CN103789779A - Process for preventing gold deposition in non plated though hole of chemical gold-plated board and palladium removal treating solution used in process - Google Patents
Process for preventing gold deposition in non plated though hole of chemical gold-plated board and palladium removal treating solution used in process Download PDFInfo
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- CN103789779A CN103789779A CN201410062290.2A CN201410062290A CN103789779A CN 103789779 A CN103789779 A CN 103789779A CN 201410062290 A CN201410062290 A CN 201410062290A CN 103789779 A CN103789779 A CN 103789779A
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- chemical gilding
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Abstract
The invention discloses a process for preventing gold deposition in a non plated though hole of a chemical gold-plated board. The process is characterized in that the chemical gold-plated board is subjected to palladium removal before being subjected to an alkaline etching process and electroless nickel/gold immersion. According to the process and a palladium removal treating solution used in the process, the chemical gold-plated board is subjected to palladium removal through the palladium removal treating solution, so that palladium which is left on the inner wall of the hole and is adsorbed on the inner wall of the hole during chemical copper plating can be removed; the palladium is separated or poisoned to lose activity, so that a catalytic effect cannot be generated to gold during chemical gold plating, the phenomenon of deposition of a gold layer in a nonmetal hole cannot be caused, and the product quality and the production efficiency are improved.
Description
Technical field
The present invention relates to a kind of chemical gilding technique, relate in particular to anti-deposition of gold technique and palladium removing treatment solution thereof in the non-heavy copper of a kind of chemical gilding plate hole.
Background technology
In printed circuit board, there is the plank that a class surface treatment mode is immersion Ni/Au to be called chemical gilding plate.In the process of its immersion Ni/Au, often there will be and in the non-metallic hole that does not need gold layer in deposition, deposit gold layer, thereby cause product defective.In order to overcome this defect, the mode of often taking is the manual gold layer depositing in non-metallic hole that scrapes off, and not only efficiency is low but also be difficult for scraping clean; Or the mode that adopts machine to return brill is removed gold layer, this mode often causes aperture to become large, produces property in batches and scraps.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides anti-deposition of gold technique and palladium removing treatment solution thereof in the non-heavy copper of a kind of chemical gilding plate hole, to eliminate the impact of the active substance existing on the inwall of non-metallic hole on chemical turmeric process, when immersion Ni/Au is produced, in non-metallic hole, no longer include gold layer deposition, guarantee product quality, immersion Ni/Au is produced can carry out smoothly.
The present invention for the technical scheme that solves its technical problem and adopt is: anti-deposition of gold technique in the non-heavy copper of a kind of chemical gilding plate hole, after described chemical gilding plate carries out alkali etching technique and before immersion Ni/Au, this chemical gilding plate is carried out to palladium removing processing.
As a further improvement on the present invention, described palladium removing processing is to adopt palladium removing treatment solution that described chemical gilding plate is sprayed or soaked, described palladium removing treatment solution is made up of thiocarbamide and hydrochloric acid, and the quality percentage composition of described thiocarbamide is 3.0～6.0%, the quality percentage composition of described hydrochloric acid is 0.5～1.5%.
As a further improvement on the present invention, the temperature while adopting described palladium removing treatment solution that described chemical gilding plate is sprayed or soaked is 35～40 ℃.
As a further improvement on the present invention, the time that adopts described palladium removing treatment solution to spray described chemical gilding plate is 1～3min.
As a further improvement on the present invention, the time that adopts described palladium removing treatment solution to soak described chemical gilding plate is 3～5min.
The present invention also provides a kind of palladium removing treatment solution, it is characterized in that, comprises the component of following quality percentage composition: thiocarbamide 3.0～6.0%, hydrochloric acid 0.5～1.5%.
The invention has the beneficial effects as follows: anti-deposition of gold technique and palladium removing treatment solution thereof in the non-heavy copper of this chemical gilding plate hole, by palladium removing treatment solution, chemical gilding plate is carried out to palladium removing processing, while eliminating the residual electroless copper of hole inwall, be adsorbed on the palladium metal of hole inwall, make palladium metal depart from or be poisoned, lose activity, thereby in the time of chemical gilding, gold element is not produced to katalysis, no longer occur the phenomenon of the long-pending upper gold layer of non-metallic inner hole deposition, improved quality product and production efficiency.
Embodiment
Below, the present invention is elaborated, but protection scope of the present invention is not limited to following embodiment, the simple equivalence of in every case being done with the present patent application the scope of the claims and description changes and modifies, within all still belonging to patent covering scope of the present invention.
Embodiment 1:
A kind of palladium removing treatment solution, comprises the component of following quality percentage composition: thiocarbamide 3.0%, hydrochloric acid 0.5%.
Anti-deposition of gold technique in a kind of non-heavy copper of chemical gilding plate hole, is immersed in this chemical gilding plate in above-mentioned palladium removing treatment solution and carries out palladium removing processing after chemical gilding plate carries out alkali etching technique and before immersion Ni/Au, 35 ℃ of temperature, time 3min.
The follow-up chemical nickel plating gold process that carries out, does not find upper golden problem in non-metallic hole, and quality product promotes greatly.
Embodiment 2:
A kind of palladium removing treatment solution, comprises the component of following quality percentage composition: thiocarbamide 6.0%, hydrochloric acid 1.5%.
Anti-deposition of gold technique in a kind of non-heavy copper of chemical gilding plate hole, is immersed in this chemical gilding plate in above-mentioned palladium removing treatment solution and carries out palladium removing processing after chemical gilding plate carries out alkali etching technique and before immersion Ni/Au, 40 ℃ of temperature, time 5min.
The follow-up chemical nickel plating gold process that carries out, does not find upper golden problem in non-metallic hole, and quality product promotes greatly.
Embodiment 3:
A kind of palladium removing treatment solution, comprises the component of following quality percentage composition: thiocarbamide 4.5%, hydrochloric acid 1.0%.
Anti-deposition of gold technique in a kind of non-heavy copper of chemical gilding plate hole, is immersed in this chemical gilding plate in above-mentioned palladium removing treatment solution and carries out palladium removing processing after chemical gilding plate carries out alkali etching technique and before immersion Ni/Au, 37 ℃ of temperature, time 4min.
The follow-up chemical nickel plating gold process that carries out, does not find upper golden problem in non-metallic hole, and quality product promotes greatly.
Embodiment 4:
A kind of palladium removing treatment solution, comprises the component of following quality percentage composition: thiocarbamide 4.5%, hydrochloric acid 1.0%.
Anti-deposition of gold technique in a kind of non-heavy copper of chemical gilding plate hole, after chemical gilding plate carries out alkali etching technique and before immersion Ni/Au by spraying above-mentioned palladium removing treatment solution on this chemical gilding plate, to carry out palladium removing processing, 37 ℃ of temperature, time 3min.
The follow-up chemical nickel plating gold process that carries out, does not find upper golden problem in non-metallic hole, and quality product promotes greatly.
Embodiment 5:
A kind of palladium removing treatment solution, comprises the component of following quality percentage composition: thiocarbamide 3.0%, hydrochloric acid 1.5%.
Anti-deposition of gold technique in a kind of non-heavy copper of chemical gilding plate hole, after chemical gilding plate carries out alkali etching technique and before immersion Ni/Au by spraying above-mentioned palladium removing treatment solution on this chemical gilding plate, to carry out palladium removing processing, 39 ℃ of temperature, time 1min.
The follow-up chemical nickel plating gold process that carries out, does not find upper golden problem in non-metallic hole, and quality product promotes greatly.
Embodiment 6:
A kind of palladium removing treatment solution, comprises the component of following quality percentage composition: thiocarbamide 6.0%, hydrochloric acid 0.5%.
Anti-deposition of gold technique in a kind of non-heavy copper of chemical gilding plate hole, after chemical gilding plate carries out alkali etching technique and before immersion Ni/Au by spraying above-mentioned palladium removing treatment solution on this chemical gilding plate, to carry out palladium removing processing, 35 ℃ of temperature, time 1.5min.
The follow-up chemical nickel plating gold process that carries out, does not find upper golden problem in non-metallic hole, and quality product promotes greatly.
Claims (6)
1. an anti-deposition of gold technique in the non-heavy copper of chemical gilding plate hole, is characterized in that: after described chemical gilding plate carries out alkali etching technique and before immersion Ni/Au, this chemical gilding plate is carried out to palladium removing processing.
2. anti-deposition of gold technique in the non-heavy copper of chemical gilding plate according to claim 1 hole, it is characterized in that: described palladium removing processing is to adopt palladium removing treatment solution that described chemical gilding plate is sprayed or soaked, described palladium removing treatment solution is made up of thiocarbamide and hydrochloric acid, and the quality percentage composition of described thiocarbamide is 3.0～6.0%, the quality percentage composition of described hydrochloric acid is 0.5～1.5%.
3. anti-deposition of gold technique in the non-heavy copper of coated plate according to claim 2 hole, is characterized in that: the temperature while adopting described palladium removing treatment solution that described chemical gilding plate is sprayed or soaked is 35～40 ℃.
4. anti-deposition of gold technique in the non-heavy copper of coated plate according to claim 2 hole, is characterized in that: the time that adopts described palladium removing treatment solution to spray described chemical gilding plate is 1～3min.
5. anti-deposition of gold technique in the non-heavy copper of coated plate according to claim 2 hole, is characterized in that: the time that adopts described palladium removing treatment solution to soak described chemical gilding plate is 3～5min.
6. a palladium removing treatment solution, is characterized in that, comprises the component of following quality percentage composition: thiocarbamide 3.0～6.0%, hydrochloric acid 0.5～1.5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410062290.2A CN103789779A (en) | 2014-02-24 | 2014-02-24 | Process for preventing gold deposition in non plated though hole of chemical gold-plated board and palladium removal treating solution used in process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410062290.2A CN103789779A (en) | 2014-02-24 | 2014-02-24 | Process for preventing gold deposition in non plated though hole of chemical gold-plated board and palladium removal treating solution used in process |
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| Publication Number | Publication Date |
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| CN103789779A true CN103789779A (en) | 2014-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410062290.2A Pending CN103789779A (en) | 2014-02-24 | 2014-02-24 | Process for preventing gold deposition in non plated though hole of chemical gold-plated board and palladium removal treating solution used in process |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106350787A (en) * | 2015-07-13 | 2017-01-25 | 东莞市斯坦得电子材料有限公司 | Palladium inactivation process for electroless nickel-gold plating |
| CN107208280A (en) * | 2015-02-12 | 2017-09-26 | Mec股份有限公司 | Etching solution and engraving method |
-
2014
- 2014-02-24 CN CN201410062290.2A patent/CN103789779A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107208280A (en) * | 2015-02-12 | 2017-09-26 | Mec股份有限公司 | Etching solution and engraving method |
| CN107208280B (en) * | 2015-02-12 | 2019-06-07 | Mec股份有限公司 | Etching solution and engraving method |
| CN106350787A (en) * | 2015-07-13 | 2017-01-25 | 东莞市斯坦得电子材料有限公司 | Palladium inactivation process for electroless nickel-gold plating |
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Application publication date: 20140514 |
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| RJ01 | Rejection of invention patent application after publication |