CN103746191A - Ultra-compact metamaterial wave-absorbing unit - Google Patents
Ultra-compact metamaterial wave-absorbing unit Download PDFInfo
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- CN103746191A CN103746191A CN201410007228.3A CN201410007228A CN103746191A CN 103746191 A CN103746191 A CN 103746191A CN 201410007228 A CN201410007228 A CN 201410007228A CN 103746191 A CN103746191 A CN 103746191A
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Abstract
The invention discloses an ultra-compact metamaterial wave-absorbing unit, which comprises a first metal film, a rectangular medium layer is arranged on the rectangular first metal film, a second metal film is arranged on the rectangular medium layer, the first metal film is provided with a hollow, the hollow consists of a first C-shaped hollow and a second C-shaped hollow, moreover, the first C-shaped hollow and the second C-shaped hollow are arranged back to back, the second metal film consists of a first C-shaped metal foil and a second C-shaped metal foil, furthermore, the first C-shaped metal foil and the second C-shaped metal foil are arranged back to back, and the hollow is shaped like the second metal film. The ultra-compact metamaterial wave-absorbing unit has the advantages that: the ultra-compact metamaterial wave-absorbing unit is extremely thin, and the wave-absorbing property exceeds more than negative 15dB.
Description
Technical field
The present invention relates to the super material of a kind of ultra-compact and inhale ripple unit.
Background technology
Traditional absorbing material requires size that will be thicker can obtain good wave-absorbing effect, but in low-frequency range, such as frequency is within the scope of 1-2GHz, more than absorbing material thickness will exceed 10mm conventionally, this has received serious restriction in actual applications, especially, in the microwave circuit of compact conformation, is difficult to especially use, simultaneously the performance of traditional absorbing material namely-level of 10dB left and right, this index is usually also difficult to meet the demands in microwave circuit, aerial array.
For this reason, need to invent a kind of thickness as thin as a wafer, the material of about exceed-15dB of absorbing property, the present invention just in time can meet such designing requirement.
Summary of the invention
The invention provides a kind of thickness as thin as a wafer, absorbing property exceedes-the more than 15dB super material of ultra-compact inhales ripple unit.
The present invention adopts following technical scheme:
The super material of a kind of ultra-compact is inhaled ripple unit, comprise: the first metallic film, in rectangular metallic film, be provided with Rectangular Enclosure with Participating Media layer, on Rectangular Enclosure with Participating Media layer, be provided with the second metallic film, at described the first metallic film, be provided with hollow out, described hollow out consists of a C shape hollow out and the 2nd C shape hollow out and a C shape hollow out and the 2nd C shape hollow out are back-to-back and arrange, described the second metallic film consists of a C shape metal forming and the 2nd C shape metal forming and a C shape metal forming and the 2nd C shape metal forming are back-to-back and arrange, the shape of the shape of described hollow out and the second metallic film similar figures each other.
Compared with prior art, tool of the present invention has the following advantages:
The hollow out of similar figures and the second metallic film each other, make the first metallic film and the second metallic film form complementation, form complementary metamaterial structure, first this complementary metamaterial structure can guarantee that the input impedance of whole suction ripple unit approaches the wave impedance of air in wider frequency band, thereby first overcome in traditional sense, be that super material is inhaled ripple device resistance matching problem, this is that super material is inhaled primarily satisfying condition of ripple device.Be different from the additional short microstrip line construction of double C shape that first Lindy in 2008 proposes, the structure that is positioned at the first metallic film has substituted the short microstrip line construction of traditional longer size, both can guarantee in total, to there is enough large equivalent inductance, the size of effectively having dwindled again whole unit simultaneously, this structure also helps further dwindles whole element thickness, also be that engraved structure based on same brings larger equivalent inductance, therefore, thickness of the present invention is less than 1/100th operation wavelengths, exceed-15dB of absorbing property, and conventional absorbing material thickness can only be less than 1/tens operation wavelengths conventionally, and be generally-10dB of absorbing property left and right.
Accompanying drawing explanation
Reading by reference to the accompanying drawings after description, above-mentioned purpose of the present invention, further feature and advantage all can be more obvious, wherein:
Fig. 1 is overall structure end view of the present invention.
Fig. 2 is the first metallic film vertical view of the present invention.
Fig. 3 is the A-A cutaway view of the present invention's the first metallic film.
Fig. 4 is Rectangular Enclosure with Participating Media layer vertical view of the present invention.
Fig. 5 is the second metallic film vertical view of the present invention.
Fig. 6 is the absorbing property curve in the embodiment of the present invention.
Embodiment
The super material of a kind of ultra-compact is inhaled ripple unit, comprise: the first metallic film 1, in rectangular metallic film 1, be provided with Rectangular Enclosure with Participating Media layer 3, on Rectangular Enclosure with Participating Media layer 3, be provided with the second metallic film 4, at described the first metallic film 1, be provided with hollow out 2, described hollow out 2 consists of a C shape hollow out 21 and the 2nd C shape hollow out 22 and a C shape hollow out 21 and the 2nd C shape hollow out 22 are back-to-back and arrange, described the second metallic film 4 consists of a C shape metal forming 41 and the 2nd C shape metal forming 42 and a C shape metal forming 41 and the 2nd C shape metal forming 42 are back-to-back and arrange, the shape of the shape of described hollow out 2 and the second metallic film 4 similar figures each other.The projection of the second metallic film 4 on the first metallic film 1 falls into hollow out 2 inside of the first metallic film 1.
Be the detailed content of a preferred embodiment of the present invention below, embodiment in conjunction with the accompanying drawings.Possible in the situation that, for the same label of institute's drawings attached and explanation, represent same or analogous part.This embodiment is a kind of for radio circuit electromagnetic isolation, micro-strip antenna array cell isolation.Comprise from the bottom to top three-decker, extension width is 7.2mm, and basecoat material is rectangle copper film, and thickness is 17um, has surely the I-shaped shape part hollow out that is corroded in the middle of this metallic film, and openwork part width is 1.8mm; At this metallic film upside, be one deck Rectangular Enclosure with Participating Media material, dielectric constant is 60+0.24i, and its thickness is 0.95mm; At this dielectric material upside, be layer of copper film, thickness is 17um, and this metallic film shape is as the criterion I-shaped, and metal live width is 1mm, and its absorbing property curve as shown in Figure 5.Obviously at working frequency points 1.2659GHz, exceed-20dB of the absorbing property of this structure, and its integral thickness only has 0.97mm, and corresponding operation wavelength is 239mm, and comparatively speaking, its integral thickness is only 1/246 operation wavelength.Than traditional absorbing material, this new structure has minimum thickness and splendid absorbing property.
The present invention can combine multiple such suction ripple unit and can build the absorbing material of very thin thickness, and such absorbing material working range, at 0.5GHz between 150GHz, can be widely used in the electromagnetic isolation, stealthy etc. of microwave device inside conventionally.
Although the present invention is illustrated with reference to accompanying drawing and preferred embodiment,, for a person skilled in the art, the present invention can have various modifications and variations.Various change of the present invention, variation, and equivalent has the content of appending claims to contain.
Claims (2)
1. the super material of ultra-compact is inhaled ripple unit, it is characterized in that, comprise: the first metallic film (1), in rectangular metallic film (1), be provided with Rectangular Enclosure with Participating Media layer (3), on Rectangular Enclosure with Participating Media layer (3), be provided with the second metallic film (4), at described the first metallic film (1), be provided with hollow out (2), described hollow out (2) consists of a C shape hollow out (21) and the 2nd C shape hollow out (22) and a C shape hollow out (21) and the 2nd C shape hollow out (22) are setting back-to-back, described the second metallic film (4) consists of a C shape metal forming (41) and the 2nd C shape metal forming (42) and a C shape metal forming (41) and the 2nd C shape metal forming (42) are setting back-to-back, the shape similar figures each other of the shape of described hollow out (2) and the second metallic film (4).
2. the super material of ultra-compact according to claim 1 is inhaled ripple unit, it is characterized in that, the projection of the second metallic film (4) on the first metallic film (1) falls into hollow out (2) inside of the first metallic film (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410007228.3A CN103746191A (en) | 2014-01-08 | 2014-01-08 | Ultra-compact metamaterial wave-absorbing unit |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410007228.3A CN103746191A (en) | 2014-01-08 | 2014-01-08 | Ultra-compact metamaterial wave-absorbing unit |
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| CN103746191A true CN103746191A (en) | 2014-04-23 |
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| CN201410007228.3A Pending CN103746191A (en) | 2014-01-08 | 2014-01-08 | Ultra-compact metamaterial wave-absorbing unit |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104810575A (en) * | 2015-04-14 | 2015-07-29 | 哈尔滨理工大学 | Terahertz tuning device based on graphene |
| CN110366361A (en) * | 2019-08-06 | 2019-10-22 | 集美大学 | A kind of wave absorbing device based on super surface |
| CN111293440A (en) * | 2020-01-27 | 2020-06-16 | 浙江大学 | Ultra-thin wave absorber based on deep sub-wavelength slit |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102843899A (en) * | 2012-08-03 | 2012-12-26 | 深圳光启创新技术有限公司 | Wave absorbing metamaterial and device |
| CN103181025A (en) * | 2010-04-12 | 2013-06-26 | 塔夫茨大学 | Silk electronic components |
| CN103259097A (en) * | 2013-04-19 | 2013-08-21 | 电子科技大学 | Terahertz metamaterial unit structure and preparation, adjusting and control method thereof |
-
2014
- 2014-01-08 CN CN201410007228.3A patent/CN103746191A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103181025A (en) * | 2010-04-12 | 2013-06-26 | 塔夫茨大学 | Silk electronic components |
| CN102843899A (en) * | 2012-08-03 | 2012-12-26 | 深圳光启创新技术有限公司 | Wave absorbing metamaterial and device |
| CN103259097A (en) * | 2013-04-19 | 2013-08-21 | 电子科技大学 | Terahertz metamaterial unit structure and preparation, adjusting and control method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104810575A (en) * | 2015-04-14 | 2015-07-29 | 哈尔滨理工大学 | Terahertz tuning device based on graphene |
| CN110366361A (en) * | 2019-08-06 | 2019-10-22 | 集美大学 | A kind of wave absorbing device based on super surface |
| CN111293440A (en) * | 2020-01-27 | 2020-06-16 | 浙江大学 | Ultra-thin wave absorber based on deep sub-wavelength slit |
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Application publication date: 20140423 |