CN103594611A - Light emitting module - Google Patents
Light emitting module Download PDFInfo
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- CN103594611A CN103594611A CN201210440017.XA CN201210440017A CN103594611A CN 103594611 A CN103594611 A CN 103594611A CN 201210440017 A CN201210440017 A CN 201210440017A CN 103594611 A CN103594611 A CN 103594611A
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- 239000000084 colloidal system Substances 0.000 claims abstract description 95
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000012856 packing Methods 0.000 claims description 90
- 239000000463 material Substances 0.000 claims description 27
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 241000218202 Coptis Species 0.000 description 5
- 235000002991 Coptis groenlandica Nutrition 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 241001222009 Beamys Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002650 habitual effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
The invention discloses a light-emitting module which comprises a substrate, a plurality of light-emitting diodes, a plurality of leads, a packaging colloid and a plurality of columns. The light emitting diode is arranged on the substrate. The wire is connected with the light emitting diode. The packaging colloid is arranged on the substrate and covers the light-emitting diode and the lead. The column body is fixed in the packaging colloid, wherein the top surface of the column body is not lower than the conducting wire, and the hardness of the column body is greater than that of the packaging colloid.
Description
Technical field
The invention relates to a kind of light emitting module, and particularly relevant for a kind of light emitting module with light-emitting diode.
Background technology
In general package structure for LED, light-emitting diode chip for backlight unit is normally arranged on the dielectric layer highly equating with line layer, but because light-emitting diode chip for backlight unit will inevitably produce heat energy in luminous, because the heat-sinking capability of dielectric layer is not enough, tend to the problem that causes light-emitting diode chip for backlight unit overheated again.Therefore, relevant manufacturer develops the technology of a kind of chip direct package (Chip on Board, hereinafter to be referred as COB) then.
General COB package structure for LED comprises a heat-conducting substrate, a plurality of light-emitting diode chip for backlight unit, many gold threads and a fluorescence coating.A plurality of light-emitting diode chip for backlight unit are directly to anchor on heat-conducting substrate, and this heat-conducting substrate is generally metal substrate, for example: copper base or aluminium base, in order to the heat radiation of light-emitting diode chip for backlight unit.Gold thread is to be electrically connected between different light-emitting diode chip for backlight unit, to reach serial or parallel connection light-emitting diode chip for backlight unit.Fluorescence coating covering luminousing diode chip, with the radiation light wavelength of conversion light emitting diode chip.
Yet, in above-mentioned COB package structure for LED, because gold thread is comparatively very thin, soft, when packing colloid is deformed by external force pressure, gold thread is easily affected and is shifted or subsides, and then cause the situations such as short circuit or electric leakage, have a strong impact on the luminous power of package structure for LED, and the situation of electric leakage also may derive safety issue.
Summary of the invention
In view of this, a technical scheme of the present invention is that a kind of light emitting module is being provided, and its main purpose is to protect the wire in light emitting module, to avoid wire to be subject to external force impact, is shifted or subsides.
In order to achieve the above object, according to one embodiment of the present invention, a kind of light emitting module comprises a substrate, a plurality of light-emitting diode, a plurality of wire, a packing colloid and a plurality of column.Light-emitting diode is to be arranged on substrate.These wire connecting luminous diodes.Packing colloid is arranged on substrate and covers light-emitting diode and wire.Column is fixed in packing colloid, and wherein the end face of column is not less than wire, and the hardness of column is greater than the hardness of packing colloid.
In one or more execution mode of the present invention, the end face of column is higher than the end face of packing colloid.
In one or more execution mode of the present invention, the bottom of column is connected on substrate.
In one or more execution mode of the present invention, the end face of column is lower than the end face of this packing colloid.
In one or more execution mode of the present invention, packing colloid comprises the first packing colloid and one second packing colloid.The first packing colloid is to fill out to be distributed between light-emitting diode.The second packing colloid is to be arranged on the first packing colloid and light-emitting diode.
In one or more execution mode of the present invention, the bottom of column is fixed on the first packing colloid.
In one or more execution mode of the present invention, the first packing colloid and the second packing colloid are formed by same material.
In one or more execution mode of the present invention, the first packing colloid and the second packing colloid are formed by different materials.
In one or more execution mode of the present invention, column and substrate are one-body molded by same material.
In one or more execution mode of the present invention, column is to be stamped to form by substrate.
In one or more execution mode of the present invention, column has reflecting surface.
In one or more execution mode of the present invention, column is formed by light transmissive material.
In one or more execution mode of the present invention, column and light-emitting diode are staggered.
In one or more execution mode of the present invention, adjacent light-emitting diode is longitudinally adjacent, laterally adjacent or oblique adjacent.
In one or more execution mode of the present invention, arbitrary column is to be arranged between two adjacent wires.
In one or more execution mode of the present invention, arbitrary wire is provided with two columns in the relative both sides of radial direction, and arbitrary wire is connecting two light-emitting diodes in the opposite end of axial direction.
Above-mentioned execution mode of the present invention can be provided with a plurality of columns in packing colloid, its hardness is greater than the hardness of packing colloid, and end face is not less than wire, therefore when packing colloid is subject to external force pressure, column can be avoided the packing colloid arround wire to be affected deforming, thereby prevents wire displacement or subside.
The above is only effect of the problem of setting forth institute of the present invention wish solution, the technological means of dealing with problems and generation thereof etc., and detail of the present invention will be introduced in the execution mode below and relevant drawings in detail.
Accompanying drawing explanation
For above and other object of the present invention, feature, advantage and embodiment can be become apparent, appended the description of the drawings is as follows:
Fig. 1 illustrates the vertical view according to the light emitting module of first embodiment of the invention;
Fig. 2 illustrates the profile along A-A line according to the light emitting module of Fig. 1 of the present invention;
Fig. 3 illustrates the profile according to the light emitting module of second embodiment of the invention;
Fig. 4 illustrates the profile according to the light emitting module of third embodiment of the invention.
[main element symbol description]
100: light emitting module
110: substrate
120: substrate
200: light-emitting diode
300: wire
410: packing colloid
412: end face
420: packing colloid
422: the first packing colloids
424: the second packing colloids
426: end face
510: column
512: end face
514: bottom
520: column
522: end face
524: bottom
530: column
532: end face
600: barricade
602: end face
700: dielectric layer
800: coating
Embodiment
Below will disclose a plurality of execution mode of the present invention with accompanying drawing, as clearly stated, the details in many practices will be explained in the following description.Yet those of ordinary skill in the art should recognize, in part execution mode of the present invention, the details in these practices is also non-essential, therefore does not apply to limit the present invention.In addition,, for the purpose of simplifying accompanying drawing, some known habitual structures and element illustrate the mode simply to illustrate in the accompanying drawings.
the first execution mode
Fig. 1 illustrates the vertical view according to the light emitting module of first embodiment of the invention.Fig. 2 illustrates the profile along A-A line according to the light emitting module of Fig. 1 of the present invention.As shown in the figure, the light emitting module 100 of present embodiment can comprise a substrate 110, a plurality of light-emitting diode 200, a plurality of wire 300, a packing colloid 410 and a plurality of column 510.Light-emitting diode 200 is to be arranged on substrate 110.These wire 300 connecting luminous diodes 200.Packing colloid 410 is be arranged on substrate 110 and cover light-emitting diode 200 and wire 300.Column 510 is to be fixed in packing colloid 410, and wherein the end face 512 of column 510 is not less than wire 300, and the hardness of column 510 is greater than the hardness of packing colloid 410.
As shown in Figure 2, in packing colloid 410, be scattered with many columns 510, because column 510 is harder than packing colloid 410, and its end face 512 is higher than wire 300, for example, therefore if packing colloid 410 is subject to external force while affecting (: the packing colloid 410 of Fig. 1 by finger compressing time), column 510 can avoid the packing colloid 410 arround wire 300 to deform, and prevents wire 300 displacements or subside.
In present embodiment, the end face 512 of column 510 is the end faces 412 higher than packing colloid 410.In other words, the end face 512 of column 510 is to protrude from outside packing colloid 410, and whereby, the end face 512 of column 510 can stop foreign object (for example finger) contact packing colloid 410, avoid packing colloid 410 distortion, thereby prevent wire 300 displacements or subside.In part execution mode, the distance of adjacent two columns 510 can be less than normal finger width, to avoid finger contact compressing packing colloid 410.The normal finger width of above-mentioned indication is approximately between between 1cm to 2.5cm.
In present embodiment, the bottom 514 of column 510 can be connected on substrate 110.Specifically, the bottom 514 of column 510 is on directly contact fixing base 110, so that column 510 is firmly arranged on substrate 110.In part execution mode, the bottom 514 of column 510 is to be vertically fixed on substrate 110.
As shown in Figure 1, in present embodiment, column 510 can be staggered with light-emitting diode 200.Specifically, adjacent light-emitting diode 200 can be longitudinally adjacent, laterally adjacent or oblique adjacent, and any two longitudinally adjacent, laterally between adjacent or oblique adjacent light-emitting diode 200, be provided with a column 510.
In part execution mode, arbitrary column 510 can be arranged at 300, two adjacent wire.Specifically, arbitrary wire 300 is provided with two columns 510 in the relative both sides of radial direction (as the y direction in Fig. 1), and arbitrary wire 300 is connecting two light-emitting diodes 200 in the opposite end of axial direction (as the x direction in Fig. 1).In other words, wire 300 by 200 of two columns 510 and two light-emitting diodes around.
In part execution mode, column 510 can be cylinder.In part execution mode, column 510 has reflecting surface, the light radiating in order to reflect light-emitting diode 200, thereby the luminous efficiency of increase light emitting module.Specifically, the surface of column 510 can be coated with reflecting material, and its material can be silver, but not as limit.In part execution mode, column 510 can be formed by the metal of tool high reflectance, for example: and silver, but not as limit.
In part execution mode, column 510 is formed by light transmissive material, penetrable the passing through of light of radiating for light-emitting diode 200.
As shown in Figure 2, in present embodiment, light emitting module can further comprise a barricade 600, and it is around packing colloid 410, in order to support and protection packaging colloid 410.In part execution mode, the end face 412 of packing colloid 410 is not higher than the end face 602 of barricade 600.In part execution mode, the end face 602 of barricade 600 can be contour with the end face 412 of packing colloid 410, and the end face 512 of column 510 can be higher than the end face 602 of barricade 600.
In part execution mode, the inner surface of barricade 600 can be coated with reflecting material, the light being radiated to reflect light-emitting diode 200, thereby the luminous efficiency of increase light emitting module.For instance, the reflecting material that barricade 600 is coated with can be silver, but not as limit.
In present embodiment, packing colloid 410 material for transformation of wave length that can adulterate, so that 200 beamy wavelength of conversion light emitting diode.For instance, above-mentioned material for transformation of wave length can be fluorescent material, and its color can be redness, green or yellow, but not as limit.
In present embodiment, light-emitting diode 200 can be blue LED chip, in order to excite the material for transformation of wave length in packing colloid 410.In present embodiment, light-emitting diode 200 is that the mode with chip direct package (Chip on Board, COB) is set directly on substrate 110.
In present embodiment, light emitting module can further comprise a dielectric layer 700, and it is be positioned on substrate 110 and be surrounded on column 510 and the periphery of light-emitting diode 200.The material of dielectric layer 700 can be FR-4 or BT (Bismaleimide Triacine) resin, but not as limit.
In present embodiment, light emitting module can further comprise a coating 800, and it is to be covered on dielectric layer 700.Coating 800 can see through wire 300 and be electrically connected to light-emitting diode 200.The material of coating 800 can be metal, for example: and nickel or silver, but not as limit.
In present embodiment, substrate 110 can be made by Heat Conduction Material, and for example, the material of substrate 110 can be copper or aluminium, but not as limit.In part execution mode, wire 300 can be gold thread, but not as limit.In part execution mode, the surface of substrate 110 can be coated with high reflecting material, for example: and silver, but not as limit.
the second execution mode
Fig. 3 illustrates the profile according to the light emitting module of second embodiment of the invention.As shown in the figure, present embodiment is similar to the first execution mode, both difference be the column 520 of present embodiment and packing colloid 420 different from the column 510 of the first execution mode and the structure of packing colloid 410.In present embodiment, packing colloid 420 can comprise one first packing colloid 422 and one second packing colloid 424.The first packing colloid 422 is to fill out to be distributed between light-emitting diode 200.The second packing colloid 424 is to be arranged on the first packing colloid 422 and light-emitting diode 200.
Specifically, light-emitting diode 200 is compartment of terrain and arranges, and the first packing colloid 422 is to fill out in the interval that is distributed in adjacent light-emitting diode 200, and the second 424 of packing colloids are to be covered on light-emitting diode 200 and the first packing colloid 422.In part execution mode, the first packing colloid 422 and light-emitting diode 200 can be contour, in order to covering the second packing colloid 424.
In present embodiment, the bottom 524 of column 520 can be fixed on the first packing colloid 422.Specifically, the bottom 524 of column 520 can be inserted on the first packing colloid 422, in order to fixing column 520.In part execution mode, the bottom 524 of column 520 is to stand on the first packing colloid 422.In part execution mode, before the first packing colloid 422 not yet solidifies, the bottom 524 of column 520 can first be inserted in the first packing colloid 422, and after the first packing colloid 422 solidifies (for example, through overbaking), column 520 can firmly stand on the first packing colloid 422.
In part execution mode, the first packing colloid 422 and the second packing colloid 424 can be formed by same material.In part execution mode, the first packing colloid 422 and the second packing colloid 424 can be formed by different materials.
In present embodiment, the end face 522 of column 520 can be lower than the end face 426 of packing colloid 420.Should be appreciated that, the end face 426 of packing colloid 420 is also the upper surface of the second packing colloid 424.
Be similar to the first execution mode, the end face 522 of column 520 is not less than wire 300, and the hardness of column 520 is greater than the hardness of packing colloid 420.
Be similar to the first execution mode, column 520 can have reflecting surface or be formed by light transmissive material, and column 520 can be staggered with light-emitting diode 200, and its spread geometry is identical with Fig. 1, please refer to Fig. 1 and above in relevant narration, at this repeated description not.The substrate 110 of present embodiment, light-emitting diode 200, wire 300, barricade 600, dielectric layer 700 and coating 800 are identical with Fig. 1, please refer to Fig. 1 and above in relevant narration, at this, do not repeat to repeat.
the 3rd execution mode
Fig. 4 illustrates the profile according to the light emitting module of third embodiment of the invention.As shown in the figure, present embodiment is similar to the first execution mode, and difference is that column 530 is different with the structure of substrate 110 from the column 510 of substrate 120 and the first execution mode.Specifically, column 530 is one-body molded by same material with substrate 120.
For instance, column 530 can be formed by 120 punching presses of substrate (punch).The material of substrate 120 can be metal, for example: and aluminium or copper, but not as limit.
In present embodiment, the end face 532 of column 530 can be lower than the end face 412 of packing colloid 410.
Be similar to the first execution mode, the end face 532 of column 530 is not less than wire 300, and the hardness of column 520 is greater than the hardness of packing colloid 410.
Be similar to the first execution mode, column 530 can be staggered with light-emitting diode 200, and its spread geometry is identical with Fig. 1, please refer to Fig. 1 and above in relevant narration, at this repeated description not.The light-emitting diode 200 of present embodiment, wire 300, packing colloid 410, barricade 600, dielectric layer 700 and coating 800 are identical with Fig. 1, please refer to Fig. 1 and above in relevant narration, at this, do not repeat to repeat.
Shown in comprehensive above execution mode, column 510, column 520 and column 530 be guardwire 300 effectively, avoids it affected by external force and be shifted, subside or be urged to light-emitting diode 200, therefore can effectively promote reliability and the fail safe of light emitting module.
Should be appreciated that, the words such as " first " described in this specification and " second " are only to help reader area every similar technical characterictic, do not represent that " first " and " second " is inevitable different in function.
Separately should be appreciated that, in this specification, about First Characteristic, be arranged at the top of Second Characteristic or the narration on Second Characteristic, should comprise First Characteristic is directly to contact with Second Characteristic, and has additional features and make First Characteristic not directly contact the embodiment such as formation with Second Characteristic between First Characteristic and Second Characteristic.
Although the present invention discloses as above with execution mode; so it is not in order to limit the present invention; anyly be familiar with this skill person; without departing from the spirit and scope of the present invention; when being used for a variety of modifications and variations, so the scope that protection scope of the present invention ought define depending on appending claims is as the criterion.
Claims (16)
1. a light emitting module, is characterized in that, comprises:
One substrate;
A plurality of light-emitting diodes, are arranged on this substrate;
A plurality of wires, connect described a plurality of light-emitting diode;
One packing colloid, is arranged on this substrate and covers described a plurality of light-emitting diode and described a plurality of wire; And
A plurality of columns, are fixed in this packing colloid, and the end face of wherein said a plurality of columns is not less than described a plurality of wire, and the hardness of described a plurality of columns is greater than the hardness of this packing colloid.
2. light emitting module according to claim 1, is characterized in that, the end face of described a plurality of columns is higher than the end face of this packing colloid.
3. light emitting module according to claim 1, is characterized in that, the bottom of described a plurality of columns is connected on this substrate.
4. light emitting module according to claim 1, is characterized in that, the end face of described a plurality of columns is lower than the end face of this packing colloid.
5. light emitting module according to claim 1, is characterized in that, this packing colloid comprises:
One first packing colloid, fills out and is distributed between described a plurality of light-emitting diode; And
One second packing colloid, is arranged on this first packing colloid and described a plurality of light-emitting diode.
6. light emitting module according to claim 5, is characterized in that, the bottom of described a plurality of columns is fixed on this first packing colloid.
7. light emitting module according to claim 5, is characterized in that, this first packing colloid and this second packing colloid are formed by same material.
8. light emitting module according to claim 5, is characterized in that, this first packing colloid and this second packing colloid are formed by different materials.
9. light emitting module according to claim 1, is characterized in that, described a plurality of columns and this substrate are one-body molded by same material.
10. light emitting module according to claim 9, is characterized in that, described a plurality of columns are to be stamped to form by this substrate.
11. light emitting modules according to claim 1, is characterized in that, described a plurality of columns have reflecting surface.
12. light emitting modules according to claim 1, is characterized in that, described a plurality of columns are formed by light transmissive material.
13. according to the light emitting module described in any one claim in claim 1 to 12, it is characterized in that, described a plurality of columns are to be staggered with described a plurality of light-emitting diodes.
14. light emitting modules according to claim 13, is characterized in that, adjacent described light-emitting diode is longitudinally adjacent, laterally adjacent or oblique adjacent.
15. light emitting modules according to claim 13, is characterized in that, arbitrary described column is arranged between two adjacent described wires.
16. light emitting modules according to claim 15, is characterized in that, arbitrary described wire is provided with two described columns in the relative both sides of radial direction, and arbitrary described wire is connecting two described light-emitting diodes in the opposite end of axial direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101129392 | 2012-08-14 | ||
| TW101129392A TW201407810A (en) | 2012-08-14 | 2012-08-14 | Illumination module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103594611A true CN103594611A (en) | 2014-02-19 |
Family
ID=50084671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210440017.XA Pending CN103594611A (en) | 2012-08-14 | 2012-11-06 | Light emitting module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103594611A (en) |
| TW (1) | TW201407810A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107148684A (en) * | 2014-12-11 | 2017-09-08 | 西铁城电子株式会社 | Light-emitting device |
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|---|---|---|---|---|
| TW453517U (en) * | 2000-06-16 | 2001-09-01 | Chen Wen Jin | Improved structure of semiconductor packaging substrate |
| US20070064429A1 (en) * | 2004-04-09 | 2007-03-22 | Joseph Mazzochette | Light emitting diode arrays with improved light extraction |
| WO2011070872A1 (en) * | 2009-12-08 | 2011-06-16 | シャープ株式会社 | Lighting device, display device, and television reception device |
| US20110233568A1 (en) * | 2008-12-18 | 2011-09-29 | Set Co., Ltd. | Led street lamp |
-
2012
- 2012-08-14 TW TW101129392A patent/TW201407810A/en unknown
- 2012-11-06 CN CN201210440017.XA patent/CN103594611A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW453517U (en) * | 2000-06-16 | 2001-09-01 | Chen Wen Jin | Improved structure of semiconductor packaging substrate |
| US20070064429A1 (en) * | 2004-04-09 | 2007-03-22 | Joseph Mazzochette | Light emitting diode arrays with improved light extraction |
| US20110233568A1 (en) * | 2008-12-18 | 2011-09-29 | Set Co., Ltd. | Led street lamp |
| WO2011070872A1 (en) * | 2009-12-08 | 2011-06-16 | シャープ株式会社 | Lighting device, display device, and television reception device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107148684A (en) * | 2014-12-11 | 2017-09-08 | 西铁城电子株式会社 | Light-emitting device |
| US10361344B2 (en) | 2014-12-11 | 2019-07-23 | Citizen Electronics Co., Ltd. | Light emitting device |
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| TW201407810A (en) | 2014-02-16 |
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Application publication date: 20140219 |