Then, install depositing materials 10 additional in the chamber 3 and exchange the position of two Room 1,3 to collimation as required.In this way, being deposited in material 10 on collimation chamber 3 walls resembles and obtains utilizing the material that reloads in next spraying plating circulation.
By pin 12 and spring 14 sealing element 9 and two Room 1,3 are contained in bearing 13(Fig. 2) on device carry out work in a similar fashion.This appliance ensure the higher homogeneity of film thickness, and this is because 17 that discharge and have the cyclic vapour stream from the gap, has formed a succession of vapour stream in by its scope by collimation chamber 3.The steam flow of this vapour stream peripheral part is condensate on the wall of chamber 3, and the steam flow of middle body arrives on the substrate 11, and forms the uniform film of thickness thereon.This device cored bar 16, an end of axle are arranged in the tube stub 6 and reserve gap 17; When this device exceeds 0.4 when the diameter of substrate and ratio to the distance of tube stub 6, just be applicable to the large-sized substrate of spraying plating.
Carry out work in a similar fashion at the device shown in Fig. 3.This apparatus features is: evaporating materials comes out from evaporator room 1, and the medium pore 18 that passes in axle 16 lateral holes 19 and the free end enters collimation chamber 3.After coming out in hole 18, just form the directed vapour stream that scatters, can guarantee substrate 11 spraying plating protective membranes to different size by the device that is provided like this.
When to the thicker protective membrane of substrate 11 spraying platings, in the spraying plating process, regularly connect the power supply of heating unit 20, make the depositing materials fusion and the overflow that are deposited in the tube stub 7 advance to collimate in the chamber 3.Prevent to cause to reduce the problem of dwindling of tube stub 7 internal diameters of deposition rate and sputtered film thickness evenness in this way.
By the apparatus for forming films by evaporation in vacuum that provides, can guarantee in this way the possibility to the substrate sputtered film of vertically laying; And in the low consumed situation of material, reach the high homogeneity of film thickness.
Film (mainly plating such as precious materials such as Au Ag Pt Pds) vacuum evaporating device when for example making integrated circuit, metalling and vacuum fine setting quartz resonator, can be used on electronic technology, radiotechnics and the acoustics.
Claims (7)
1, apparatus for forming films by evaporation in vacuum contains the evaporator room (1) of a depositing materials, arranging heating unit (2) in the outside of evaporator room, evaporator room and collimation chamber (3) communications and liaison, their structure is identical, two holes (4 that are arranged on the same medullary ray (8) are all arranged separately, 5), the characteristics of evaporator room are: (hole 4,5) medullary ray (8) is the level of state, depositing materials evaporator room (1) and collimation chamber (3) all have the wherein tube stub (6 in a hole of packing into separately, 7), the tube stub (6) of depositing materials evaporator room (1) is packed into and is collimated in another hole (5) of chamber (3), depositing materials evaporator room (1) also has the sealing element (9) in its another hole (4) of packing into, and depositing materials (10) is directly put into depositing materials evaporator room (1).
2, according to claim 1, this apparatus features is: contain a directed vapour stream former that is made into axle (16) shape, axle (16) is arranged and is fixed on the sealing element (9) of evaporator room along the medullary ray (8) in the hole (4) of depositing materials evaporator room (1).
3, according to this apparatus features of claim 2 be: the free end of axle (16) is arranged in the tube stub (6) of depositing materials evaporator room (1), and reserve and the tube stub internal surface between gap (17).
4, according to claim 2, this apparatus features is: the free end of axle (16) is connected tube stub (6) internal surface in depositing materials evaporator room (1), a centre hole (18) is arranged in free end, and be shaped on the one group of hole (19) that communicates with this hole in the side of axle (16).
5, according to claim 1 or 2 or 3 or 4, this apparatus features is: the periphery along the tube stub (7) that collimates chamber (3) is arranged an auxiliary heating element (20).
6, according to claim 4, this apparatus features is: sealing element (9) has been made into an integral body with main heating unit (2).
7, according to claim 5, this apparatus features is: sealing element (9) has been made into an integral body with main heating unit (2).
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU4434256 | 1988-05-31 | ||
| SU884434256A SU1678899A1 (en) | 1988-05-31 | 1988-05-31 | Device for applying coats in vacuum |
| SU4601811 | 1988-11-15 | ||
| SU4601810 | 1988-11-15 | ||
| SU4601808 | 1988-11-15 | ||
| SU4601812 | 1988-11-15 | ||
| SU4601810 | 1988-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1038129A true CN1038129A (en) | 1989-12-20 |
Family
ID=26666172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 89103427 Pending CN1038129A (en) | 1988-05-31 | 1989-05-25 | Apparatus for forming films by evaporation in vacuum |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1038129A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1046971C (en) * | 1994-09-28 | 1999-12-01 | 先进陶瓷公司 | Evaporator having multiple coating |
| CN1047209C (en) * | 1994-09-28 | 1999-12-08 | 先进陶瓷公司 | High density flash evaporator |
| CN101845610A (en) * | 2010-06-07 | 2010-09-29 | 崔铮 | Continuous vertical hot evaporation metal film coating method |
| CN109594343A (en) * | 2017-09-30 | 2019-04-09 | 翰诠特种纺织品（平湖）有限公司 | A kind of high air permeability non-woven cloth and the production technology for producing the non-woven fabrics |
-
1989
- 1989-05-25 CN CN 89103427 patent/CN1038129A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1046971C (en) * | 1994-09-28 | 1999-12-01 | 先进陶瓷公司 | Evaporator having multiple coating |
| CN1047209C (en) * | 1994-09-28 | 1999-12-08 | 先进陶瓷公司 | High density flash evaporator |
| CN101845610A (en) * | 2010-06-07 | 2010-09-29 | 崔铮 | Continuous vertical hot evaporation metal film coating method |
| CN101845610B (en) * | 2010-06-07 | 2011-12-07 | 崔铮 | Continuous vertical hot evaporation metal film coating method |
| CN109594343A (en) * | 2017-09-30 | 2019-04-09 | 翰诠特种纺织品（平湖）有限公司 | A kind of high air permeability non-woven cloth and the production technology for producing the non-woven fabrics |
| CN109594343B (en) * | 2017-09-30 | 2021-10-08 | 翰诠特种纺织品（平湖）有限公司 | High-air-permeability non-woven fabric and production process for producing same |
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