CN103596407A - Thermal buffering element - Google Patents

Thermal buffering element Download PDF

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Publication number
CN103596407A
CN103596407A CN 201310270709 CN201310270709A CN103596407A CN 103596407 A CN103596407 A CN 103596407A CN 201310270709 CN201310270709 CN 201310270709 CN 201310270709 A CN201310270709 A CN 201310270709A CN 103596407 A CN103596407 A CN 103596407A
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heat
buffering
element
thermal
material
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CN 201310270709
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Chinese (zh)
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CN103596407B (en )
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张光宇
邱英哲
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华硕电脑股份有限公司
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Abstract

A thermal buffering element applied to an electronic device is provided. The thermal buffering element includes a heat absorbing material and a plurality of metal particles. The heat absorbing material is disposed corresponding to a heat source of the electronic device. The metal particles are distributed in the heat absorbing material. The invention solves the problem of uneven heat dissipation of an electronic product, which makes a user feel more comfortable.

Description

热缓冲元件 Thermal buffer element

技术领域 FIELD

[0001] 本发明涉及一种热缓冲元件。 [0001] The present invention relates to a thermal cushioning member.

背景技术 Background technique

[0002]目前应用于电子产品的散热元件大多为风扇、散热片、热管或水冷式装置。 [0002] It radiating element used in electronic products mostly fans, heat sinks, heat pipes or water-cooled device. 然而,由于科技的进步,笔记本电脑、平板电脑与手机等电子产品的外型已越来越轻薄,而上述散热元件因体积难以缩小,限制了电子产品整体厚度的降低,因此会造成设计上的不便。 However, due to advances in technology, appearance laptops, tablet computers and mobile phones and other electronic products has become increasingly thin, and the heat dissipation element because the volume is difficult to reduce, limit reduce the overall thickness of electronic products, thus giving the design inconvenient.

[0003] 此外,虽能以已知薄型的导热片或散热片贴附在电子产品的热源上,但已知导热片或散热片仅能作为热传递的媒介,仅能提供热能传递的路径,并没有储存热能的功能,并不易维持电子产品的温度。 [0003] Further, although to a known thin fins or fins attached to the heat source of the electronic product, it is known that only fins or fin as a heat transfer medium, can only provide the thermal energy transfer path, and not storing thermal energy function, is not easy to maintain the temperature of electronic products. 也就是说,已知导热片或散热片对于电子产品的热均匀分布的效果其实非常有限,因此难以为使用者提供良好的使用体验。 That is, it is known for the fins or fin heat effect uniform distribution of electronic products is actually very limited, it is difficult to provide a good experience for the user.

发明内容 SUMMARY

[0004] 本发明提供一种应用于电子装置的热缓冲元件,其包含吸热材料与多个金属颗粒。 [0004] The present invention provides a thermal buffer element which is applied to an electronic device, comprising a plurality of heat absorbing material with metal particles. 吸热材料与电子装置的热源对应设置。 Heat endothermic material corresponding to the electronic device is provided. 金属颗粒散布在吸热材料中。 Metal particles dispersed in an endothermic material.

[0005] 由于吸热材料可储存热源产生的热能,且金属颗粒可提高热缓冲元件的传热速率,因此当热缓冲元件位于热源上时、位于电路板背对热源的表面上时、或位于紧邻热源的壳体上时,热缓冲元件可将热源的热能储存并扩散,使电子装置具有均匀分布的温度,避免在电子装置的热源位置造成热集中现象。 [0005] Due to the thermal energy store endothermic material produced by the heat source, and the metal particles can improve the heat transfer rate of heat cushioning member, so that when the damping element is located on the thermal source, facing away from the heat source is located on the circuit board surface, or located when the housing adjacent to the heat source, the heat source can be thermal buffering element and diffusion of the thermal energy storage, electronic devices having a uniform temperature distribution, to avoid heat concentration phenomenon at the position of the heat source of the electronic device.

[0006] 此外,当热源的温度剧烈变化时,热缓冲元件可通过吸热材料的吸热与放热,减缓电子装置的温度变化速率,便于电子装置整体的热管理。 [0006] Further, when the heat source drastic changes in temperature, the thermal element may be buffered by the exothermic heat absorbing endothermic material, slowing the rate of temperature change of the electronic device, the electronic facilitate the overall thermal management device. 如此一来,不仅能提升电子装置内的元件寿命,且当用户使用电子装置时,不会因触摸的位置不同而感到过大的温差,具有较佳的温度感受。 Thus, not only can improve the life of elements within the electronic device, and when the user uses the electronic device, without depending on the location of touch and feel the temperature difference is too large, with the preferred temperature feeling.

附图说明 BRIEF DESCRIPTION

[0007] 图1为根据本发明第一实施方式的热缓冲元件的俯视图。 [0007] FIG. 1 is a top plan view of a heat cushioning member according to the first embodiment of the present invention.

[0008] 图2为图1的热缓冲元件沿线段2-2的剖面图。 [0008] FIG. 2 is a cross-sectional view of a heat cushioning member of FIG. 1 along line 2-2.

[0009] 图3为图2的热缓冲元件设置在电子装置的电路板背面的剖面图。 [0009] FIG. 3 FIG. 2 is a thermal buffer member provided on a cross-sectional view of the rear of a circuit board for the electronic device.

[0010] 图4为根据本发明第二实施方式的热缓冲元件的剖面图。 [0010] FIG. 4 is a cross-sectional view of a heat cushioning member according to the second embodiment of the present invention.

[0011] 图5为图4的热缓冲元件设置在电子装置的电路板背面的剖面图。 [0011] FIG 5 FIG thermal buffer member 4 is disposed in a cross-sectional view of the rear of a circuit board for the electronic device.

[0012] 图6为图4的热缓冲元件设置在电子装置的电路板正面的剖面图。 [0012] FIG. 6 is a thermal buffer member 4 is disposed a front sectional view of a circuit board of the electronic device.

[0013] 图7为根据本发明第三实施方式的热缓冲元件的俯视图。 [0013] FIG. 7 is a top plan view of a heat cushioning member according to a third embodiment of the present invention.

[0014] 图8为图7的热缓冲元件沿线段8-8的剖面图。 8-8 is a sectional view along the line thermal buffer element [0014] FIG. 8 is a diagram 7.

[0015] 图9为图8的热缓冲元件设置在电子装置的电路板背面的剖面图。 [0015] Figure 9 Figure 8 is a thermal cushioning member disposed in a cross-sectional view of the rear of a circuit board for the electronic device.

[0016] 图10为图8的热缓冲元件设置在电子装置的电路板正面的剖面图。 [0016] FIG. 10 is provided at a front sectional view of a circuit board of the electronic device is a thermal cushioning member of FIG. 8.

[0017] 图11为根据本发明第四实施方式的热缓冲元件设置在电子装置的壳体的剖面图。 [0017] FIG. 11 is a thermal buffering element according to a fourth embodiment of the present invention is provided a cross-sectional view of the housing of the electronic device.

具体实施方式 detailed description

[0018] 以下将以附图公开本发明的多个实施方式,为明确说明起见,许多具体细节将在以下叙述中一并说明。 [0018] The following drawings will be disclosed embodiment of the present invention, a plurality of embodiments for a clear explanation, numerous specific details will also be explained in the following description. 然而,应了解到,这些具体细节不应用以限制本发明。 However, it should be understood that these specific details are not be used to limit the present invention. 也就是说,在本发明部分实施方式中,这些具体细节是非必要的。 That is, in some embodiments of the present invention, these specific details are not necessary. 此外,为简化附图起见,一些已知惯用的结构与元件在附图中将以简单示意的方式表示。 In addition, to simplify the drawing, conventional structures and devices are known in the drawings will be represented by a simple schematic manner.

[0019] 图1所示为根据本发明第一实施方式的热缓冲元件100的俯视图。 [0019] Figure 1 is a top plan view of a heat cushioning member 100 according to a first embodiment of the present invention. 图2所示为图1的热缓冲元件100沿线段2-2的剖面图。 Figure 2 is a sectional view taken along line thermal buffering element 100 of FIG. 1 2-2. 同时参阅图1与图2,热缓冲元件100包含吸热材料110与多个金属颗粒120。 Referring to FIG 1 and FIG 2, a thermal buffer comprising a heat absorbing material member 100 and a plurality of metal particles 110 120. 金属颗粒120散布在吸热材料110中。 Metal particles 120 dispersed in the endothermic material 110.

[0020] 其中,吸热材料110具有热能储存的功能,而金属颗粒120具有传热的功能。 [0020] wherein the endothermic material having a thermal energy storage function 110, and the metal particles 120 having the function of heat transfer. 在本实施方式中,吸热材料110可以包含石蜡,但并不以石蜡为限,例如其他具有热能储存功能的材料皆可。 In the present embodiment, the endothermic material 10 may comprise paraffins, but are not limited to paraffins, for example other materials with a thermal energy storage function can be. 金属颗粒120可以为铜颗粒或铝颗粒,但并不以铜颗粒或铝颗粒为限,例如其他具有高热传导系数的金属颗粒皆可。 120 may be metal particles or aluminum particles are copper particles, copper particles, but not to limit, or aluminum particles, such as other metals having a high thermal conductivity of the particles can be.

[0021] 此外,热缓冲元件100还可包含第一热扩散材料130。 [0021] In addition, the thermal buffer member 100 may also include a first heat diffusion material 130. 第一热扩散材料130覆盖在吸热材料110的表面112上。 A first heat diffusing material 130 covers the upper surface 112 of the endothermic material. 其中,第一热扩散材料130可以包含铜、铝、石墨或上述材料的组合。 Wherein the first thermal diffusion material 130 may comprise, aluminum, copper, graphite, or a combination of the above materials. 第一热扩散材料130可通过黏胶贴合或热压合的方式固定在吸热材料110上。 Heat diffusion material 130 of the first embodiment may be bonded by thermocompression bonding or glue is fixed on the heat absorbing material 110. 第一热扩散材料130可提升热缓冲元件100的传热速率。 The first material 130 can enhance the heat diffusion rate of heat transfer buffer member 100.

[0022] 在以下叙述中,将说明热缓冲元件100应用于电子装置200中的状态。 [0022] In the following description, the state in which the electronic device 100 is applied to a thermal buffer member 200 will be described.

[0023] 图3所示为图2的热缓冲元件100设置在电子装置200的电路板210背面的剖面图。 Cushioning element 100 is provided to heat the circuit board in FIG. 2 is a sectional view of the electronic device 200 [0023] 210 shown in FIG. 3 in the back. 电子装置200的热源220设置在电路板210的正面,且散热片230固定在热源220上。 Heat source 220 is disposed in front of the electronic device 200 of circuit board 210, and the heat sink 230, heat source 220 is fixed. 其中,热源220可以为中央处理器或影像芯片,电路板210可以为电脑主板,但并不以限制本发明。 Wherein the heat source 220 may be a central processor or video chip, circuit board 210 may be a computer motherboard, but not to limit the present invention. 在本实施方式中,吸热材料110与热源220分别位于电路板210的相反两表面(即电路板210背对热源220的表面与面对热源220的表面),且热缓冲元件100至少部分延伸至热源220正下方的位置,使吸热材料110与热源220对应设置。 In the present embodiment, the endothermic material 110 and 220 are located on both surfaces of the heat source (i.e., the surface facing away from the heat source 210 of the circuit board 220 facing a surface 220 of the heat source) opposite to the circuit board 210, and 100 extends at least partially heat cushioning member source 220 to a position directly below the heat absorbing material 110 is provided with a heat source 220 corresponds.

[0024] 当热源220发热时,由于吸热材料110可储存热源220产生的热能,且金属颗粒120可提高热缓冲元件100的传热速率,因此当热缓冲元件100位于电路板210背对热源220的表面上时,热缓冲元件100可将热源220的热能储存并均匀扩散,使电子装置200具有均匀分布的温度,避免在电子装置200的热源220位置造成热集中现象。 [0024] When the heat source 220, since the endothermic material 110 may store thermal energy source 220, and the metal particles 120 can improve the heat transfer rate of heat cushioning element 100, cushioning element 100 so that when the heat of the circuit board 210 facing away from the heat source when the upper surface 220 of heat cushioning element 100 may store thermal energy source 220 and uniformly dispersed, so that the electronic device 200 having a uniform temperature distribution, to avoid heat concentration phenomenon at position 220 of the electronic device 200 of the heat source. 在本实施方式中,除了金属颗粒120可提高热缓冲元件100的传热速率外,第一热扩散材料130亦可提高热缓冲元件100的传热速率。 In the present embodiment, in addition to the metal particles 120 can improve the heat transfer rate of heat cushioning element 100, the first thermal diffusion material 130 may also improve the heat transfer rate of heat cushioning member 100.

[0025] 此外,当热源220的温度剧烈变化时(例如热源220超频时或电子装置200断电时),热缓冲元件100可通过吸热材料110的吸热与放热,减缓电子装置200的温度变化速率,便于电子装置200整体的热管理,使其温度缓缓升高或缓缓降低。 [0025] Further, when large changes in temperature heat source 220 (e.g., the heat source 220 OC 200 or when power electronic device), a thermal buffer member 100 may be endothermic and exothermic endothermic material 110, the electronic device 200 of slowing rate of change of temperature, the overall ease thermal management of the electronic device 200, so that the temperature gradually increased or gradually decreased. 如此一来,不仅能提升电子装置200内的元件寿命,且当用户使用电子装置200时,不会因触摸的位置不同而感到过大的温差,具有较佳的温度感受,且能避免烫伤。 Thus, not only can improve the life of elements within the electronic device 200, and when the user uses the electronic device 200 does not vary the position of the touch feel too large temperature difference, having a temperature feeling better, and can avoid scalding.

[0026] 应了解到,在以上叙述中已叙述过的元件连接关系与叙述过的一致,将不再重复赘述。 [0026] It should be appreciated, in the above description of the elements already described with the same connection relationship described earlier, will not be repeated herein. 在以下叙述中,将叙述不同型式的热缓冲元件。 In the following description, it will be described for different types of heat cushioning member.

[0027] 图4所示为根据本发明第二实施方式的热缓冲元件IOOa的剖面图。 [0027] FIG. 4 is a sectional view according to a second embodiment of the present invention the thermal buffering element IOOa. 图5所示为图4的热缓冲元件IOOa设置在电子装置200的电路板210背面的剖面图。 Figure 5 shows a cross-sectional view of the electronic IOOa provided apparatus back side 210 of circuit board 200 for heat cushioning member of FIG. 同时参阅图4与图5,热缓冲元件IOOa包含吸热材料110、多个金属颗粒120与第一热扩散材料130。 Referring to FIG 4 and FIG 5, the thermal buffer comprising a heat absorbing material IOOa element 110, a plurality of metal particles 120 and the first thermal diffusion material 130. 与图 FIG.

2、图3实施方式不同的地方在于:热缓冲元件IOOa还可包含第二热扩散材料140。 2, a different embodiment of FIG. 3 embodiment is this: a thermal buffer element may further comprise a second thermal diffusion IOOa material 140. 其中,第二热扩散材料140覆盖在吸热材料110相对第一热扩散材料130的另一表面114上,使吸热材料110位于第一热扩散材料130与第二热扩散材料140之间。 Wherein the second thermal diffusion material 140 covered on the other surface 114 of the endothermic material 110 relative to the first thermal diffusion material 130, material 110 is in the first endothermic heat diffusion material 130 and the second thermal diffusion material 140.

[0028] 在使用时,第二热扩散材料140与电路板210背面接触,使得第二热扩散材料140与热源220分别位于电路板210的相反两表面。 [0028] In use, the second thermal diffusion material 140 contact with the back of the circuit board 210, so that the second heat source heat diffusion material 220 and 140 are respectively located two opposite surfaces of the circuit board 210. 热缓冲元件IOOa可将热源220的热能储存并均匀扩散,使电子装置200具有均匀分布的温度 IOOa thermal buffer member 220 may be a thermal energy storage and heat evenly spread, so that the electronic device 200 having a uniform temperature distribution

[0029] 在本实施方式中,第二热扩散材料140可以包含铜、铝、石墨或上述材料的组合,且第二热扩散材料140与第一热扩散材料130可以是相同的也可以是不同的,并不以限制本发明。 [0029] In the present embodiment, the second thermal diffusion material 140 may comprise, aluminum, copper, graphite, or a combination of the above materials, and the second heat diffusion material 140 and the first heat diffusing material 130 may be the same or may be different and are not to limit the present invention. 由于吸热材料110的相对两表面112、114分别覆盖有第一热扩散材料130与第二热扩散材料140,因此热缓冲元件IOOa的传热速率较图2的热缓冲元件100的传热速率快。 Since the two opposite surfaces 112, 114 of the endothermic material 110 are covered with the first heat diffusing material 130 and the second thermal diffusion material 140, and therefore the rate of heat transfer buffer member IOOa heat transfer rate of heat cushioning element 100 than in FIG. 2 fast. 此外,第一热扩散材料130与第二热扩散材料140可通过连接材料135相连接。 Further, the first heat diffusion material 130 and the second thermal diffusion material 140 may be linked by a linker material 135. 连接材料135可以为黏胶,也可以为与第一、第二热扩散材料130、140相似的扩散材料,并不以限制本发明。 Connecting material 135 may be a glue, a diffusion material may be similar to the first and second heat diffusion material 130 and 140, not to limit the present invention.

[0030] 图6所示为图4的热缓冲元件IOOa设置在电子装置200的电路板210正面的剖面图。 [0030] Figure 6 IOOa 210 disposed in a front sectional view of an electronic device board 200 is a thermal cushioning member of FIG. 与图5实施方式不同的地方在于:热缓冲元件IOOa的第二热扩散材料140覆盖在热源220与电路板210上。 Embodiment 5 The difference is that: a second heat diffusing member IOOa thermal buffer material 140 coated on the heat source 220 and the circuit board 210. 也就是说,热缓冲元件IOOa与热源220位于电路板210的同一侧,且热缓冲元件IOOa至少部分位于热源220上,并通过第二热扩散材料140与热源220相接触。 That is, the heat source 220 and the damping element IOOa on the same side of the circuit board 210, and the heat cushioning member at least partially located IOOa heat source 220, through a second thermal diffusion material 220 is in contact with the heat source 140. 热缓冲元件IOOa可将热源220的热能储存并均匀扩散,使电子装置200具有均匀分布的温度。 IOOa thermal buffer member 220 may be a thermal energy storage and heat evenly spread, so that the electronic device 200 having a uniform temperature distribution. 在本实施方式中,可省略图5热源220上的散热片230。 In the present embodiment, the fins on the heat source 5 220 230 may be omitted.

[0031] 图7所示为根据本发明第三实施方式的热缓冲元件IOOb的俯视图。 [0031] FIG. 7 is a top plan view of a heat cushioning member IOOb according to a third embodiment of the present invention. 图8所示为图7的热缓冲元件IOOb沿线段8-8的剖面图。 7 is a thermal cushioning member of FIG. 8 is a sectional view along the line 8-8 of IOOb. 同时参阅图7与图8,热缓冲元件IOOb包含吸热材料110、多个金属颗粒120、第一热扩散材料130与第二热扩散材料140。 Referring to FIG 7 and FIG 8, the thermal buffer comprising a heat absorbing material IOOb element 110, a plurality of metal particles 120, a first heat diffusing material 130 and the second thermal diffusion material 140. 与图4实施方式不同的地方在于:第二热扩散材料140具有开口142,且热缓冲元件IOOb还包含绝缘材料150。 Embodiment 4 The difference is that: a second heat diffusion material 140 has an opening 142, and a heat cushioning member further comprises an insulating material 150 IOOb. 其中,绝缘材料150位于开口142中。 Wherein the insulating material 150 located in the opening 142. 在以下叙述中,将说明热缓冲元件IOOb应用于电子装置200中的状态。 In the following description, the state of thermal cushioning member IOOb applied to the electronic device 200 will be described.

[0032] 图9所示为图8的热缓冲元件IOOb设置在电子装置200的电路板210背面的剖面图。 [0032] Figure 9 IOOb sectional view of the electronic apparatus provided at the circuit board 200 to rear surface 210 of heat cushioning member of FIG. 8. 在使用时,热缓冲元件IOOb的第二热扩散材料140与电路板210背面相接触,且绝缘材料150及开口142对应会造成电路板210短路的位置设置。 In use, a thermal buffer member IOOb second heat diffusion material 140 is in contact with the back surface of the circuit board 210, and the insulating material 150 and the opening 142 will cause a corresponding position of a short circuit circuit board 210 is provided. 在本实施方式中,虽然绝缘材料150位于热源220的下方,但绝缘材料150的位置并不以此为限。 In the present embodiment, although the heat insulating material 150 located below the 220, the position of the insulating material 150 is not limited thereto. 热缓冲元件IOOb可将热源220的热能储存并均匀扩散,使电子装置200具有均匀分布的温度。 IOOb thermal buffer member 220 may be a thermal energy storage and heat evenly spread, so that the electronic device 200 having a uniform temperature distribution. 在本实施方式中,绝缘材料150可以包含塑料、橡胶或陶瓷,但不以上述材料为限。 In the present embodiment, the insulating material 150 may comprise a plastic, rubber, or ceramic, but is not limited to the above materials. 绝缘材料150可避免第二热扩散材料140接触电路板210背面的热源220接点而造成短路。 Insulation material 150 can prevent a short circuit caused by the thermal diffusion of the second material of the circuit board 140 contacts the back surface of the source contacts 210,220.

[0033] 图10所示为图8的热缓冲元件IOOb设置在电子装置200的电路板210正面的剖面图。 [0033] Figure 10 shows a sectional view IOOb 210 disposed front surface board 200 of the electronic device is a thermal cushioning member of FIG. 8. 与图9实施方式不同的地方在于:热缓冲元件IOOb的第二热扩散材料140覆盖在热源220与电路板210上。 Embodiment 9 The difference is that: a thermal buffer member IOOb second heat diffusing material 140 coated on the heat source 220 and the circuit board 210. 也就是说,热缓冲元件IOOb与热源220位于电路板210的同一侧,且热缓冲元件IOOb至少部分位于热源220上,并通过第二热扩散材料140与热源220相接触。 That is, the heat source 220 and the damping element IOOb on the same side of the circuit board 210, and the heat cushioning member at least partially located IOOb heat source 220, and by contacting a second heat source heat diffusion material 140 and 220. 如此一来,热缓冲元件IOOb可将热源220的热能储存并均匀扩散,使电子装置200具有均匀分布的温度。 Thus, the heat source may be IOOb cushioning member 220 of the thermal energy storage and uniformly diffused, so that the electronic device 200 having a uniform temperature distribution. 在本实施方式中,可省略图9热源220上的散热片230。 In the present embodiment, the fins 220 on the heat source 230 may be omitted in FIG. 9.

[0034] 图11所示为根据本发明第四实施方式的热缓冲元件IOOc设置在电子装置200的壳体240的剖面图。 [0034] Figure 11 is a cross-sectional view of the housing IOOc provided 240 of the electronic device 200 according to a fourth embodiment of the thermal buffering element of the present invention. 热缓冲元件IOOc包含吸热材料110、多个金属颗粒120与保护胶带160。 IOOc thermal buffer comprising a heat absorbing material member 110, a plurality of metal particles 120 and the protective tape 160. 吸热材料110位于电子装置200的壳体240上,且保护胶带160贴附在吸热材料110与壳体240上,使吸热材料110与电路板210上的热源220相距距离d。 Endothermic material 110 on the housing 240 of the electronic device 200, and the protective tape 160 stuck on the heat absorbing material 110 and the housing 240, heat source 220 at a distance d on the heat absorbing material 110 and the circuit board 210.

[0035] 当热源220发热时,热空气会上升,使热源220上方的热缓冲元件IOOc温度升高。 [0035] When the heat source 220, the hot air rises, the temperature of the heat IOOc cushioning element 220 increases above the heat source. 热缓冲元件IOOc可将热源220的热能储存并均匀扩散,使电子装置200具有均匀分布的温度。 IOOc thermal buffer member 220 may be a thermal energy storage and heat evenly spread, so that the electronic device 200 having a uniform temperature distribution.

[0036] 本发明的热缓冲元件具有以下优点: [0036] The heat absorbing member of the invention has the following advantages:

[0037] (I)吸热材料可储存热源产生的热能,且金属颗粒可提高热缓冲元件的传热速率,因此当热缓冲元件位于热源上时、位于电路板背对热源的表面上时、或位于紧邻热源的壳体上时,热缓冲元件可将热源的热能储存并扩散,使电子装置具有均匀分布的温度,避免在电子装置的热源位置造成热集中现象。 [0037] (I) endothermic material store heat generated by the heat, and the metal particles can improve the heat transfer rate of heat cushioning member, so that when the heat source is located on the cushioning element, the upper surface of the circuit board facing away from the heat source, or heat source located proximate the casing, a thermal buffer member may be a thermal energy storage and diffusion of the heat source, the temperature of the electronic device having a uniform distribution of heat to avoid heat concentration phenomenon in the position of the electronic device.

[0038] (2)当热源的温度剧烈变化时,热缓冲元件可通过吸热材料的吸热与放热,减缓电子装置的温度变化速率,便于电子装置整体的热管理。 [0038] (2) when the heat source drastic changes in temperature, the thermal element may be buffered by the exothermic heat absorbing endothermic material, slowing the rate of temperature change of the electronic device, the entire device to facilitate the electronic thermal management. 如此一来,不仅能提升电子装置内的元件寿命,且当用户使用电子装置时,不会因触摸的位置不同而感到过大的温差,具有较佳的温度感受,并避免烫伤。 Thus, not only can improve the life of elements within the electronic device, and when the user uses the electronic device, the touch positions does not vary over a large temperature difference and feel, with the preferred temperature feeling, and to avoid burns.

[0039] (3)由于热缓冲元件可选择性地设置在电路板背面、正面及壳体的内表面上,且热缓冲元件的厚度薄而呈片状,因此对于电子装置空间的运用比较具有弹性。 [0039] (3) Since a thermal buffer member is selectively disposed on the inner surface of the back surface of the circuit board, and the front housing, and the thickness of the thin flaky thermal buffer element, so the space for the use of an electronic device having a comparison elasticity.

[0040] 虽然本发明已经以实施例公开如上,然其并非用以限定本发明,任何所属技术领域中具有通常知识的人员,在不脱离本发明的精神和范围内,当可作些许的变动与润饰,故本发明的保护范围当视权利要求书所界定者为准。 [0040] Although the present invention has been disclosed in the above embodiments, they are not intended to limit the present invention, any person skilled in the art having knowledge generally, without departing from the spirit and scope of the present invention, when changes may be made a little and variations, so the scope of the invention is best defined by the appended claims and their equivalents.

Claims (10)

  1. 1.一种热缓冲元件,其应用于电子装置,该电子装置具有热源,其特征在于,该热缓冲元件包含: 吸热材料,其对应于上述热源设置;以及多个金属颗粒,其散布在上述吸热材料中。 1. A heat cushioning member, which is applied to an electronic device, the electronic device having a heat source, characterized in that the thermal buffering element comprising: endothermic material, which corresponds to the heat source is disposed; and a plurality of metal particles, dispersed in which the endothermic material.
  2. 2.根据权利要求1所述的热缓冲元件,其特征在于,还包含: 第一热扩散材料,其覆盖在所述吸热材料的表面上。 2. Thermal cushioning element recited in claim 1, characterized in that, further comprising: a first heat diffusing material, which cover the surface of the heat sink material.
  3. 3.根据权利要求2所述的热缓冲元件,其特征在于,所述第一热扩散材料包含铜、铝、石墨或上述材料的组合。 The thermal buffering element according to claim 2, wherein said first material comprises a heat diffusion, aluminum, copper, graphite, or a combination of the above materials.
  4. 4.根据权利要求2所述的热缓冲元件,其特征在于,所述热源设置在电路板上,且所述吸热材料与所述热源分别位于该电路板的相反两表面。 4. The thermal buffering element according to claim 2, wherein said heat source is disposed on a circuit board, and the heat source and the heat sink material respectively located two opposite surfaces of the circuit board.
  5. 5.根据权利要求2所述的热缓冲元件,其特征在于,还包含: 第二热扩散材料,其覆盖在所述吸热材料相对所述第一热扩散材料的另一表面上,使所述吸热材料位于所述第一热扩散材料与该第二热扩散材料之间。 The thermal buffering element according to claim 2, characterized in that, further comprising: a second heat diffusing material, which covers the opposite surface on the other of the first thermal diffusion material, the heat sink material, so that the said endothermic material positioned between the first material and the second thermal diffusion thermal diffusion material.
  6. 6.根据权利要求5所述的热缓冲元件,其特征在于,所述热源设置在所述电子装置的电路板上,且所述第二热扩散材料与所述热源分别位于该电路板的相反两表面。 The thermal buffering element according to claim 5, wherein said heat source is disposed on a circuit board of the electronic device, and the second heat spreader material and the heat source are located opposite to the circuit board two surfaces.
  7. 7.根据权利要求5所述的热缓冲元件,其特征在于,所述热源设置在所述电子装置的电路板上,且所述第二热扩散材料覆盖在所述热源与该电路板上。 7. The heat cushioning member according to claim 5, wherein said heat source is disposed on a circuit board of the electronic device, and the second thermal diffusion material covering the heat source and the circuit board.
  8. 8.根据权利要求5所述的热缓冲元件,其特征在于,所述第二热扩散材料具有开口,所述热缓冲元件还包含: 绝缘材料,其位于上述开口中,且该绝缘材料及上述开口设置于对应会造成所述电子装置的电路板短路的位置。 Thermal buffering element according to claim 5, characterized in that said second thermal diffusion material having an opening, said member further comprising a thermal buffer: insulating material positioned in the opening, and the insulating material and said an opening is provided at a position of the circuit board causes a short circuit corresponding to the electronic device.
  9. 9.根据权利要求5所述的热缓冲元件,其特征在于,所述第二热扩散材料包含铜、铝、石墨或上述材料的组合。 9. The thermal buffering element according to claim 5, wherein said second material comprises a heat diffusion, aluminum, copper, graphite, or a combination of the above materials.
  10. 10.根据权利要求1所述的热缓冲元件,其特征在于,所述吸热材料位于所述电子装置的壳体上,所述热缓冲元件还包含: 保护胶带,其贴附在所述吸热材料与上述壳体上,使所述吸热材料与所述热源相距一段距离。 10. The thermal buffer element according to claim 1, wherein said heat absorbing material is located on the housing of the electronic device, the thermal buffering element further comprising: a protective tape, which is attached to the suction thermal material of the housing, the heat absorbing material with a distance from the heat source.
CN 201310270709 2012-08-13 2013-07-01 Thermal buffer element CN103596407B (en)

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EP0450968A2 (en) * 1990-04-06 1991-10-09 De Beers Industrial Diamond Division (Proprietary) Limited Circuit boards
US5315154A (en) * 1993-05-14 1994-05-24 Hughes Aircraft Company Electronic assembly including heat absorbing material for limiting temperature through isothermal solid-solid phase transition
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