CN103545274A - Heat-dissipating fastener fixing structure and tool for demounting heat-dissipating fastener - Google Patents
Heat-dissipating fastener fixing structure and tool for demounting heat-dissipating fastener Download PDFInfo
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- CN103545274A CN103545274A CN201310264577.9A CN201310264577A CN103545274A CN 103545274 A CN103545274 A CN 103545274A CN 201310264577 A CN201310264577 A CN 201310264577A CN 103545274 A CN103545274 A CN 103545274A
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- heat
- dissipating
- heat radiation
- main body
- clip main
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Abstract
The invention discloses a heat-dissipating fastener fixing structure and a tool for demounting a heat-dissipating fastener. The heat-dissipating fastener fixing structure comprises a chute and a heat-dissipating fastener body. The chute is formed at the back of a heat-dissipating device, and a fastening groove is formed above the chute. The heat-dissipating fastener body is a U-shaped plate with a long side and a short side. A section of inwards-recessed arc-shaped face is arranged on the long side of the heat-dissipating fastener body. The short side of the heat-dissipating fastener body can be fastened in the chute. The arc-shaped face on the long side of the heat-dissipating fastener body can be pressed on a power element at the back of the heat-dissipating device. A gap is formed between the long side of the heat-dissipating fastener body and the bottom side of the U-shaped plate. The heat-dissipating fastener fixing structure has the advantages that demounting of the heat-dissipating fastener body is facilitated, assembly efficiency is obviously improved, reliable fit of the power element and the heat-dissipating device is guaranteed, uniformity in assembly is good, process steps such as punching of the heat-dissipating device and shaping of the power element are reduced, and the heat-dissipating fastener fixing structure is simple in structure, convenient to process, high in assembly efficiency, good in uniformity and reliable in fixation.
Description
Technical field
Patent of the present invention relates to a kind of radiator structure of use for electronic products, specifically a kind of clamp fixed structure and for the instrument of this heat radiation clamp of dismounting of dispelling the heat.
Background technology
Along with the development of electronic technology, powerful IGBT, field effect transistor, thyristor, the technology of bipolar transistor constant power device is increasingly mature, based on this electric ballast, Switching Power Supply, power amplifier, the application of the electronic products such as controller for electric vehicle is also more extensive.And in the Design and manufacturing process of these products, continue to use bolt or traditional U-shaped spring clip always, power device and heat abstractor are fixed;
When using bolt, requiring must have the hole corresponding with power device on heat abstractor, makes bolt pass heat abstractor and power device, and both are combined closely; And the requirement of the position of related features in hole is very strict, otherwise cannot assembling corresponding to power device, power device welding and assembling height tolerance is in the circuit board strict equally, this makes the machine work of heat abstractor, the welding procedure operation of power device increases, cost increases, and the efficiency of assembling in later stage is also very low, and cost of labor increases.
When using U-shaped spring clip, be easy to come off, must increase operation, some glue is fixed; Secondly restricted to the size of heat abstractor, can not be over the height of power device; If in the situation with engine housing heat radiation, can affect outward appearance.
As can be seen here, the shortcoming of these modes is fairly obvious, and main defect is summarized as follows:
1, manufacturing procedure is loaded down with trivial details, needs the operations such as boring; 2, efficiency of assembling is low, and assembling consistency is wayward; 3, outward appearance is not attractive in appearance.
Summary of the invention
The technical problem that patent of the present invention will solve is to provide a kind of simple in structure, easy to process, and efficiency of assembling is high, high conformity, fixing heat radiation clamp fixed structure reliably and for the instrument of this heat radiation clamp of dismounting.
In order to solve the problems of the technologies described above, the heat radiation clamp fixed structure of patent of the present invention, comprise the skewed slot that is arranged on heat abstractor back, skewed slot top is provided with for placing the slot of dismantling device, also comprise a heat radiation clip main body, described heat radiation clip main body is a U-shaped sheet material part with long limit and minor face, on the long limit of heat radiation clip main body, be provided with the arcwall face of one section of indent, the minor face of heat radiation clip main body can be fastened in skewed slot, arcwall face on the long limit of heat radiation clip main body can be pressed on a power original paper at heat abstractor back, between the long limit of heat radiation clip main body and U-shaped sheet material part base, be provided with a breach.
A kind of instrument for the above-mentioned heat radiation clamp of dismounting, comprise a briquetting with lower concave arc surface, the front end of briquetting is provided with a salient point that can extend in slot, the upper end of briquetting is provided with handle, the end of handle is provided with a sunk part, and sunk part can extend into the interior dismounting for the clip main body of dispelling the heat of breach.
The advantage of patent of the present invention is:
Due to the skewed slot at heat abstractor back and the heat radiation clip main body of setting, by heat radiation clip main body, can realize the location between power device and heat abstractor, the instrument for the above-mentioned heat radiation clamp of dismounting simultaneously arranging, the dismounting of the clip main body of can conveniently dispelling the heat, the significant efficiency of assembling that improved is set thus, guaranteed that power device and radiator reliably fit, and assembling high conformity, reduce heat abstractor boring, the processes such as power device shaping, reduced the harmful effect of traditional approach to product appearance, it is simple in structure, easy to process, efficiency of assembling is high, high conformity, fixing reliable.
Accompanying drawing explanation
Fig. 1 is the cross section structure schematic diagram of heat abstractor in patent heat radiation clamp fixed structure of the present invention;
Fig. 2 is the perspective view of clip main body of dispelling the heat in patent of the present invention heat radiation clamp fixed structure;
Fig. 3 is that patent of the present invention is for the tool construction schematic diagram of this heat radiation clamp of dismounting;
Fig. 4 is the mounting structure schematic diagram of patent heat radiation clamp fixed structure of the present invention;
Fig. 5 is the detaching structure schematic diagram of patent heat radiation clamp fixed structure of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments, to the heat radiation clamp fixed structure of patent of the present invention and for the instrument of this heat radiation clamp of dismounting, be described in further detail.
As shown in the figure, the heat radiation clamp fixed structure of patent of the present invention, comprise the skewed slot 2 that is arranged on heat abstractor 1 back, skewed slot 2 tops are provided with for placing the slot 3 of dismantling device, also comprise a heat radiation clip main body, heat radiation clip main body is a U-shaped sheet material part with long limit 4 and minor face 5, on the long limit 4 of heat radiation clip main body, be provided with the arcwall face 6 of one section of indent, the minor face 5 of heat radiation clip main body can be fastened in skewed slot, arcwall face 6 on the long limit 4 of heat radiation clip main body can be pressed on a power original paper 7 at heat abstractor 1 back, between the long limit 4 of heat radiation clip main body and U-shaped sheet material part base, be provided with a breach 8.
A kind of instrument for the above-mentioned heat radiation clamp of dismounting, comprise a briquetting 10 with lower concave arc surface 9, the front end of briquetting 10 is provided with a salient point 11 that can extend in slot 3, the upper end of briquetting 10 is provided with handle 12, the end of handle 12 is provided with a sunk part 13, and described sunk part 13 can extend into the interior dismounting for the clip main body of dispelling the heat of breach 8.
Claims (2)
1. a heat radiation clamp fixed structure, it is characterized in that: comprise the skewed slot (2) that is arranged on heat abstractor (1) back, described skewed slot (2) top is provided with the slot (3) for placing dismantling device, also comprise a heat radiation clip main body, described heat radiation clip main body is a U-shaped sheet material part with long limit (4) and minor face (5), on the long limit (4) of heat radiation clip main body, be provided with the arcwall face (6) of one section of indent, the minor face of described heat radiation clip main body (5) can be fastened in skewed slot, arcwall face (6) on the long limit (4) of described heat radiation clip main body can be pressed on a power original paper (7) at heat abstractor (1) back, between the long limit (4) of described heat radiation clip main body and U-shaped sheet material part base, be provided with a breach (8).
2. the instrument for the above-mentioned heat radiation clamp of dismounting, it is characterized in that: comprise a briquetting (10) with lower concave arc surface (9), the front end of briquetting (10) is provided with a salient point (11) that can extend in slot (3), the upper end of described briquetting (10) is provided with handle (12), the end of handle (12) is provided with a sunk part (13), and described sunk part (13) can extend into the interior dismounting for the clip main body of dispelling the heat of breach (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310264577.9A CN103545274B (en) | 2013-06-28 | 2013-06-28 | Radiate clamp fixed structure and the instrument for dismounting the radiating clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310264577.9A CN103545274B (en) | 2013-06-28 | 2013-06-28 | Radiate clamp fixed structure and the instrument for dismounting the radiating clamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103545274A true CN103545274A (en) | 2014-01-29 |
| CN103545274B CN103545274B (en) | 2017-08-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310264577.9A Expired - Fee Related CN103545274B (en) | 2013-06-28 | 2013-06-28 | Radiate clamp fixed structure and the instrument for dismounting the radiating clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103545274B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211724A (en) * | 2016-08-30 | 2016-12-07 | 无锡康博瑞特电子科技有限公司 | A kind of device compressing power semiconductor |
| CN108831864A (en) * | 2018-09-04 | 2018-11-16 | 常州索维尔电子科技有限公司 | Semiconductor power device heat dissipation base and assemble method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4766653A (en) * | 1987-10-16 | 1988-08-30 | Otis Elevator Company | Method and tool for assembling power semiconductor and heat sink |
| US5280409A (en) * | 1992-10-09 | 1994-01-18 | Sun Microsystems, Inc. | Heat sink and cover for tab integrated circuits |
| EP0751563A2 (en) * | 1995-06-30 | 1997-01-02 | Siemens Aktiengesellschaft | Apparatus holding an electric device to a supporting part |
| US6079486A (en) * | 1997-02-27 | 2000-06-27 | Aavid Thermal Technologies, Inc. | Spring clip for attaching an electronic component to a heat sink and an assembly utilizing the same |
| CN1316876A (en) * | 2000-02-24 | 2001-10-10 | 欧佩克欧洲功率半导体股份有限两合公司 | Holding for semiconductor component on cooler |
| JP2007013008A (en) * | 2005-07-01 | 2007-01-18 | Sansha Electric Mfg Co Ltd | Clip for fixing semiconductor element |
| CN202045609U (en) * | 2011-04-22 | 2011-11-23 | 上海沿锋汽车科技有限公司 | Dismounting tool for bound edge on automobile open-close member |
| CN202964537U (en) * | 2012-12-29 | 2013-06-05 | 安徽安利合成革股份有限公司 | Special tool for transporting embossing roller |
| CN203325889U (en) * | 2013-06-28 | 2013-12-04 | 青岛美奂电子科技有限公司 | Heat radiation clip fixing structure and tool used for dismounting heat radiation clip |
-
2013
- 2013-06-28 CN CN201310264577.9A patent/CN103545274B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4766653A (en) * | 1987-10-16 | 1988-08-30 | Otis Elevator Company | Method and tool for assembling power semiconductor and heat sink |
| US5280409A (en) * | 1992-10-09 | 1994-01-18 | Sun Microsystems, Inc. | Heat sink and cover for tab integrated circuits |
| EP0751563A2 (en) * | 1995-06-30 | 1997-01-02 | Siemens Aktiengesellschaft | Apparatus holding an electric device to a supporting part |
| US6079486A (en) * | 1997-02-27 | 2000-06-27 | Aavid Thermal Technologies, Inc. | Spring clip for attaching an electronic component to a heat sink and an assembly utilizing the same |
| CN1316876A (en) * | 2000-02-24 | 2001-10-10 | 欧佩克欧洲功率半导体股份有限两合公司 | Holding for semiconductor component on cooler |
| JP2007013008A (en) * | 2005-07-01 | 2007-01-18 | Sansha Electric Mfg Co Ltd | Clip for fixing semiconductor element |
| CN202045609U (en) * | 2011-04-22 | 2011-11-23 | 上海沿锋汽车科技有限公司 | Dismounting tool for bound edge on automobile open-close member |
| CN202964537U (en) * | 2012-12-29 | 2013-06-05 | 安徽安利合成革股份有限公司 | Special tool for transporting embossing roller |
| CN203325889U (en) * | 2013-06-28 | 2013-12-04 | 青岛美奂电子科技有限公司 | Heat radiation clip fixing structure and tool used for dismounting heat radiation clip |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211724A (en) * | 2016-08-30 | 2016-12-07 | 无锡康博瑞特电子科技有限公司 | A kind of device compressing power semiconductor |
| CN106211724B (en) * | 2016-08-30 | 2018-09-18 | 无锡康博瑞特电子科技有限公司 | A kind of device compressing power semiconductor |
| CN108831864A (en) * | 2018-09-04 | 2018-11-16 | 常州索维尔电子科技有限公司 | Semiconductor power device heat dissipation base and assemble method |
| CN108831864B (en) * | 2018-09-04 | 2024-02-20 | 常州是为电子有限公司 | Semiconductor power device heat dissipation base and assembly method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103545274B (en) | 2017-08-01 |
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