CN103440905A - Conducting film - Google Patents
Conducting film Download PDFInfo
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- CN103440905A CN103440905A CN2013103256208A CN201310325620A CN103440905A CN 103440905 A CN103440905 A CN 103440905A CN 2013103256208 A CN2013103256208 A CN 2013103256208A CN 201310325620 A CN201310325620 A CN 201310325620A CN 103440905 A CN103440905 A CN 103440905A
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- conductive layer
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Abstract
Provided is a conducting film. The conducting film comprises a first transparent substrate, a first conducting layer, a bonding layer, a second transparent substrate and a second conducting layer, wherein a conducting pattern of the first conducting layer is of a grid shape, the first conducting layer is arranged on the first transparent substrate, the bonding layer adheres to one side, far away from the first conducting layer, of the first transparent substrate, the second transparent substrate adheres to one side, far away from the first transparent substrate, of the bonding layer, a conducting pattern of the second conducting layer is of a grid shape, the second conducting layer is arranged on the second transparent substrate, and a transparent protective layer is arranged on the surface of at least one of the first conducting layer and the second conducting layer. The conducting film is low in cost.
Description
[technical field]
The present invention relates to a kind of conducting film, particularly relate to a kind of touch-control conducting film.
[background technology]
Nesa coating is to receive the sensing element of the input signals such as touch in touch-screen.At present, ITO(tin indium oxide) layer is vital part in nesa coating.Although the develop rapidly at a tremendous pace of the manufacturing technology of touch-screen, take the projecting type capacitor screen as example, too large change does not occur in the basic manufacturing process of ITO layer in recent years, always inevitably needs the ITO plated film, and ITO is graphical.
Therefore indium is a kind of metal material of costliness, usings ITO as the material of conductive layer, has promoted to a great extent the cost of touch-screen.The ITO pattern of conductive layer is generally strip, triangle or rhombus etc., this large-area ITO pattern array formation conductive layer of arranging.Yet, because the ITO material cost is high, large-area ITO pattern array causes the cost of traditional conducting film higher.
[summary of the invention]
In view of above-mentioned condition, be necessary to provide a kind of lower-cost conducting film.
A kind of conducting film, it comprises:
The first transparent substrates;
The first conductive layer, the conductive pattern of described the first conductive layer is latticed, and described the first conductive layer is located on described the first transparent substrates;
Adhesive layer, adhere to the side of described the first transparent substrates away from described the first conductive layer;
The second transparent substrates, adhere to the side of described adhesive layer away from described the first transparent substrates;
The second conductive layer, the conductive pattern of described the second conductive layer is latticed, and described the second conductive layer is located on described the second transparent substrates;
Wherein, in described the first conductive layer and described the second conductive layer, the surface of at least one is provided with protective clear layer.
Compared to traditional conducting film, the first conductive layer of above-mentioned conducting film and the conductive pattern of the second conductive layer are latticed, and the material that latticed conductive pattern is used is less, thereby reduces costs; The surface of at least one in the first conductive layer and the second conductive layer is provided with protective clear layer, in the process of placing or depositing, can avoid electric conducting material to be scratched.
In embodiment, described the first conductive layer is convexly set in described the first transparent substrates surface therein, and described the second conductive layer is convexly set in the surface of described the second transparent substrates.
In embodiment, described protective clear layer is attached at least one in described the first conductive layer and described the second conductive layer separably therein.
In embodiment, also comprise the hard protective layer of being located between described the first transparent substrates and described adhesive layer therein.
In embodiment, also comprise the hard protective layer of being located between described the second transparent substrates and described adhesive layer therein.
In embodiment, the material of described protective clear layer is UV glue, impression glue or Merlon therein.
In embodiment, also comprise the hypothallus of being located between described the first transparent substrates and described the first conductive layer therein, described the first conductive layer is located at the surface of described the first hypothallus.
In embodiment, also comprise the hypothallus of being located between described the second transparent substrates and described the second conductive layer therein, described the second conductive layer is located at the surface of described the second hypothallus.
In embodiment, the grid of described the first conductive layer and described the second conductive layer is random grid or regular grid therein.
In embodiment, described regular grid is regular hexagonal cell, network or square net therein.
Therein in embodiment, also comprise the first lead-in wire electrode and the second lead-in wire electrode, described the first lead-in wire electrode is located at the edge of described the first conductive layer and is electrically connected to described the first conductive layer, and described the second lead-in wire electrode is located at the edge of described the second conductive layer and is electrically connected to described the second conductive layer.
In embodiment, described the first lead-in wire electrode and the second lead-in wire electrode are latticed or linear therein.
In embodiment, described the first lead-in wire electrode is convexly set in described the first transparent substrates surface therein, and described the second lead-in wire electrode is convexly set in described the second transparent substrates surface.
Therein in embodiment, material silver, copper, conducting polymer or the ITO of described the first lead-in wire electrode and the second lead-in wire electrode.
In embodiment, the material of described the first conductive layer and described the second conductive layer is silver, copper, conducting polymer or ITO therein.
[accompanying drawing explanation]
The profile of the conducting film that Fig. 1 is embodiment of the present invention;
The vertical view that Fig. 2 is the conducting film in Fig. 1;
Fig. 3 (a) is to the structural representation of the different embodiment of Fig. 3 (d) grid that is the conducting film shown in Fig. 2;
The exploded view that Fig. 4 is the conducting film in Fig. 1;
The profile of the conducting film that Fig. 5 is another execution mode;
The profile of the conducting film that Fig. 6 is another execution mode;
The profile of the conducting film that Fig. 7 is another execution mode;
Fig. 8 (a) is to form the structural representation of the first conductive layer step in embodiment of the present invention on the first transparent substrates to Fig. 8 (e).
[embodiment]
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Provided preferred embodiment of the present invention in accompanying drawing.But the present invention can realize in many different forms, is not limited to embodiment described herein.On the contrary, provide the purpose of these embodiment be make the understanding of disclosure of the present invention more comprehensively thorough.
It should be noted that, when element is called as " being fixed in " another element, can directly can there be element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may have centering elements simultaneously.Term as used herein " vertical ", " level ", " left side ", " right side " and similar statement are just for illustrative purposes.
Unless otherwise defined, all technology that this paper is used are identical with the implication that belongs to the common understanding of those skilled in the art of the present invention with scientific terminology.The term used in specification of the present invention herein, just in order to describe the purpose of specific embodiment, is not intended to be restriction the present invention.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
Refer to Fig. 1, the conducting film 200 of embodiment of the present invention comprises adhesive layer 210, the first transparent substrates 220, the second transparent substrates 230, hypothallus 240, the first conductive layer 250, the second conductive layer 260 and protective clear layer 270.
The first transparent substrates 220, adhesive layer 210 and the second transparent substrates 230 stack gradually.The first transparent substrates 220 and the second transparent substrates 230 bond together by adhesive layer 210.The shape of the first transparent substrates 220, adhesive layer 210 and the second transparent substrates 230 can be set according to the shape of conducting film 200, for example, is rectangle.The material of the first transparent substrates 220 and the second transparent substrates 230 is thermoplastic, PET or glass.Concrete, thermoplastic is PC or PMMA, can certainly be other thermoplastics.
The first conductive layer 250 is located at the surface of the hypothallus 240 on the surface that is positioned at the first transparent substrates 220.The conductive pattern of the first conductive layer 250 is latticed.The material of the first conductive layer 250 is silver, copper, conducting polymer or ITO.Specifically in the present embodiment, the first conductive layer 250 is convexly set in the surface of hypothallus 240.
The second conductive layer 260 is located at the surface of the hypothallus 240 on the surface that is positioned at the second transparent substrates 230.The conductive pattern of the second conductive layer 260 is latticed.The material of the second conductive layer 260 is silver, copper, conducting polymer or ITO.Specifically in the present embodiment, the second conductive layer 260 is convexly set in the surface of hypothallus 240.
Please consult Fig. 2 and Fig. 4, further, the grid of the first conductive layer 250 and the second conductive layer 260 is random grid or regular grid simultaneously.Refer to Fig. 3 (a) to Fig. 3 (d), the grid shown in Fig. 3 (a) is random grid, and Fig. 3 (b) is respectively regular hexagonal cell, network and square net to the grid shown in Fig. 3 (d).
In present embodiment, the first conductive layer 250 and the second conductive layer 260 complete by modes such as exposure imaging, silk screen printings.
In the execution mode of Fig. 4, the first conductive layer 250 and the second conductive layer 260 form by the conduction band of a plurality of array arrangements.The conduction band of the first conductive layer 250 extends along the direction of the first dimension, and the conduction band of the second conductive layer 260 extends along the direction of the second dimension, and the first dimension direction is mutually vertical with the second dimension direction.Certainly, in other execution mode, the first dimension direction and the second dimension direction oblique.
Please again consult Fig. 1, protective clear layer 270 has two.One of them protective clear layer 270 is located at the surface of the first conductive layer 250 and hypothallus 240, and another protective layer 270 is located at the surface of the second conductive layer 260 and hypothallus 240.In the execution mode shown in Fig. 1; two protective clear layers 270 fit tightly with the surface of two hypothalluses 240 away from adhesive layer 210 respectively; thereby make the first conductive layer 250 and the second conductive layer 260 be embedded in protective clear layer 270; thereby protective clear layer 270 can form protection to the first conductive layer 250 and the second conductive layer 260, avoids being scratched.The material of protective clear layer 270 is UV glue, impression glue or Merlon.
In Fig. 1 illustrated embodiment, protective clear layer 270 has two, and certainly, in other execution mode, protective clear layer 270 also can only have one.Refer to Fig. 5, in the execution mode shown in Fig. 5, protective clear layer 270 only has one, and protective clear layer 270 is located at the surface of the first conductive layer 250 and hypothallus 240.Certainly, protective clear layer 270 also can only be located at the surface of the second conductive layer 260 and hypothallus 240.
In the execution mode shown in Fig. 1, two protective clear layers 270 fit tightly with the surface of two hypothalluses 240 away from adhesive layer 210 respectively, and the first conductive layer 250 and the second conductive layer 260 are embedded in protective clear layer 270.Certainly, in other execution mode, protective clear layer 270 also can adhere at least one in the first conductive layer 250 and the second conductive layer 260 separably.Refer to Fig. 6, in the execution mode shown in Fig. 6, one of them protective clear layer 270 adheres to the first conductive layer 250 separably, and another protective clear layer 270 is located at the surface of the second conductive layer 260 and hypothallus 240.In the execution mode shown in Fig. 6; protective clear layer 270 adhere to separably the first conductive layer 250 and with hypothallus 240 separately; thereby can form protection to the first conductive layer 250, in follow-up technique, this protective clear layer 270 can tear easily.
In the execution mode shown in Fig. 1, the first conductive layer 250 and the first transparent substrates 220, and the second conductive layer 260 and the second transparent substrates 230 between be equipped with hypothallus 240, to increase the first conductive layer 250 and the first transparent substrates 220, and the adhesion between the second conductive layer 260 and the second transparent substrates 230, certainly, in other execution mode, hypothallus 240 can omit, now the first conductive layer 250 directly is located at the surface of the first transparent substrates 220, and the second conductive layer 260 directly is located at the surface of the second transparent substrates 230.
In the execution mode shown in Fig. 1, the first transparent substrates 220 and the second transparent substrates 230 directly adhere to adhesive layer 210.Refer to Fig. 7, further, in the execution mode shown in Fig. 7, between the first transparent substrates 220 and adhesive layer 210 and between the second transparent substrates 230 and adhesive layer 210, also be provided with hard protective layer 280.
Further, please again consult Fig. 1 and Fig. 2, conducting film 200 also comprises is located at the first lead-in wire electrode 290 and the second lead-in wire electrode (not shown).The first lead-in wire electrode 290 is positioned at the edge of the first conductive layer 250 and is electrically connected to the first conductive layer 250, and the second lead-in wire electrode is positioned at the edge of the second conductive layer 260 and is electrically connected to the second conductive layer 260.The first lead-in wire electrode 290 and the second lead-in wire electrode are convexly set in the surface of hypothallus 240.The first lead-in wire electrode 290 and the second lead-in wire electrode can form by modes such as exposure imaging or inkjet printings.
In the present embodiment, the first lead-in wire electrode 290 comprises cross one another the first conductive lead wire, and the second lead-in wire electrode comprises cross one another the second conductive lead wire, and the first lead-in wire electrode 290 and the second lead-in wire electrode are network.The network of the first lead-in wire electrode 290 and the second lead-in wire electrode 270 is identical with the network of the first conductive layer 250 and the second conductive layer 260, is specifically as follows Fig. 3 (a) to the structure shown in Fig. 3 (d).Certainly, in other embodiment, the first lead-in wire electrode 290 and the second lead-in wire electrode can also be linear.
Preferably, the material of the first lead-in wire electrode 290 and the second lead-in wire electrode 270 is silver, copper, conducting polymer or ITO.
Refer to Fig. 8 (a) to Fig. 8 (e), specifically, in illustrated embodiment, the step that forms the first conductive layer 250 on the first transparent substrates 220 surfaces comprises:
As shown in Fig. 8 (a), be formed for the conductive material layer 300 of the first conductive layer 250 on the surface of the first transparent substrates 220;
As shown in Figure 8 (b) shows, can form the shadow shield 400 of the first corresponding conductive layer 250 in the surperficial setting of conductive material layer 300;
As shown in Fig. 8 (c), conductive material layer 300 is carried out to exposure light irradiation;
As shown in Fig. 8 (d), conductive material layer 300 is carried out to etching and form the first conductive layer 250 as shown in Fig. 8 (e).
Adopt the method for exposure imaging to prepare the method for the step of the second conductive layer 260, the first lead-in wire electrode 290 and the second lead-in wire electrode and above-mentioned preparation the first conductive layer 260 similar, do not repeat them here.
Certainly, the first conductive layer 250 and the second conductive layer 260 can also adopt the additive method preparations such as silk screen printing.
Compared to traditional conducting film, above-mentioned conducting film 200 at least has the following advantages:
(1) above-mentioned conducting film 200 replaces conventional I TO process structure with network, and the material that latticed conductive pattern is used is less, thereby reduces costs.
The surface of at least one in (2) first conductive layers 250 and the second conductive layer 260 is provided with protective clear layer 270, in the process of placing or depositing, can avoid electric conducting material to be scratched.
(3) first conductive layers 250 and the first transparent substrates 220, and the second conductive layer 260 and the second transparent substrates 230 between be equipped with hypothallus 240, can increase the first conductive layer 250 and the first transparent substrates 220, and the adhesion between the second conductive layer 260 and the second transparent substrates 230.
Being provided with hard protective layer 280 between (4) first transparent substrates 220 and adhesive layer 210 and between the second transparent substrates 230 and adhesive layer 210 can be protected the first transparent substrates 220 and the second transparent substrates 230.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (15)
1. a conducting film, is characterized in that, comprising:
The first transparent substrates;
The first conductive layer, the conductive pattern of described the first conductive layer is latticed, and described the first conductive layer is located on described the first transparent substrates;
Adhesive layer, adhere to the side of described the first transparent substrates away from described the first conductive layer;
The second transparent substrates, adhere to the side of described adhesive layer away from described the first transparent substrates;
The second conductive layer, the conductive pattern of described the second conductive layer is latticed, and described the second conductive layer is located on described the second transparent substrates;
Wherein, in described the first conductive layer and described the second conductive layer, the surface of at least one is provided with protective clear layer.
2. conducting film as claimed in claim 1, is characterized in that, described the first conductive layer is convexly set in described the first transparent substrates surface, and described the second conductive layer is convexly set in the surface of described the second transparent substrates.
3. conducting film as claimed in claim 1, is characterized in that, described protective clear layer is attached at least one in described the first conductive layer and described the second conductive layer separably.
4. conducting film as claimed in claim 1, is characterized in that, also comprises the hard protective layer of being located between described the first transparent substrates and described adhesive layer.
5. conducting film as claimed in claim 1, is characterized in that, also comprises the hard protective layer of being located between described the second transparent substrates and described adhesive layer.
6. conducting film as claimed in claim 1, is characterized in that, the material of described protective clear layer is UV glue, impression glue or Merlon.
7. conducting film as claimed in claim 1, is characterized in that, also comprises the hypothallus of being located between described the first transparent substrates and described the first conductive layer, and described the first conductive layer is located at the surface of described the first hypothallus.
8. conducting film as claimed in claim 1, is characterized in that, also comprises the hypothallus of being located between described the second transparent substrates and described the second conductive layer, and described the second conductive layer is located at the surface of described the second hypothallus.
9. conducting film as claimed in claim 1, is characterized in that, the grid of described the first conductive layer and described the second conductive layer is random grid or regular grid.
10. conducting film as claimed in claim 9, is characterized in that, described regular grid is regular hexagonal cell, network or square net.
11. conducting film as claimed in claim 1, it is characterized in that, also comprise the first lead-in wire electrode and the second lead-in wire electrode, described the first lead-in wire electrode is located at the edge of described the first conductive layer and is electrically connected to described the first conductive layer, and described the second lead-in wire electrode is located at the edge of described the second conductive layer and is electrically connected to described the second conductive layer.
12. conducting film as claimed in claim 11, is characterized in that, described the first lead-in wire electrode and the second lead-in wire electrode are latticed or linear.
13. conducting film as claimed in claim 11, is characterized in that, described the first lead-in wire electrode is convexly set in described the first transparent substrates surface, and described the second lead-in wire electrode is convexly set in described the second transparent substrates surface.
14. conducting film as claimed in claim 11, is characterized in that, material silver, copper, conducting polymer or the ITO of described the first lead-in wire electrode and the second lead-in wire electrode.
15. conducting film as claimed in claim 1, is characterized in that, the material of described the first conductive layer and described the second conductive layer is silver, copper, conducting polymer or ITO.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103256208A CN103440905A (en) | 2013-07-30 | 2013-07-30 | Conducting film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103256208A CN103440905A (en) | 2013-07-30 | 2013-07-30 | Conducting film |
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| CN103440905A true CN103440905A (en) | 2013-12-11 |
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| CN102005255A (en) * | 2010-11-23 | 2011-04-06 | 苏州禾盛新型材料股份有限公司 | Double-sided conducting film for projection type capacitive touch panel |
| JP2011129272A (en) * | 2009-12-15 | 2011-06-30 | Nissha Printing Co Ltd | Double-sided transparent conductive film sheet and method of manufacturing the same |
| CN102290129A (en) * | 2010-06-18 | 2011-12-21 | 富士胶片株式会社 | Conductive film and method for producing the same |
| CN102314254A (en) * | 2010-06-29 | 2012-01-11 | 乐金显示有限公司 | Touch panel |
| CN102639318A (en) * | 2009-11-27 | 2012-08-15 | 凸版印刷株式会社 | Transparent conductive laminate, method for producing same, and electrostatic capacitance type touch panel |
| CN203366779U (en) * | 2013-07-30 | 2013-12-25 | 南昌欧菲光科技有限公司 | Conductive film |
-
2013
- 2013-07-30 CN CN2013103256208A patent/CN103440905A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102639318A (en) * | 2009-11-27 | 2012-08-15 | 凸版印刷株式会社 | Transparent conductive laminate, method for producing same, and electrostatic capacitance type touch panel |
| JP2011129272A (en) * | 2009-12-15 | 2011-06-30 | Nissha Printing Co Ltd | Double-sided transparent conductive film sheet and method of manufacturing the same |
| CN102290129A (en) * | 2010-06-18 | 2011-12-21 | 富士胶片株式会社 | Conductive film and method for producing the same |
| CN102314254A (en) * | 2010-06-29 | 2012-01-11 | 乐金显示有限公司 | Touch panel |
| CN102005255A (en) * | 2010-11-23 | 2011-04-06 | 苏州禾盛新型材料股份有限公司 | Double-sided conducting film for projection type capacitive touch panel |
| CN203366779U (en) * | 2013-07-30 | 2013-12-25 | 南昌欧菲光科技有限公司 | Conductive film |
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Application publication date: 20131211 |