CN103515366A - LED integrated light source and connecting method thereof - Google Patents
LED integrated light source and connecting method thereof Download PDFInfo
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- CN103515366A CN103515366A CN201210199848.2A CN201210199848A CN103515366A CN 103515366 A CN103515366 A CN 103515366A CN 201210199848 A CN201210199848 A CN 201210199848A CN 103515366 A CN103515366 A CN 103515366A
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Abstract
The invention discloses an LED integrated light source and a connecting method thereof, wherein the LED integrated light source comprises a PCB substrate and a plurality of LED chips, the PCB substrate is provided with a first surface and a second surface which are opposite, the PCB substrate is penetratingly provided with a plurality of mounting holes corresponding to light emitting surfaces of the LED chips, the first surface of the PCB substrate is provided with a first bonding pad corresponding to the LED chips, the light emitting surface of each LED chip is correspondingly accommodated in one mounting hole, and the LED chips are correspondingly bonded on the first bonding pad through tin paste; adopt COB packaging technology to correspond the LED chip through the tin cream and bond on PCB base plate's first pad, the manual welded mode of traditional wire relatively, degree of automation is high, consequently improves production efficiency by a wide margin, and can effectively avoid appearing the rosin joint or scald the encapsulation resin of LED chip and damage the phenomenon of LED chip to fine protection LED chip. Correspondingly, the connecting method of the LED integrated light source has the same technical effect.
Description
Technical field
The present invention relates to a kind of LED lighting technical field, relate in particular to a kind of LED integrated optical source based on chip on board encapsulation (be Chip On Board, be called for short COB) and attaching method thereof.
Background technology
Due to LED light source, have the advantages such as long-life, energy-saving and environmental protection, high efficiency feature, its superior physical attribute is that conventional incandescent, fluorescent lamp etc. are incomparable, so it is more and more subject to people at lighting field and favors.
At present, the encapsulation of LED light source is mainly divided into two kinds: the one, and independent encapsulation, encapsulates every LEDs luminescence chip separately exactly, produces arbitrary source one by one, and then assembles as required; The single individual LED luminous tube that this mode adopts support to be packaged into is conventionally integrated again, being about to LED chip is encapsulated on support, again support array is welded on additional PCB substrate and forms and be electrically connected, and the Bonding that the electrical connection of LED chip is and chip chamber direct by chip forms, and the lead key closing process of chip and chip chamber is more complicated, and the electrode of LED chip is more fragile, the direct lead wire bonding of chip chamber easily causes electrode damage.The 2nd, integration packaging, according to certain arrangement mode, then carries out integration packaging by a plurality of LED chips, and what this method encapsulated out is the aggregate of a multi-chip.But after employing integration packaging, plurality of LEDs chip is concentrated on very little area, the thermal resistance between LED chip and fin increases, and this just makes heat dissipation problem more outstanding.And, the parallel circuitss that adopt when current a plurality of integrated LED chips form one group of light source more, the connection of LED adopts wire to weld by hand, pad is many, and circuit is complicated, in disorder, and to be connected wire many with power supply, be difficult for being connected firmly, and because the heat sink heat transfer of LED is very fast, therefore, in the process of manual welding, welding difficulty is large, cause production efficiency low, and easily occur the situation of rosin joint or scald LED potting resin, and then damage LED chip.
Therefore, be necessary to provide a kind of method of attachment of improved LED integrated optical source to solve the deficiencies in the prior art.
Summary of the invention
The present invention's one object is to provide a kind of LED integrated optical source; this LED integrated optical source adopts chip on board encapsulation (COB) technology, LED chip is directly adhered on PCB substrate to the phenomenon of avoiding occurring rosin joint or scalding LED potting resin; well protection LED chip is enhanced productivity simultaneously.
Another object of the present invention is to provide a kind of method of attachment of LED integrated optical source; it adopts chip on board encapsulation (COB) technology that LED chip is directly adhered on PCB substrate; automaticity is high; thereby enhance productivity; simultaneously; LED chip can well be protected, the phenomenon of avoiding occurring rosin joint or scalding LED potting resin.
For realizing above-mentioned object, the invention provides a kind of LED integrated optical source, it comprises a PCB substrate and some LED chips, described PCB substrate has relative first surface and second, on described PCB substrate, penetratingly offer the some installing holes corresponding with the exiting surface of described LED chip, and on the first surface of described PCB substrate, be provided with first pad corresponding with described LED chip, described in each the exiting surface correspondence of LED chip be placed in one described in installing hole, and described LED chip is adhered on described the first pad by tin cream correspondence.
Preferably, be provided with the LED pad corresponding with described the first pad on described LED chip, described LED pad correspondence is adhered on described the first pad.
Preferably, be provided with the second corresponding pad of some and described the first pad on second of described PCB substrate, between described the second pad and described the first pad, offer through hole conducting.
Preferably, be also provided with positive and negative electrode power supply input pad on second of described PCB substrate, described cathode power supply input pad is electrically connected to the positive pole of described the second pad, and described negative power supply input pad is connected with the negative electricity of described the second pad.
Preferably, described positive and negative electrode power supply input pad is electrically connected to driving power.
Accordingly, the method for attachment of LED integrated optical source provided by the invention, comprises the steps: that (1) all coat tin cream by the first pad on described PCB substrate; (2) the exiting surface correspondence of described LED chip is placed in described installing hole, and the LED pad correspondence of described LED chip is affixed on described the first pad; (3) described LED chip and described PCB substrate are put into reflow soldering and carry out Automatic-heating, make described LED chip mutually bonding with described PCB substrate; And (4) are connected described positive and negative electrode power supply input pad with driving power.
Compared with prior art, due to LED integrated optical source of the present invention, it comprises a PCB substrate and some LED chips, described PCB substrate has relative first surface and second, on described PCB substrate, penetratingly offer the some installing holes corresponding with the exiting surface of described LED chip, and on the first surface of described PCB substrate, be provided with first pad corresponding with described LED chip, described in each the exiting surface correspondence of LED chip be placed in one described in installing hole, and described LED chip is adhered on described the first pad by tin cream correspondence; Adopt COB encapsulation technology LED chip to be adhered to by tin cream correspondence on the first pad of described PCB substrate, the mode of conventional wires manual welding relatively, automaticity is high, therefore significantly enhances productivity, being connected firmly of LED chip; And the phenomenon that adopts COB encapsulation technology can effectively avoid occurring the potting resin of rosin joint or scald LED chip and damage LED chip, thereby well protect LED chip.Correspondingly, the method for attachment of LED integrated optical source of the present invention, also has identical technique effect.
Accompanying drawing explanation
Fig. 1 is the structural representation of LED integrated optical source of the present invention.
Fig. 2 is the structural representation of another angle of LED integrated optical source of the present invention.
Fig. 3 is the exploded view of Fig. 1.
Fig. 4 is the exploded view of Fig. 2.
Fig. 5 is the flow chart of the method for attachment of LED integrated optical source of the present invention.
Embodiment
In order to describe technology contents of the present invention, structural feature in detail, below in conjunction with execution mode and coordinate accompanying drawing to be described further.LED integrated optical source 1 provided by the present invention; adopting chip on board encapsulation (is Chip On Board; be called for short COB) technology; LED chip 20 is directly adhered on PCB substrate 10; the phenomenon of avoiding occurring rosin joint or scalding the potting resin of LED chip 20; well protection LED chip 20 is enhanced productivity simultaneously.
Refer to Fig. 1, LED integrated optical source 1 provided by the invention, comprise a PCB substrate 10 and some LED chips 20, described PCB substrate 10 has relative first surface 11 and second 12, and on described PCB substrate 10, penetratingly offer the some installing holes 13 corresponding with the exiting surface 21 of described LED chip 20, for example, in one embodiment of the invention, on PCB substrate 10, offer three installing holes 13, therefore, the exiting surface 21 of three LED chips 20 respectively correspondence is arranged in three installing holes 13, certainly, the quantity of LED chip 20 is not and as limit, the technology that this is well known to those skilled in the art.
Continuation, in conjunction with shown in Fig. 1-Fig. 4, is provided with first pad 111 corresponding with described LED chip 20 on the first surface 11 of described PCB substrate 10, in the present embodiment, three the first pads 111 are located the corresponding periphery that is arranged at three installing holes 13 respectively; Correspondingly, on described LED chip 20, be provided with the LED pad 22 corresponding with described the first pad 111; Therefore, when LED chip 20 is connected with PCB substrate 10, first on described the first pad 111, all coat tin cream, again the exiting surface of described LED chip 20 21 correspondences are placed in the installing hole 13 on PCB substrate 10, and the positive and negative electrode that makes LED pad 22 is distinguished the positive and negative electrode of corresponding the first pad 111, again LED pad 22 correspondences of described LED chip 20 are adhered on described the first pad 111, then both are put into reflow soldering and carry out Automatic-heating, complete the welding of PCB substrate 10 and LED chip 20.Adopt chip on board encapsulation (COB) that LED chip 20 is amplexiformed in PCB substrate 10, method of attachment is simple, and can well protect LED chip 20, makes LED chip 20 have good electric property.
Continuation is in conjunction with shown in Fig. 1-Fig. 4, on second 12 of described PCB substrate, be provided with the second corresponding pad 121 of some and described the first pad 111, between described the second pad 121 and described the first pad 111 by offering through hole conducting, in a preferred embodiment of the invention, be provided with three second pads 121 corresponding with the first pad 111 on second of PCB substrate 12; On second 12 of described PCB substrate, be also provided with positive and negative electrode power supply input pad 122a, 122b, the positive pole of described the second pad 121 is all electrically connected to described cathode power supply input pad 122a by electronic circuit 123, the negative pole of described the second pad 121 is all electrically connected to described negative power supply input pad 122b by electronic circuit 123, forms circuit; After described positive and negative electrode power supply input pad 122a, 122b are electrically connected to driving power, described LED integrated optical source can work.
As shown in Figure 5, the method for attachment of LED integrated optical source provided by the invention, comprises the steps:
(S1) the first pad on described PCB substrate is all coated to tin cream;
(S2) the exiting surface correspondence of described LED chip is placed in described installing hole, and the LED pad correspondence of described LED chip is affixed on described the first pad;
(S3) described LED chip and described PCB substrate are put into reflow soldering and carry out Automatic-heating, make described LED chip mutually bonding with described PCB substrate;
(S4) described positive and negative electrode power supply input pad is connected with driving power.
Due to LED integrated optical source of the present invention, it comprises a PCB substrate 10 and some LED chips 20, described PCB substrate 10 has relative first surface 11 and second 12, on described PCB substrate 10, penetratingly offer the installing hole corresponding with the exiting surface of described LED chip 20 13, and on the first surface 11 of described PCB substrate 10, be provided with first pad 111 corresponding with described LED chip 20, exiting surface 21 correspondences of described LED chip 20 are placed in described installing hole 13, and described LED chip 20 is adhered on described the first pad 111 by tin cream correspondence; Adopt chip on board encapsulation (COB) technology that LED chip 20 is adhered on the first pad 111 of described PCB substrate 10 by tin cream correspondence; the mode of relative conventional wires manual welding; automaticity is high; therefore significantly enhance productivity; and the phenomenon that can effectively avoid occurring the potting resin of rosin joint or scald LED chip 20 and damage LED chip 20, thereby well protect LED chip 20.Correspondingly, the method for attachment of LED integrated optical source of the present invention, also has identical technique effect.
Above disclosed is only preferred embodiments of the present invention, certainly can not limit with this interest field of the present invention, and the equivalent variations of therefore doing according to the claims in the present invention, still belongs to the scope that the present invention is contained.
Claims (6)
1. a LED integrated optical source, it is characterized in that: comprise a PCB substrate and some LED chips, described PCB substrate has relative first surface and second, on described PCB substrate, penetratingly offer the some installing holes corresponding with the exiting surface of described LED chip, and on the first surface of described PCB substrate, be provided with first pad corresponding with described LED chip, described in each the exiting surface correspondence of LED chip be placed in one described in installing hole, and described LED chip is adhered on described the first pad by tin cream correspondence.
2. LED integrated optical source as claimed in claim 1, is characterized in that: on described LED chip, be provided with the LED pad corresponding with described the first pad, described LED pad correspondence is adhered on described the first pad.
3. LED integrated optical source as claimed in claim 1, is characterized in that: on second of described PCB substrate, be provided with the second corresponding pad of some and described the first pad, between described the second pad and described the first pad, offer through hole conducting.
4. LED integrated optical source as claimed in claim 2, it is characterized in that: on second of described PCB substrate, be also provided with positive and negative electrode power supply input pad, described cathode power supply input pad is electrically connected to the positive pole of described the second pad, and described negative power supply input pad is connected with the negative electricity of described the second pad.
5. LED integrated optical source as claimed in claim 4, is characterized in that: described positive and negative electrode power supply input pad is electrically connected to driving power.
6. a method of attachment for the LED integrated optical source as described in claim 1-5 any one, is characterized in that, comprises the steps:
(1) the first pad on described PCB substrate is all coated to tin cream;
(2) the exiting surface correspondence of described LED chip is placed in described installing hole, and the LED pad correspondence of described LED chip is affixed on described the first pad;
(3) described LED chip and described PCB substrate are put into reflow soldering and carry out Automatic-heating, make described LED chip mutually bonding with described PCB substrate; And
(4) described positive and negative electrode power supply input pad is connected with driving power.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210199848.2A CN103515366A (en) | 2012-06-15 | 2012-06-15 | LED integrated light source and connecting method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210199848.2A CN103515366A (en) | 2012-06-15 | 2012-06-15 | LED integrated light source and connecting method thereof |
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| CN103515366A true CN103515366A (en) | 2014-01-15 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114321745A (en) * | 2021-12-31 | 2022-04-12 | 联晶智能电子有限公司 | High-reliability module system |
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| CN201742641U (en) * | 2010-05-10 | 2011-02-09 | 爱铭数码株式会社 | Flexible circuit board for laser head LED |
| CN201853742U (en) * | 2010-05-07 | 2011-06-01 | 佛山市国星光电股份有限公司 | Surface pasting type power light emitting diode (LED) support frame structure |
| CN102387663A (en) * | 2010-08-30 | 2012-03-21 | 三星移动显示器株式会社 | Electronic component and method of manufacturing the same |
| CN202695440U (en) * | 2012-06-15 | 2013-01-23 | 霍尼韦尔朗能电器系统技术（广东）有限公司 | Led integrated light source |
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2012
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2926809Y (en) * | 2006-06-07 | 2007-07-25 | 广州市雅江光电设备有限公司 | Connecting structure of LED and circuit board |
| CN101431861A (en) * | 2007-11-07 | 2009-05-13 | 株式会社东海理化电机制作所 | Printed wiring board |
| CN201853742U (en) * | 2010-05-07 | 2011-06-01 | 佛山市国星光电股份有限公司 | Surface pasting type power light emitting diode (LED) support frame structure |
| CN201742641U (en) * | 2010-05-10 | 2011-02-09 | 爱铭数码株式会社 | Flexible circuit board for laser head LED |
| CN102387663A (en) * | 2010-08-30 | 2012-03-21 | 三星移动显示器株式会社 | Electronic component and method of manufacturing the same |
| CN202695440U (en) * | 2012-06-15 | 2013-01-23 | 霍尼韦尔朗能电器系统技术（广东）有限公司 | Led integrated light source |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114321745A (en) * | 2021-12-31 | 2022-04-12 | 联晶智能电子有限公司 | High-reliability module system |
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Owner name: GUANGDONG LANGNENG ELECTRICAL APPLIANCE CO., LTD. Free format text: FORMER OWNER: HONEYWELL LONON ELECTRIC APPLIANCE SYSTEM TECHNOLOGY GUANGDONG CO., LTD. Effective date: 20141114 |
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Effective date of registration: 20141114 Address after: 7, No. 45, No. 8, No. 528415 and No. 9, industrial road, Xiaolan Town, Guangdong, Zhongshan Applicant after: Guangdong Langneng Electrical Appliance Co., Ltd. Address before: 528415 No. 45, industrial road, Xiaolan Town, Guangdong, Zhongshan Applicant before: Honeywell Lonon Electric Appliance System Technology Guangdong Co., Ltd. |
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Application publication date: 20140115 |