CN103724964A - High-ductility high-diffusion PC/ABS alloy material and preparation method thereof - Google Patents
High-ductility high-diffusion PC/ABS alloy material and preparation method thereof Download PDFInfo
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- CN103724964A CN103724964A CN201310655882.0A CN201310655882A CN103724964A CN 103724964 A CN103724964 A CN 103724964A CN 201310655882 A CN201310655882 A CN 201310655882A CN 103724964 A CN103724964 A CN 103724964A
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- 239000000956 alloy Substances 0.000 title claims abstract description 23
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 238000009792 diffusion process Methods 0.000 title abstract description 19
- 229920000122 Acrylonitrile butadiene styrene Polymers 0.000 claims abstract description 47
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 230000003078 antioxidant Effects 0.000 claims abstract description 7
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 7
- 238000005453 pelletization Methods 0.000 claims abstract description 5
- 239000004417 polycarbonate Substances 0.000 claims description 41
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 28
- 239000006185 dispersion Substances 0.000 claims description 22
- -1 polysiloxane Polymers 0.000 claims description 14
- XECAHXYUAAWDEL-UHFFFAOYSA-N Acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 13
- XBDQKXXYIPTUBI-UHFFFAOYSA-N propionic acid Chemical compound CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 7
- 230000002087 whitening Effects 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 5
- 239000003112 inhibitor Substances 0.000 claims description 5
- 230000002401 inhibitory effect Effects 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 5
- 238000007254 oxidation reaction Methods 0.000 claims description 5
- FPYJFEHAWHCUMM-UHFFFAOYSA-N Maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 235000019260 propionic acid Nutrition 0.000 claims description 4
- 238000005469 granulation Methods 0.000 claims description 3
- 230000003179 granulation Effects 0.000 claims description 3
- 239000004615 ingredient Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 2
- AQSJGOWTSHOLKH-UHFFFAOYSA-N Phosphite Chemical compound [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 claims description 2
- 239000007983 Tris buffer Substances 0.000 claims description 2
- 238000007334 copolymerization reaction Methods 0.000 claims description 2
- QHZOMAXECYYXGP-UHFFFAOYSA-N ethene;prop-2-enoic acid Chemical group C=C.OC(=O)C=C QHZOMAXECYYXGP-UHFFFAOYSA-N 0.000 claims description 2
- 239000008187 granular material Substances 0.000 claims description 2
- 239000000178 monomer Substances 0.000 claims description 2
- 239000002530 phenolic antioxidant Substances 0.000 claims description 2
- 150000008301 phosphite esters Chemical class 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 2
- 229920001897 terpolymer Polymers 0.000 claims description 2
- 239000002253 acid Substances 0.000 abstract description 3
- 238000005336 cracking Methods 0.000 abstract description 3
- 238000010079 rubber tapping Methods 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 2
- 238000002834 transmittance Methods 0.000 abstract description 2
- 239000000654 additive Substances 0.000 abstract 1
- 239000003513 alkali Substances 0.000 abstract 1
- 235000006708 antioxidants Nutrition 0.000 abstract 1
- 238000005282 brightening Methods 0.000 abstract 1
- 239000002270 dispersing agent Substances 0.000 abstract 1
- 238000001125 extrusion Methods 0.000 abstract 1
- 230000003287 optical Effects 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 238000005286 illumination Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 208000008425 Protein Deficiency Diseases 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 101710014322 MDV028 Proteins 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
The invention aims to provide a high-ductility high-diffusion PC/ABS alloy material and a preparation method thereof. The alloy material comprises the following components in percentage by weight: 5-15 percent of ABS resin, 1-3 percent of a PC/ABS compatilizer, 0.1-2 percent of a light diffuser, 0.1-0.5 percent of a dispersing agent, 0.2-0.6 percent of an anti-oxidant and the balance of PC resin, and further comprises other additives (white powder and brightening agents). The preparation method comprises the following steps: all components are mixed in a high-speed mixer for 1-2 min, and then the mixture is put in a double-screw extruder for extrusion and pelletization, thereby obtaining the alloy material. The prepared PC/ABS alloy material is high in light transmittance and diffusibility through reasonable matching ratio of PC resin and ABS resin and the using of the light diffuser. Meanwhile, the PC machinability is greatly improved and internal stress cracking problem is solved through the adding of a toughening agent and the ABS resin. The alloy material can replace a light diffusion PC and light diffusion ABS material to be applied in the optical field, and overcome the difficulty that the light diffusion PC and light diffusion ABS material can not be used in severe conditions (for example: work piece is punched with a self-tapping screw and required to be in contact with strong acid and strong alkali).
Description
Technical field
The present invention relates to technical field of polymer materials, the high dispersion pattern PC/ABS of especially a kind of high tenacity alloy material and preparation method thereof.
Background technology
Photodiffusion material refers to a line source to be changed into the material of line area source, general by being dispersed in transparent substrate and preparing from the light diffusion particle of the different specific refractions of base material, be used in early days the backlight source material of liquid-crystal display, be called again light-scattering material or diffusion material; By photodiffusion material, for light emitting diode LED lighting, be a new Application Areas of opening up in recent years.LED illumination can the higher photodiffusion material for LED illumination compared with the stronger fill light linearity of liquid crystal backlight in diffusion light, must reduce light loss as far as possible; Therefore organic smooth diffusion particle and the polycarbonates of adopting are prepared the LED illumination light diffusion material that has high transmission rate and high light diffusing energy concurrently more by blending method.
But the light diffusion PC material of preparing by blend due to simple PC resin and light diffusing agent exists easy stress cracking, the defects such as poor in processability, under the severe condition of some environmental requirements, there is geneogenous deficiency, limited to a great extent the application neck of light diffusion PC, based on this, the present invention, by improving the deficiency of existing photodiffusion material, meets the demand that client is more and more higher, expands the Application Areas of photodiffusion material.
Summary of the invention
The shortcoming existing for above-mentioned prior art, the experience of this area work is engaged in inventor's accumulation for many years, through feasibility study repeatedly, obtain eventually generation of the present invention, the present invention is by PC resin and the rational allocation of ABS resin ratio and the use of light diffusing agent, make the PC/ABS alloy material of high diffusibility, simultaneously toughner and ABS resin adds the great processibility of PC and the problem of internal stress cracking improved, this alloy material can replace light diffusion PC and light diffusion ABS material, solved simultaneously existing light diffusion PC and light diffusion ABS material under ask for something severe condition (as product will be played self-tapping screw, product is wanted the situations such as strong acid and strong base contact) an out of use difficult problem, increased the Application Areas of photodiffusion material.
The technical solution used in the present invention: a kind of high tenacity disclosed by the invention high dispersion pattern PC/ABS alloy material component (according to weight percent) comprising:
Preferably, PC resin is bisphenol A-type polycarbonate, in sticky, its melting index is at 10～12g/10min, and at 120 ℃, dries and within 4 hours, control moisture below 0.1%.
Preferably, ABS resin is acrylonitrile-butadiene-styrene terpolymer, and at 90 ℃, dries and within 4 hours, control moisture below 0.1%.
Preferably, PC/ABS compatilizer is the ternary atactic copolymer being formed by vinylbenzene (S), vinyl cyanide (AN) and three kinds of monomer copolymerizations of maleic anhydride (MA), and at 90 ℃, dries and within 4 hours, control moisture below 0.1%.
Preferably, light diffusing agent is formulated by 10% and 90% mass ratio by acrylic resin and polysiloxane dispersible granule.
Preferably, dispersion agent is ethylene acrylic acid co polymer.
Preferably, oxidation inhibitor is phenolic antioxidant four [β-(3 ', 5 '-di-t-butyl-4 '-hydroxy phenyl) propionic acid] pentaerythritol ester and/or phosphite ester kind antioxidant (2,4 di-tert-butyl-phenyl) tris phosphite.
Preferably, also comprise toner and/or whitening agent.
The present invention also comprises a kind of method of preparing the high dispersion pattern PC/ABS of above-mentioned high tenacity alloy material, comprises the following steps:
(1) raw-material processing and mixing
Dry PC resin and ABS resin;
Major ingredient and PC/ABS compatilizer, light diffusing agent, dispersion agent, oxidation inhibitor, other auxiliary agents (toner and/or whitening agent) are mixed in high speed mixer, make the abundant dispersed with stirring of each component even;
(2) melt extrude
The material mixing is added in twin screw extruder, melt extrude temperature between 230-270 ℃, screw speed is 200-600 rev/min;
(3) granulation and aftertreatment
The material of extruding is carried out cooling, air-dry, pelletizing, crosses strong magnetic, is packaged to be finished product.
Preferably, in step (1), PC resin dries 4 hours at 120 ℃, controls moisture below 0.1%; ABS resin is dried 4 hours at 90 ℃, controls moisture below 0.1%.
Each component is mixed and after 1～2 minute, is put into twin screw extruder extruding pelletization and obtain product of the present invention in high speed mixer.The high dispersion pattern PC/ABS of high tenacity of the present invention alloy material can meet original light diffusion PC with light diffusion ABS material under ask for something severe condition (as product will be beaten self-tapping screw, the product situation such as want that strong acid and strong base contacts) out of use deficiency, increased greatly the Application Areas of photodiffusion material.Simultaneously this material possess high strength, good toughness, can rapid shaping, the feature such as high performance-price ratio.
Embodiment
Below in conjunction with embodiment, illustrate the present invention.
Embodiment 1
First the PC resin of 92.5% weight is dried at 120 ℃ and within 4 hours, control moisture below 0.1%, at 90 ℃, dry and within 4 hours, control moisture below 0.1% with the ABS resin of 5% weight subsequently, the PC/ABS compatilizer of 1% weight, the light diffusing agent of 0.5% weight, the dispersion agent of 0.3% weight, primary antioxidant four (β-(3 of 0.1% weight, 5-di-tert-butyl-hydroxy phenyl) propionic acid) pentaerythritol ester (1010) and 0.1% auxiliary antioxidant three (2, 4-di-tert-butyl-phenyl) phosphorous acid ester (168), other auxiliary agents (toner and whitening agent) of 0.5% weight are mixed after 2 minutes and are entered twin screw extruder plasticizing from metering feeding device by high speed mixer, melting, again through extruding, cooling, cross magnetic, be packaged to be product,
Embodiment 2
First the PC resin of 80% weight is dried at 120 ℃ and within 4 hours, control moisture below 0.1%, at 90 ℃, dry and within 4 hours, control moisture below 0.1% with the ABS resin of 13% weight subsequently, the PC/ABS compatilizer of 3% weight, the light diffusing agent of 2% weight, the dispersion agent of 0.5% weight, primary antioxidant four (β-(3 of 0.2% weight, 5-di-tert-butyl-hydroxy phenyl) propionic acid) pentaerythritol ester (1010) and 0.3% auxiliary antioxidant three (2, 4-di-tert-butyl-phenyl) phosphorous acid ester (168), other auxiliary agents (toner and whitening agent) of 1% weight are mixed after 2 minutes and are entered twin screw extruder plasticizing from metering feeding device by high speed mixer, melting, again through extruding, cooling, cross magnetic, be packaged to be product,
Preparation method and the technique of embodiment are as follows:
(1) raw-material processing and mixing
PC resin dries 4 hours at 120 ℃, controls moisture below 0.1%; ABS resin is dried 4 hours at 90 ℃, controls moisture below 0.1%;
Major ingredient and PC/ABS compatilizer, light diffusing agent, dispersion agent, oxidation inhibitor, other auxiliary agents (toner and/or whitening agent) are mixed 2 minutes in high speed mixer, make the abundant dispersed with stirring of each component even;
(2) melt extrude
The material mixing is added in twin screw extruder, melt extrude temperature between 230-270 ℃, screw speed is 200-600 rev/min;
(3) granulation and aftertreatment
The material of extruding is carried out cooling, air-dry, pelletizing, crosses strong magnetic, is packaged to be finished product.
As follows according to the performance of the high dispersion pattern PC/ABS of the high tenacity alloy material of embodiment 1 and embodiment 2 gained:
| Test event | Testing standard | Test condition | Embodiment 1 | Embodiment 2 |
| Proportion (g/cm3) | D792 | 23℃ | 1.20 | 1.19 |
| Tensile strength (Mpa) | D638 | 10mm/min | 62 | 58 |
| Elongation at break (%) | D638 | 10mm/min | 50 | 56 |
| Flexural strength (Mpa) | D790 | 2mm/min | 96 | 92 |
| Modulus in flexure (Mpa) | D790 | 2mm/min | 2400 | 2300 |
| Notched Izod impact strength (J/m) | D256 | 3.2mm,23℃ | 700 | 680 |
| Heat-drawn wire (℃) | D648 | 1.8Mpa,6.4mm | 130 | 128 |
| Flame retardant resistance (Class) | UL94 | 1.5mm | V-2 | V-2 |
| Transmittance (%) | D1003 | 1.0mm | 75 | 72 |
| Mist degree (%) | D1003 | 1.0mm | 23.5 | 24.5 |
In sum, be preferred embodiment of the present invention, all changes of having done according to technical solution of the present invention, when the function producing does not exceed the scope of technical solution of the present invention, all belong to protection scope of the present invention.
Claims (10)
1. the high dispersion pattern PC/ABS of a high tenacity alloy material, is characterized in that comprising by weight percentage following component:
2. the high dispersion pattern PC/ABS of high tenacity as claimed in claim 1 alloy material, is characterized in that PC resin is bisphenol A-type polycarbonate, in sticky, its melting index is at 10～12g/10min, and at 120 ℃, dries and within 4 hours, control moisture below 0.1%.
3. the high dispersion pattern PC/ABS of high tenacity as claimed in claim 1 or 2 alloy material, is characterized in that ABS resin is acrylonitrile-butadiene-styrene terpolymer, and at 90 ℃, dries and within 4 hours, control moisture below 0.1%.
4. the high dispersion pattern PC/ABS of high tenacity as claimed in claim 1 or 2 alloy material, it is characterized in that PC/ABS compatilizer is the ternary atactic copolymer being formed by vinylbenzene (S), vinyl cyanide (AN) and three kinds of monomer copolymerizations of maleic anhydride (MA), and at 90 ℃, dry and within 4 hours, control moisture below 0.1%.
5. the high dispersion pattern PC/ABS of high tenacity as claimed in claim 1 or 2 alloy material, is characterized in that light diffusing agent is formulated by 10% and 90% mass ratio by acrylic resin and polysiloxane dispersible granule.
6. the high dispersion pattern PC/ABS of high tenacity as claimed in claim 1 or 2 alloy material, is characterized in that dispersion agent is ethylene acrylic acid co polymer.
7. the high dispersion pattern PC/ABS of high tenacity as claimed in claim 1 or 2 alloy material, it is characterized in that oxidation inhibitor is phenolic antioxidant four [β-(3 ', 5 '-di-t-butyl-4 '-hydroxy phenyl) propionic acid] pentaerythritol ester and/or phosphite ester kind antioxidant (2,4 di-tert-butyl-phenyl) tris phosphite.
8. the high dispersion pattern PC/ABS of high tenacity as claimed in claim 1 or 2 alloy material, characterized by further comprising toner and whitening agent.
9. the preparation method of the high dispersion pattern PC/ABS of the high tenacity alloy material as described in any one in claim 1-8, is characterized in that comprising the following steps:
(1) raw-material processing and mixing
Dry PC resin and ABS resin; Major ingredient and PC/ABS compatilizer, light diffusing agent, dispersion agent, oxidation inhibitor, other auxiliary agents (toner and/or whitening agent) are mixed in high speed mixer, make the abundant dispersed with stirring of each component even;
(2) melt extrude
The material mixing is added in twin screw extruder, melt extrude temperature between 230-270 ℃, screw speed is 200-600 rev/min;
(3) granulation and aftertreatment
The material of extruding is carried out cooling, air-dry, pelletizing, crosses strong magnetic, is packaged to be finished product.
10. method as claimed in claim 9, is characterized in that, in step (1), PC resin dries 4 hours at 120 ℃, controls moisture below 0.1%; ABS resin is dried 4 hours at 90 ℃, controls moisture below 0.1%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310655882.0A CN103724964B (en) | 2013-12-06 | 2013-12-06 | A kind of High-ductility high-diffusion PC/ABS alloy material and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310655882.0A CN103724964B (en) | 2013-12-06 | 2013-12-06 | A kind of High-ductility high-diffusion PC/ABS alloy material and preparation method thereof |
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| CN103724964B CN103724964B (en) | 2015-11-18 |
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Cited By (3)
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| CN112480635A (en) * | 2020-12-09 | 2021-03-12 | 上海锦湖日丽塑料有限公司 | Transparent PC/ABS alloy and preparation method thereof |
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| CN112480635A (en) * | 2020-12-09 | 2021-03-12 | 上海锦湖日丽塑料有限公司 | Transparent PC/ABS alloy and preparation method thereof |
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Denomination of invention: High toughness and high diffusion type PC/ABS alloy material and preparation method thereof Effective date of registration: 20180830 Granted publication date: 20151118 Pledgee: China Co. truction Bank Corp Jiangmen branch Pledgor: GUANGDONG DOSN TECHNOLOGY CO.,LTD. Registration number: 2018440000252 |
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Date of cancellation: 20221227 Granted publication date: 20151118 Pledgee: China Co. truction Bank Corp Jiangmen branch Pledgor: GUANGDONG DOSN TECHNOLOGY CO.,LTD. Registration number: 2018440000252 |
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