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CN103806345B - A polyimide insulating board and preparation method - Google Patents

A polyimide insulating board and preparation method Download PDF

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Publication number
CN103806345B
CN103806345B CN 201410052356 CN201410052356A CN103806345B CN 103806345 B CN103806345 B CN 103806345B CN 201410052356 CN201410052356 CN 201410052356 CN 201410052356 A CN201410052356 A CN 201410052356A CN 103806345 B CN103806345 B CN 103806345B
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CN 201410052356
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CN103806345A (en )
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谭洪艳
丁孟贤
刘斌
吕晓义
张万彬
邵会千
韩京成
于暴
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长春高琦聚酰亚胺材料有限公司
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Abstract

<b>本发明公开了一种聚酰亚胺绝缘纸板及其制备方法,按以下方法制备而成:1)制备半成品聚酰亚胺纸;2)将多层半成品聚酰亚胺纸放入模压机中,控制模压机的压力为10Mpa,温度为150℃,热压40min后,取出半成品纸板;然后放气</b><b>3min</b><b>,再次将半成品纸板放入模压机中,控制模压机压力为15Mpa,温度300℃,热压</b><b>1h</b><b>后,取出得到聚酰亚胺绝缘纸板。 <B> The present invention discloses a method of preparing an insulating board and a polyimide, prepared by the following methods: 1) Preparation of polyimide semi-finished sheet; 2) semi polyimide multilayer paper into molding machine, the molding machine control pressure is 10Mpa, a temperature of 150 deg.] C, after thermocompression 40min, remove the semi-finished board; then deflated </ b> <b> 3min </ b> <b>, again put the semi-finished cardboard into the molding machine, the molding machine control pressure is 15Mpa, temperature 300 ℃, thermocompression </ b> <b> 1h </ b> <b>, remove the polyimide insulating board. 本发明的生产工艺不使用胶黏剂,减少了产品的二次污染,节约能源。 Production process of the present invention does not use adhesives, reduce the secondary product contamination, energy conservation. 生产的聚酰亚胺绝缘纸板具有耐高温、吸湿性小、耐电压性能高的特点,耐温等级高,可耐300℃以上高温。 Production of the polyimide insulating board having a high temperature, low moisture absorption, high withstand voltage performance characteristics, high temperature levels, can withstand a high temperature above 300 ℃. </b> </ B>

Description

一种聚酰亚胺绝缘纸板及其制备方法 A polyimide insulating board and preparation method

技术领域 FIELD

[0001]本发明涉及一种聚酰亚胺绝缘纸板及其制备方法,属于造纸工艺和绝缘材料制造领域。 [0001] The present invention relates to a method of preparing an insulating board and polyimide insulation material belonging to the papermaking process and manufacturing.

背景技术 Background technique

[0002]绝缘纸板主要是取代层压木和层合纸板用于变压器做绝缘件。 [0002] pressboard mainly substituted laminated wood board and laminated to make a transformer for insulation. 目前变压器用于制作绝缘结构件的层压木和层合纸板采用木板或纸板粘合、干燥加工而成,这种加工方法复杂、生产效率低,纸板在运输、保管、加工过程中容易产生二次污染。 Current transformers for the production of laminated wood insulating structural member and the laminated board using bonding wood or cardboard, drying processing, this method is complicated processing, production efficiency is low, easy to produce two cardboard in the transport, storage, processing secondary pollution.

[0003] 公开号为CN101787665A的发明专利公开了一种超厚绝缘纸板的生产工艺。 [0003] Publication No. CN101787665A the invention discloses a thick insulating board production process. 该工艺是:将木浆经过净化预处理,再经水力碎浆机碎解后的浆浓缩至浓度4.2-4.8%进入浆池,通过浆栗把浆送至磨浆机磨浆,浆的叩解度30-34° SR,湿重ll-15g,进成浆池,用浆栗把浆送入高效低浓除渣器除渣后进入稳浆箱,浆栗将浆送入湿纸坯成型器,做好的湿纸坯送入组坯机进行脱水,水分达到40-50%时取出湿纸坯送入热压机,干燥湿度为120-130°C,干燥时间视厚度而定,纸板含水量为4-6%时,取出半成品纸板放入恒温恒湿室内平衡48小时以上,经过平衡的纸板送入截边机切边,纸板经检验合格后,进行真空包装,入库。 The process is: After purification pretreated wood pulp, pulp hydrapulper and then the broken solution after concentration to a concentration of 4.2-4.8% into the slurry tank, the slurry supplied by the slurry Li refining refiner, beating pulp degree of 30-34 ° SR, wet weight ll-15g, into the slurry tank, the slurry is pumped with a slurry Li efficiency and low density cleaner into the slag stable headbox, the pulp slurry is pumped Li wet paper blank former , do the wet paper stock fed blank set dewatering machine, remove the wet paper stock fed into a hot press when 40-50% moisture, humidity drying 120-130 ° C, the drying time depending on thickness, cardboard containing 4-6% of the amount of water removed into the semi-finished cardboard balance hygrostat chamber more than 48 hours, cut into the cardboard equilibrated edge trimming machine, after passing inspection cardboard, vacuum packaging, storage. 虽然克服了层压木和层合纸板的缺点,但是该方法中生产的超厚绝缘纸板并不能做到耐高温,而且纸板性能易受天气条件影响,存在吸湿性大的缺点。 Although overcome the shortcomings of laminated wood and cardboard together layers, but the method in the production of thick cardboard and can not do high-temperature insulation, cardboard and performance is susceptible to weather conditions, as there is a large hygroscopic shortcomings.

发明内容 SUMMARY

[0004]为克服现有技术的缺陷,本发明的目的在于提供一种聚酰亚胺绝缘纸板,该聚酰亚胺纸板具有耐高温、吸湿性小、耐电压性能高的特点。 [0004] To overcome the disadvantages of the prior art, an object of the present invention is to provide a polyimide insulating board, the board having a polyimide high temperature, low moisture absorption, high withstand voltage performance characteristics.

[0005]本发明的另一目的在于提供一种聚酰亚胺绝缘纸板的制备方法,该工艺不使用胶黏剂,减少了产品的二次污染,节约能源,同时由于聚酰亚胺绝缘纸板纤维的纯净度高,没有胶粘物,比传统的层合纸板介质损耗小,可延长变压器的使用寿命。 [0005] Another object of the present invention to provide a method for preparing a polyimide insulating board, the process does not use adhesives, reduce the secondary product contamination, energy conservation, and because the polyimide insulating board fibers of high purity, without glue, a small dielectric loss than conventional paperboard laminate, extend the life of the transformer. 生产的聚酰亚胺绝缘纸板具有耐尚温、吸湿性小、耐电压性能尚的特点,耐温等级尚,可耐300°C以上尚温。 Production resistant polyimide insulating board still warm, moisture absorption, yet withstand voltage performance characteristics, temperature levels still, resistant to 300 ° C above still warm.

[0006]为实现上述目的本发明所采用的技术方案如下: [0006] To achieve the above object of the present invention employed the following technical solution:

[0007] —种聚酰亚胺绝缘纸板,其特征在于,由多层半成品聚酰亚胺纸进行层合制备而成。 [0007] - species polyimide insulating board, characterized in that the poly-imide multilayer semifinished sheet prepared by laminating.

[0008] —种聚酰亚胺绝缘纸板的制备方法,按以下方法制备而成: [0008] - preparation of polyimides pressboard, prepared by the following methods:

[0009] I)制备半成品聚酰亚胺纸; [0009] I) Preparation of polyimide semi-finished sheet;

[0010] 2)将多层半成品聚酰亚胺纸进行层合,制备得到聚酰亚胺纸板。 [0010] 2) semi polyimide multilayer laminating paper, cardboard polyimide prepared.

[0011]作为本发明的一种优选的方案,在步骤I)中,所述半成品聚酰亚胺纸是以聚酰胺酸短切纤维、聚酰亚胺纤维中的一种或两种混合为原料,经过抄造得到。 [0011] As a preferred embodiment of the present invention, in step I), the semifinished product is a polyamic acid, polyimide paper chopped fibers, polyimide fibers or as two hybrid raw material, papermaking get.

[0012]作为本发明的一种优选的方案,在步骤I)中,所述半成品聚酰亚胺纸按以下步骤制备而成: [0012] As a preferred embodiment of the present invention, in step I), the semi-finished polyimide sheet prepared by the following steps:

[0013] a)以聚酰胺酸短切纤维、聚酰亚胺纤维中的一种或两种混合为原料,将原料分散于水中,得到浆液; [0013] a) a polyamide acid chopped fibers, polyimide fibers mixed into one or both of raw material, the raw material is dispersed in water to obtain a slurry;

[0014] b)将步骤a)得到的浆液进行抄纸、压榨和干燥处理后,得到聚酰胺酸纤维纸; After [0014] b) step a) obtained in papermaking slurry, pressing and drying process, to give a polyamic acid fiber paper;

[0015] c)将步骤b)得到的聚酰胺酸纤维纸进行酰亚胺化处理,得到半成品聚酰亚胺纸。 [0015] c) step b) fiber paper obtained polyamic acid is imidized to give semifinished polyimide sheet.

[0016]作为本发明的一种优选的方案,在步骤c)中,所述酰亚胺化处理的温度为100°C_200。 [0016] As a preferred embodiment of the present invention, in step c), the imidization temperature treatment is 100 ° C_200. . .

[0017]详细情况可参照中国申请号为“201210334745.2”的发明专利所公开的聚酰亚胺纤维纸的制备方法。 [0017] The details may refer to China application No. preparing a polyimide fiber paper "201210334745.2" as disclosed in the patent.

[0018]作为本发明的一种优选的方案,在步骤2)中,在对聚酰亚胺半成品纸进行层合的过程中,不加入任何胶黏剂。 [0018] As a preferred embodiment of the present invention, in the step 2), the polyimide in the process of laminating the semi-finished product in the paper, without the addition of any adhesive.

[0019]作为本发明的一种优选的方案,在步骤2)中,对聚酰亚胺半成品纸进行层合的过程中,需要进行两次层压,具体如下:将多层半成品聚酰亚胺纸放入模压机中,控制模压机的压力为5-25Mpa,温度为100-400°C,热压30min-240min后,取出半成品纸板;然后放气,待气体完全排出后,再次将半成品纸板放入模压机中,控制模压机压力为5_25Mpa,温度100-400°C,热压30min-240min后,取出得到聚酰亚胺绝缘纸板,放置在恒温恒湿库内,保存24h以上,经过平衡处理的纸板,经检验合格后进行真空包装,入库。 [0019] As a preferred embodiment of the present invention, in the step 2), the process for the polyimide sheet laminated semi-finished product, the need for laminating two, as follows: The polyimide multilayer semifinished amine paper in the press machine, the molding machine control 5-25Mpa pressure, a temperature of 100-400 ° C, after thermocompression 30min-240min, taken semi cardboard; then deflated, until the gas is completely discharged, again semifinished cardboard into the molding machine, the molding machine control pressure 5_25Mpa, a temperature of 100-400 ° C, after thermocompression 30min-240min, polyimide insulating board was taken out, placed in a constant temperature and humidity compartment, to save more than 24h, after cardboard balance processing, after passing inspection vacuum packaging, warehousing.

[0020]本发明之所以将模压机的压力控制在10_25Mpa,是因为模压机压力过低,纸页之间层压强度不够,纸板层合不好;压力过高,易压溃纸页中的纤维,影响纸板强度。 [0020] The reason why the present invention is a pressure molding machine controlled 10_25Mpa, because the low pressure molding machine, not the lamination strength between the paper, laminated paperboard bad; high pressure, easy to crush the paper sheet fibers, impact strength paperboard. 本发明之所以将模压机的温度控制在100-400°C,是因为温度过低,纸页之间不能进行粘结,温度过高,纸板外观会受到影响。 The reason why the present invention, the temperature of the molding machine is controlled 100-400 ° C, because the temperature is too low for the adhesive between the sheet temperature is too high, the appearance of the cardboard can be affected. 本发明的生产工艺采用两次层压,这样做一方面可以采用两段加温的方式,增加纸板内部的匀度;另一方面,避免单次加温时间过长,半成品聚酰亚胺纸出现部分降解。 Production process of the invention is the use of two laminated, this aspect of the two heating methods can be used to increase the evenness of the inner cardboard; on the other hand, to avoid a single heating time is too long, semi polyimide sheet partial degradation occurs.

[0021 ]作为本发明的一种优选的方案,所述聚酰亚胺绝缘纸板的厚度为2mm-20mm。 [0021] As a preferred embodiment of the present invention, the thickness of the polyimide insulating board for 2mm-20mm.

[0022]本发明的有益效果在于: [0022] Advantageous effects of the present invention:

[0023] 1、本发明聚酰亚胺纸板是由聚酰亚胺纸直接层合而成,使得聚酰亚胺纸板具有耐高温、吸湿性小、耐电压性能高等特点,从而克服了目前市场上绝缘板存在耐温等级低、吸湿性大等缺点。 [0023] 1, the present invention is a polyimide board made of a polyimide bonding layer directly to paper, paperboard such polyimide high temperature, moisture absorption, and high withstand voltage performance, to overcome the current market there is a low temperature level, a large hygroscopicity disadvantage insulating plate.

[0024] 2、本发明的生产工艺不使用胶黏剂,减少了产品的二次污染,节约能源。 [0024] 2, the production process of the present invention does not use adhesives, reduce the secondary product contamination, energy conservation. 生产的聚酰亚胺绝缘纸板纤维的纯净度高,没有胶粘物,比传统的层合纸板介质损耗小,可延长变压器的使用寿命。 Production of high purity polyimide insulating fiber board, without glue, a small dielectric loss than conventional paperboard laminate, extend the life of the transformer. 生产的聚酰亚胺绝缘纸板,耐温等级高,可耐300°C以上高温。 Production of the polyimide insulating board, high temperature levels, can withstand high temperatures 300 ° C above. 本发明所述的聚酰亚胺纤维及半成品聚酰亚胺纸均为我公司自主生产,避免了原料封锁带给我们的影响。 Polyimide fibers according to the present invention, a polyimide sheet and semi are independent production company, brings us to avoid the blockade of the raw material influence. 聚酰亚胺绝缘纸板的工艺技术含量高,会为企业带来经济效益和品牌效益。 High technology content of the polyimide insulation board, will bring economic benefits for businesses and brands.

[0025] 3、发明人经过大量的试验后,发现将模压机的压力控制在10_25Mpa时,能够保证纸板具有最佳的抗张强度,当将模压机的温度控制在100-400°C,即能保证纸页之间进行良好的粘结,又能保证纸板外观不受影响。 [0025] 3, the inventors, after a lot of tests, found that a pressure molding machine controlled at 10_25Mpa, to ensure that the board has the best tensile strength, when the temperature of the molding machine is controlled to 100-400 ° C, i.e. performed to ensure good adhesion between the sheets, but also ensures that the appearance of the cardboard is not affected. 本发明的生产工艺采用两次层压,这样做一方面可以采用两段加温的方式,增加纸板内部的匀度;另一方面,避免单次加温时间过长,半成品聚酰亚胺纸出现部分降解。 Production process of the invention is the use of two laminated, this aspect of the two heating methods can be used to increase the evenness of the inner cardboard; on the other hand, to avoid a single heating time is too long, semi polyimide sheet partial degradation occurs.

[0026]下面结合具体的实施方式对本发明作进一步详细说明。 [0026] Next, with reference to specific embodiments of the present invention is described in further detail.

附图说明 BRIEF DESCRIPTION

[0027]图1为本发明的工艺流程图。 [0027] FIG. 1 is a process flow diagram of the present invention.

具体实施方式 detailed description

[0028]下面,结合具体实施方式,对本发明做进一步描述: [0028] Next, with reference to specific embodiments, the present invention will be further described:

[0029] 实施例1: [0029] Example 1:

[0030]如图1所示,一种聚酰亚胺绝缘纸板的制备方法,按以下方法制备而成: [0030] As shown, a method of preparing a polyimide insulating board, was prepared from 1 by the following method:

[0031] I)所述半成品聚酰亚胺纸按以下步骤制备而成: [0031] I) the semifinished polyimide sheet prepared by the following steps:

[0032] a)以聚酰胺酸短切纤维为原料,将原料分散于水中,得到浆液; [0032] a) chopped fibers of polyamide acid as a raw material, the raw material is dispersed in water to obtain a slurry;

[0033] b)将步骤a)得到的浆液进行抄纸、压榨和干燥处理后,得到聚酰胺酸纤维纸; After [0033] b) step a) obtained in papermaking slurry, pressing and drying process, to give a polyamic acid fiber paper;

[0034] c)将步骤b)得到的聚酰胺酸纤维纸进行酰亚胺化处理,得到半成品聚酰亚胺纸。 [0034] c) step b) fiber paper obtained polyamic acid is imidized to give semifinished polyimide sheet. 所述酰亚胺化处理的温度为100°c。 The imidization temperature treatment of 100 ° c.

[0035] 2)将多层半成品聚酰亚胺纸进行层合,制备得到聚酰亚胺纸板;对聚酰亚胺半成品纸进行层合的过程中,需要进行两次层压,具体如下:将多层半成品聚酰亚胺纸放入模压机中,控制模压机的压力为lOMpa,温度为150°C,热压40min后,取出半成品纸板;然后放气3min,待气体完全排出后,再次将半成品纸板放入模压机中,控制模压机压力为15Mpa,温度300°C,热压Ih后,取出得到聚酰亚胺绝缘纸板;放置在恒温恒湿库内,保存24h,经过平衡处理的纸板,经检验合格后进行真空包装,入库。 [0035] 2) semi polyimide multilayer laminating paper, paperboard prepared polyimide; semi-finished product during the polyimide sheet laminating, the laminating is required twice, as follows: the polyimide multilayer semifinished paper into the molding machine, the molding machine control Lompa pressure, a temperature of 150 ° C, after thermocompression 40min, remove the semi-finished board; then deflated 3min, until the gas is completely discharged, again molding into semi-finished cardboard machine, the molding machine control pressure is 15Mpa, temperature 300 ° C, after Ih is hot, remove the polyimide insulating board; placed in the constant temperature and humidity compartment, save 24h, after the balancing process cardboard, after passing inspection vacuum packaging, warehousing.

[0036]最终得到厚度为5mm的纸板。 [0036] The finally obtained a thickness of 5mm cardboard.

[0037]在步骤2)中,在对聚酰亚胺半成品纸进行层合的过程中,不加入任何胶黏剂。 [0037] In step 2), the polyimide in the process of laminating the semi-finished product in the paper, without the addition of any adhesive.

[0038] 经检验,该纸板克重500g/m2,厚度2mm,纵向抗张强度400N/mm,横向抗张强度3531'1/1]11]1;空气中介电强度201^/1]11]1,绝缘油中介电强度471^/臟;极限氧指数38%;300°(3纵向热收缩率0.1%,300°C横向热收缩率0.15%,热分解温度570°C ;吸水率为0.02%。 [0038] Upon examination, the paperboard grammage 500g / m2, a thickness of 2mm, the longitudinal tensile strength of 400N / mm, a transverse tensile strength 3531'1 / 1] 11] 1; ^ air of dielectric strength of 201/1] 11] 1, the dielectric strength of the insulating oil 471 ^ / dirty; Limiting oxygen index 38%; 300 ° (3 longitudinal thermal shrinkage rate of 0.1%, 300 ° C heat shrinkage rate of 0.15% lateral, thermal decomposition temperature of 570 ° C; water absorption of 0.02 %.

[0039] 实施例2: [0039] Example 2:

[0040]本实施例的特点是: [0040] The feature of this embodiment is that:

[0041]在步骤I)中,用聚酰亚胺纤维与聚酰胺酸短切纤维按照1:1的比例混合,抄造聚酰亚胺纸,聚酰亚胺纸的处理温度为150°C。 [0041] In step I) in accordance with a polyamic acid and polyimide fiber chopped strands: 1 ratio, papermaking polyimide paper, the treatment temperature of the polyimide sheet is 150 ° C.

[0042]在步骤2)中,将50张聚酰亚胺纸放入模压机内,压力为lOMpa,温度200°C,热压lOOmin,放气5min。 [0042] In step 2), the polyimide sheet 50 into the molding machine, Lompa pressure, temperature of 200 ° C, hot lOOmin, deflated 5min. 再次将半成品纸板放入模压机内,压力20Mpa,温度350°C,热压lh。 The semi-finished cardboard again into the molding machine, a pressure 20Mpa, a temperature of 350 ° C, hot lh. 取出半成品纸板放入恒温恒湿库内30h。 Remove the cardboard into the constant temperature and humidity compartment semifinished 30h.

[0043]生产得到厚度为1mm的纸板。 [0043] Production of paperboard having a thickness of 1mm.

[0044]其他与具体实施例1相同。 [0044] Other specific embodiments the same as in Example 1.

[0045] 经检验,该纸板克重100(^/1112,厚度51111]1,纵向抗张强度62謂/1111]1,横向抗张强度4341'1/1111]1;空气中介电强度351^/1]11]1,绝缘油中介电强度681^/1]11]1;极限氧指数38%;300°(3纵向热收缩率0.1%,300°C横向热收缩率0.15%,热分解温度570°C ;吸水率为0.02%。 [0045] Upon examination, the paperboard grammage 100 (^ / 1112, a thickness 51111] 1, that longitudinal tensile strength 62/1111] 1, the transverse tensile strength 4341'1 / 1111] 1; 351 ^ air of dielectric strength / 1] 11] 1, the dielectric strength of the insulating oil 681 ^ / 1] 11] 1; Limiting oxygen index 38%; 300 ° (3 longitudinal thermal shrinkage rate of 0.1%, 300 ° C heat shrinkage rate of 0.15% lateral, thermal decomposition a temperature of 570 ° C; water absorption of 0.02%.

[0046] 实施例3: [0046] Example 3:

[0047]本实施例的特点是: Features [0047] The present embodiment is:

[0048]在步骤I)中,用聚酰亚胺纤维与聚酰胺酸短切纤维按照4:1的比例混合,抄造聚酰亚胺纸,聚酰亚胺纸的处理温度为100°c。 [0048] In step I), polyimide fiber 4 according to the polyamic acid chopped fibers: 1 ratio, papermaking polyimide paper, polyimide paper treatment temperature is 100 ° c.

[0049]在步骤2)中,将80张聚酰亚胺纸放入模压机内,压力为15Mpa,温度200°C,热压lOOmin,放气5min。 [0049] In step 2), the polyimide sheet 80 into the molding machine, a pressure of 15Mpa, temperature of 200 ° C, hot lOOmin, deflated 5min. 再次将半成品纸板放入模压机内,压力25Mpa,温度400°C,热压2h。 The semi-finished cardboard again into the molding machine, a pressure 25Mpa, temperature of 400 ° C, hot 2h. 取出半成品纸板放入恒温恒湿库内48h。 Remove the cardboard into the constant temperature and humidity compartment semifinished 48h.

[0050]生产得到厚度为20mm的纸板。 [0050] Production of paperboard having a thickness of 20mm.

[0051 ]其他与具体实施例1相同。 [0051] Other specific embodiments the same as in Example 1.

[0052] 经检验,该纸板克重1300g/m2,厚度8_,纵向抗张强度811N/mm,横向抗张强度6411'1/1]11]1;空气中介电强度461^/1]11]1,绝缘油中介电强度801^/臟;极限氧指数38%;300°(3纵向热收缩率0.1%,300°C横向热收缩率0.15%,热分解温度570°C ;吸水率为0.02%。 [0052] Upon examination, the paperboard grammage 1300g / m2, thickness 8_, the longitudinal tensile strength of 811N / mm, a transverse tensile strength 6411'1 / 1] 11] 1; ^ air of dielectric strength of 461/1] 11] 1, the dielectric strength of the insulating oil 801 ^ / dirty; Limiting oxygen index 38%; 300 ° (3 longitudinal thermal shrinkage rate of 0.1%, 300 ° C heat shrinkage rate of 0.15% lateral, thermal decomposition temperature of 570 ° C; water absorption of 0.02 %.

[0053]对于本领域的技术人员来说,可根据以上描述的技术方案以及构思,做出其它各种相应的改变以及变形,而所有的这些改变以及变形都应该属于本发明权利要求的保护范围之内。 [0053] to those skilled in the art, the technical solution according to the above described and contemplated, that various other changes and modifications appropriate, and all such changes and modifications should fall into the scope of the claims of the invention within.

Claims (1)

  1. 1.一种聚酰亚胺绝缘纸板的制备方法,其特征在于,按以下方法制备而成: 1)制备半成品聚酰亚胺纸; 2)将多层半成品聚酰亚胺纸进行层合,制备得到聚酰亚胺纸板; 所述步骤I)中,所述半成品聚酰亚胺纸按以下步骤制备而成: a)以聚酰亚胺纤维与聚酰胺酸短切纤维按照4:1的比例混合为原料,将原料分散于水中,得到浆液; b)将步骤a)得到的浆液进行抄纸、压榨和干燥处理后,得到聚酰胺酸纤维纸; c)将步骤b)得到的聚酰胺酸纤维纸进行酰亚胺化处理,所述酰亚胺化处理的温度为100°C,得到半成品聚酰亚胺纸; 所述步骤2)中,在对聚酰亚胺半成品纸进行层合的过程中,不加入任何胶黏剂; 所述步骤2)中,对聚酰亚胺半成品纸进行层合的过程中,需要进行两次层压,具体如下:将80张聚酰亚胺纸放入模压机内,压力为15MPa,温度200°C,热压lOOmin,放气5min, 1. A method of preparing a polyimide insulating board, characterized by the following method was prepared from: 1) Preparation of polyimide semi-finished sheet; 2) semi polyimide multilayer laminating paper, preparation of polyimide paperboard; step I), the semi-finished product prepared from the polyimide sheet by the steps of: a) a polyamic acid and polyimide fiber chopped fiber according to 4: 1 mixing ratio of the raw material, the raw material is dispersed in water to obtain a slurry; b) after step a) obtained in papermaking slurry, pressing and drying process, to give a polyamic acid fiber paper; c) step b) polyamides obtained acid fiber paper imidization process, the process of imidization temperature 100 ° C, to give semifinished polyimide sheet; step 2), the semi-finished product in the polyimide paper laminating process, without the addition of any adhesive; in the step 2), the process for the polyimide sheet laminated semi-finished product, the need for laminating two, as follows: the polyimide sheet 80 into the molding machine, a pressure of 15MPa, temperature of 200 ° C, hot lOOmin, deflated 5min, 次将半成品纸板放入模压机内,压力25MPa,温度400°C,热压2h;取出半成品纸板放入恒温恒湿库内48h; 所述聚酰亚胺绝缘纸板的厚度为20mm。 The semi-finished cardboard into the secondary molding machine, pressure 25MPa, temperature of 400 ° C, hot 2H; constant temperature and humidity taken into the interior of semi-finished cardboard 48h; the thickness of the polyimide insulating board is 20mm.
CN 201410052356 2014-02-14 2014-02-14 A polyimide insulating board and preparation method CN103806345B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3756908A (en) * 1971-02-26 1973-09-04 Du Pont Synthetic paper structures of aromatic polyamides
US4060451A (en) * 1972-03-31 1977-11-29 Teijin Limited Polyamide-imide and mica pulp particles and paper-like sheets made therefrom
JPS60206644A (en) * 1984-03-30 1985-10-18 Akebono Brake Ind Composite material
JP3012365B2 (en) * 1990-06-14 2000-02-21 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Aramid paper containing aramid paper pulp
US6294049B1 (en) * 1992-06-09 2001-09-25 Unitika Ltd. Polyimide precursor fibrid, polyimide paper, polyimide composite paper and polyimide composite board obtained therefrom, and process for producing the fibrid and the paper products

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3756908A (en) * 1971-02-26 1973-09-04 Du Pont Synthetic paper structures of aromatic polyamides
US4060451A (en) * 1972-03-31 1977-11-29 Teijin Limited Polyamide-imide and mica pulp particles and paper-like sheets made therefrom
JPS60206644A (en) * 1984-03-30 1985-10-18 Akebono Brake Ind Composite material
JP3012365B2 (en) * 1990-06-14 2000-02-21 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Aramid paper containing aramid paper pulp
US6294049B1 (en) * 1992-06-09 2001-09-25 Unitika Ltd. Polyimide precursor fibrid, polyimide paper, polyimide composite paper and polyimide composite board obtained therefrom, and process for producing the fibrid and the paper products

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