CN103620778B - Flip-chip, face-up and face-down centerbond memory wirebond assemblies - Google Patents

Flip-chip, face-up and face-down centerbond memory wirebond assemblies Download PDF

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Publication number
CN103620778B
CN103620778B CN201280030801.1A CN201280030801A CN103620778B CN 103620778 B CN103620778 B CN 103620778B CN 201280030801 A CN201280030801 A CN 201280030801A CN 103620778 B CN103620778 B CN 103620778B
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China
Prior art keywords
microelectronic
micromodule
lead
edge
terminal
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CN201280030801.1A
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Chinese (zh)
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CN103620778A (en
Inventor
贝尔加桑·哈巴
理查德·德威特·克里斯普
韦勒·佐尼
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泰塞拉公司
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Priority to US201161477967P priority Critical
Priority to US61/477,967 priority
Priority to US13/306,099 priority
Priority to US13/306,099 priority patent/US8928153B2/en
Application filed by 泰塞拉公司 filed Critical 泰塞拉公司
Priority to PCT/US2012/032997 priority patent/WO2012145201A1/en
Publication of CN103620778A publication Critical patent/CN103620778A/en
Application granted granted Critical
Publication of CN103620778B publication Critical patent/CN103620778B/en

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Abstract

A microelectronic assembly 10 can include a substrate 30 having first and second surfaces 34, 58, an aperture 39 extending therebetween, and terminals 36. The assembly 10 can also include a first microelectronic element 12 having a front surface 16 facing the first surface 34, a second microelectronic element 14 having a front surface 22 projecting beyond an edge 29 of the first microelectronic element, first and second leads 70, 76 electrically connecting contacts 20, 52 of the microelectronic elements to the terminals, and third leads 73 electrically interconnecting the contacts of the first and second microelectronic elements. The contacts 20 of the first microelectronic element 12 can be disposed adjacent the edge 29. The contacts 26 of the second microelectronic element 14 can be disposed in a central region 19 of the front surface 22 thereof. The leads 70, 76, 99 can have portions aligned with the aperture 39.

Description

Flip-chip, front and back center bonding storage line bonding component
Cross-Reference to Related Applications
This application claims U.S. Provisional Patent Application No. No.61/477,967 and 2011 filed in 21 days April in 2011 U.S. Patent Application No. No.13/306 filed on November 29, in, 099 rights and interests, the disclosure of which is incorporated herein by. Include below by way of the commonly owned application being incorporated herein by reference:U.S. Provisional Patent Application filed in 21 days April in 2011 Number No.61/477,820, No.61/477,877 and No.61/477,883.
Technical field
The present invention relates to micromodule and the method for manufacturing this component are stacked, and for the portion of this component Part.
Background technology
Semiconductor chip is typically set to single pre-packaged units.Standard chips have the flattened rectangular carried before big Body, the contact should above with the internal circuit for being connected to chip.Each single chip is typically mounted in encapsulation, encapsulation It is arranged on again on circuit board such as printed circuit board (PCB), encapsulates the conductor of the contact portion of chip to circuit board.Many conventional Design in, the area that chip package takes in the circuit board is more much larger than the area of chip itself.As with reference to above Used in the disclosure of flat chip, " area of chip " should be understood to refer to the area before described.In " upside-down mounting In chip " design, in the face of the face of package substrate chip before, i.e. by soldered ball or other connecting elements by chip carrier and Contact on chip is bonded directly to the contact of chip carrier.Again can be by chip carrier by the terminal covered before chip It is bonded to circuit board." flip-chip " design provides the arrangement of relative compact;The area of the circuit board that each chip takes is equal to Or slightly larger than the area before chip, such as in commonly assigned United States Patent (USP) 5,148,265,5,148,266 and 5,679, Disclosed in some of 977 embodiments, the entire disclosure is incorporated herein by.
Compactness of the compactness that the mounting technique of some innovations is provided close or equal to conventional flip-chips bonding.Can be with The encapsulation that one single chip is housed in area, circuit board the area equal to or slightly greater than chip itself is commonly known as " core Chip size package ".
The area of plane except minimizing the circuit board taken by micromodule, in addition it is also necessary to which production one kind is perpendicular to circuit The less chip package of whole height or size of plate plane.This thin microelectronics Packaging allows wherein to be provided with encapsulation Circuit board is close to adjacent structure placement, thus produces the overall dimensions of the product comprising circuit board.Have been proposed that in list Various proposals of multiple chips are set in individual encapsulation or module.In conventional " multi-chip module ", chip is abreast arranged on On single package substrate, then the package substrate can be attached to circuit board.This method is only to provide shared by chip The limited reduction of the gross area of circuit board.Total surface area of the gross area still above each chip in module.
It has also been proposed that by multiple chip packages, in " stacking " arrangement, (i.e. multiple chips are positioned to one on another Arrangement) in.In stacked arrangement, multiple chips can be arranged in the area of the circuit board less than the gross area of chip. For example, disclose in some embodiments of above-mentioned United States Patent (USP) 5,679,977,5,148,265 and 5,347,159 Stacked chip arrangements, the entire disclosure is incorporated herein by.Also by United States Patent (USP) No.4 being incorporated herein by reference, A kind of 941,033 open arrangements, one Shangdi at another of its chips stacks, and so-called by what is be associated with chip Conductor on " wiring membrane " is interconnected amongst one another.
Except these effort of prior art, need to for the core of the contact with the central area generally within chip The situation of the multi-chip package of piece is further improved.Some semiconductor chips, such as some storage chips, generally with basic edge A line or two row contacts that the central shaft of chip is arranged.
The content of the invention
The present invention relates to the method for micromodule and this component of manufacture.According to aspects of the present invention, micromodule Can include:Extend with the first surface and second surface that relatively face and between first surface and second surface The substrate in hole;The first microelectronic element with the front surface in the face of substrate first surface;And with the face of the first microelectronics Second microelectronic element of the front surface of element.Substrate can have the first terminal for being exposed to its second surface.First micro- electricity Subcomponent can also have the rear surface away from front surface, and the edge for extending between the front and back surfaces.First is micro- Electronic component can have be exposed at its front surface and the edge of neighbouring first microelectronic element multiple contacts.Second micro- electricity Subcomponent can have relative first edge and second edge.The front surface of the second microelectronic element can in first edge and Extend between second edge.
Second microelectronic element can have be arranged on the central area of its front surface and away from first edge and the second side Multiple contacts of edge.The front surface of the second microelectronic element can be protruded from outside the edge of the first microelectronic element.Microelectronics Component can also include for the contact of the first microelectronic element being electrically connected to the first lead of the first terminal and by second micro- electricity Second lead of the contact portion of subcomponent to the first terminal.First lead and the second lead can have the portion alignd with hole Point.Micromodule can also include being exposed to the second end at the surface of the micromodule relative with the second surface of substrate Son.At least some Second terminal can cover at least one microelectronic element.
In one embodiment, at least some Second terminal can pass through line bonding and be exposed at the first surface of substrate Conducting element electrical connection.In particular example, micromodule can also include at least partly covering the first microelectronic element With the second microelectronic element and the sealant of at least part of line bonding.Second terminal exposure micromodule at which Surface can be the surface of sealant.In one example, line bonding can have be attached to conducting element pedestal and away from The unsealing end surfaces of conducting element, and the edge surface extended between pedestal and unsealing end surfaces.Unsealing end table Face can not be covered by sealant.Second terminal can be electrically connected with unsealing end surfaces.In the exemplary embodiment, at least one At least part of edge surface of individual line bonding can be unencapsulated, and at least one Second terminal can be with least one line bonding Unsealing edge surface and unsealing end surfaces electrical connection.
In certain embodiments, line bonding can have be located at be attached to conducting element line bonding pedestal and away from Unsealing edge surface between the end of the line bonding of conducting element.Second terminal can be electrically connected with unsealing edge surface Connect.In one embodiment, at least one microelectronic element can include volatile random access memory (RAM), at least one Individual microelectronic element can include non-volatile flash memory.In the exemplary embodiment, micromodule can also be included first The 3rd lead that the contact of microelectronic element is electrically interconnected with the contact of the second microelectronic element.First lead, the second lead and Three leads can have the part alignd with hole.In one example, at least one of the first lead or the second lead can be with Including the line bonding extended from the contact of at least one of the first microelectronic element or the second microelectronic element.
In specific example, at least one part alignd with hole of the first lead and the second lead can be monolithic The part of conductive element, monolithic conducting element has the Part II that terminal is extended to along substrate.In the exemplary embodiment, micro- electricity Sub-component can also include the spacer element between the front surface and the first surface of substrate of the second microelectronic element.Show at one In example, the first microelectronic element can be included for the chip of main execution logic function.In certain embodiments, second is micro- Electronic component can have the more active devices of active device than providing any other function to provide memory storage battle array Row function.In one embodiment, the first microelectronic element can have the active device than providing any other function more Active device providing memory array function.In the exemplary embodiment, micromodule can also be included The contact of one microelectronic element is electrically connected to the 3rd lead of terminal.First lead and the 3rd lead may be coupled to the relative of hole Terminal on side.First lead, the second lead and the 3rd lead can have the part alignd with hole.
In one example, micromodule can also include being arranged on the first surface and the second microelectronic element of substrate Front surface between the 3rd microelectronic element, the contact of the 3rd microelectronic element is electrically connected to into the 3rd lead of terminal, with And the 4th lead for being electrically interconnected the contact of the contact of the first microelectronic element and the 3rd microelectronic element.3rd microelectronic element Can have relative first edge and second edge, the front surface extended between first edge and second edge, Yi Jishe Put on its front surface and adjacent to multiple contacts of its first edge.The front surface of the 3rd microelectronic element can face substrate First surface.The contact of the contact of the first microelectronic element and the 3rd microelectronic element may be located on the opposite side in hole.First Lead, the second lead, the 3rd lead and the 4th lead can have the part alignd with hole.In the exemplary embodiment, micro- electricity Sub-component can also include the 5th lead for being electrically interconnected the contact of the contact of the first microelectronic element and the second microelectronic element. In certain embodiments, micromodule can also be included the contact of the second microelectronic element and the 3rd microelectronic element The 6th lead that contact is electrically interconnected.
In one embodiment, microelectronic component can include the first micromodule as above and the second microelectronics Component.First micromodule can at least in part cover the second micromodule.The first terminal of the first micromodule Can engage with the Second terminal of the second micromodule.In the exemplary embodiment, at least one first microelectronic elements can To be mainly used in execution logic function.At least one second microelectronic elements can have than providing the active of any other function The more active devices of device are providing memory array function.In certain embodiments, first micromodule At least some Second terminal of at least some the first terminal and the second micromodule can be arranged to face battle array.First microelectronics group Part and the second micromodule can be by adapter units, and joint unit is the conducting block of sintering metal.
In the exemplary embodiment, micromodule can pass through the joint unit of the peripheral disposition of neighbouring microelectronic component It is electrically interconnected to each other.In one example, joint unit may be located at the outside of the non-dense set central area of microelectronic component.In spy In fixed example, system can include micromodule as above and be electrically connected to one or more of micromodule Other electronic units.In certain embodiments, at least some terminal may be electrically connected to circuit board.In one example, it is System can also include housing, and micromodule and other electronic units are installed to the housing.
According to a further aspect in the invention, micromodule can include substrate, and the substrate has for relatively facing One surface and second surface and the hole extended between first surface and second surface;First microelectronic element, this is first micro- Electronic component has the front surface in the face of substrate first surface;And second microelectronic element, second microelectronic element has In the face of the front surface of the first microelectronic element.Substrate can have terminal.First microelectronic element can also be included away from front table The rear surface in face and the edge for extending between the front and back surfaces.First microelectronic element can have be exposed to before it Multiple terminals at the surface and edge of neighbouring first microelectronic element.Second microelectronic element can have the first relative side Edge and second edge.The front surface of the second microelectronic element can extend between first edge and second edge.
Second microelectronic element can have be arranged on the central area of its front surface and away from first edge and the second side Multiple contacts of edge.The front surface of the second microelectronic element can be protruded from outside the edge of the first microelectronic element.Microelectronics Component can also include the contact of the first microelectronic element is electrically connected to the first lead of terminal, by the second microelectronic element Contact is electrically connected to the second lead of terminal and the contact electricity by the contact of the first microelectronic element and the second microelectronic element 3rd lead of interconnection.First lead, the second lead and the 3rd lead can have the part alignd with hole.
In the exemplary embodiment, at least one of the first lead or the second lead can be included from the first microelectronics unit The line bonding that the contact of at least one of part or the second microelectronic element extends.In one embodiment, the first lead and The part alignd with hole of at least one of two leads can be the part of monolithic conducting element, and monolithic conducting element has edge Substrate extends to the Part II of terminal.In certain embodiments, micromodule can also include the second microelectronic element Front surface and the first surface of substrate between spacer element.In certain embodiments, the first microelectronic element can be wrapped Include for the chip of main execution logic function.In the exemplary embodiment, the second microelectronic element can have and appoint than providing The more active devices of active device of what its function are providing memory array function.In one embodiment, One microelectronic element can have the more active devices of active device than providing any other function to deposit to provide memorizer Storage array functional.
The present invention other aspect can provide by the micromodule of above-mentioned aspect of the invention with electrically connect To the system that its other electronic units combine.For example, terminal may be electrically connected to circuit board.In another example, system Single housing can be arranged in single housing and/or be installed to, the housing can be portable sandwich type element.It is of the invention this The system of the preferred embodiment of individual aspect can be more more compact than comparable conventional system.
In one embodiment, microelectronic component can include the first micromodule as above and the second microelectronics Component.First micromodule can electrically connect and can cover at least in part the second microelectronics group with the second micromodule Part.In the exemplary embodiment, micromodule can be by the joint unit that is arranged at the periphery of neighbouring microelectronic component It is electrically connected to each other.In certain embodiments, joint unit may be located at the outside of the non-dense set central area of microelectronic component. In one embodiment, some microelectronic elements can include volatile random access memory (RAM), some microelectronic elements Non-volatile flash memory can be included.In certain embodiments, at least one of the first microelectronic element is mainly useful and holds Row logic function, at least one of the second microelectronic element can have the active device than providing any other function more Active device is providing memory array function.
Another aspect of the invention, micromodule can include:Substrate, the substrate has what is relatively faced First surface and second surface and the hole extended between first surface and second surface;First microelectronic element, this first Microelectronic element has the front surface of the first surface in the face of substrate;And second microelectronic element, second microelectronic element With the front surface in the face of the first microelectronic element.Substrate can have terminal.First microelectronic element can also include away from The rear surface of front surface and the edge for extending between the front and back surfaces.First microelectronic element can have be exposed to Multiple contacts at its front surface and edge of neighbouring first microelectronic element.Second microelectronic element can have relative the One edge and second edge.The front surface of the second microelectronic element can extend between first edge and second edge.
Second microelectronic element can have be arranged on it away from first edge and the center of the front surface of second edge Multiple contacts in domain.The front surface of the second microelectronic element can be protruded from outside the edge of the first microelectronic element.Micro- electricity Sub-component can also include the contact of the first microelectronic element is electrically connected to the first lead of terminal, by the second microelectronic element Contact portion to the second lead of terminal, and the contact of the first microelectronic element is electrically connected to into the 3rd lead of terminal. First lead and the 3rd lead may be coupled to the terminal on the opposite side in hole.First lead, the second lead and the 3rd lead can With with the part alignd with hole.
In certain embodiments, the first microelectronic element can be included for the chip of main execution logic function. In exemplary embodiment, the second microelectronic element can have the more active dresses of the active device than providing any other function Put to provide memory array function.In one embodiment, the first microelectronic element can have than provide it is any its The more active devices of active device of its function are providing memory array function.
Yet another aspect of the invention, micromodule can include:Substrate, the substrate has what is relatively faced First surface and second surface and the hole extended between the first and second surfaces;First microelectronic element, first micro- electricity Subcomponent has the front surface of the first surface in the face of substrate;Second microelectronic element, second microelectronic element have face The front surface of the first microelectronic element;And the 3rd microelectronic element, the 3rd microelectronic element is arranged on the first table of substrate Between the front surface of face and the second microelectronic element.Substrate can have terminal.
First microelectronic element can also include away from front surface rear surface and prolong between the front and back surfaces The edge stretched.First microelectronic element can have be exposed at its front surface and the edge of neighbouring first microelectronic element it is many Individual contact.Second microelectronic element can have relative first edge and second edge.The front surface of the second microelectronic element Can extend between first edge and second edge.Second microelectronic element can have be arranged on its front surface away from the Multiple contacts in the central area of one edge and second edge.It is micro- that the front surface of the second microelectronic element can protrude from first Outside the edge of electronic component.3rd microelectronic element can be with relative first edge and second edge, in first edge The front surface that extends and second edge between and be arranged at front surface and neighbouring its first edge multiple contacts.3rd is micro- The front surface of electronic component can face the first surface of substrate.
Micromodule can also include the contact of the first microelectronic element is electrically connected to the first lead of terminal, by The contact of the 3rd microelectronic element is electrically connected to the of terminal by the contact portion of two microelectronic elements to the second lead of terminal Three leads and the 4th lead for being electrically interconnected the contact of the contact of the first microelectronic element and the 3rd microelectronic element.First is micro- The contact of the contact of electronic component and the 3rd microelectronic element may be located on the opposite side in hole.First lead, the second lead, Three leads and the 4th lead can have the part alignd with hole.
In one embodiment, micromodule can also be included the contact of the first microelectronic element and the second microelectronics The 5th lead that the contact of element is electrically interconnected.In certain embodiments, micromodule can also be included the second microelectronics The 6th lead that the contact of the contact of element and the 3rd microelectronic element is electrically interconnected.In certain embodiments, the first microelectronics Element can be included for the chip of main execution logic function.In the exemplary embodiment, the second microelectronic element can be with With the more active devices of active device than providing any other function providing memory array function.At one In embodiment, the first microelectronic element can have the more active devices of active device than providing any other function to carry For memory array function.
Description of the drawings
Referring now to each embodiment of the Description of Drawings present invention.It is to be appreciated that these accompanying drawings only describe this Some bright embodiments, therefore should not be taken as limiting the scope of the invention.
Figure 1A is the schematic cross-sectional front view for stacking micromodule according to an embodiment of the invention;
Figure 1B is the schematic cross-sectional front view for stacking micromodule according to an embodiment of the invention;
Fig. 1 C are the phantoms for stacking micromodule according to an embodiment of the invention;
Fig. 2 is the top view of the micromodule shown in Figure 1A;
Fig. 3 A are the schematic cross-sectional front views of stacking micromodule according to another embodiment of the present invention;
Fig. 3 B are the phantoms for further illustrating the embodiment described in Fig. 3 A;
Fig. 4 is the schematic cross-sectional front view of stacking micromodule according to still another embodiment of the invention;
Fig. 5 is the sectional view of the part for illustrating the stacking micromodule shown in Fig. 4;
Fig. 6 is the schematic cross-sectional front view for stacking micromodule according to an embodiment of the invention;
Fig. 7 is the schematic cross-sectional front view of stacking micromodule according to another embodiment of the present invention;
Fig. 8 is the schematic cross-sectional front view of stacking micromodule according to still another embodiment of the invention;
Fig. 9 A are the schematic cross-sectional front views of stacking micromodule according to another embodiment of the present invention;
Fig. 9 B are the top views of the stacking micromodule shown in Fig. 9 A;
Figure 10 is the schematic cross-sectional front view of the stacking micromodule of still another embodiment of the invention;And
Figure 11 is the schematic diagram of system according to an embodiment of the invention.
Specific embodiment
With reference to Figure 1A and Fig. 2, micromodule 10 is stacked according to an embodiment of the invention includes the first microelectronic element 12 and second microelectronic element 14, the back side of the first microelectronic element 12 is placed and in the face of substrate 30, and the second microelectronic element 14 is carried on the back Place and cover at least part of of the first microelectronic element 12 in face.In certain embodiments, the first microelectronic element 12 and second Microelectronic element 14 can be semiconductor chip, or including the element of semiconductor chip, the semiconductor chip has before it Contact at surface 16.Semiconductor chip can be the thin slice of semi-conducting material (such as silicon or GaAs), and can be set For independent pre-packaged units.Semiconductor chip can be the thin slice of semi-conducting material (such as silicon or GaAs), and can quilt It is set to independent pre-packaged units.Semiconductor chip can be equipped with active circuit element (for example, transistor, diode Deng), or passive electric circuit element (such as resistance, inductively or capacitively etc.), or active and passive electric circuit element combination." active " In semiconductor chip, the active circuit element in each microelectronic element is typically electrically connected in one or more " integrated circuits " It is connected together.First microelectronic element and the second microelectronic element all can be as discussed below be electrically connected to substrate 30.Substrate 30 can be electrically connected to circuit board, such as printed circuit board (PCB) by the terminal 36 at its surface again.In a particular embodiment, microelectronics Component 10 can be with the micro- of the terminal for being used to be electrically connected with the corresponding contacts on the face of circuit board (such as printed circuit board (PCB) etc.) Electronics " encapsulation ".
In a particular embodiment, substrate can be the medium element of various structures, and such as polymeric material or inorganic material are (for example Ceramics or glass) medium element, substrate has a conducting element thereon, such as terminal and the conduction that electrically connects with terminal Element (such as trace, substrate contact or with other conducting elements).In another example, substrate can be substantially by semi-conducting material (such as silicon) is constituted, or alternatively includes semiconductor material layer and one or more dielectric layer.This substrate can have low In the thermal coefficient of expansion of 7/1000000ths per degree Celsius (" 7ppm/ DEG C ").In yet another embodiment, substrate can be with pin Lead frame, wherein terminal can be pin part, the end of such as pin.In yet another embodiment, substrate can be Lead frame with lead, wherein terminal can be the part of lead, the end of such as lead.
First microelectronic element 12 can include being mainly used in the semiconductor chip of execution logic function, such as microprocessor Device, application-specific IC (ASIC), field programmable gate array (FPGA) or other logic chips etc..Specifically implementing In example, microelectronic element 12 can be controller or the main core for providing logic function but can also including memory array SOC(system on a chip) (SOC).In other examples, the first microelectronic element 12 can include or storage chip (for example, flash memory (" or It is non-" or NAND) chip, dynamic random access memory (DRAM) chip or static random access memory (SRAM) chip), or It is mainly used in performing some other functions.This storage chip includes memory array, and typically has than offer times The more active circuit elements of active circuit element (for example, active device, such as transistor) of what its function are providing storage Device storage array function.First microelectronic element 12 has front surface 16, away from front surface behind 18, and front surface with The first edge 27 for extending between surface afterwards and second edge 29.Electric contact 20 is exposed to the front surface of the first microelectronic element 12 Place and neighbouring second edge 29.As used in the present invention, conducting element " is exposed to " description at the surface of structure and represents and leads Electric device can be used for on the direction vertical with the surface of dielectric structure from the outside of dielectric structure towards the surface of dielectric structure Mobile theoretical punctiform contact.Therefore, the terminal being exposed at the surface of structure or other conducting elements can be prominent from such surface Go out;Can be with such flush;Or can be recessed and by the hole in dielectric structure or recess relative to such surface Exposure.Electric contact 20 may include bonding welding pad or other conductive structures (such as salient point, binding post etc.).Bonding welding pad can include One or more metal (such as copper, nickel, gold or aluminum), and can be about 0.5 μ m-thick.The big I of bonding welding pad is with dress Put the change of type and change, but its side will be typically from tens microns to hundreds of micron.
Second microelectronic element 14 has front surface 22, away from the rear surface 24 of front surface, front surface and rear surface it Between the first edge 35 that extends and second edge 37 and the contact 26 that is exposed at front surface 22.As shown in Figure 1A, first is micro- The microelectronic element 14 of electronic component 12 and second is stacked with, so as at least part of covering first of the second microelectronic element 14 it is micro- Electronic component 12 it is at least part of.In certain embodiments, as shown in Figure 1A, the front surface 22 of the second microelectronic element 14 is wrapped Include first end region 21 and second petiolarea domain 23 and the center extended between first end region 21 and second petiolarea domain 23 Domain 19.First end region 21 extends between central area 19 and first edge 35, and second petiolarea domain 23 is in the He of central area 19 Extend between second edge 37.Between the first edge 35 and second edge 37 of extensible second microelectronic element 14 in central area Distance 1/3rd, first end region and second petiolarea domain can each extend over the three of the distance between edge 35 and edge 37 / mono-.Electric contact 26 is exposed at the front surface 22 of the second microelectronic element 14.For example, contact 26 may be disposed to neighbouring front table The a line at the center in face 22 or two parallel rows.Second microelectronic element 14 may include or can be dram chip.This DRAM Chip includes memory array, and typically has the active circuit element than providing any other function more active Component (for example, active device, such as transistor) is providing memory array function.In second microelectronic element 14 Outside the second edge 29 at least partly protruding from the first microelectronic element 12 in heart district domain 19, so as to the second microelectronic element 14 Contact 26 be exposed to outside the second edge 29 of the first microelectronic element 12.As discussed above, in one embodiment, serve as a contrast Bottom 30 may include the dielectric layer with the first surface 34 and second surface 32 for relatively facing.One or more conducting elements or Terminal 36 is exposed at the second surface 32 of substrate 30.In a particular embodiment, some or all terminals 36 can be with regard to first The microelectronic element 14 of microelectronic element 12 and/or second is moveable.
Substrate 30 is further included between its relative first surface and second surface (for example, in medium element 30 Between the first surface and second surface of opposite face pair) extend one or more holes.In the embodiment shown in Figure 1A, substrate 30 include hole 39 and at least some contact 26 alignd with the hole 39 of substrate 30.A plurality of leads is by the contact of the second microelectronic element 26 electrically connect with the terminal 36 of micromodule.Lead has the part alignd with hole 39.For example, lead may include to be bonded to lining The line bonding 52 of bottom contact, substrate contact (for example, is prolonged again by the other parts of lead along semiconductor element or medium element 30 The metal trace stretched) terminal 36 is connected to, or if substrate includes lead frame, lead may include the part of its pin.
The first surface 34 of medium element 30 can be arranged side by side with the front surface 16 of the first microelectronic element 12.Such as Figure 1A institutes Show, substrate 30 can extend to the second edge 35 of the microelectronic element 14 of first edge 27 and second of the first microelectronic element 12 Outside.In this example, including the substrate of dielectric material can be referred to as " medium element " 30, no matter its be partly or fully by Any suitable dielectric material is made.Substrate 30 partly or wholly can be made up of any suitable dielectric material.For example, Substrate 30 can include flexible material layer, such as polyimide layer, BT resin beds or be commonly used to manufacture tape automated bonding (TAB) other layer of dielectric material of band.Alternatively, substrate 30 may include the board-like material of relative stiffness, such as fiber reinforcement ring The thick-layer of oxygen tree fat, for example, Fr-4 plates or Fr-5 plates.No matter using which kind of material, substrate 30 can be by single layer or multiple layers of group Into.
Figure 1A is returned, spacer element or support component 31 can be placed in the He of first end region 21 of the second microelectronic element 14 Between a part for medium element 30.Spacer element 31 can help that the second microelectronic element is supported on the top of substrate 30.This Kind of spacer element 31 can by such as dielectric material (such as silicon diode or other materials), semi-conducting material (such as silicon) or One or more layers binding agent or other polymeric materials are made.In a particular embodiment, spacer element can include metal or by Metal is made.If spacer element includes binding agent, the second microelectronic element 14 can be connected to substrate 30 by binding agent.One In individual embodiment, spacer element 31 can have and the first microelectronics in the vertical direction of the first surface 34 for being basically perpendicular to substrate The of substantially equal thickness of the thickness of the first microelectronic element 12 between the front surface 16 of element 12 and rear surface 18.Such as Fig. 1 institutes Show, if spacer element 31 includes binding agent, the second microelectronic element 14 can be connected to medium element 30 by the binding agent.
As shown in Figure 1A and Fig. 2, substrate 30 can also include conducting element or substrate contact 40 and be exposed to the second table Conductive trace 25 on face 32.Substrate contact 40 is electrically coupled to terminal 36 by conductive trace 25.Commonly assigned U.S. can be used State applies for the method illustrated in open No.2005/0181544 to produce trace 25 and substrate contact 40 that the disclosure of which passes through It is incorporated herein by reference.
Figure 1A is returned to, spacer element or support component 31 (such as adhesive layer) can be placed on the of the second microelectronic element 14 Between a part for hospital areas 21 and substrate 30.If spacer element 31 includes binding agent, the binding agent can be micro- by second Electronic component 14 is connected to substrate 30.As shown in Figure 1A, the second petiolarea domain 23 of the second microelectronic element 14 can be by bonding Material 60 binding agent 60 of conduction of heat (such as can) is bonded to the second petiolarea domain 17 of the first microelectronic element 12.Similarly, key Condensation material 61, such as binding agent (alternatively, the binding agent of conduction of heat), can by the first end region of the second microelectronic element and It is bonded every element 31.Bonding material 71 can be arranged on the of the major part of the front surface 16 of the first microelectronic element and substrate 30 Between the part on one surface 34.In certain embodiments, bonding material 60,61 and/or 71 can be partly or wholly It is made up of substrate bond binding agent, and in specific example, can be made up of low modulus of elasticity materials (such as silicone elastomer).So And, in certain embodiments, if two microelectronic elements 12,14 are the conventional semiconductor chips being formed from the same material, So bonding material 60,61 and/or 71 wholly or partly can be made up of high elastic modulus binding agent or solder, this be because For in response to temperature change, microelectronic element is expanded or shunk in which will reach unanimity.No matter using which kind of material, spacer element 31 can include single layer or multilamellar.Discuss in detail below in conjunction with Fig. 4-8, spacer element 31 could alternatively be one or more Microelectronic element.
With reference to Figure 1A and Fig. 2, micromodule can be included the contact 20 of the first microelectronic element and at least some end The lead 70 of the electrical connection of son 36.Lead 70 has the part alignd with the hole 39 of substrate 30.In one embodiment, lead can be with Including bonding elements 70, such as extend through via 39 and be bonded to the line bonding of the contact 20,40 of microelectronic element and substrate.Trace (not shown) can be between contact 40 and terminal 36 substrate extend.In a modification, bonding line 70 can include extending Through hole 39 and it is electrically connected to the line bonding 72 of substrate contact 40.Contact 20 is electrically coupled to substrate 30 by each of line bonding 72 Respective substrate contact 40.Line bonding 70 can be included filed in 19 days October in 2010, entitled " Enhanced Stacked Microelectronic Assemblies with Central Contacts and Improved Thermal The U.S. Patent application No.12/907 of Characteristics ", the multi-thread bonding structure described in 522, in its entire disclosure Appearance is incorporated herein by.As mentioned above and as shown in Fig. 2 substrate contact 40 is electrically connected to terminal 36 by trace 25.Cause This, lead 50 can include line bonding 52, at least some substrate contact 40, and at least some trace 25.All these elements The foundation of the electrical connection between contact 20 and terminal 36 to the first microelectronic element 12 is contributed.
As shown in Figure 1B, alternately or additionally, lead (such as wire bonding 76) can be along substrate as depicted 30 First surface 34 extends or extends into hole 39 to be connected to contact 20 along second surface.Wire bonding 76 may be electrically connected to lead to Hole 83, or one or more terminals 36 being electrically connected at the second surface for extending to substrate 30 from first surface 34 it is any its The conducting element of his type.Therefore, lead 70 can include wire bonding 76 and through hole 83.As further shown in Figure 1B, micro- electricity Sub-component 10 can include the electricity of substrate contact 40 of the second surface 32 by the contact 26 of the second microelectronic element 14 Yu substrate mutually Wire bonding 85 even.
Micromodule 10 further includes for the contact 26 of the second microelectronic element 12 to be electrically connected to the second of substrate 30 The lead 50 of at least some terminal 36 at surface 32.Lead 50 has the part alignd with hole 39, it is possible to include second The contact 26 of microelectronic element is electrically connected to many line bondings 52 of the substrate contact 40 at the second surface 32 of substrate 30.Line bonding 52 can extend through via 39.Contact 26 is electrically coupled to each line bonding 52 the respective substrate contact 40 of substrate 30.Lead 50 Can include as filed in 19 days October in 2010, entitled " Enhanced Stacked Microelectronic The U.S. of Assemblies with Central Contacts and Improved Thermal Characteristics " Patent application No.12/907, the multi-thread bonding structure described in 522, the entire disclosure is incorporated herein by.As schemed Shown in 2, substrate contact 40 is electrically connected to terminal 36 by trace 25.Therefore, lead 50 can include line bonding 52, at least some lining Bottom contact 40 and at least some trace 25.Contact 26 and terminal 36 of all these elements to the second microelectronic element 14 it Between the foundation of electrical connection contribute.Alternately or additionally, lead 50 can include the first table by contact 26 and substrate 30 The wire bonding that some substrate contacts at face 34 or at the second surface 32 of substrate are electrically connected.Wire bonding need not be extended through The hole 39 of substrate 30, but align with hole at least in part.
Micromodule 10 can also include at least covering the bag of the first microelectronic element 12 and the second microelectronic element 14 Rubber moulding (overmold) or sealant 11.As shown in Figure 1A, rubber-coating module 11 can also be covered and extend the first microelectronic element The part of the substrate 30 outside the first edge 35 of the microelectronic element 14 of first edge 27 and second.Therefore, rubber-coating module 11 can be with At least contact first edge 27, the first edge 35 of the second microelectronic element 14 and the substrate 30 of the first microelectronic element 12 First surface 34.Rubber-coating module 11 can be made up of any suitable material, including epoxy resin etc..
As filed in 19 days October in 2010, entitled " Enhanced Stacked Microelectronic The U.S. of Assemblies with Central Contacts and Improved Thermal Characteristics " Patent application No.12/907, described by 522, micromodule 10 can extraly include being attached to one or more first micro- The radiator or heat sink on the rear surface of the microelectronic element 14 of electronic component 12 or second, the entire disclosure is by quoting simultaneously Enter herein.In certain embodiments, micromodule 10 includes being thermally coupled to the first microelectronic element 12 and/or the second microelectronics The radiator that (edge surface 27,35,37 may be thermally coupled to) 18,24 behind one or more of element 14.Radiator can be with Occupy some parts in the region occupied by the rubber-coating module 11 shown in Figure 1A.
In addition, micromodule 10 can also include connecing for the terminal 36 being attached on the second surface 32 of medium element 30 Close unit 81.Joint unit 81 can be soldered ball or other bonding blocks and metal (such as stannum, indium or its combination) block, and be applied to Micromodule 10 is engaged and is electrically coupled to circuit board (such as printed circuit board (PCB)).
As shown in Figure 1 C, the lead 50 of micromodule 10 can additionally or optionally be included the first microelectronic element The line bonding 53 that 12 at least some contact 20 electrically connects with least some substrate contact 40 on the opposite side in hole 39.Cause This, line bonding 53 can be across the hole of substrate 30.Additionally, lead 70 can alternately or additionally be included the first microelectronics unit The line bonding 73 that at least some contact 20 of part 12 electrically connects with least some contact 26 of the second microelectronic element 14.
Fig. 3 A describe the modification 10 ' of the micromodule 10 shown in Figure 1A.In this variant, the place of surface 16 ' is replaced Contact 20 (or in addition to the contact 20 at the place of surface 16 '), the first microelectronic element 12 ' can include dorsad substrate 30 ' The place of surface 18 ' contact 20 '.This surface 18 ' can be the front surface of the first microelectronic element 12 '.Surface 18 ' can have There are first end section 82, the second end of neighbouring second edge 29 ' of the first edge 27 ' of neighbouring first microelectronic element 12 ' The core 86 divided between 84, and first end section 82 and second end section 84.Contact 20 ' can be positioned adjacent to first In the first end section 82 on the surface 18 ' at edge 27 ', in the core 86 on surface 18 ', or at first end section and center In part.In one embodiment, contact 20 ' may be arranged to a line at the core 86 on surface 18 ' or parallel two OK.
Micromodule 10 ' can include the lead 88 that the contact 20 ' with the place of surface 18 ' and terminal 36 are electrically connected. In one example, the part (such as line bonding) of lead 88 can extend beyond the first edge 27 ' of the first microelectronic element 12 ' Contact 40 ' is reached, contact 40 ' for example can be connected to terminal by trace (not shown) or other conducting elements again.Lead 88 Line bonding 90 can be included, line bonding 90 starts to extend from contact 20 ', more than the first edge 27 ' of the first microelectronic element, arrives Contact 40 ' up at the first surface of substrate 30 ', and lead 88 can include other conductive structures of substrate, such as contact And the conductive trace between terminal 36.As shown in Figure 3 B, lead portion 52 ', such as line bonding, can be by microelectronic element 14 ' Contact 26 be connected to the either side in hole 39 ' or both sides on contact 40 '.
Fig. 4 and Fig. 5 describe the modification of the micromodule 10 shown in Figure 1A.The class of micromodule 10 shown in Figure 1A The micromodule 10 ' being similar to shown in Fig. 3 A, the two all has the first microelectronic element (12,12 ') that front is placed.At this In individual modification, the 3rd microelectronic element 112 placed using flip-chip replaces spacer element 31.But, shown specific In view, the first microelectronic element 101 occurs in the right side of figure, and the 3rd microelectronic element 112 occurs in the left side of figure.3rd is micro- Electronic component 112 is included in the multiple contacts 120 at its front surface 116.The contact 120 of the 3rd microelectronic element 112 and substrate At least some contact 136 at 130 second surface 132 connects.
Contact 120 on the front surface 116 of the 3rd microelectronic element 112 is passed through metal salient point by flip-chip interconnection 143 At least some contact 141 that (for example, such as the bond wire of solder) is electrically connected on the first surface 134 of substrate 30.Then it is anti- Turn microelectronic element, lead to so that metal salient point provides electricity of the contact (for example, bonding welding pad) of microelectronic element and substrate between Road and the mechanical attachment of microelectronic element to substrate.Controlled collapsible chip connec-tion has many modifications, but a kind of conventional configuration is Using solder as metal salient point and the method melted as bonding welding pad and substrate is secured it to using solder.Work as weldering During material fusing, it is flowable forming intercept sphere.
Flip-chip be mutually linked as the 3rd microelectronic element 112 provide than by line bonding be connected to medium element other are micro- I/O (input/output) more than electronic component.Additionally, flip-chip interconnection by the second microelectronic element 114 and medium element 30 it Between line bonding path minimum, so as to reduce the impedance of line bonding.
In the embodiment shown in Fig. 4 and Fig. 5, flip-chip interconnection 143 can include being arranged on the 3rd microelectronic element Multiple solid metal salient points 145 between 112 and substrate 130, such as soldered ball.Metal salient point 145 can be conducting sphere or conduction Binding post.Each solid metal salient point 145 can be arranged on the contact 120 of the 3rd microelectronic element 112 and the substrate of substrate 130 Between contact 141 (and contacting with them), so as to provide the electrical connection between electric contact 120 and conducting element 141.Metal salient point 145 can be made up of jointing metal or any other suitable material substantially.
Underfill may 147 can surround solid metal salient point 145 the 3rd microelectronic element 112 is adhered to into substrate 130.Bottom Fill glue 147 can be typically provided at the 3rd microelectronic element 112 front surface 116 and substrate 130 first surface 134 it Between, the 3rd microelectronic element 112 is connected to into substrate 130.For example, underfill may 147 can wholly or partly by being polymerized Material (such as epoxy resin) is made.But, in certain embodiments, underfill may is omitted entirely.
Fig. 6 shows the modification of the micromodule 100 shown in Fig. 4.Micromodule 200 is similar to micromodule 100, but not including that the first microelectronic element is electrically connected to into the flip-chip interconnection of substrate contact.Conversely, the first microelectronics The front of element 212 is placed, and a line including neighbouring its first edge 227 or the contact 220 of parallel multirow.Lead 270 will Contact 220 is electrically connected to the terminal 236 on the second surface 236 of substrate 230.
Lead 270 can include line bonding, and line bonding starts to extend from contact 220, more than the first microelectronic element 212 First edge 227, reaches the substrate contact 240 at the second surface 234 of substrate 230.Additionally, lead 270 can include through hole 283 or any other suitable conducting element for electrically connecting substrate contact 240 and at least some terminal 236.Through hole 283 can be with The second surface 232 that substrate 230 reaches substrate 230 is extended through from first surface 234.
Micromodule 200 also includes being electrically connected to the contact 226 at the front surface 222 of the second microelectronic element 214 The lead 250 of at least some terminal 236.Align with the hole 239 of substrate 230 part of lead 250.In this variant, lead 270 include extending through many line bondings 252 of via 239 from contact 226.Line bonding 252 may be electrically connected to be located at substrate 230 Substrate contact 240 on the opposite side at second surface and hole 239.
Fig. 7 describes the modification of the micromodule 200 shown in Fig. 6.Micromodule 300 shown in Fig. 7 is substantially similar In the micromodule 200 shown in Figure 1A or 1B, but micromodule 300 has the 3rd microelectronics unit for replacing spacer element 31 Part 301, the 3rd microelectronic element has the mutual with the electricity of substrate of the electrical interconnection (such as Figure 1A) similar to the first microelectronic element 12 Even.
Fig. 8 describes the modification of the micromodule 300 shown in Fig. 7.In this variant, shown micromodule On 400 parts (such as circuit board 900, such as printed circuit board (PCB)) mounted externally, and including extra electrical connection or lead.Though So only Fig. 8 shows the micromodule being electrically mounted on circuit board (such as printed circuit board (PCB)), but hereinbefore appoints What micromodule can be attached to circuit board or micromodule outside miscellaneous part.
Micromodule 400 can include extending across via 439 and by the contact 420 of the first microelectronic element 412 and the The electrical connection of the electrical connection of contact 490 of three microelectronic elements 401 or lead 474.Lead 474 can include line bonding and/or draw Line bonding.Another group of electrical connection or lead 476 can align at least in part with the hole 439 of substrate 430, and by the first microelectronics At least some contact 420 of element 412 electrically connects with least some contact 426 of the second microelectronic element 414.Lead 476 can With including line bonding and/or wire bonding.Again another group of electrical connection or lead 478 at least in part with 430 pairs, the hole of substrate 430 Together, and by least some contact 490 of at least some microelectronic element 401 of contact 426 and the 3rd of the second microelectronic element 414 Electrical connection.Lead 478 can include line bonding and/or wire bonding.
Fig. 9 A show the stacking modification of the side schematic sectional view shown in Figure 1A.Microelectronic component 500 can have heap Folded the first micromodule 510a and the second micromodule 510b (being referred to as micromodule 510).Each microelectronics group Part 510 can be any micromodule above with reference to Figure 1A to Fig. 8 descriptions, and micromodule can be with mutually the same or not Together.There can be any number of micromodule 510 in stacking, for example, as shown in Figure 9 A, including two micromodule 510a And 510b.
Such as soldered ball of joint unit 581 can each other meet the first micromodule 510a and the second micromodule 510b Close and electrically connect each other.This joint unit 581 can be attached to the of the substrate 530 for being exposed to the first micromodule 510a Terminal 536 at two surfaces 532 and the end being exposed at the first surface 534 of the substrate 530 of the second micromodule 510b Son 536 '.Can be by being exposed to the top table of microelectronic component 500 including the microelectronic component 500 of stacking micromodule 510 Joint unit 581 at face 501 or basal surface 502 is attached to circuit board (such as printed circuit board (PCB)).
As shown in Figure 9 B, microelectronic component 500 can include the joint unit that the periphery 503 of neighbouring microelectronic component is arranged 581.Joint unit 581 may be located at the outer of non-dense set (sparse, the depopulated) central area 590 of microelectronic component 500 Side.In such an embodiment, joint unit may be arranged to not cover the He of the first microelectronic element 512 of micromodule 510 Second microelectronic element 514.This embodiment can allow the multiple micromodules 510 being bonded together to have than at center Region 590 includes the lower stacks as high of the microelectronic component 500 of joint unit 581.
As shown in Figure 9 A, microelectronic component 500 can have the first microelectronics at least partly covering micromodule 510 The single sealant 511 of the microelectronic element 514 of element 512 and second.In such an embodiment, micromodule 510 can not It is engaged with each other by sealing, it is then possible to the single sealing of the microelectronic element in forming the microelectronic component for covering engagement Agent 511.Sealant 511 can cover being not used in and one or more parts outside microelectronic component for microelectronic component 500 The part of electrical connection.
In an alternate embodiment of the invention, each micromodule 510 can be independently formed, and each has respective sealant, Similar to the embodiment shown in Figure 10.In this each micromodule 510 has the embodiment of the sealant for independently forming, The micromodule of these sealings can overlie one another and engagement, for example, structure as shown in Figure 10 is stacked into, so as to provide that This electric connection.
In specific example, microelectronic component 500 can serve as non-uniform memory, for example, can be used for smart mobile phone Using.In such examples, some microelectronic elements 512,514 in micromodule 510 can be included such as volatibility RAM Memory storage element, some microelectronic elements 512,514 can include the memory storage element such as non-volatile flash memory.
Figure 10 shows the stacking modification of the side schematic sectional view shown in Fig. 9 A.Microelectronic component 600 can have heap Folded the first micromodule 610a and the second micromodule 610b (being referred to as micromodule 610).Each microelectronics group Part can be any one of the micromodule above with reference to Figure 1A to Fig. 8 descriptions, and micromodule can with mutually the same or It is different.There can be any number of micromodule 610 in stacking, it may for example comprise two micromodules as shown in Figure 9 A 610a and 610b.
Except at least some joint unit 681 covers micromodule 612 and 614 and micromodule 610a and 610b Each can independently form and with respective sealant 611a and 610b outside, microelectronic component 600 and Fig. 9 A and Fig. 9 B Shown in microelectronic component 500 it is identical.In an alternate embodiment of the invention, microelectronic component 600 can have and cover at least in part First microelectronic element 612 of lid micromodule 610 and the single sealant of the second microelectronic element 614, similar to Fig. 9 A Shown single sealant 511.
As shown in Figure 10, micromodule 610 can be engaged with each other and be electrically connected each other by joint unit 681.It is this to connect Closing unit 681 can be attached to the terminal 636 being exposed at the second surface 632 of the substrate 630 of the first micromodule 610a And the terminal 682 being exposed at the top surface 603 of the sealant 611b of the second micromodule 610b.Terminal 682 can lead to Cross line bonding 604 and electrically connect with the conducting element 636 ' being exposed at the first surface 634 of substrate 630.It is exposed to sealant Some of terminal 682 at the top surface 603 of 611a or 611b can cover at least one of microelectronic element 612 and 614. The microelectronic component of this micromodule 610 that microelectronic element 612 and at least one of 614 is covered with terminal 682 In 600, the terminal 682 and 636 of each micromodule 610 can be arranged to face battle array, such that it is able to allow micromodule 610 Face battle array stacking.
Being exposed to the terminal 682 at the top surface 603 of sealant 611a or 611b can extend on the top, Ke Yiyu Top surface is flushed, or can be recessed under top surface.This terminal 682 can be any shape, including such as plate-like (pad- ) or spherical shape like.On May 3rd, 2011 is pending while application and commonly owned korean patent application No.10- The other shapes and the example of structure of terminal 682 and line bonding 604, the disclosure of which are illustrated and described in 2011-0041843 It is incorporated herein by.
Line bonding 604 is joined to conducting element 636 ' at its pedestal 607, and may extend into away from the He of each pedestal 607 The free end 608 of substrate 630.The feature of the free end 608 of line bonding 604 is free because they not with micromodule Microelectronic element 612,614 or (being then connected to microelectronic element 612,614) any other conductive features in 610a is electrically connected Connect or otherwise engage.In other words, free end 608 can be used for by soldered ball or other features being discussed herein directly or Ground connection is electrically connected to the conductive features outside micromodule 610a.For example, by sealant 611 or electric with another conductive features Connect or the fact that otherwise engage and be held in a predetermined position free end 608 do not mean that they are not as retouched herein " freedom " stated, as long as any this feature is not electrically connected with microelectronic element 612,614.On the contrary, pedestal 607 is not It is free, because it is directly or indirectly electrically connected to as described herein microelectronic element 612,614.
Line bonding 604 can be made up of conductive material (such as copper, gold, nickel, solder, aluminum).Extraly, line bonding 604 can To be made up of combined material, such as by the core with conductive material (for example, copper or aluminum) (for example, with being coated in core Coating) make.Coating can be made by the second conductive material (for example, aluminum, nickel etc.).Alternatively, coating can be by Made by insulant, such as insulating jacket.In embodiment, the wire for forming line bonding 604 can have about 15 μm To 150 μm of thickness (that is, perpendicular to wire length size).
The free end 608 of line bonding 604 has end surfaces 638.End surfaces 638 can be formed by multiple line bondings 604 At least a portion of contact in the array that each end surfaces is formed.Partial line bonding 604 can be kept not by sealant 611a covers (alternatively referred to as unsealing), so that line bonding can be used to be electrically connected with the feature or element on the outside of sealant Connect.In embodiment, the end surfaces 638 of line bonding 604 keep not covered by sealant 611a, and can be exposed to sealant At top surface 603.Other embodiment is feasible, wherein in addition to end surfaces 638 are not covered by sealant, or replace not The end surfaces 638 covered by sealant a, part for the edge surface 605 of line bonding 604 is not covered by sealant 611a.Change speech It, sealant 611a can cover from first surface start and its on all micromodule 610a, except line bonding 604 A part, such as end surfaces 638, edge surface 605 or the combination of the two.
In one embodiment, end surfaces 638 and partial edge surface 605 can not be covered by sealant 611a.It is logical Cross permission solder to engage along edge surface 605 tin plating (wick) and with edge surface 605 and end surfaces 638, this configuration can To provide the connection (such as by soldered ball etc.) with another conducting element.In the illustrated embodiment, surface is (such as sealant 611a Top surface 603) sufficiently large distance can be spaced apart with the first surface 634 of substrate 630 with cover microelectronic element 612, 614.Correspondingly, the embodiment of the end 638 of the line bonding 604 micromodule 610a concordant with top surface 630 can include The line bonding 604 than the high height of microelectronic element 612,614 is extended on substrate 630.
Can be using the top table for being exposed to microelectronic component 600 including the microelectronic component 600 of stacking micromodule 610 Joint unit 681 at face 601 or basal surface 602 is attached to circuit board (such as printed circuit board (PCB)).
In particular example, microelectronic component 600 can serve as non-uniform memory, such as be used for smart mobile phone application. In such example, some microelectronic elements 612,614 in micromodule 610 can include the storage such as volatibility RAM Device memory element, some microelectronic elements 612,614 can include the memory storage element such as non-volatile flash memory.
Although the enforcement shown in Fig. 9 A, Fig. 9 B and Figure 10 be illustrated by line bonding be electrically connected to substrate contact it is micro- Electronic component, but in other embodiments, this microelectronic element can be by other connection configurations (including such as lead key Conjunction and flip-chip are attached to one or more microelectronic elements of the contact of substrate) it is electrically connected to the contact of substrate.
As shown in figure 11, above-mentioned micromodule can be used for building various electronic systems.For example, one is entered according to the present invention The system 1100 of step embodiment includes the above-mentioned micromodule 1106 in combination with other electronic units 1108 and 1110.Showing In the example for going out, part 1108 is semiconductor chip, and part 1110 is display screen, but can be using any other part. Certainly, although for the clearness of explanation, two extra parts are merely illustrated in Figure 11, system can include any amount This part.Micromodule 1106 can be any one of said modules.In further modification, it is possible to use any This micromodule of quantity.
Micromodule 1106 and part 1108,1110 are arranged in common housing 1101 (being shown in dashed lines) And be electrically interconnected to each other to form desired circuit when necessary.In the example system for illustrating, system includes circuit board 1102 (such as flexible printed circuit board), circuit board includes that by part many conductors 1104 interconnected amongst one another Figure 11 only illustrates one Conductor.However, this is only exemplary, it is possible to use for making any appropriate structure of electrical connection.Housing 1101 is shown It is the portable sandwich type element of the available type in such as mobile phone or personal digital assistant, screen 1110 is exposed to the table of housing At face.In the case where structure 1106 includes photo-sensitive cell (for example, imager chip), may be provided for directing the light to this The lens 1111 or other Optical devices of structure.Additionally, what the system of the simplification shown in Figure 11 was merely exemplary;Can use Above-mentioned structure forms other systems, including the system for being typically considered fixed structure, such as desktop computer, router etc..
Although describing the present invention by reference to certain specific embodiments herein, it should be understood that these embodiments are only It is the explanation to principles and applications.It is to be understood, therefore, that without departing from defined in the appended claims In the case of the spirit and scope of invention, various modifications can be carried out to illustrative embodiment described above and other cloth can be designed Put.
It should be understood that each dependent claims for illustrating and feature can be presenting with original claim herein The different mode of mode is combined.It will also be appreciated that with reference to the description of each embodiment feature can with the embodiment other Feature is shared.

Claims (42)

1. a kind of micromodule, including:
Substrate, the substrate has the first surface for relatively facing, second surface and in the first surface and the second table The hole extended between face, the substrate has the first terminal being exposed at its second surface;
First microelectronic element, first microelectronic element have in the face of the substrate first surface front surface, away from The rear surface of the front surface, and the edge extended between the front surface and rear surface, first microelectronic element Be exposed at its described front surface and neighbouring first microelectronic element the edge multiple contacts;
Second microelectronic element, second microelectronic element has relative first edge and second edge, described first The front surface extended between edge and second edge, and it is arranged on the central area of its front surface and away from the first edge With multiple contacts of second edge, the front surface of second microelectronic element is in the face of first microelectronic element and protrudes from Outside the edge of first microelectronic element;
The contact of first microelectronic element is electrically connected to the first terminal by the first lead, first lead;
Second lead, second lead is by the contact portion of second microelectronic element to the first terminal, institute State the first lead and the second lead has the part alignd with the hole;
Second terminal, the Second terminal is exposed to the micromodule relative with the second surface of the substrate At surface, Second terminal covering first microelectronic element and second microelectronic element described in wherein at least some are extremely Lack one and electrically connected with the conducting element being exposed at the first surface of the substrate by line bonding;And
Sealant, the sealant covers at least in part first microelectronic element and the second microelectronic element and at least The partial line bonding, wherein the surface of the Second terminal exposure micromodule at which is described close The surface of envelope agent,
Wherein described line bonding has unsealing edge surface, and the unsealing edge surface is located at and is attached to the conducting element The line bonding pedestal and the end away from the line bonding of the conducting element between, wherein the Second terminal with The unsealing edge surface electrical connection.
2. micromodule according to claim 1, wherein the line bonding has away from the not close of the conducting element Terminated surface, the edge surface extends between the pedestal and the unsealing end surfaces, and the sealant does not cover institute Unsealing end surfaces are stated, wherein the Second terminal is electrically connected with the unsealing end surfaces and the unsealing edge surface.
3. micromodule according to claim 1, wherein first microelectronic element and second microelectronic element At least one include volatile random access memory, and first microelectronic element and second microelectronic element At least one includes non-volatile flash memory.
4. micromodule according to claim 1, further includes the contact of first microelectronic element The 3rd lead being electrically interconnected with the contact of second microelectronic element, first lead, the second lead and the 3rd draw Line has the part alignd with the hole.
5. micromodule according to claim 1, wherein at least one of first lead or second lead bag Include the line bonding extended from the contact of at least one of first microelectronic element or the second microelectronic element.
6. micromodule according to claim 1, wherein at least one of first lead and second lead The part alignd with the hole is the part of monolithic conducting element, and the monolithic conducting element has along substrate extension To the Part II of the first terminal.
7. micromodule according to claim 1, further includes the described front table in second microelectronic element Spacer element between face and the first surface of the substrate.
8. micromodule according to claim 1, wherein first microelectronic element includes being patrolled for main execution Collect the chip of function.
9. micromodule according to claim 1, wherein second microelectronic element have it is more any other than providing The more active devices of active device of function are providing memory array function.
10. micromodule according to claim 1, wherein first microelectronic element have it is more any other than providing The more active devices of active device of function are providing memory array function.
11. micromodules according to claim 1, further include the contact of first microelectronic element The 3rd lead of the first terminal is electrically connected to, first lead and the 3rd lead are connected on the opposite side in the hole The first terminal, first lead, the second lead and the 3rd lead have the part alignd with the hole.
12. micromodules according to claim 1, further include:
3rd microelectronic element, the 3rd microelectronic element is arranged on the first surface and second microelectronics of the substrate Between the front surface of element, the 3rd microelectronic element has relative first edge and second edge, described The front surface extended between one edge and second edge, and be arranged on its described front surface and adjacent to the first edge Multiple contacts, the front surface of the 3rd microelectronic element faces the first surface of the substrate;
The contact of the 3rd microelectronic element is electrically connected to the first terminal by the 3rd lead, the 3rd lead; And
4th lead, the 4th lead is mutual by the contact electricity of first microelectronic element and the 3rd microelectronic element Even, the contact of first microelectronic element and the 3rd microelectronic element is located on the opposite side in the hole, and described first Lead, the second lead, the 3rd lead and the 4th lead have the part alignd with the hole.
13. micromodules according to claim 12, further include the 5th lead, and the 5th lead is by described The contact of one microelectronic element and the second microelectronic element is electrically interconnected.
14. micromodules according to claim 13, also including the 6th lead, the 6th lead is micro- by described second The contact of electronic component and the 3rd microelectronic element is electrically interconnected.
15. micromodules according to claim 4, wherein at least one of first lead or second lead bag Include the second line bonding extended from the contact of at least one of first microelectronic element or the second microelectronic element.
16. micromodules according to claim 4, wherein at least in first lead or second lead The individual part alignd with the hole is the part of monolithic conducting element, and the monolithic conducting element has along the substrate Extend to the Part II of the terminal.
17. micromodules according to claim 4, further include the described front table in second microelectronic element Spacer element between face and the first surface of the substrate.
18. micromodules according to claim 4, wherein first microelectronic element includes being patrolled for main execution Collect the chip of function.
19. micromodules according to claim 4, wherein second microelectronic element is with more any other than providing The more active devices of active device of function are providing memory array function.
20. micromodules according to claim 4, wherein first microelectronic element is with more any other than providing The more active devices of active device of function are providing memory array function.
21. micromodules according to claim 11, wherein first microelectronic element is included for main execution The chip of logic function.
22. micromodules according to claim 11, wherein second microelectronic element have than provide it is any its The more active devices of active device of its function are providing memory array function.
23. micromodules according to claim 11, wherein first microelectronic element have than provide it is any its The more active devices of active device of its function are providing memory array function.
24. micromodules according to claim 12, wherein first microelectronic element is included for main execution The chip of logic function.
25. micromodules according to claim 12, wherein second microelectronic element have than provide it is any its The more active devices of active device of its function are providing memory array function.
26. micromodules according to claim 12, wherein first microelectronic element have than provide it is any its The more active devices of active device of its function are providing memory array function.
A kind of 27. microelectronic components, including the first micromodule and the second micromodule, first micromodule and Second micromodule is micromodule according to claim 1, first micromodule at least portion Ground is divided to cover second micromodule, and the first terminal of first micromodule and second microelectronics The Second terminal engagement of component.
28. microelectronic components according to claim 27, the first microelectronic element described in wherein at least one is mainly used in Execution logic function, the second microelectronic element described at least one has the active device than providing any other function more Active device is providing memory array function.
29. microelectronic components according to claim 27, wherein first micromodule at least some described At least some described Second terminal of one terminal and second micromodule is arranged to face battle array, and wherein described first micro- electricity Sub-component and the second micromodule are engaged by joint unit, and the joint unit is the conducting block of sintering metal.
30. microelectronic components according to claim 27, wherein the micromodule is by the neighbouring microelectronics portion The joint unit of the peripheral disposition of part is electrically connected to each other.
31. microelectronic components according to claim 30, wherein the joint unit is located at the non-of the microelectronic component The outside in density center region.
A kind of 32. systems, including micromodule according to claim 1 and it is electrically connected to the one of the micromodule Individual or multiple other electronic units.
33. systems according to claim 32, the first terminal described in wherein at least some is electrically connected to circuit board.
34. systems according to claim 33, further include housing, the micromodule and described other ministrys of electronics industry Part is installed to the housing.
A kind of 35. systems, including micromodule according to claim 4 and it is electrically connected to the one of the micromodule Individual or multiple other electronic units.
36. systems according to claim 35, wherein the first terminal is electrically connected to circuit board.
37. systems according to claim 36, further include housing, the micromodule and described other ministrys of electronics industry Part is installed to the housing.
A kind of 38. microelectronic components, including the first micromodule and the second micromodule, first micromodule and Second micromodule is micromodule according to claim 4, first micromodule with it is described Second micromodule is electrically connected, and first micromodule covers at least in part second micromodule.
39. microelectronic components according to claim 38, wherein the micromodule is by the neighbouring microelectronics portion The joint unit of the peripheral disposition of part is electrically connected to each other.
40. microelectronic components according to claim 39, wherein the joint unit is located at the non-of the microelectronic component The outside in density center region.
41. microelectronic components according to claim 38, wherein first micromodule and second microelectronics Some of microelectronic element in component include volatile random access memory, first micromodule and described second Some of microelectronic element in micromodule include non-volatile flash memory.
42. microelectronic components according to claim 38, the first microelectronic element described in wherein at least one is mainly used in Execution logic function, the second microelectronic element described at least one has the active device than providing any other function more Active device is providing memory array function.
CN201280030801.1A 2011-04-21 2012-04-11 Flip-chip, face-up and face-down centerbond memory wirebond assemblies CN103620778B (en)

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US13/306,099 US8928153B2 (en) 2011-04-21 2011-11-29 Flip-chip, face-up and face-down centerbond memory wirebond assemblies
PCT/US2012/032997 WO2012145201A1 (en) 2011-04-21 2012-04-11 Flip-chip, face-up and face-down centerbond memory wirebond assemblies

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