CN103533758B - The preparation method of FPC - Google Patents
The preparation method of FPC Download PDFInfo
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- CN103533758B CN103533758B CN201310496359.8A CN201310496359A CN103533758B CN 103533758 B CN103533758 B CN 103533758B CN 201310496359 A CN201310496359 A CN 201310496359A CN 103533758 B CN103533758 B CN 103533758B
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- basic unit
- fpc
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- copper foil
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Abstract
The present invention provides a kind of preparation method of FPC, comprises the following steps:Step 1, offer base material, the base material include the extension in interface portion and connecting interface portion, and the interface portion includes the first basic unit and is attached at first and second copper foil layer of the first basic unit both sides;Described first and second copper foil layer of step 2, patterning, the first circuitous pattern is formed with the side of the first basic unit;Step 3, the first basic unit be formed with the first circuitous pattern side coating green oil;Step 4, the first diaphragm of offer, first diaphragm are provided with windowing;Step 5, the opposite side that the first diaphragm is attached at first basic unit.
Description
Technical field
The present invention relates to a kind of FPC, more particularly to a kind of FPC of mobile phone liquid crystal display panel
Preparation method.
Background technology
Currently, FPC (Flexible Printed Circuit, FPC) industry remains and develops faster.FPC
Continue most of design considerations of rigid printed substrate, and on this basis, with many rigid printed substrates not
The advantage for possessing, for example, Distribution density is high, thickness of thin, lightweight, wiring space limitation less, foldable, flexibility ratio it is high etc., and
Arbitrarily moved and flexible in three dimensions, so as to reach the integration of components and parts assembling and wire connection, be widely used in space
Narrow and small, removable, folding all kinds of electronics and IT products, such as notebook computer, mobile phone, liquid crystal display, plasma show
Show the PC component markets such as device, digital camera and hard disk, CD-ROM drive, mobile storage.By taking liquid crystal display as an example, it is used as consumption
High development product in electronic market, the demand to FPC is also very huge.From FPC with taking temperature, a current liquid crystal display sets
Standby FPC consumptions are about 2~4 pieces, are mainly used in liquid crystal display panel and LCD MODULE.
Fig. 1 is referred to, is that the package assembly of the driving FPC300 of liquid crystal display panel 100 in liquid crystal display module is illustrated
Figure, the liquid crystal display panel 100 includes thin film transistor base plate 102 and the coloured silk for setting of being fitted with thin film transistor base plate 102
Colo(u)r filter substrate 104, the size of wherein colored filter substrate 104 is slightly smaller than thin film transistor base plate 102, and then in laminating
When, offset position 124 is formed with least side of thin film transistor base plate 102, drive FPC300 to be just fitted in offset position
Put on 124, to realize the driving to liquid crystal display panel 100, driving FPC300 is folded to the lower section of backlight module 500, when
When driving the interface position 302 of FPC300 really up to the mark, the position for driving FPC300 to be connected with liquid crystal display panel 100 can be caused to occur
Warpage, causes electric connection bad.
Above-mentioned bad to overcome, existing way is to drive the diaphragm of FPC and the interface position of liquid crystal display panel
Excision, to reduce the hardness of the interface position.However, this kind of way is while the hardness for driving FPC interface positions is reduced
The intensity of driving FPC interface positions is result in, causes driving FPC interface positions to be easily broken off, cause circuit breaker, and then
Influence the display of liquid crystal display panel.
The content of the invention
It is an object of the invention to provide a kind of preparation method of FPC, its processing procedure is simple, effectively reduces circuit
The hardness of interface position, while ensureing the intensity of the circuit interface position, effectively prevents the generation of warpage and fracture, effectively improves
The quality of liquid crystal display panel.
To achieve the above object, the present invention provides a kind of preparation method of FPC, comprises the following steps:
Step 1, offer base material, the base material include the extension in interface portion and connecting interface portion, and the interface portion includes
First basic unit and it is attached at first and second copper foil layers of the first basic unit both sides;
Described first and second copper foil layer of step 2, patterning, the first circuitous pattern is formed with the side of the first basic unit;
Step 3, the first basic unit be formed with the first circuitous pattern side coating green oil;
Step 4, the first diaphragm of offer, first diaphragm are provided with windowing;
Step 5, the opposite side that the first diaphragm is attached at first basic unit.
The extension includes:Second basic unit and it is attached at the 3rd and the 4th copper foil layer of the second basic unit both sides.
Described first and the 3rd copper foil layer be integrally formed setting;Described second and the 4th copper foil layer be integrally formed setting.
The step 2 is specially:Described first and the 3rd copper foil layer and second and the 4th copper foil layer are patterned respectively,
The side of one basic unit forms the first circuitous pattern, and second circuit figure is formed in the side of the second basic unit, first and second electricity
Road figure is electrically connected with and is oppositely arranged.
The step 3 is specially:The second diaphragm is first attached on the opposite side of the second basic unit, then is formed in the first basic unit
There is the first circuitous pattern side to coat green oil.
Also include step 6, be formed with the 3rd diaphragm of attaching on the side of second circuit figure in the second basic unit.
First diaphragm and the 3rd diaphragm are integrally formed setting.
First diaphragm is in " returning " font.
Described first and second basic unit is integrally formed setting.
The FPC is applied to mobile phone liquid crystal display panel.
Beneficial effects of the present invention:The preparation method of FPC of the invention, by the interface in FPC
Portion side coating green oil, while protection circuit strengthen interface portion intensity, and FPC interface portion it is another
Side attaches " returning " font diaphragm, and reinforcement, while not increasing hardness, effectively prevents the hair of warpage and fracture to the intensity of interface portion
It is raw, effectively increase the quality of liquid crystal display panel.
In order to be able to be further understood that feature of the invention and technology contents, refer to below in connection with of the invention detailed
Illustrate and accompanying drawing, however accompanying drawing only provide with reference to and explanation use, not for being any limitation as to the present invention.
Brief description of the drawings
Below in conjunction with the accompanying drawings, described in detail by specific embodiment of the invention, technical scheme will be made
And other beneficial effects are apparent.
In accompanying drawing,
Fig. 1 is the foldable structure of the FPC of the drive circuit of liquid crystal display panel in existing liquid crystal display module
Schematic diagram;
Fig. 2 is the flow chart of the preparation method of FPC of the invention;
Fig. 3 to Fig. 7 is the structural representation of the FPC in the preparation method stage of correspondence FPC of the present invention
Figure;
Fig. 8 is the structural representation of the first diaphragm of the invention.
Specific embodiment
Further to illustrate technological means and its effect that the present invention is taken, it is preferable to carry out below in conjunction with of the invention
Example and its accompanying drawing are described in detail.
Fig. 2 to Fig. 8 is referred to, the present invention provides a kind of making side of the FPC of mobile phone liquid crystal display panel
Method, comprises the following steps:
Step 1, offer base material 20, the base material 20 includes the extension 24 in interface portion 22 and connecting interface portion 22, described
Interface portion 22 includes the first basic unit 222 and is attached at first and second copper foil layer 224,226 of the both sides of the first basic unit 222, described
Extension 24 includes:Second basic unit 242, the 3rd and the 4th copper foil layer 244,246 for being attached at the both sides of the second basic unit 242.
Specifically, described first and second basic unit 222,242 is integrally formed setting;Described first and the 3rd copper foil layer 224,
244 are integrally formed setting;Described second and the 4th copper foil layer 226,246 be integrally formed setting.
Step 2, patterning first copper foil layer 224, the first circuitous pattern is formed with the side for forming the first basic unit 222
220。
The step is specially:Described first and the 3rd copper foil layer 224,244 and second and the 4th copper foil layer are patterned respectively
226th, 246, the first circuitous pattern 220 is formed in the side of the first basic unit 222, form the second electricity in the side of the second basic unit 242
Road figure 240, first and second circuitous pattern 220,240 is electrically connected with and is oppositely arranged.
Step 3, it is formed with the side of the first circuitous pattern 220 coating green oil 228 in the first basic unit 222.
The green oil 228 is liquid photopolymerizable solder resist, and it is a kind of protective layer, is coated in printed circuit board and is not required to welding
On circuit and base material, the line pattern formed with digital preservation.
The step 3 is specially:The second diaphragm 248 is first attached on the opposite side of the second basic unit 242, then in the first base
Layer 222 is formed with coating green oil 228 on the side of the first circuitous pattern 220.
Step 4, the first diaphragm 229 of offer, first diaphragm 229 are provided with windowing 230.
In the present embodiment, first diaphragm 229 is set in " returning " font, and its concrete technology can be directly to protect
Opened a window on cuticula.
Step 5, the first diaphragm 229 is attached on the opposite side of first basic unit 222.
Because first diaphragm 229 is set in " returning " font, its can the effective edge of the first basic unit of reinforcement 222 it is strong
Degree so that the edge of the first basic unit 222 is not easy to be torn, simultaneously as the presence of middle windowing 230, effectively reduces at this
Hardness, and then avoid in use due to hardness it is excessive caused by warpage occur.
Step 6, it is formed with the side of second circuit figure 240 the 3rd diaphragm 249 of attaching in the second basic unit 242.
Wherein, the diaphragm 249 of first diaphragm 229 and the 3rd is integrally formed setting.
Specifically, the specific formation process of the FPC can be:First circuit diagram is formed on the copper foil layer of base material
Shape;Then a diaphragm is attached on the circuitous pattern of side, a diaphragm is attached at the extension of FPC;Then
The position for not attaching a diaphragm in the side coats green oil;Another diaphragm is finally attached on the circuitous pattern of opposite side, should
Another diaphragm corresponding interface portion is provided with a windowing, you can complete the making of whole piece FPC, and processing procedure is simple, effectively lifting
The quality of FPC.
In sum, the preparation method of FPC of the invention, by the side of the interface portion in FPC
Coating green oil, strengthens the intensity of interface portion while protection circuit, and the opposite side of the interface portion in FPC is attached
" returning " font diaphragm, reinforcement, while not increasing hardness, effectively prevents the generation of warpage and fracture to the intensity of interface portion, has
Effect improves the quality of liquid crystal display panel.
The above, for the person of ordinary skill of the art, can be with technology according to the present invention scheme and technology
Other various corresponding changes and deformation are made in design, and all these changes and deformation should all belong to the claims in the present invention
Protection domain.
Claims (7)
1. a kind of preparation method of FPC, it is characterised in that comprise the following steps:
Step 1, offer base material, the base material include the extension in interface portion and connecting interface portion, and the interface portion includes first
Basic unit and it is attached at first and second copper foil layers of the first basic unit both sides;
Described first and second copper foil layer of step 2, patterning, the first circuitous pattern is formed with the side of the first basic unit;
Step 3, the first basic unit be formed with the first circuitous pattern side coating green oil;
Step 4, the first diaphragm of offer, first diaphragm are provided with windowing;
Step 5, the opposite side that the first diaphragm is attached at first basic unit, windowing and interface on first diaphragm
Portion is corresponding;
The extension includes:Second basic unit and it is attached at the 3rd and the 4th copper foil layer of the second basic unit both sides;
Described first and the 3rd copper foil layer be integrally formed setting;Described second and the 4th copper foil layer be integrally formed setting;
The step 2 is specially:Described first and the 3rd copper foil layer and second and the 4th copper foil layer are patterned respectively, in the first base
The side of layer forms the first circuitous pattern, and second circuit figure, first and second circuit diagram are formed in the side of the second basic unit
Shape is electrically connected with and is oppositely arranged.
2. the preparation method of FPC as claimed in claim 1, it is characterised in that the step 3 is specially:First the
The second diaphragm is attached on the opposite side of two basic units, then the first circuitous pattern side coating green oil is formed with the first basic unit.
3. the preparation method of FPC as claimed in claim 2, it is characterised in that also including step 6, in the second basic unit
It is formed with the 3rd diaphragm of attaching on the side of second circuit figure.
4. the preparation method of FPC as claimed in claim 3, it is characterised in that first diaphragm and the 3rd is protected
Cuticula is integrally formed setting.
5. the preparation method of FPC as claimed in claim 1, it is characterised in that first diaphragm is in " returning " word
Shape.
6. the preparation method of FPC as claimed in claim 1, it is characterised in that described first and second basic unit is integrally
Shaping is set.
7. the preparation method of FPC as claimed in claim 1, it is characterised in that the FPC is applied to hand
Machine liquid crystal display panel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310496359.8A CN103533758B (en) | 2013-10-21 | 2013-10-21 | The preparation method of FPC |
Applications Claiming Priority (1)
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CN201310496359.8A CN103533758B (en) | 2013-10-21 | 2013-10-21 | The preparation method of FPC |
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CN103533758A CN103533758A (en) | 2014-01-22 |
CN103533758B true CN103533758B (en) | 2017-06-13 |
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CN201310496359.8A Active CN103533758B (en) | 2013-10-21 | 2013-10-21 | The preparation method of FPC |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101222823A (en) * | 2007-01-11 | 2008-07-16 | 夏普株式会社 | Method for manufacturing multilayer printed wiring board |
CN202095174U (en) * | 2011-05-23 | 2011-12-28 | 上海中航光电子有限公司 | Flexible printed circuit for LCM (liquid crystal module) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11289151A (en) * | 1998-04-03 | 1999-10-19 | Nippon Mektron Ltd | Surface protection layer forming method for circuit substrate |
-
2013
- 2013-10-21 CN CN201310496359.8A patent/CN103533758B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101222823A (en) * | 2007-01-11 | 2008-07-16 | 夏普株式会社 | Method for manufacturing multilayer printed wiring board |
CN202095174U (en) * | 2011-05-23 | 2011-12-28 | 上海中航光电子有限公司 | Flexible printed circuit for LCM (liquid crystal module) |
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Publication number | Publication date |
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CN103533758A (en) | 2014-01-22 |
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Effective date of registration: 20180918 Address after: 523000 7 Bai Ye Avenue, 100 industrial town, Liaobu Town, Dongguan, Guangdong. Patentee after: Guangdong Jinlong electromechanical Co., Ltd. Address before: 214000 Jinxi Road, Wuxi City, Jiangsu Province, No. 100 Patentee before: Wuxi Booyi Optoelectronics Science & Technology Co., Ltd. |
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