CN103515089B - Electric capacity and there is the multilayer circuit board of this electric capacity - Google Patents

Electric capacity and there is the multilayer circuit board of this electric capacity Download PDF

Info

Publication number
CN103515089B
CN103515089B CN201210220963.3A CN201210220963A CN103515089B CN 103515089 B CN103515089 B CN 103515089B CN 201210220963 A CN201210220963 A CN 201210220963A CN 103515089 B CN103515089 B CN 103515089B
Authority
CN
China
Prior art keywords
electrode layer
pole portion
coupling part
negative pole
principal part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210220963.3A
Other languages
Chinese (zh)
Other versions
CN103515089A (en
Inventor
赖盈佐
苏晓芸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taizhou Wisdom Software Park Co Ltd
Original Assignee
Taizhou Wisdom Software Park Co Ltd
Filing date
Publication date
Application filed by Taizhou Wisdom Software Park Co Ltd filed Critical Taizhou Wisdom Software Park Co Ltd
Priority to CN201210220963.3A priority Critical patent/CN103515089B/en
Publication of CN103515089A publication Critical patent/CN103515089A/en
Application granted granted Critical
Publication of CN103515089B publication Critical patent/CN103515089B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

A kind of electric capacity and there is the multilayer circuit board of electric capacity, electric capacity includes the first electrode layer, the second electrode lay and be located in the first electrode layer, dielectric layer between the second electrode lay, each first electrode layer, the second electrode lay includes that anode connection terminal is connected end with negative pole respectively, two anode connection terminal electrical connections, two negative poles connect end electrical connection, first electrode layer includes the first positive pole portion, first negative pole portion and be located in the dielectric layer between the first positive pole portion and the first negative pole portion, the second electrode lay includes the second positive pole portion, second negative pole portion and be located in the dielectric layer between the second positive pole portion and the second negative pole portion, the para-position on the stacked direction of the first electrode layer and the second electrode lay of first positive pole portion and the second negative pole portion is arranged, the para-position on the stacked direction of the first electrode layer and the second electrode lay of second positive pole portion and the first negative pole portion is arranged.Said structure increases electric capacity electricity.

Description

Electric capacity and there is the multilayer circuit board of this electric capacity
Technical field
The present invention relates to a kind of electric capacity and there is the multilayer circuit board of this electric capacity.
Background technology
Electric capacity is widely used in the middle of various electronic product, to meet different operating frequency range and the demand of function of electronic product.The metal polar plate that electric capacity is typically oppositely arranged by two panels forms, and its capacitance is directly proportional to the coupling area of two metal polar plates, and the medium thickness between two metal polar plates is inversely proportional to.Therefore, during larger capacitance amount to be obtained, can be realized by the means increasing the medium thickness between two metal polar plate sizes or reduction two metal polar plates.So, in above two means, the former needs to increase the extra area of plane, when this electric capacity forms on circuit board, can increase the layout area on circuit board extraly;The latter then affects the impedance matching of other holding wire on this layer circuit board.
Summary of the invention
In order to solve in prior art in the case of not increasing by two metal polar plate sizes and not reducing the medium thickness between two metal polar plates, the problem that the electricity of electric capacity cannot increase, it is necessary to a kind of electric capacity that capacity is bigger on the premise of not increasing electric capacity overall dimensions is provided.
It addition, there is a need to provide a kind of multilayer circuit board with above-mentioned electric capacity.
A kind of electric capacity, it includes the electrode layer that at least two stacking is arranged and the dielectric layer being located between adjacent electrode layer, wherein, each electrode layer includes that anode connection terminal is connected end with negative pole, the anode connection terminal of each electrode layer is connected with each other, the negative pole of each electrode layer connects end and is connected with each other, this each electrode layer includes positive pole portion, negative pole portion and be located in the dielectric layer between this positive pole portion and negative pole portion, this positive pole portion includes the first coupling part, this negative pole portion includes the second coupling part, this first coupling part be arranged in parallel with this second coupling part, the first principal part of arrangement in dressing is extended to this second coupling part in this first coupling part side along its length, relative opposite side is connected with this anode connection terminal;The second principal part of arrangement in dressing is extended to this first coupling part in this second coupling part side along its length, and relative opposite side is connected end and is connected with this negative pole;This first principal part and the second principal part are staggered, and this first principal part extends at least two the first branches being parallel to the first coupling part along the side of bearing of trend;This second principal part extends at least two the second branches being parallel to the second coupling part along the side of bearing of trend, and at least two the first branches are staggered with at least two the second branches;In interval between this first branch and second branch that this dielectric layer is arranged on same electrode layer and between this first principal part and second principal part;The para-position on stacked direction of positive pole portion on each electrode layer and the negative pole portion on adjacent electrode layer is arranged.
A kind of multilayer circuit board, it includes top layer, bottom and be located in the electric capacity between this top layer and bottom, wherein, this electric capacity includes the electrode layer that at least two stacking is arranged and the dielectric layer being located between adjacent electrode layer, wherein, each electrode layer includes that anode connection terminal is connected end with negative pole, the anode connection terminal of each electrode layer is connected with each other, the negative pole of each electrode layer connects end and is connected with each other, this each electrode layer includes positive pole portion, negative pole portion and be located in the dielectric layer between this positive pole portion and negative pole portion, this positive pole portion includes the first coupling part, this negative pole portion includes the second coupling part, this first coupling part be arranged in parallel with this second coupling part, the first principal part of arrangement in dressing is extended to this second coupling part in this first coupling part side along its length, relative opposite side is connected with this anode connection terminal;The second principal part of arrangement in dressing is extended to this first coupling part in this second coupling part side along its length, and relative opposite side is connected end and is connected with this negative pole;This first principal part and the second principal part are staggered, and this first principal part extends at least two the first branches being parallel to the first coupling part along the side of bearing of trend;This second principal part extends at least two the second branches being parallel to the second coupling part along the side of bearing of trend, and at least two the first branches are staggered with at least two the second branches;In interval between this first branch and second branch that this dielectric layer is arranged on same electrode layer and between this first principal part and second principal part;The para-position on stacked direction of positive pole portion on each electrode layer and the negative pole portion on adjacent electrode layer is arranged.
Compared with prior art, there is on same electrode layer positive pole portion and negative pole portion, the thickness of the dielectric layer between former two adjacent electrode layers keeps constant and electric capacity the area of plane constant, while i.e. the overall dimensions of electric capacity is constant, electric capacity is formed between positive pole portion and negative pole portion on same electrode layer, the coupling area making this electric capacity substantially increases, the corresponding capacity increasing this electric capacity.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of electric capacity of the present invention.
Fig. 2 is the three-dimensional exploded view of the first electrode layer of electric capacity shown in Fig. 1.
Fig. 3 is first of electric capacity shown in Fig. 1, the floor map of the 3rd electrode layer.
Fig. 4 is second of electric capacity shown in Fig. 1, the floor map of the 4th electrode layer.
Fig. 5 is the sectional view in Fig. 1 at V-V.
Fig. 6 is to have the decomposing schematic representation of the circuit board of electric capacity in Fig. 1.
Main element symbol description
Electric capacity 10
Dielectric layer 119
First electrode layer 11
The second electrode lay 12
3rd electrode layer 13
4th electrode layer 14
Anode connection terminal 80
Negative pole connects end 90
First positive pole portion 115
First negative pole portion 113
Dielectric layer 117
First coupling part 1153
First branch 1154
First principal part 1156
First branch 1157
Second coupling part 1133
Second branch 1134
Second principal part 1136
Second branch 1137
Second positive pole portion 125
Second negative pole portion 123
3rd coupling part 1253
3rd branch 1254
3rd principal part 1256
3rd branch 1257
4th coupling part 1233
4th branch 1234
4th principal part 1236
4th branch 1237
Circuit board 100
Top layer 30
Bottom 50
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
Referring to Fig. 1 to Fig. 3, electric capacity 10 includes the electrode layer that at least two-layer is spaced and stacking is arranged and at least one of which dielectric layer 119 being located between two electrode layers.In present embodiment, illustrate as a example by the electric capacity 10 with four layers of electrode layer.Electric capacity 10 includes the first electrode layer 11, dielectric layer 119, the second electrode lay 12, dielectric layer the 119, the 3rd electrode layer 13, dielectric layer 119 and the 4th electrode layer 14 that sequentially stacking is arranged.This first electrode layer 11 each, the second electrode lay the 12, the 3rd electrode layer 13 and the 4th electrode layer 14 all include that anode connection terminal 80 is connected end 90 with negative pole.Four anode connection terminal 80 are electrically connected to each other the positive pole as electric capacity 10, and four negative poles connect end 90 and are electrically connected to each other the negative pole as electric capacity 10.In the present embodiment, this first electrode layer 11 is consistent with the structure of the 3rd electrode layer 13, and this second electrode lay 12 is consistent with the structure of the 4th electrode layer 14.
This first electrode layer 11 includes the 115, first negative pole portion 113 of the first positive pole portion and is located in the dielectric layer 117 between this first positive pole portion 115 and first negative pole portion 113.This first positive pole portion 115 includes the first coupling part 1153 and at least one the first branch 1154.A wherein side along its length of this first coupling part 1153 is connected with this anode connection terminal 80, and this at least one first branch 1154 is extended by the opposite side limit being connected with this anode connection terminal 80 of the first coupling part 1153.When this first branch 1154 is multiple, the plurality of first branch 1154 is arranged in thin shape.This first branch 1154 each includes the first principal part 1156 and the first branch 1157.This first principal part 1156 each is extended in the same direction by the side of the first coupling part 1153, and the relative both sides of this first principal part 1156 are along extending in parallel out this first branches 1157 some with the first coupling part 1153 length direction.Between these some first branches 1157 parallel to each other.
This first negative pole portion 113 includes the second coupling part 1133 and at least one the second branch 1134.This second coupling part 1133 can be arranged in parallel with this first coupling part 1153.A wherein side along its length of this second coupling part 1133 is connected end 90 with this negative pole and is connected, and this at least one second branch 1134 is extended by the connected opposite side limit of end 90 that is connected with this negative pole of this second coupling part 1133.When this second branch 1134 is multiple, the plurality of second branch 1134 is arranged in thin shape.This second branch 1134 each includes the second principal part 1136 and the second branch 1137.This second principal part 1136 each is extended in the same direction by the side of the second coupling part 1133, and the relative both sides of this second principal part 1136 are along extending in parallel out this second branches 1137 some with the second coupling part 1133 length direction.Between these some second branches 1137 parallel to each other.In these second branches 1134 multiple, 2 second branches 1134 being positioned at the first electrode layer 11 edge extend this second branch 1137 inside this first electrode layer 11, wherein 2 second branches 1137 away from this second coupling part 1133 extend relatively, and the distance of two extended end portion is slightly larger than the width of this anode connection terminal 80.
Additionally, this first coupling part 1153 and the first branch 1154 are correspondingly arranged at the second coupling part 1133 and in space that the second branch 1134 is surrounded.Each first principal part 1156 is spaced with the second principal part 1136, alternately with being arranged on same first electrode layer 11.Each second branch 1137 is spaced with the first branch 1157, alternately with being arranged on same first electrode layer 11.The free end of each second branch 1137 stretches between 2 first branches 1157 being disposed adjacent, this dielectric layer 117 will be spaced between this first branch 1157 and second branch 1137, between the first principal part 1156 and the second principal part 1136, to form electric capacity between the first branch 1154 and the second branch 1134 on same electrode layer.
Correspondingly, Fig. 4 and Fig. 5 is referred to. this second electrode lay 12 includes the 125, second negative pole portion 123 of the second positive pole portion and is located in the dielectric layer 127 between this second positive pole portion 125 and second negative pole portion 123.This second positive pole portion 125 includes the 3rd coupling part 1253 and at least one the 3rd branch 1254.Each 3rd branch 1254 includes the 3rd principal part 1256 and some 3rd branches 1257 being arranged on the 3rd principal part 1256.3rd coupling part 1253 in this second positive pole portion 125 and at least one the 3rd branch 1254, and the 3rd principal part 1256 of the 3rd branch 1254 is identical with this first negative pole portion 113 structure of the first electrode layer 11 with relation each other with the structure of the 3rd branch 1257.3rd coupling part 1253 is connected with this anode connection terminal 80.
This second negative pole portion 123 includes the 4th coupling part 1233 and at least one the 4th branch 1234.Each 4th branch 1234 includes the 4th principal part 1236 and some 4th branches 1237 being arranged on the 4th principal part 1236.4th coupling part 1233 in this second negative pole portion 123 and at least one the 4th branch 1234, and the 4th principal part 1236 of the 4th branch 1234 is identical with this first positive pole portion 115 structure of the first electrode layer 11 with relation each other with the structure of the 4th branch 1237.4th coupling part 1233 is connected end 90 with this negative pole and is connected.
When this first electrode layer 11 is arranged with the second electrode lay 12 stacking, this first branch 1154 corresponding with the 4th branch 1234 and on stacked direction alignment therewith, this second branch 1134 corresponding with the 3rd branch 1254 and on stacked direction alignment therewith.This first coupling part 1153 corresponding with the 3rd coupling part 1253 and on stacked direction alignment therewith, the second coupling part 1133 corresponding with the 4th coupling part 1233 and on stacked direction alignment therewith.
The first branch 1154 with anode connection terminal 80 electrical connection on each first electrode layer 11 is all connected the second branch 1134 cincture that end 90 electrically connects with negative pole.Identical, this first electrode layer 11 is connected the first branch 1154 institute cincture (joining shown in Fig. 6) that the second branch 1134 of end 90 electrical connection is all electrically connected with anode connection terminal 80 with negative pole.Be with, thickness at described dielectric layer 119 keeps constant and electric capacity 10 the area of plane constant, while i.e. the overall dimensions of electric capacity 10 is constant, the second branch 1134 being connected end 90 electrical connection with negative pole on this first electrode layer 11 is not only coupled with the 3rd branch 1254 on the second electrode lay 12, and be the most also coupled with the first branch 1154 on same first electrode layer 11, the coupling area making this electric capacity 10 substantially increases, the corresponding capacity increasing this electric capacity 10.
In addition, the dielectric layer 117 being positioned on same first electrode layer 11 is the thinnest, the interlayer area of plane that it is shared can be controlled to the least, therefore, the interlayer area of plane shared by dielectric layer 117 and affect the capacitance between the first electrode layer 11 and the second electrode lay 12 negligible.Further, owing to the first coupling part 1153 on the first electrode layer 11 is all connected to anode connection terminal 80 with the 3rd coupling part 1253 on the second electrode lay 12, the two the most also produces without capacitance, therefore, also the interlayer area of plane shared by said two devices can be controlled to the least, negligible with the effect reaching capacitance is reduced.
Referring to Fig. 6, multilayer circuit board 100 also includes top layer 30, bottom 50 and this electric capacity 10 being located between top layer 30, bottom 50.This electric capacity 10 is without taking described top layer 30 and the layout area of bottom 50.
This top layer 30, bottom 50 are dielectric layer, and realize the transmission of signal, the transmission of electric energy or the electric connection etc. being arranged between the element on top layer 30 and bottom 50 by the circuit laid on its surface.

Claims (4)

1. an electric capacity, it includes the electrode layer that at least two stacking is arranged and the dielectric layer being located between adjacent electrode layer, it is characterized in that: each electrode layer includes that anode connection terminal is connected end with negative pole, the anode connection terminal of each electrode layer is connected with each other, the negative pole of each electrode layer connects end and is connected with each other, this each electrode layer includes positive pole portion, negative pole portion and be located in the dielectric layer between this positive pole portion and negative pole portion, this positive pole portion includes the first coupling part, this negative pole portion includes the second coupling part, this first coupling part be arranged in parallel with this second coupling part, the first principal part of arrangement in pectination is extended to this second coupling part in this first coupling part side along its length, relative opposite side is connected with this anode connection terminal;The second principal part of arrangement in pectination is extended to this first coupling part in this second coupling part side along its length, and relative opposite side is connected end and is connected with this negative pole;This first principal part and the second principal part are staggered, and this first principal part extends at least two the first branches being parallel to the first coupling part along the side of bearing of trend;This second principal part extends at least two the second branches being parallel to the second coupling part along the side of bearing of trend, and at least two the first branches are staggered with at least two the second branches;In interval between this first branch and second branch that this dielectric layer is arranged on same electrode layer and between this first principal part and second principal part;The para-position on stacked direction of positive pole portion on each electrode layer and the negative pole portion on adjacent electrode layer is arranged, it is positioned at the first electrode layer and the second electrode lay medium position, this at least two first branch is to extend from the opposite sides of this first principal part to form, and this at least two second branch is to extend from the opposite sides of this second principal part to form.
2. electric capacity as claimed in claim 1, it is characterized in that: 2 second principal parts being positioned at same electrode layer edge house at least two first branches therebetween, this 2 second principal part extends in parallel this second branch to the direction with anode connection terminal of the electrode layer at this place, wherein 2 second branches away from this second coupling part extend relatively, and the distance of two extended end portion is more than the width of this anode connection terminal.
3. a multilayer circuit board, including top layer, bottom and be located in the electric capacity between this top layer and bottom, it is characterized in that: this electric capacity includes that it includes the electrode layer that at least two stacking is arranged and the dielectric layer being located between adjacent electrode layer, each electrode layer includes that anode connection terminal is connected end with negative pole, the anode connection terminal of each electrode layer is connected with each other, the negative pole of each electrode layer connects end and is connected with each other, this each electrode layer includes positive pole portion, negative pole portion and be located in the dielectric layer between this positive pole portion and negative pole portion, this positive pole portion includes the first coupling part, this negative pole portion includes the second coupling part, this first coupling part be arranged in parallel with this second coupling part, the first principal part of arrangement in pectination is extended to this second coupling part in this first coupling part side along its length, relative opposite side is connected with this anode connection terminal;The second principal part of arrangement in pectination is extended to this first coupling part in this second coupling part side along its length, and relative opposite side is connected end and is connected with this negative pole;This first principal part and the second principal part are staggered, and this first principal part extends at least two the first branches being parallel to the first coupling part along the side of bearing of trend;This second principal part extends at least two the second branches being parallel to the second coupling part along the side of bearing of trend, and at least two the first branches are staggered with at least two the second branches;This dielectric layer will be spaced between this first branch and second branch on same electrode layer, between the first principal part and the second principal part;Positive pole portion on one electrode layer is arranged with the para-position on stacked direction of the negative pole portion on adjacent electrode layer, it is positioned at the first electrode layer and the second electrode lay medium position, this at least two first branch is to extend from the opposite sides of this first principal part to form, and this at least two second branch is to extend from the opposite sides of this second principal part to form.
4. multilayer circuit board as claimed in claim 3, it is characterized in that: 2 second principal parts being positioned at same electrode layer edge house at least two first branches therebetween, this 2 second principal part extends in parallel this second branch to the direction with anode connection terminal of the electrode layer at this place, wherein 2 second branches away from this second coupling part extend relatively, and the distance of two extended end portion is more than the width of this anode connection terminal.
CN201210220963.3A 2012-06-29 Electric capacity and there is the multilayer circuit board of this electric capacity Active CN103515089B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210220963.3A CN103515089B (en) 2012-06-29 Electric capacity and there is the multilayer circuit board of this electric capacity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210220963.3A CN103515089B (en) 2012-06-29 Electric capacity and there is the multilayer circuit board of this electric capacity

Publications (2)

Publication Number Publication Date
CN103515089A CN103515089A (en) 2014-01-15
CN103515089B true CN103515089B (en) 2016-11-30

Family

ID=

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6155936A (en) * 1984-08-27 1986-03-20 Nec Ic Microcomput Syst Ltd Semiconductor integrated circuit
CN1527385A (en) * 2003-03-04 2004-09-08 台湾积体电路制造股份有限公司 Multilayer composite metal capacitor structure
CN1835235A (en) * 2005-03-17 2006-09-20 富士通株式会社 Semiconductor device and mim capacitor
JP2010103408A (en) * 2008-10-27 2010-05-06 Kuraray Co Ltd Fabric-like capacitor and input device with the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6155936A (en) * 1984-08-27 1986-03-20 Nec Ic Microcomput Syst Ltd Semiconductor integrated circuit
CN1527385A (en) * 2003-03-04 2004-09-08 台湾积体电路制造股份有限公司 Multilayer composite metal capacitor structure
CN1835235A (en) * 2005-03-17 2006-09-20 富士通株式会社 Semiconductor device and mim capacitor
JP2010103408A (en) * 2008-10-27 2010-05-06 Kuraray Co Ltd Fabric-like capacitor and input device with the same

Similar Documents

Publication Publication Date Title
JP6048633B1 (en) Composite transmission line and electronic equipment
CN101615710A (en) Waveguide structure and printed circuit board (PCB)
CN205081202U (en) Transmission line and flat cable
JP2011023439A5 (en) Capacitor and wiring board
US20150022948A1 (en) Capacitor structure
TW200949875A (en) Multilayer capacitor and mounted structure thereof
JP2009027172A5 (en)
JP2009065198A (en) Multilayer capacitor
US8026777B2 (en) Energy conditioner structures
JP5319559B2 (en) Metallized film capacitor and power converter using the same
JP2015041876A (en) Electromagnetic band gap element, electronic circuit, and conductor structure
TWI447764B (en) Capacitance and multilayer pcb with the capacitance
US8324981B2 (en) Composite balun
JP2014146754A (en) Laminated through capacitor
CN103515089B (en) Electric capacity and there is the multilayer circuit board of this electric capacity
US8953301B2 (en) Capacitor and multilayer circuit board using the same
US20070035363A1 (en) Electromagnetic delay line inductance element
CN103578761B (en) Electric capacity and there is the multilayer circuit board of this electric capacity
CN107240497A (en) Ceramic capacitor
KR100916480B1 (en) Laminated ceramic capacitor
CN101047063B (en) Capacitor structure
JP5031650B2 (en) Multilayer capacitor
CN102348327A (en) Printed circuit board
JP2010080615A (en) Multilayer capacitor, mounting structure for the multilayer capacitor and method for manufacturing the multilayer capacitor
CN103515089A (en) Capacitor and multilayer circuit board with same

Legal Events

Date Code Title Description
PB01 Publication
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20160323

Address after: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor

Applicant after: SCIENBIZIP CONSULTING (SHEN ZHEN) Co.,Ltd.

Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two

Applicant before: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) Co.,Ltd.

Applicant before: HON HAI PRECISION INDUSTRY Co.,Ltd.

TA01 Transfer of patent application right

Effective date of registration: 20160527

Address after: 518000 Guangdong Province, Shenzhen New District of Longhua City, Dalang street, Hua Sheng Lu Yong Jingxuan commercial building 1608

Applicant after: Jinyang Shenzhen sea Network Intelligent Technology Co.,Ltd.

Address before: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor

Applicant before: SCIENBIZIP CONSULTING (SHEN ZHEN) Co.,Ltd.

TA01 Transfer of patent application right

Effective date of registration: 20161010

Address after: 225599 Cao village, Jiangyan Town, Jiangyan District, Jiangsu, Taizhou

Applicant after: Taizhou Zhigu Software Park Co.,Ltd.

Address before: Tianhe District Tong East Road Guangzhou city Guangdong province 510665 B-101 No. 5, room B-118

Applicant before: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd.

Effective date of registration: 20161010

Address after: Tianhe District Tong East Road Guangzhou city Guangdong province 510665 B-101 No. 5, room B-118

Applicant after: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd.

Address before: 518000 Guangdong Province, Shenzhen New District of Longhua City, Dalang street, Hua Sheng Lu Yong Jingxuan commercial building 1608

Applicant before: Jinyang Shenzhen sea Network Intelligent Technology Co.,Ltd.

GR01 Patent grant