CN103403957B - Resonant coupler - Google Patents

Resonant coupler Download PDF

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Publication number
CN103403957B
CN103403957B CN201280010610.9A CN201280010610A CN103403957B CN 103403957 B CN103403957 B CN 103403957B CN 201280010610 A CN201280010610 A CN 201280010610A CN 103403957 B CN103403957 B CN 103403957B
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wiring
line
resonance
transmission
input
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CN201280010610.9A
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Chinese (zh)
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CN103403957A (en
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永井秀一
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松下电器产业株式会社
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Priority to PCT/JP2012/006493 priority patent/WO2013065238A1/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/02Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/201Filters for transverse electromagnetic waves
    • H01P1/203Strip line filters
    • H01P1/20327Electromagnetic interstage coupling
    • H01P1/20354Non-comb or non-interdigital filters
    • H01P1/20381Special shape resonators
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/12Coupling devices having more than two ports
    • H01P5/16Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/184Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
    • H01P5/187Broadside coupled lines
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B5/00Near-field transmission systems, e.g. inductive loop type

Abstract

发送基板(101)上设置的发送侧共振布线(113)在发送侧共振布线(113)上的第一发送布线(111)的连接部位与第二发送布线(112)的连接部位之间连接于发送地电位,接收基板(102)上设置的接收侧共振布线(123)在接收侧共振布线(123)上的第一接收布线(121)的连接部位与第二接收布线(122)的连接部位之间连接于接收地电位,发送基板(101)与接收基板(102)对置设置,使得在从垂直于发送基板(101)主面的方向观察的情况下,发送侧共振布线(113)的轮廓与接收侧共振布线(123)的轮廓一致,且成点对称的关系。 Transmission between the substrate (101) transmission side resonance line (113) provided on a first resonance line transmission line (111) (113) in the transmitting side connecting portion and a second transmission line (112) is connected to the connection point receiving a first wiring (121) on the ground transmission, receiving substrate (102) the reception side resonance provided on a wiring (123) on the receiving side resonant line (123) receiving the second wiring connection portion (122) of the connecting portion between the ground potential connected to the receiving, transmitting substrate (101) with the receiving substrate (102) disposed opposite, so that when viewed from the main surface of the substrate perpendicular to the transmission (101) direction, the transmission side resonance line (113) and the reception side resonance contour line (123) of the same contour, and in point symmetry relationship.

Description

共振耦合器 Resonant coupler

技术领域 FIELD

[0001] 本发明涉及一种非接触信号传送、或非接触电力传送中使用的共振耦合器。 [0001] The present invention relates to a non-contact signal transmission, the resonant coupler or contactless transmission power used.

背景技术 Background technique

[0002] 已知一种非接触(无线)传送技术,不利用布线来直接连接电气设备,在电气设备间进行电力及信号的传送。 [0002] discloses a non-contact (wireless) transmission technology, without using direct wiring to connect electrical equipment, electric power and signal transmission between the electrical device.

[0003] 在高频用半导体芯片与外部的信号收发中,在使用引线接合法(wire bonding) 来构成传送线路的情况下,产生对高频信号的特性造成影响的不确定的寄生电容或寄生电感。 [0003] In the high-frequency semiconductor chip and the external signal receiving and transmitting, in case of using wire bonding (wire bonding) to form the transmission line, the parasitic capacitance affect the characteristics of the high-frequency signal or parasitic uncertain inductance. 因此,使用不使高频信号的特性恶化的非接触传送技术。 Thus, using a high-frequency signal without deteriorating the characteristics of the non-contact transmission technology.

[0004] 作为使用非接触传送技术的非接触传送装置的一例,已知被称为数字隔离器(digital isolator)的电子电路元件(例如参照专利文献1)。 [0004] As an example of a non-contact transfer means is non-contact transmission technology, known to be referred to as a digital isolator (digital isolator) of the electronic circuit components (e.g. refer to Patent Document 1). 专利文献1中记载的技术是能够将逻辑信号的地电位与RF信号的地电位分离的技术,所以用于各种用途。 Patent Document 1 discloses technology is the ability to earth potential of the RF signal of the logic signal separation technology, so for a variety of purposes.

[0005] 这样的非接触传送装置例如被用作作为功率电子设备用半导体开关元件的IGBTQnsulated gate bipolar transistor,绝缘栅双极型晶体管)等栅极驱动元件。 [0005] Such non-contact transmission device, such as a power electronic device is used as a IGBTQnsulated gate bipolar transistor semiconductor switching element, an insulated gate bipolar transistor) or the like gate drive element. 更具体地,这样的非接触传送装置用于从直流电源实现任意频率的交流电源的逆变器(inverter)系统或矩阵变换器(matrix converter)系统。 More specifically, such a non-contact transmission means for realizing the inverter AC of an arbitrary frequency (inverter) system or a matrix converter (matrix converter) from the DC power supply system.

[0006] 在这样的功率半导体开关元件中,由于源极电位以高电压为基准变动,所以需要在栅极驱动元件内与功率半导体开关元件之间将直流成分绝缘。 [0006] In such a power semiconductor switching element, since the source potential of the high voltage reference change is required between the power semiconductor switching elements in the DC component of the insulating gate drive member. 因此,在这样的功率半导体开关元件中,能够分离地电位的非接触传送装置被用于栅极的驱动。 Accordingly, in such a power semiconductor switching element, the non-contact transfer means capable of separating the ground potential is used to drive the gate.

[0007] 另外,作为非接触传送技术的一例,利用两个电气布线共振器的耦合的电磁共振耦合器(或也称为电磁场共振耦合器)近年来非常引人注目(例如参照专利文献2及非专利文献1)。 [0007] Further, as an example of non-contact transmission technology, electrical wiring using two resonators electrically coupled resonance coupler (also called field resonance or coupler) very noticeable in recent years (see Patent Document 2 and Non-Patent Document 1). 这样的电磁共振耦合器的特征在于能实现高效率且长距离的信号传送。 Such a feature is that the electromagnetic resonance coupling signal transmission can be realized with high efficiency and long distances.

[0008] 现有技术文献 [0008] The prior art documents

[0009] 专利文献 [0009] Patent Document

[0010] 专利文献1 :美国专利第7692444号说明书 [0010] Patent Document 1: U.S. Patent No. 7,692,444 specification

[0011] 专利文献2 :日本特开2008-067012号公报 [0011] Patent Document 2: Japanese Laid-Open Patent Publication No. 2008-067012

[0012] 非专利文献 [0012] Non-Patent Document

[0013] 非专利文献I :Andre Kurs,et al. :"Wireless Power Transfer via Strongly Coupled Magnetic Resonances",Science Express,Vol. 317, No. 5834, pp.83 - 86 (2207) 发明概要 [0013] Patent Document I: Andre Kurs, et al:.. "Wireless Power Transfer via Strongly Coupled Magnetic Resonances", Science Express, Vol 317, No. 5834, pp.83 - 86 (2207) SUMMARY OF INVENTION

[0014] 发明要解决的问题 [0014] Problems to be solved

[0015] 在使用电磁共振耦合器作为上述栅极驱动元件的情况下,需要具备大量电磁共振耦合器的非接触传送装置。 Non-contact transmission means [0015] In the case where the electromagnetic resonance coupling element as the gate driver, requires a large amount of electromagnetic resonance coupling. 但是,由于电磁共振耦合器与半导体集成电路的晶体管等相比非常大,所以非接触传送装置的小型化、高集成化成为课题。 However, since the electromagnetic resonance coupling with the semiconductor integrated circuit such as a transistor is very large compared to the size of noncontact transmission device, high integration become a problem.

发明内容 SUMMARY

[0016] 因此,本发明解决上述课题,其目的在于提供一种实现非接触传送装置的小型化、 高集成化的电磁共振耦合器。 [0016] Accordingly, the present invention is to solve the above problems, and its object is to provide a miniaturized non-contact transmission device, high integration of electromagnetic resonance coupling.

[0017] 解决课题所采用的手段 Means [0017] Solution to Problem of

[0018] 为了解决上述课题,本发明的一个形态的共振耦合器,在第一传送线路与第二传送线路之间非接触传送高频信号,其特征在于,具备:所述第一传送线路,在第一平面上具备第一共振布线和连接于所述第一共振布线的第一输入输出布线及第二输入输出布线, 所述第一共振布线是布线的一部分通过开放部而被开放的环绕形状的布线;以及所述第二传送线路,在与所述第一平面对置的第二平面上具备第二共振布线和连接于所述第二共振布线的第三输入输出布线及第四输入输出布线,所述第二共振布线是布线宽度及形状与所述第一共振布线的布线宽度及形状相同的布线,所述第一共振布线上的、在连接所述第一输入输出布线的连接部位与连接所述第二输入输出布线的连接部位之间设置的第一接地部连接于第一地电位布线,该第一地电位布线表示所 [0018] To solve the above problems, an aspect of the present invention, the resonant coupler between the first transmission line and the second transmission line non-contact transmission high-frequency signal, which comprising: a first transmission line, a first input-output wiring, and a second input-output wiring line includes a first resonant in a first plane and connected to the first resonance line, the first wiring is a resonance portion through the open portion of the wiring is open surrounded wiring configuration; and the second transmission line, the second resonance line is provided on a second plane facing the first plane and the second resonator connected to the third input wiring and output wiring fourth input output wiring, the second wiring is a wiring width and the resonant shape of the wiring line width and the same shape as the first resonant wiring, a first input connected to said output connection wiring on the first wiring resonance the first ground portion is provided between the connecting portion and connected to the second portion of the input-output wiring connected to a ground potential of the first wiring, the first representing the ground potential wiring 第一传送线路内的所述高频信号的基准电位,所述第二共振布线上的、在连接所述第三输入输出布线的连接部位与连接所述第四输入输出布线的连接部位之间设置的第二接地部连接于第二地电位布线,该第二地电位布线表示所述第二传送线路内的所述高频信号的基准电位,所述第一传送线路与所述第二传送线路对置设置,使得在从垂直于所述第一平面的方向观察的情况下,所述第一共振布线的轮廓与所述第二共振布线的轮廓一致,并且所述第一共振布线与所述第二共振布线成点对称的关系。 The reference potential in the first high-frequency signal transmission line, on the second resonance line, the third connecting portion connecting said input and output wiring is connected to the fourth connection portion between the input and output wirings the second ground portion is provided connected to the second ground wiring, the second wiring represents ground reference potential of the high-frequency signal in said second transmission line, the first transmission line and the second transmission disposed opposite the line, such that when viewed from a direction perpendicular to the first plane, consistent with the contours of the second resonant first resonant line wirings, and the first resonance line and the said second resonance point symmetry relationship to the wiring.

[0019] 发明效果 [0019] Effect of the Invention

[0020] 根据本发明的共振耦合器,能将使用了多个共振耦合器的非接触传送装置小型化、高集成化。 [0020] According to the present invention, the resonant coupler, capable of using a plurality of non-contact transmission device of the size of the resonant coupler, high integration.

附图说明 BRIEF DESCRIPTION

[0021] 图1是专利文献2的电磁共振耦合器的示意图。 [0021] FIG. 1 is a schematic view of the electrical resonance coupler Patent Document 2.

[0022] 图2是表示专利文献2的电磁共振耦合器的传送特性的图。 [0022] FIG. 2 is a graph showing transmission characteristics of electromagnetic resonance coupler Patent Document 2.

[0023] 图3是实施方式1的共振耦合器的立体图(透视图)。 [0023] FIG. 3 is a perspective view of the resonant coupler of Embodiment 1 (perspective view).

[0024] 图4是实施方式1的共振耦合器的剖视图。 [0024] FIG. 4 is a cross-sectional view of the coupler of the resonator of Embodiment 1.

[0025] 图5是实施方式1的共振耦合器的发送基板的俯视图。 [0025] FIG. 5 is a top view showing the resonant coupler transmitting substrate 1.

[0026] 图6是实施方式1的共振耦合器的接收基板的俯视图。 [0026] FIG. 6 is a top view showing the resonant coupler receiving substrate 1.

[0027] 图7是表示实施方式1的共振耦合器的各输入输出端子的传送特性的图。 [0027] FIG. 7 is a graph showing transmission characteristics of the input and output terminals of the resonator according to Embodiment 1 of the coupler.

[0028] 图8是表示实施方式1的共振耦合器的各输入输出端子的分离特性的图。 [0028] FIG. 8 is a diagram illustrating the separation characteristics of the input and output terminals of the resonator according to Embodiment 1 of the coupler.

[0029] 图9是设置了地电位分离区域的发送基板的俯视图。 [0029] FIG. 9 is a plan view of the transmission of the substrate provided with the ground potential of the isolated region.

[0030] 图10是实施方式2的共振耦合器的立体图(透视图)。 [0030] FIG. 10 is a perspective view of the resonant coupler of the second embodiment (perspective view).

[0031] 图11是实施方式2的共振耦合器的发送基板的俯视图。 [0031] FIG. 11 is a top view showing a resonator transmitting substrate 2 coupler.

[0032] 图12是实施方式3的共振耦合器的发送基板的俯视图。 [0032] FIG. 12 is a top view showing the resonant coupler transmitting substrate 3.

[0033] 图13是实施方式4的共振耦合器的示意图(透视图)。 [0033] FIG. 13 is a schematic diagram of Embodiment 4 of the resonant coupler (perspective view).

[0034] 图14是实施方式4的共振耦合器的发送基板的俯视图。 [0034] FIG. 14 is a top view showing the resonant coupler transmitting substrate 4.

[0035] 图15是实施方式4的共振耦合器的接收基板的俯视图。 [0035] FIG. 15 is a top view showing a receiving substrate 4 of the resonant coupler.

[0036] 图16是通过通孔将共振布线与地电位连接的发送基板的俯视图。 [0036] FIG. 16 is a through hole through the substrate resonant transmission plan view of a wiring connected to the ground potential.

具体实施方式 Detailed ways

[0037] (成为发明基础的知识) [0037] (a knowledge base of the present invention)

[0038] 如背景技术所述,作为非接触传送技术的一例,已知利用两个电气布线共振器的親合的电磁共振親合器。 [0038] As described in the background, as an example of non-contact transmission technology, known electrical wiring using two resonators affinity affinity of the electromagnetic resonance device.

[0039] 这样的电磁共振耦合器中,图1所示那样的开环型电磁共振耦合器为简单的结构,小型化容易,能节省空间地实现非接触传送。 [0039] Such electrical resonance coupler, such as open-loop electrical resonance coupler shown in FIG. 1 is a simple configuration, miniaturization is easy, space-saving can be achieved non-contact transmission.

[0040] 另外,已知这样的开环型电磁共振耦合器具有良好的传送特性。 [0040] Further, there is known an open loop type electrical resonance coupler having good transmission characteristics.

[0041] 图2是表示专利文献2所公开的开环型电磁共振耦合器的传送特性的图。 [0041] FIG. 2 is a diagram of FIG. 2 open-loop transmission characteristic of electromagnetic resonance coupler disclosed in Patent Document.

[0042] 图2中,S21表示开环型电磁共振耦合器的插入损耗,表示能以约IdB的插入损耗有效地对频率在15GHz附近的电信号进行传送。 In [0042] FIG. 2, S21 represents the open-loop electrical resonance coupler insertion loss, can be effectively represents the frequency is 15GHz electrical signal transmitted to the vicinity of the insertion loss of about IdB.

[0043] 图1所示的开环型电磁共振耦合器可传送的信号的频率(动作频率)正确地讲由电磁共振耦合器的环形共振布线的电感与电容决定。 The open-loop frequency signal electrical resonance coupler shown may be transmitted [0043] FIG. 1 (operation frequency) properly speaking by an annular electromagnetic resonance coupler resonant inductance and the wiring capacitance. 但是,动作频率能够通过环形布线的有效面积及形成环形布线的基板的介电常数近似地求出。 However, the dielectric constant of the effective area of ​​the operating frequency to be routed through an annular ring and forming a wiring substrate is approximately determined.

Figure CN103403957BD00071

[0046] (式1)中,c指光速,ε r指基板(电介质)的相对介电常数。 [0046] (Formula 1), c is speed of light, ε r the relative dielectric constant refers to a substrate (dielectric) is. 另外,a是环形布线的有效面积,是环的直径左右。 Further, a is the effective area of ​​the annular wires, the diameter around the ring.

[0047] 例如,开环型电磁共振耦合器中,在传送15GHz附近的频率的情况下,环形布线的直径为1mm左右的大小。 [0047] For example, open-loop electrical resonance coupler, in a case where the transmission frequency is 15GHz vicinity of annular wire diameter of about 1mm size. 另外,根据式(1),若使该开环型电磁共振耦合器的直径为2 倍,则动作频率成为1/2的7. 5GHz频带。 Further, according to the formula (1), when the electrical resonance of the open-loop coupler having a diameter of 2 times, the operating frequency becomes 1/2 7. 5GHz band.

[0048] 即,开环型电磁共振耦合器的大小与半导体集成电路的晶体管等相比非常大。 [0048] That is, the size of a transistor in the semiconductor integrated circuit is electrically resonance coupler ring much larger than the other.

[0049] 这里,在使用电磁共振耦合器作为背景技术中说明的逆变器系统等栅极驱动元件的情况下,需要具备大量电磁共振耦合器的非接触传送装置,所以非接触传送装置的小型化、高集成化成为课题。 Non-contact transmission means [0049] Here, in the case where the electromagnetic resonance coupling element as the gate driver described in the background art inverter system and the like, need to have a large number of electrical resonance coupler, so a small non-contact transmission device and high integration becomes subject.

[0050] 为了解决上述课题,本发明的一个形态的共振耦合器,在第一传送线路与第二传送线路之间非接触传送高频信号,其特征在于,具备:所述第一传送线路,在第一平面上具备第一共振布线和连接于所述第一共振布线的第一输入输出布线及第二输入输出布线, 所述第一共振布线是布线的一部分通过开放部而被开放的环绕形状的布线;以及所述第二传送线路,在与所述第一平面对置的第二平面上具备第二共振布线和连接于所述第二共振布线的第三输入输出布线及第四输入输出布线,所述第二共振布线是布线宽度及形状与所述第一共振布线的布线宽度及形状相同的布线,所述第一共振布线上的、在连接所述第一输入输出布线的连接部位与连接所述第二输入输出布线的连接部位之间设置的第一接地部连接于第一地电位布线,该第一地电位布线表示所 [0050] To solve the above problems, an aspect of the present invention, the resonant coupler between the first transmission line and the second transmission line non-contact transmission high-frequency signal, which comprising: a first transmission line, a first input-output wiring, and a second input-output wiring line includes a first resonant in a first plane and connected to the first resonance line, the first wiring is a resonance portion through the open portion of the wiring is open surrounded wiring configuration; and the second transmission line, the second resonance line is provided on a second plane facing the first plane and the second resonator connected to the third input wiring and output wiring fourth input output wiring, the second wiring is a wiring width and the resonant shape of the wiring line width and the same shape as the first resonant wiring, a first input connected to said output connection wiring on the first wiring resonance the first ground portion is provided between the connecting portion and connected to the second portion of the input-output wiring connected to a ground potential of the first wiring, the first representing the ground potential wiring 第一传送线路内的所述高频信号的基准电位,所述第二共振布线上的、在连接所述第三输入输出布线的连接部位与连接所述第四输入输出布线的连接部位之间设置的第二接地部连接于第二地电位布线,该第二地电位布线表示所述第二传送线路内的所述高频信号的基准电位,所述第一传送线路与所述第二传送线路对置设置,使得在从垂直于所述第一平面的方向观察的情况下,所述第一共振布线的轮廓与所述第二共振布线的轮廓一致,并且所述第一共振布线与所述第二共振布线成点对称的关系。 The reference potential in the first high-frequency signal transmission line, on the second resonance line, the third connecting portion connecting said input and output wiring is connected to the fourth connection portion between the input and output wirings the second ground portion is provided connected to the second ground wiring, the second wiring represents ground reference potential of the high-frequency signal in said second transmission line, the first transmission line and the second transmission disposed opposite the line, such that when viewed from a direction perpendicular to the first plane, consistent with the contours of the second resonant first resonant line wirings, and the first resonance line and the said second resonance point symmetry relationship to the wiring.

[0051] 由此,能够由一个共振耦合器将两个高频信号分离并非接触传送。 [0051] Accordingly, a resonator can be coupled by the two high-frequency signals will not separate contact transmission. 因此,在使用多个共振耦合器的非接触传送装置中,共振耦合器的数量減半,实现装置的小型化、高集成化。 Thus, the non-contact transmission apparatus using a plurality of resonant coupler, the coupler is half the number of the resonator, the device miniaturization and high integration.

[0052] 另外,在本发明的一个形态中,可以是,所述第一传送线路设置在第一基板的一个面,所述第二传送线路设置在第二基板的一个面。 [0052] Further, in one aspect of the present invention, may be, a second surface of said substrate a first transmission line disposed on the first surface of the substrate, the second transmission line is provided.

[0053] 另外,在本发明的一个形态中,可以是,所述第一地电位布线设置在所述第一基板的另一面、或者对置于所述第一基板而设置的基板,所述第一接地部通过第一通孔而与所述第一地电位布线连接,所述第二地电位布线设置在所述第二基板的另一面、或者对置于所述第二基板而设置的基板,所述第二接地部通过第二通孔而与所述第二地电位布线连接。 [0053] Further, in one aspect of the present invention, it is possible that the first ground potential wiring disposed on the other surface of the first substrate, or the substrate disposed on the first substrate and disposed, the the first portion is connected to ground through the first through hole and the first ground potential wiring, a ground potential of the second wiring disposed on the other surface of the second substrate, or disposed on the second substrate and disposed substrate, the second ground portion is connected to the second ground wiring through the second through hole.

[0054] 另外,在本发明的一个形态中,可以是,所述第一接地部经布线而与所述第一通孔连接,所述第二接地部经布线而与所述第二通孔连接。 [0054] Further, in one aspect of the present invention, it is possible that the first ground unit via a wiring connected to the first through hole, the second ground wiring portion via the second through hole with the connection.

[0055] 由此,能够抑制由共振耦合器传送的两个高频信号的干扰,确保隔离。 [0055] Accordingly, it is possible to suppress interference of two high-frequency signals transmitted by the resonant coupler, to ensure isolation.

[0056] 另外,在本发明的一个形态中,可以是,所述第一通孔设置在所述第一共振布线的所述环绕形状的内侧,所述第二通孔设置在所述第二共振布线的所述环绕形状的内侧。 [0056] Further, in one aspect of the present invention may be the first through hole is provided in the surrounding inner shape of the first resonance line, the second through hole disposed in the second the resonance line shape surrounding the inside.

[0057] 由此,由于通孔设置在环绕形状的共振布线的内侧,所以能减小基板内的通孔及布线的面积。 [0057] Accordingly, since the through hole is provided inside the resonance line shape of the surrounding, it is possible to reduce the area of ​​the through-hole and a wiring in the substrate. 因此,共振耦合器能小型化。 Thus, the resonant coupler can be miniaturized.

[0058] 另外,在本发明的一个形态中,可以是,所述第一地电位布线设置在所述第一基板的一个面的、所述第一共振布线、所述第一输入输出布线及所述第二输入输出布线的周边,所述第二地电位布线设置在所述第二基板的一个面的、所述第二共振布线、所述第三输入输出布线及所述第四输入输出布线的周边。 [0058] Further, in one aspect of the present invention, it is possible that the first ground potential wiring disposed on one surface of the first substrate, the first resonance line, the first input and output wirings surrounding said second input-output wiring, the second ground wiring provided on one surface of the second substrate, the second resonance line, the third line and the fourth input output O surrounding wiring.

[0059] 由此,由于不需要通孔,所以实现共振耦合器的基板厚度方向的小型化。 [0059] Accordingly, since no through hole, so miniaturized substrate thickness direction of the resonant coupler.

[0060] 另外,由于共振耦合器的传送线路为共面布线结构,在共振耦合器的周边有地电位,所以具有提高电磁共振耦合器的传送效率并抑制不必要的放射噪声的效果。 [0060] Further, since the transmission line resonator coupler coplanar wiring structure in the peripheral resonant coupler has the ground potential, there is an improved transmission efficiency and the electrical resonance coupler effect of suppressing unnecessary radiation noise.

[0061] 另外,在本发明的一个形态中,可以是,所述第一输入输出布线连接于距所述第一共振布线的一端的距离为相当于所述第一共振布线的布线长的8分之3长度的位置,所述第二输入输出布线连接于距所述第一共振布线的一端的距离为相当于所述第一共振布线的布线长的8分之5长度的位置,所述第三输入输出布线连接于距所述第二共振布线的一端的距离为相当于所述第二共振布线的布线长的8分之3长度的位置,所述第四输入输出布线连接于距所述第二共振布线的一端的距离为相当于所述第二共振布线的布线长的8 分之5长度的位置。 [0061] Further, in one aspect of the present invention may be the first input wirings connected to output the distance from an end of the first resonance line is equivalent to the length of the first resonance line wirings 8 3 thirds length positions, said second input-output wiring connected to the distance from an end of the first resonance corresponds to the wiring length of the wiring position 85 parts per length of the first resonance line, said a third input connected to the output wiring distance from said end of the second resonant wiring corresponding to the wiring length to the position of 3/8 of the length of the second resonance line, the fourth input line is connected to the output from the the wiring length from the one end position of the second resonance line corresponds to the second resonant wirings 85 parts per length. 在本发明的一个形态中,可以是,所述第一接地部设置在距所述第一共振布线的一端的距离为相当于所述第一共振布线的布线长的2分之1长度的位置,所述第二接地部设置在距所述第二共振布线的一端的距离为相当于所述第二共振布线的布线长的2分之1长度的位置。 In one aspect of the present invention, may be, the first ground portion provided at a distance from an end of the first resonance line is a position corresponding to half the length of the wiring length of the wiring of the first resonant , the second ground portion is provided at an end of the second resonant distance from the wiring length of the wiring to a position corresponding to half the length of the second resonance line. 在本发明的一个形态中,可以是,所述第一传送线路与所述第二传送线路对置设置,使得所述第一共振布线与所述第二共振布线在垂直于所述第一平面的方向上的距离在所述高频信号的波长的2分之1以下。 In one aspect of the present invention, it is possible that the first transmission line and the second transmission line disposed opposite, such that the first resonance line and the second resonance line perpendicular to the first plane the distance in the direction in which the wavelength of the high frequency signal of 21 ppm or less.

[0062] 由此,能降低电场辐射等损耗,以高的传送效率传送信号。 [0062] Accordingly, the electric field can reduce the radiation loss, a high transmission efficiency transmission signal.

[0063]另外,在本发明的一个形态中,可以是,所述环绕形状的轮廓为圆形状。 [0063] Further, in one aspect of the present invention, may be, the contour shape surrounding a circular shape.

[0064]另外,在本发明的一个形态中,可以是,所述环绕形状的轮廓为矩形。 [0064] Further, in one aspect of the present invention, it is possible that the surrounding contour shape is rectangular.

[0065]另外,在本发明的一个形态中,可以是,所述环绕形状为具有至少5处以上弯曲部的形状。 [0065] Further, in one aspect of the present invention, may be, the shape surrounds at least a shape having a curved portion 5.

[0066] 这样,由于通过设置多个弯曲部分能减小共振耦合器中共振布线所占的面积,所以能进一步小型化共振耦合器。 [0066] Thus, by providing the plurality of curved portions can be reduced in the area of ​​the resonant coupler resonant occupied by the wiring, it is possible to further miniaturization of the resonant coupler. 因此,能实现非常小型的非接触传送装置。 Therefore, to achieve a very small non-contact transfer means.

[0067] 在本发明的一个形态中,可以是一种共振耦合器,在第一传送线路与第二传送线路之间非接触传送高频信号,其特征在于,具备:所述第一传送线路,在第一平面上具备第一共振布线和第一输入输出布线群,所述第一共振布线是布线的一部分通过开放部而被开放的环绕形状的布线,所述第一输入输出布线群是连接于所述第一共振布线的η个布线群,η是3以上的整数;以及所述第二传送线路,在与所述第一平面对置的第二平面上具备第二共振布线和第二输入输出布线群,所述第二共振布线是布线宽度及形状与所述第一共振布线的布线宽度及形状相同的布线,所述第二输入输出布线群是连接于所述第二共振布线的η个布线群,所述第一共振布线上的、在连接所述第一输入输出布线群的连接部位与同所述连接部位相邻的连接所述第一输入输出布线群 [0067] In one aspect of the present invention, may be a resonant coupler, the transmission line between the first transmission line and the second non-contact transmission high-frequency signal, which comprising: a first transmission line , includes a first resonator and a first input-output wiring group of wirings on a first plane, the first resonance line is a wiring portion through the open portion being surrounded by an open-shaped wiring, the first wiring group is O connected to the first resonance line [eta] of a wiring groups, [eta] is an integer of 3; and the second transmission line, comprising first and second resonant line on a second plane opposed to the first plane two input and output wiring group, the second resonance line is a wiring line width and the same shape as the wiring width and shape of the first resonance line, the second input-output wiring group is connected to the second resonant wiring connecting said wirings η group, the connecting portion connecting the first input and output wiring group with said connecting portion adjacent to the first resonant line on a first group of input output wirings 连接部位之间设置的η-1处接地部连接于第一地电位布线,该第一地电位布线表示所述第一传送线路内的所述高频信号的基准电位,所述第二共振布线上的、在连接所述第二输入输出布线群的连接部位与同所述连接部位相邻的连接所述第二输入输出布线群的连接部位之间设置的η-1处接地部连接于第二地电位布线,该第二地电位布线表示所述第二传送线路内的所述高频信号的基准电位,所述第一传送线路与所述第二传送线路对置设置,使得在从垂直于所述第一平面的方向观察的情况下,所述第一共振布线的轮廓与所述第二共振布线的轮廓一致,并且所述第一共振布线与所述第二共振布线成点对称的关系。 η-1 grounded at the portion disposed between the first connecting point is connected to the ground potential wiring, the ground wiring represents the first potential of the first reference frequency signal in the transmission line, the second resonance line η-1 grounded at the portion provided between the connecting portion connecting the second input of the group of wirings on the output of the second connecting portion connecting the input and output wiring group with the adjacent connection portion connected to the first two ground potential wiring, the second wiring represents the ground reference potential of the high-frequency signal in the second transmission line, the first transmission line and the second transmission line disposed opposite, so that from the vertical when viewed in a direction of the first plane, the first resonant contour line coincides with the resonant contour of the second wiring and the first wiring and the second resonance point symmetric resonant wirings relationship.

[0068] 由此,能由一个共振耦合器将多个高频信号分离并非接触传送。 [0068] Accordingly, the resonant coupler capable of separating a plurality of high-frequency signal transmission is not in contact. 因此,在使用多个共振耦合器的非接触传送装置中,共振耦合器的数量锐减,能大幅使装置小型化、高集成化。 Thus, the non-contact transmission apparatus using a plurality of resonant coupler, the number of dropped resonant coupler, of the apparatus can be greatly downsized and high integration.

[0069] 以下,使用附图来详细说明本发明的实施方式。 [0069] Hereinafter, detailed embodiments of the present invention using the drawings. 另外,以下说明的实施方式均表示概括的或具体的示例。 Further, embodiments described below are represented by general or specific example. 以下实施方式所示的数值、形状、材料、构成要素、构成要素的配置位置及连接形态等是一例,并不意欲限定本发明。 Numerical values ​​shown in the following embodiments, shapes, materials, structural elements, the arrangement and connection of the structural elements and the like are examples, not intended to limit the present invention. 另外,以下实施方式中的构成要素中, 表示最上位概念的独立权利要求中未记载的构成要素作为任意构成要素来说明。 Further, the constituent elements in the following embodiments, structural elements of the independent claims of the broadest concept is not described as optional components will be described.

[0070] (实施方式1) [0070] (Embodiment 1)

[0071] 以下,参照附图来说明本发明的实施方式1。 [0071] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings 1.

[0072] (结构) [0072] (Structure)

[0073] 首先,说明本发明的实施方式1的共振耦合器的结构。 [0073] First, the configuration of the embodiment of the present invention, the resonant coupler 1.

[0074] 图3是实施方式1的共振耦合器的立体图。 [0074] FIG. 3 is a perspective view of the resonant coupler of Embodiment 1.

[0075] 图4是将图3的共振耦合器用通过基板对角线的平面(通过图中Χ-Χ'线并垂直于基板的平面)切断的情况下的剖视图。 [0075] FIG. 4 is a resonant coupling Used FIG. 3 by a sectional view of a diagonal line of the substrate plane in the case of cutting (by FIG Χ-Χ 'lines and perpendicular to the plane of the substrate).

[0076] 本发明实施方式1的共振耦合器10是传送18GHz的交流信号的共振耦合器。 [0076] The embodiment of the present invention is embodiment 1 of the resonant coupler resonant coupler 10 is transmitted AC signal of 18GHz. 另外,共振耦合器10能以一组共振布线来传送两个信号。 Further, the resonant coupler 10 can be set to a resonant two wires to transmit signals.

[0077] 共振耦合器10由发送基板(第一基板)101、设置在发送基板101上部的接收基板(第二基板)102、与设置在接收基板102上部的盖体基板103构成。 102, provided receiving substrate (second substrate) [0077] The resonant coupler 10 transmits a substrate (first substrate) 101, 101 disposed in an upper portion of the substrate constituting the transmission in the lid substrate 102 receives the upper substrate 103. 发送基板101、接收基板102及盖体基板103是电介质基板,例如是蓝宝石基板。 Transmitting substrate 101, a receiver substrate 102 and the lid substrate 103 is a dielectric substrate, for example, a sapphire substrate. 另外,基板厚度全部为0.2mm。 Further, all of the substrate thickness 0.2mm. 另外,在各基板之间可以有空气等气体、液体、或其他电介质材料。 Further, between the substrate may be a gas such as air, liquid, or other dielectric material.

[0078] 在发送基板101的上表面(第一平面),形成作为金属布线的第一发送布线(第一输入输出布线)111、第二发送布线(第二输入输出布线)112、以及通过发送侧缝隙115 而被开放的圆形(环绕形状)的发送侧共振布线(第一共振布线)113。 [0078] transmitted on a surface of the substrate 101 (a first plane), a first transmission line formed as a metal wiring (a first input-output wiring line) 111, a second transmission line (a second input-output wiring) 112, and by transmitting the open side of the slot 115 is circular (shape surrounding) the transmission side resonance wirings (a first resonant wiring) 113. 另外,在第一发送布线111、第二发送布线112及发送侧共振布线113的周围,形成作为金属导体的发送侧共面地电位114。 Further, in the first transmission line 111, second transmission line 112 and the transmission side resonance around the wiring 113, a metal conductor is formed as a transmission-side coplanar potential 114.

[0079] 接收基板102以覆盖发送基板101的发送侧共振布线113的方式与发送基板101 重合。 [0079] The receiving substrate 102 so as to cover the substrate 101 transmits the transmission side resonance wiring 113 of the substrate 101 coincides with the transmission. 在接收基板102上表面(第二平面),形成作为金属布线的第一接收布线(第三输入输出布线)121、第二接收布线(第四输入输出布线)122、以及通过接收侧缝隙125而被开放的圆形(环绕形状)的接收侧共振布线(第二共振布线)123。 Upon receiving surface (second plane) of the substrate 102, is formed as a first metal wiring receiving wiring (third input-output wiring) 121, receives a second wiring (the fourth input output wiring) 122, and a reception side through a slit 125 the open circular (shape surrounding) the reception side resonance wirings (second wirings resonance) 123. 另外,在第一接收布线121、第二接收布线122及接收侧共振布线123的周围,形成作为金属导体的接收侧共面地电位124。 Further, the first receiving wiring 121, the wiring 122 and the second receiving reception side resonance around the wiring 123 is formed as a metal conductor receiving-side coplanar potential 124.

[0080] 盖体基板103以覆盖接收基板102的接收侧共振布线123的方式与发送基板101 重合。 [0080] The cover substrate 103 to cover the receiving side receives the substrate 102 and the resonator 123 transmits wiring substrate 101 overlap. 另外,在盖体基板103的上表面,设置作为金属导体的盖体地电位105。 Further, the upper surface of the cover substrate 103 is provided as a metal lid body ground conductor 105.

[0081] 上述金属布线及上述金属导体的材料例如是金,但也可以是其他金属材料。 [0081] The material of the metal wires and the metal conductor such as gold, but may be other metallic materials. 另外,在发送基板101的背面,形成作为金属导体的背面地电位104。 Further, the back surface of the substrate 101 is transmitted, it is formed as a back surface of the metal conductor 104 to ground potential.

[0082] 在发送基板101上表面形成的发送侧共振布线113上的、发送侧共振布线113及第一发送布线111的连接部位与发送侧共振布线113及第二发送布线112的连接部位之间,设置接地部(第一接地部)。 Between [0082], the transmission side resonance wire connecting portion 113 and the first transmission line 111 and the transmission side resonance wiring connecting portion 113 and the second transmission line 112 on the transmission side resonance wiring 113 formed on the transmission surface of the substrate 101 a grounded portion (first ground portion). 接地部通过将发送基板101贯通的发送侧分离通孔116 而与背面地电位104连接。 By penetrating the ground unit transmits the transmission-side substrate 101 is separated through hole 116 is connected to the ground potential 104 and the back surface. 发送侧分离通孔116由金属导体形成,例如由金形成。 Separating the transmission side through hole 116 is formed from a metal conductor such as gold is formed.

[0083] 同样,在接收基板102上表面形成的接收侧共振布线123上的、接收侧共振布线123及第一接收布线121的连接部位与接收侧共振布线123及第二接收布线122的连接部位之间,设置接地部(第二接地部)。 [0083] Also, the reception side resonance wiring 123 and the first wiring receives the reception side resonance wiring 123 is formed on the surface of the substrate receiving portion 102 connection portion 121 is connected to the wiring 123 and the reception side resonance second reception wirings 122 between a ground portion (second ground portion). 接地部通过将盖体基板103贯通的接收侧分离通孔126而与盖体地电位105连接。 Ground cover receiving portion side by the substrate 103 through the through hole 126 of the separator member is connected to the ground potential cover 105. 接收侧分离通孔126由金属导体形成,例如由金形成。 Separating the reception side through hole 126 is formed from a metal conductor such as gold is formed.

[0084] 另外,如图4所示,背面地电位104与发送侧共面地电位114通过将发送基板101 贯通的地电位通孔106连接。 [0084] Further, as shown in FIG. 4, the back-side ground 104 and the coplanar transmission 114 by sending the substrate potential is connected to ground potential 101 penetrating through hole 106. 背面地电位104及发送侧共面地电位114是表示发送基板101内的信号的基准电位的发送地电位(第一地电位布线)。 The back ground 104 and the transmission-side coplanar ground potential 114 is a transmission signal of the reference potential in the transmission of the substrate 101 (first ground potential wiring). 地电位通孔106由金属导体形成,例如由金形成。 Ground potential through hole 106 is formed from a metal conductor such as gold is formed.

[0085] 同样,如图4所示,盖体地电位105与接收侧共面地电位124通过将盖体基板103贯通的地电位通孔107连接。 [0085] Also, as shown, the cover member 105 to ground cover substrate 103 to ground potential through the through hole 107 connected to the reception-side coplanar potential 124 4. 盖体地电位105及接收侧共面地电位124是表示接收基板102内的信号的基准电位的接收地电位(第二地电位布线)。 Ground cover body 105 and the reception-side coplanar ground potential 124 is a reference potential of the receiving signal in the receiver substrate 102 (second ground potential wiring). 地电位通孔107由金属导体形成,例如由金形成。 Ground potential through hole 107 is formed of a metal conductor, for example formed from gold.

[0086] 下面,进一步详细说明发送基板101及接收基板102。 [0086] Next, the substrate 101 described in further detail transmit and receive the substrate 102.

[0087] 首先,说明发送基板101。 [0087] First, the substrate 101 transmission.

[0088] 图5是发送基板101的俯视图。 [0088] FIG. 5 is a plan view of the substrate 101 is transmitted.

[0089] 发送侧共振布线113是直径Imm的圆形状,是闭曲线布线的一部分通过发送侧缝隙115而被开放的环绕形状。 [0089] The transmission side resonance wiring 113 is a circular shape of a diameter of Imm, is part of a closed curve line shape is surrounded by an open slot 115 by the transmission side. 发送侧共振布线113的布线宽度为0. 1mm。 Transmission side resonance line width of the wiring 113 is 0. 1mm.

[0090] 发送侧共振布线113与第一发送布线111及第二发送布线112物理连接及电连接。 [0090] The transmission side resonance wiring 113 connected to the first transmission line 111 and second transmission line 112 is electrically and physically connected. 具体地,第一发送布线111的一端连接于发送侧共振布线113的距发送侧缝隙115部分的一端的距离为相当于发送侧共振布线113的布线长的8分之3长度的位置。 Specifically, a first end of transmission line 111 is connected to the transmission side resonance wiring portion 115 from one end side of the slit 113 is transmitted from the transmission side resonance corresponding to position the wiring line length 3/8 length 113. 另外,第二发送布线112的一端连接于发送侧共振布线113的距发送侧缝隙115部分的上述一端的距离为相当于发送侧共振布线113的布线长的8分之5长度的位置。 Further, the end of the second transmission line 112 is connected to the transmission side resonance from said one end of the wiring portion 115 from the side of the slit 113 is transmitted corresponding to the transmission side resonance position of the wiring line length of 85 parts per 113 length.

[0091] 第一发送布线111的未与发送侧共振布线113连接的另一端是输入端子A,第二发送布线112的未与发送侧共振布线113连接的另一端是输入端子B。 [0091] The first transmission line 111 is not the transmission side resonance wiring 113 is connected to the other end of the input terminal A, a second transmission line and the transmission side 112 is not resonant line 113 is connected to the other end of the input terminal B. 第一发送布线111 及第二发送布线112的布线宽度为0. 1mm。 A first transmission line 111 and the wiring width of the second transmission line 112 is 0. 1mm.

[0092] 发送侧共振布线113通过发送侧分离通孔116而与背面地电位104连接。 [0092] The transmission side resonance wiring 113 is connected to the ground potential and the back surface 104 separated by a transmitting side through hole 116.

[0093] 具体地,在距发送侧共振布线113的一端的距离为相当于发送侧共振布线113的布线长的2分之1长度的位置(接地部),连接发送侧分离通孔116的一端。 [0093] In particular, the transmission side resonance from the wiring 113 to a distance corresponding to one end 113 of the transmission side resonance wiring line length position (grounding portion) of the half length, connected to the transmission end side of the separator 116 through hole . 另外,发送侧分离通孔116设置在环绕形状的发送侧共振布线113的内侧。 Further, the through hole 116 separated from the transmission side on the transmission side is provided around the inner shape of the resonance line 113.

[0094] 即,发送侧分离通孔116连接于发送侧共振布线113上的、连接第一发送布线111 的连接部位与连接第二发送布线112的连接部位之间。 [0094] That is, the transmission side of the separator is connected to the through hole 116 on the transmission side resonance wiring 113, the connection between the connecting point of the first transmission line 111 is connected to the second connecting portion 112 of the transmission line.

[0095] 另外,发送侧分离通孔116的另一端连接于背面地电位。 [0095] Further, the other end of the transmission side of the separator through hole 116 is connected to the backside ground potential. 发送侧分离通孔116的直径为〇· 1謹。 The diameter of the transmission side is separated from the through hole 116 · 1 billion wish.

[0096] 发送侧共面地电位114沿第一发送布线111、第二发送布线112及发送侧共振布线113的周边形成。 [0096] transmitting side potential of the coplanar transmission line 114 along the first 111, second transmission line 112 and the transmission side resonance peripheral wiring 113 is formed.

[0097] 另外,如图中虚线所示,在发送基板101的上表面重合接收基板102。 [0097] Further, as shown in dashed lines, in the superposed transmission receiving substrate 102 on the substrate 101 surface. 接收基板102配置成不将输入端子A及B完全覆盖。 Receiving substrate 102 is configured not to input terminals A and B is completely covered.

[0098] 下面,说明接收基板102。 [0098] Next, the substrate 102 received.

[0099] 图6是接收基板102的俯视图。 [0099] FIG. 6 is a plan view of the substrate 102 is received.

[0100] 接收侧共振布线123是直径Imm的圆形状,是闭曲线布线的一部分通过接收侧缝隙125而被开放的环绕形状。 [0100] reception side resonance wiring 123 is a circular shape of a diameter of Imm, is part of a closed curve of the wiring is open through the receive side slot 125 surrounded shape. 接收侧共振布线123的布线宽度为0. 1mm。 Reception side resonance line width of the wiring 123 is 0. 1mm.

[0101] 接收侧共振布线123与第一接收布线121及第二接收布线122物理连接及电连接。 [0101] reception side resonance receiving the first wiring 123 and second wiring 121 and the wiring 122 receives a physical connection and an electrical connector. 具体地,第一接收布线121连接于接收侧共振布线123的距接收侧缝隙125部分的一端的距离为相当于接收侧共振布线123的布线长的8分之3长度的位置。 Specifically, the first wiring 121 is connected to receive the reception-side resonant line 123 from the receiving-side end portion of the slit 125 from the resonance position of the wiring length 3/8 the length of the wiring 123 corresponds to the reception side. 另外,第二接收布线122连接于接收侧共振布线123的距接收侧缝隙125部分的上述一端的距离为相当于接收侧共振布线123的布线长的8分之5长度的位置。 Further, a second receiving line 122 connected to the receiving side from the resonance line 123 is received from the one end portion side of the slot 125 corresponds to the wiring length of the wiring reception side resonance position 85 parts per 123 length.

[0102] 第一接收布线121的未与接收侧共振布线123连接的终端是输出端子C,第二接收布线122的未与接收侧共振布线123连接的终端是输出端子D。 [0102] and the receiving side is not received the first wiring 121 to the wiring 123 is connected to the resonator terminal is an output terminal C, the terminal receives the second wiring is not resonant with the reception side 122 is connected to the wiring 123 is an output terminal D. 第一接收布线121及第二接收布线122的布线宽度为0· Imm0 Receiving a first wiring 121 and the wiring width of the second receiving line 122 is 0 · Imm0

[0103] 接收侧共振布线123通过接收侧分离通孔126而与盖体地电位105连接。 [0103] 123 separates the reception side resonance wire through hole 126 is connected to the ground potential of the cover body 105 through the receive side.

[0104] 具体地,在距接收侧共振布线123的一端的距离为相当于接收侧共振布线123的布线长的2分之1长度的位置(接地部),连接接收侧分离通孔126的一端。 [0104] Specifically, the receiving side from the resonance line 123 a distance corresponding to one end of the reception-side wiring 123 is a wiring length resonance position (grounding portion) of the half length, connected to the receiving-side end of the through hole 126 of the separation . 另外,接收侧分离通孔126设置在环绕形状的接收侧共振布线123的内侧。 Further, the receiving side of the separator through hole 126 is provided on the reception side resonance shape surrounding the inner wirings 123.

[0105] 即,接收侧分离通孔126连接于接收侧共振布线123上的、连接第一接收布线121 的连接部位与连接第二接收布线122的连接部位之间。 [0105] That is, the reception side of the separator is connected to the through hole 126 on the reception side resonance wiring 123, the connection between the first wiring 121 is connected to the receiving portion receiving the connecting portion connects the second wiring 122.

[0106] 另外,接收侧分离通孔126的另一端与盖体地电位105连接。 [0106] Further, the other end of the receiving-side separating the through hole 126 and the lid body 105 is connected to ground potential. 接收侧分离通孔126的直径为0· 1謹。 The diameter of the receiving side is separated from the through hole 126 · 1 0 honor.

[0107] 接收侧共面地电位124沿第一接收布线121、第二接收布线122及接收侧共振布线123的周边形成。 [0107] receiving side 124 are coplanar along a first receiving the ground potential wiring 121, a second receiver 122 and the reception-side wiring line 123 is formed outside resonance.

[0108] 另外,如图中虚线所示,在接收基板102的上表面重合盖体基板103。 [0108] Further, as shown in dashed lines, the upper surface of the receiving substrate 102 substrate 103 overlaps the cover. 盖体基板103配置成不将输出端子C及D完全覆盖。 Cover substrate 103 configured not to output terminals C and D are completely covered.

[0109] 如图5及图6所示,发送基板101与接收基板102重合(对置设置),使得在从垂直于发送基板101主面的方向观察的情况下(以下也记载为俯视的情况下),发送侧共振布线113的轮廓与接收侧共振布线123的轮廓一致。 [0109] FIGS. 5 and 6, the substrate 101 and the transmission 102 coincident receiving substrate (counter set), so that in the case when viewed from the direction perpendicular to the main surface of the substrate 101 is transmitted (hereinafter, also referred to as a top view of under), the transmission side resonance contour line 113 and the reception side resonance contour line 123 is consistent. 并且,发送基板101与接收基板102重合,使得在俯视的情况下,发送侧共振布线113与接收侧共振布线123成点对称的关系。 Then, the substrate 101 and the receiver 102 transmits the superposed substrate, such that in plan view, the transmission side resonance wiring 113 and the reception side resonance wiring 123 point symmetric relationship.

[0110] 这里,所谓发送侧共振布线113 (接收侧共振布线123)的轮廓,如下进行定义。 [0110] Here, the transmission side resonance wiring 113 (reception side resonance lines 123) of the profile, defined as follows. 在假定发送侧共振布线113中未设置发送侧缝隙115、发送侧共振布线113为环绕形状的闭合布线的情况下,该环绕形状的闭合布线具有内周侧(内侧)的轮廓和外周侧(外侧)的轮廓,该内周侧(内侧)的轮廓规定由该环绕形状的闭合布线包围的区域,该外周侧(外侧) 的轮廓与上述内周侧的轮廓一起规定上述环绕形状的闭合布线的形状。 In the case of assuming the transmission side resonance wiring 113 in the transmitting side slit 115 is not provided, the transmission side resonance wiring 113 is surrounded by a closed line shape, which is surrounded by a closed line shape having an inner peripheral side (inner side) of the contour and the outer peripheral side (outside ) of the contour, the provisions of the inner peripheral side (inner side) of the region surrounded by a closed line of the winding shape, with a predetermined shape of a closed line of said circular shape of the contours of the inner peripheral side of the outer peripheral side (outside) . 所谓发送侧共振布线113的轮廓意味着这两个轮廓中发送侧共振布线113的外周侧的轮廓。 The so-called transmission side resonance contour 113 of the wiring means that both the transmission side resonance line profile contour of the outer circumferential side 113. 换言之,上述内周侧的轮廓与上述外周侧的轮廓规定发送侧共振布线113,外周侧的轮廓规定发送侧共振布线113的占有面积。 In other words, a predetermined contour profile of the inner peripheral side of the outer peripheral side of the transmission side resonance wiring 113, the outer peripheral side contour of a predetermined transmission side resonance area occupied by the wiring 113.

[0111] 另外,发送侧共振布线113与接收侧共振布线123在垂直于发送基板101主面的方向上的距离为接收基板102的基板厚度,即0. 2mm。 [0111] Further, the transmission side and the reception side resonance wiring 113 from the resonant line 123 in a direction perpendicular to the main surface of the substrate 101 is transmitted to the receiving board thickness of the substrate 102, i.e., 0. 2mm. 这在实施方式1中输入到共振耦合器10中的18GHz交流信号的波长的2分之1以下。 This AC signal is input to the wavelength in the 18GHz resonant coupler 10 in Embodiment 1 of 21 points or less. 换言之,发送侧共振布线113与接收侧共振布线123在邻域场区域共振耦合。 In other words, the transmission side resonance wiring 113 and the reception-side resonant line 123 in a neighborhood field resonance coupling region. 此时,共振耦合器10作为电磁共振耦合器动作。 In this case, the resonator resonance coupler 10 as an electric coupling operation.

[0112] (动作) [0112] (operation)

[0113] 下面,说明本发明实施方式1的共振耦合器10的动作。 [0113] Next, the operation of the embodiment of the present invention, the resonant coupler 10 1.

[0114] 如上所述,发送侧共振布线113与接收侧共振布线123电磁共振耦合,以18GHz 附近的频率共振。 [0114] As described above, the transmission side resonance wiring 113 and the reception side resonance resonance wiring 123 electrically coupled to a frequency around the resonance 18GHz. 从而,若发送侧共振布线113中产生18GHz附近频率的交流电流,则由于电磁共振耦合,接收侧共振布线123中也产生相同频率的交流电流。 Whereby, when the transmission line 113 side resonance frequency alternating current is generated in the vicinity of 18GHz, due to electromagnetic resonance coupling, the reception-side resonant line 123 also generates an alternating current of the same frequency.

[0115] 即,由于电磁共振耦合,18GHz附近频率的交流电流从发送侧共振布线113以非接触的方式传送到接收侧共振布线123。 [0115] That is, since the electromagnetic resonance coupling, the alternating current frequency in the vicinity of 18GHz resonant line 113 to the reception-side resonant line 123 in a non-contact manner from the transmission side. 在邻域场耦合的电磁共振耦合由于难以放射不必要的电波,所以在这样的非接触传送中放射噪声非常小。 Electrically coupling the neighborhood resonance field coupling due to unwanted radio waves radiated difficult, so in such a non-contact transmission of radiated noise is very small.

[0116] 并且,共振耦合器10具备两个输入端子(输入端子A及B)与两个输出端子(输出端子C及D),能同时分离传送两个信号。 [0116] Further, the resonant coupler 10 includes two input terminals (input terminals A and B) and two output terminals (the output terminals C and D), can simultaneously transmit two separate signals. 具体地,通过利用发送侧分离通孔116及接收侧分离通孔126将发送侧共振布线113及接收侧共振布线123各自的接地部连接于发送地电位及接收地电位,能分离传送两个交流信号。 Specifically, the through hole 116 separated from the transmission side and the reception side through hole 126 to separate the transmission side and the reception side resonance resonant wiring 113 respective ground wiring portion 123 is connected to ground potential transmission and reception by using the ground potential, can transfer two separate AC signal.

[0117] 以下,在由接地部将发送侧共振布线113分割成了两个区域的情况下,设发送侧共振布线113中连接有第一发送布线111 (输入端子A)的区域为布线区域A、连接有第二发送布线112 (输入端子B)的区域为布线区域B。 In the case [0117] Here, in the transmission side resonance by the ground wiring portion 113 is divided into two regions, a wiring 113 is provided in the transmission side resonance region is connected to a first transmission line 111 (input terminal A) of a wiring area A , a region connected to the second transmission line 112 (input terminal B), a wiring region B.

[0118] 同样地,在由接地部将接收侧共振布线123分割成了两个区域的情况下,设接收侧共振布线123中连接有第一接收布线121 (输出端子C)的区域为布线区域C、连接有第二接收布线122 (输出端子D)的区域为布线区域D。 [0118] Similarly, the resonance is received by the ground side wiring portion 123 would be the case where the two divided regions, a wiring 123 provided in the reception side resonance region is connected to a first receiving wiring 121 (the output terminal C) is wiring region C, the wiring 122 connected to a second receiver (output terminal D) in the region of the wiring region D.

[0119] 在图3所示的共振耦合器10中,在向发送基板101的输入端子A输入了18GHz频率的交流信号的情况下,输入的交流信号经第一发送布线111传送到发送侧共振布线113。 In the case [0119] In the resonant coupler 10 shown in FIG. 3, the AC signal frequency of 18GHz in the input terminal A to the transmission of the substrate 101 is input, via the input AC signal transmitted to the first wiring 111 to the transmission side resonance wiring 113. 此时,发送侧共振布线113的接地部由于通过发送侧分离通孔116而连接到发送地电位, 所以输入的交流信号不输出到输入端子B。 In this case, the transmission side resonance line due to the separation of the ground portion 113 through the through hole 116 is connected to the transmission side transmitting the ground potential, the output AC signal is not inputted to the input terminal B.

[0120] 由于发送侧共振布线113与接收侧共振布线123设计成在18GHz附近共振,所以传送到发送侧共振布线113的交流信号被传送到接收侧共振布线123。 [0120] Since the transmission side and the reception side resonance wiring 113 is designed to resonant lines 123 in the vicinity of the resonance 18GHz, the wiring to the transmission-side resonant AC signal 113 is transmitted to the receiving side of the resonant line 123. 此时,发送侧共振布线113中发生的交流信号经第一接收布线121输出到输出端子C。 In this case, the AC signal transmitting side resonance occurs in the first wiring 113 receives the output line 121 to the output terminal C. 这是因为输出端子C(第一接收布线121)连接于与发送侧共振布线113中的布线区域A的上表面重合的布线区域C。 This is because the output terminal C (the first reception wiring 121) connected to the wiring region coincides with the upper surface of the wiring area A transmission side resonance wiring 113 C. 另外,由于接收侧共振布线123的接地部通过接收侧分离通孔126而连接到发送地电位,所以输入的交流信号不输出到输出端子D。 Further, since the reception side resonance ground wiring portion 123 are connected to the ground potential by receiving the transmitting side through hole 126 separated, the input AC signal is not output to the output terminal D.

[0121] 另外,输入到发送基板101的输入端子B的18GHz的交流信号经第二发送布线112传送到发送侧共振布线113。 [0121] Further, the substrate is input to the input terminal B 101 transmits a second alternating signal transmission wiring 18GHz 112 transmits to the transmission side resonance wiring 113. 此时,由于接收侧共振布线123的接地部通过发送侧分离通孔116而连接到接收地电位,所以输入的交流信号不输出到输入端子A。 At this time, since the reception side resonance ground wiring portion 123 is separated from the through hole 116 is connected to the transmission side receiving the ground potential, the output AC signal is not inputted to the input terminal A.

[0122] 由于发送侧共振布线113与接收侧共振布线123设计成在18GHz附近共振,所以传送到发送侧共振布线113的交流信号被传送到接收侧共振布线123。 [0122] Since the transmission side and the reception side resonance wiring 113 is designed to resonant lines 123 in the vicinity of the resonance 18GHz, the wiring to the transmission-side resonant AC signal 113 is transmitted to the receiving side of the resonant line 123. 此时,接收侧共振布线123中发生的交流信号经第二接收布线122输出到输出端子D。 In this case, the AC signal reception side resonance occurs in the second wiring 123 receives the wiring 122 to the output terminal D.

[0123] 这是因为输出端子D (第二接收布线122)连接于与发送侧共振布线113中的布线区域B的上表面重合的布线区域D。 [0123] This is because the output terminal D (second reception wirings 122) connected to the wiring region coincides with the upper surface of the wiring region B transmission side resonance wiring 113 D. 另外,由于接收侧共振布线123的接地部通过接收侧分离通孔126而连接到发送地电位,所以输入的交流信号不输出到输出端子C。 Further, since the reception side resonance ground wiring portion 123 are connected to the ground potential by receiving the transmitting side through hole 126 separated, the input AC signal is not output to the output terminal C.

[0124] 以下,利用作为实际测定数据的图7及图8来说明上述那样的传送特性。 [0124] Hereinafter, an actual measurement data of characteristics of the transmission will be described with FIG. 7 and FIG. 8 above.

[0125] 图7是表示共振耦合器10的输入信号的反射量与输入输出间的插入损耗的图。 [0125] FIG. 7 is a diagram showing insertion loss and the reflection amount between the input and output of the input signal of the resonant coupler 10.

[0126] 首先,说明反射量。 [0126] First, the amount of reflection.

[0127] 图7的"A"表示的曲线(以下记述为曲线A)表示反射量。 [0127] FIG. 7 "A" represents a curve (hereinafter referred to as curve A) represents the amount of reflection. 在该情况下反射量用分贝(dB)表不向输入端子A输入了输入信号(交流信号)情况下的、输入信号的功率与反射到输入端子A的信号(反射信号)的功率之比。 In this case, the reflection amount in decibels (dB) in the case where the power and the reflection ratio of input signal to a signal (reflection signal) input terminal A of the sum of the power meter does not input an input signal (alternating current signal) to the input terminal A. 图7的左边的纵轴表示反射量,数值越大意味着反射越大。 FIG 7 left vertical axis represents the amount of reflection, meaning the greater the value the greater the reflection. 横轴表示输入信号的频率。 The horizontal axis represents the frequency of the input signal.

[0128] 如图7所示,在输入信号的频率为18GHz附近的情况下,曲线A的反射量在-25dB 以下,输入信号的反射非常小。 [0128] As shown in FIG. 7, the frequency of the input signal is close to the case where the 18GHz, the reflection curve A in an amount -25dB or less, the reflection of the input signal is very small.

[0129] 同样地,图7的"B"表示的曲线(以下记述为曲线B)是表示向输入端子B输入了输入信号(交流信号)情况下的、输入信号的功率与反射到输入端子B的信号(反射信号)的功率之比的反射量。 Curve (hereinafter, referred to as Curve B) [0129] Similarly, FIG. 7 "B" indicates that represents the input power and the reflected input signal at an input signal (alternating current signal) case where the input terminal B to the input terminal B the ratio of the amount of power of the reflected signal (the reflected signal). 曲线B也与曲线A同样地,在输入信号的频率为18GHz附近的情况下,输入信号的反射非常小。 Curve B is also the case with curve A in the same manner, the frequency of the input signal is around 18GHz, the reflected input signal is very small.

[0130] 下面,说明插入损耗。 [0130] Next, the insertion loss.

[0131] 图7的"AC间"表示的曲线(以下记述为曲线AC)表示输入端子A-输出端子C 间的插入损耗。 Curve "AC between" [0131] FIG. 7 shows (hereinafter, referred to as Curve AC) indicates the insertion loss between the input terminals of the output terminal A- C. 该情况下插入损耗用分贝(dB)表示向输入端子A输入了输入信号时的、从输入端子A传送到输出端子C的信号的功率损耗。 Insertion loss in decibels (dB) represents the input in this case, the power loss from the input terminal A to the terminal C of the output signal when the input signal to the input terminal A. 图7的右边的纵轴表示插入损耗,数值越大意味着输入信号的损耗越大。 Right vertical axis of FIG. 7 indicates the insertion loss, the greater the value the greater the loss of the input signal means. 横轴表示输入信号的频率。 The horizontal axis represents the frequency of the input signal.

[0132] 根据图7的曲线AC,在从15GHz至20GHz的频带下插入损耗为2dB左右,损耗小。 [0132] The graph of FIG. 7 AC, inserted from 15GHz to 20GHz frequency band of about 2dB loss, loss is small. 即,从15GHz至20GHz的频率的信号从输入端子A高效传送到输出端子C。 That is, the signal frequency of 20GHz to 15GHz efficiently transmitted from the input from the terminal A to the output terminal C.

[0133] 同样地,"BD间"表示的曲线(以下记述为曲线BD)表示输入端子B-输出端子D间的插入损耗。 [0133] Similarly, "inter-BD" denotes a curve (hereinafter referred to as curve BD) represents the insertion loss between the input terminal B- of the output terminal D. 该情况下,插入损耗表不向输入端子B输入了输入信号时的、从输入端子B传送到输出端子D的信号的功率损耗。 In this case, the insertion loss does not enter the table, the power loss is transmitted from the input terminal B to the output terminal D of the signal when the input signal to the input terminal B.

[0134] 根据图7的曲线BD,在从15GHz至20GHz的频带下插入损耗为2dB左右,损耗小。 [0134] FIG. 7 is a graph BD, inserted from 15GHz to 20GHz frequency band of about 2dB loss, loss is small. 即,从15GHz至20GHz的频率的信号从输入端子B高效传送到输出端子D。 That is, the signal frequency of 20GHz to 15GHz efficiently transmitted from the input from the terminal B to the output terminal D.

[0135] 接着,说明信号的分离量。 [0135] Next, the amount of separation signals.

[0136] 图8是表示共振耦合器10的信号的分离量的图。 [0136] FIG. 8 is a diagram showing the amount of separation of the resonant coupler signal 10 in FIG.

[0137] 图8的"AB间"表示的曲线(以下记述为曲线AB)表示输入端子A-输入端子B 间的分离量。 "Inter AB" represented by the curve [0137] FIG. 8 (hereinafter referred to as curve AB) represents the amount of separation between the input terminals of input terminal A- B. 该情况下,分离量用分贝(dB)表不向输入端子A输入了输入信号时的、输入信号的功率与在输入端子B所呈现的信号的功率之比。 In this case, a separate input, the power ratio of the power at the input terminal B of the signal presented at the input signal to the input terminal A of the input signal in decibels (dB) table does not.

[0138] 图8的纵轴表不分离量,数值越大意味着信号越被分离。 The vertical axis [0138] FIG. 8 is not the amount of separation, the greater the value means that the signal is separated. 横轴表不输入信号的频率。 The horizontal axis is not input frequency signal.

[0139] 根据图8的曲线AB,在18GHz附近的频带下分离量在IOdB以上。 [0139] AB According to the graph of FIG. 8, the amount of separation in the vicinity of 18GHz band IOdB above. SP,在18GHz 附近的频率的输入信号被输入到输入端子A的情况下,输入到输入端子A的输入信号对输入端子B的影响小。 The SP, the input signal frequency is near the 18GHz inputted to the input terminal A, input to the input terminal A little influence on the input signal of the input terminal B.

[0140] 同样地,图8的"AD间"表示的曲线(以下记述为曲线AD)表示输入端子A-输出端子D间的分离量。 [0140] Likewise, curve "between AD" shown in FIG. 8 (hereinafter referred to as the curve AD) indicates the amount of separation between the output terminal of the input terminal A- D. 该情况下,分离量表不向输入端子A输入了输入信号时的、输入信号的功率与在输出端子D所呈现的信号的功率之比。 In this case, a separate scale not input, the power ratio of the power at the output terminal D of the presented signal of the input signal of an input signal to the input terminal A.

[0141] 根据图8的曲线AD,在18GHz附近的频带下分离量在IOdB以上。 [0141] According to the graph of FIG. 8 AD, the amount of separation in the vicinity of 18GHz band IOdB above. SP,在18GHz 附近的频率的输入信号被输入到输入端子A的情况下,输入到输入端子A的输入信号对输出端子D的影响小。 The SP, the input signal frequency is near the 18GHz inputted to the input terminal A, is input to the input terminal A little effect on the output signal of the input terminal D.

[0142] 同样地,图8的"BC间"表示的输入端子B-输出端子C间的分离量、以及"CD 间"表示的输出端子C-输出端子D间的分离量在18GHz附近的频带下在IOdB以上。 B- amount of separation between the output terminals of the input terminal C [0142] Similarly, "between the BC" represented in FIG. 8, and the separation amount between the output terminals of the output terminal D C- "between CD" indicates a frequency band in the vicinity of 18GHz under IOdB above. 即, 在18GHz附近的频率的输入信号被输入到输入端子A的情况下,输入到输入端子A的输入信号对输出端子D的影响小。 That is, the input signal frequency is near the 18GHz inputted to the input terminal A, is input to the input terminal A little effect on the output signal of the input terminal D.

[0143] 如上所述,在实施方式1的共振耦合器10中,在信号传送中使用的频带下,对应的输入输出端子间的插入损耗(输入端子A-输出端子C间及输入端子B-输出端子D间) 小。 [0143] As described above, in Embodiment 1 of the resonant coupler 10, the frequency band used in signal transmission, the insertion loss between the input and output terminals between corresponding (A- input terminal and the output terminal C input terminal B- output terminals D) smaller.

[0144] 另外,在上述频带下,在输入端子间(输入端子A-输入端子B间)、输出端子间(输出端子C-输出端子D间)以及不对应的输入输出端子间(输入端子A-输出端子D间以及输入端子B-输出端子C间)传送的信号给不对应的其他端子造成的影响小。 [0144] Further, in the above frequency band, between the input terminal (input terminal between the input terminal A- B), output terminals (the output terminal between the output terminal C- D) does not correspond to between the output and input terminals (input terminal A - between output terminals D and little influence of the input terminals between the output terminal B- C) transmits a signal corresponding to the other terminals does not result. 即,输入端子A-输出端子C间传送的信号与输入端子B-输出端子D间传送的信号分别被分离传送。 That is, the signal between the signal output terminal and the input terminal B- A- D between the input terminal output terminal C are transmitted in the transmitting of the separation conveyance.

[0145] 这样,若使用实施方式1的共振耦合器10,则由于信号间的隔离高,所以由1个共振耦合器实现2路径的非接触传送。 [0145] Thus, by using the embodiment 1 of the resonant coupler 10, since high isolation between signals, the non-contact transmission path 2 is implemented by a resonant coupler. 因此,通过使用共振耦合器10,能实现非接触传送装置的小型化及高集成化。 Thus, by using a resonant coupler 10 can be reduced in size and non-contact transmission device of high integration. 另外,对于半导体基板而言,由于成本因基板的面积而变动, 所以小型化带来的成本削减效果高。 Further, for the semiconductor substrate, the cost due to the area of ​​the substrate fluctuates due, the cost of a small reduction brings a high effect.

[0146] 另外,实施方式1中,发送侧分离通孔116连接于距发送侧共振布线113的上述一端的距离为相当于发送侧共振布线113的布线长的2分之1长度的位置(接地部),但发送侧分离通孔116的连接位置不限于此。 From the one end of the [0146] Further, in Embodiment 1, the transmitting side separated from the through hole 116 is connected to the transmission-side resonant line 113 is equivalent to the transmission side resonance line length of the wiring 113 1/2 length position (ground section), but the transmission-side connection position separated through hole 116 is not limited thereto. 只要发送侧分离通孔116连接于发送侧共振布线113上的、连接第一发送布线111的连接部位与连接第二发送布线112的连接部位之间的区域即可。 As long as the transmission side through hole 116 is connected to a separate transmission side resonance on wire 113, connected to the region between the connecting portion and the connecting portion 111 is connected to the second transmission line 112 first transmission line.

[0147] 同样地,只要接收侧分离通孔126连接于接收侧共振布线123上的、连接第一接收布线121的连接部位与连接第二接收布线122的连接部位之间的区域即可。 To the region between the [0147] Similarly, as long as the receiving side of the separator is connected to the through hole 126 on the reception side resonance wiring 123 is connected to a first receiving portion 121 is connected to the wire connecting portion connected to a second wiring 122 received.

[0148] 另外,第一发送布线111连接于发送侧共振布线113的距发送侧缝隙115部分的一端的距离为相当于发送侧共振布线113的布线长的8分之3长度的位置,但第一发送布线111的连接部位不限于此。 [0148] Further, the first transmission line 111 is connected to the transmission side resonance wiring portion 115 from one end side of the slit 113 is transmitted from the transmission side resonance corresponding to position the wiring line length 3/8 the length 113, but the first send a wiring connection portion 111 is not limited thereto. 第二发送布线112、第一接收布线121及第二接收布线122也同样。 The second transmission line 112, a first wiring 121 and the second receiver 122 also receives wirings.

[0149] 另外,第一发送布线111与第二接收布线122也可以不配置在一直线上。 [0149] Further, the first wiring 111 and the second transmission line 122 may not be received arranged in a straight line. 同样地,第二发送布线112及第一接收布线121也可以不配置在一直线上。 Likewise, the second wiring 112 and the first transmission line 121 may be received not arranged in a straight line.

[0150] 另外,发送侧共振布线113与第一发送布线111及第二发送布线112直接连接, 发送侧共振布线113与发送侧分离通孔116直接连接,但它们在所传送的信号的频带下电连接即可。 [0150] Further, the transmission-side resonant transmission line 113 and the wiring 112 is directly connected to a first and a second transmission line 111, transmission line 113 and the transmission side resonance side separator connected directly to the through hole 116, but in which the band of the transmitted signal electrical connection. 即,也可以经电容元件等连接。 That is, the connection may be via a capacitive element or the like. 同样,接收侧共振布线123与第一接收布线121、第二接收布线122及接收侧分离通孔126在所传送的信号的频带下电连接即可。 Similarly, the reception side resonance wiring 123 and the first receiving wiring 121, the wiring 122 and a second receiving receiving-side separating the through hole 126 is electrically connected to the lower band of the transmitted signal.

[0151] 另外,发送基板101与接收基板102重合,使得在俯视的情况下,发送侧共振布线113的轮廓与接收侧共振布线123的轮廓一致,但轮廓彼此也可以不完全一致。 [0151] Further, the substrate 101 and the transmission receiver substrate 102 overlap, such that in plan view, the transmission side resonance contour line 113 and the reception side resonance conform to a contour line 123, it may not be exactly the same profile with each other. 只要是在制造上的共振布线的个体差或制造上的基板的配置错位等的范围内,则共振耦合器10 能充分动作。 Insofar as dislocation is disposed on the substrate for producing the individual difference or the resonance range of manufacturing a wiring, the coupler 10 can be sufficiently resonator operation.

[0152] 另外,发送基板101、接收基板102及盖体基板103是蓝宝石基板,但也可以是由硅、半导体及其他电介质材料形成的基板。 [0152] Further, transmission substrate 101, the receiving substrate 102 and the lid substrate 103 is a sapphire substrate, but may be formed of a silicon substrate, other dielectric materials and semiconductors.

[0153] 另外,发送侧共面地电位114也可以仅沿第一发送布线111及第二发送布线112 形成。 [0153] Further, the transmission-side coplanar ground wiring 114 may transmit a first 111 and the second transmission line 112 is formed along only. 也可以不形成发送侧共面地电位114。 The transmitting side may not be formed coplanar potential 114. 同样,接收侧共面地电位124也可以仅沿第一接收布线121及第二接收布线122形成。 Similarly, the receiving-side coplanar ground 124 may be a first wiring 121 and the second receiver 122 receives the wiring is formed along only. 另外,也可以不形成接收侧共面地电位124。 Further, the reception side may not be formed coplanar potential 124.

[0154] 另外,在实施方式1中,说明了使发送基板101与接收基板102重合的结构,但也可以在1个基板的上表面与下表面分别形成发送侧的布线与接收侧的布线。 [0154] Further, in Embodiment 1, described the transmission substrate 101 and the receiver substrate 102 overlapping structure, but may be formed wiring and the reception side the transmission side of the upper surface and the lower surface of a substrate wiring.

[0155] 另外,在实施方式1中,区别说明了输入端子与输出端子,但输入端子与输出端子可交换。 [0155] Further, in Embodiment 1, the difference between the input instructions and output terminals, the input terminal and the output terminal interchangeably. 即,例如也可以将输入到输出端子C的信号从输入端子A输出。 That is, for example, may be input to the signal output terminal C of the output from the input terminal A.

[0156] 另外,在实施方式1中,在发送侧共振布线113及接收侧共振布线123分别各连接两个输入输出布线,但也可以在发送侧共振布线113及接收侧共振布线123分别连接三个以上输入输出布线(输入输出布线群)。 [0156] Further, in Embodiment 1, the wiring 113 on the transmission side and the reception side resonance resonant wirings 123 are each connected to two input and output wirings, but may be connected at the transmission side respectively when the wiring 113 and the reception-side resonant resonant wiring 123 or more input-output wiring (input-output wiring group). 该情况下,在发送侧共振布线113及接收侧共振布线123中连接输入输出布线群的连接部位彼此之间设置接地部,将全部接地部连接于地电位布线。 In this case, the wiring 113 on the transmission side and the reception side resonance resonator connected to the input wiring 123 connected to the output portion of the ground wiring portion is provided between the groups with each other, all the ground portion connected to the ground potential wiring.

[0157] 另外。 [0157] Further. 在实施方式1中表不向输入端子A及B输入的信号的基准电位的均为发送地电位,但也可以构成为将发送地电位按每个输入端子分离。 Not to the input signal input terminals A and B are transmitted reference ground potential, it may be configured to transmit a ground potential for each separate input terminal in the embodiment of Table 1.

[0158] 图9是这样的情况下的发送基板701的俯视图。 [0158] FIG. 9 is a plan view of the transmission of the substrate 701 in such a case.

[0159] 图9中,在发送侧共振布线713、第一发送布线711及第二发送布线712的周边形成有作为发送地电位的发送侧共面地电位。 [0159] FIG. 9, the transmission side resonance wiring 713, a ground potential serving as a transmission side transmitting a first coplanar transmission line 711 and the potential of the second transmission line 712 is formed outside. 由于分离区域717中未设置金属导体,所以发送侧共面地电位被分离成两个。 Due to the separation region 717 metal conductor is not provided, the transmission-side coplanar ground potential is separated into two. 即,使发送地电位分离成对应于输入端子A的发送侧共面地电位714A和对应于输入端子B的发送侧共面地电位714B这两个。 That is, the ground potential is separated into the transmission-side coplanar transmission 714A potential corresponding to the input terminal A and the transmission-side coplanar potential corresponding to the input terminal B 714B both.

[0160] 另外,分离成两个的发送侧共面地电位714A及714B未连接于在发送基板701的背面设置的背面地电位。 [0160] Further, the transmission side is separated into two coplanar potential 714A and 714B are not connected to the ground back surface of the substrate in the back of the transmission 701 is provided. 另外,发送基板701的分离区域717以外的结构(发送侧缝隙715、发送侧分离通孔716等)与图5所示的发送基板101同样。 The transmission structure of the substrate 701 other than the separation area 717 (the transmission-side gap 715, separating the transmitting side through-hole 716, etc.) and transmits the substrate 101 shown in FIG. 5 similarly.

[0161] 另外,虽未图示,但也可以构成为通过对接收基板702的接收侧共面地电位也设置地电位分离区域来分离接收地电位。 [0161] Further, although not shown, may be configured by receiving substrate 702 on the receiving side coplanar ground potential is also provided to separate the separation region receiving the ground potential.

[0162] (实施方式2) [0162] (Embodiment 2)

[0163] 实施方式1中,使用发送侧分离通孔116与接收侧分离通孔126,由一个共振耦合器实现2路径的非接触信号传送,但共振耦合器10也可以不使用通孔。 [0163] In Embodiment 1, the use of separate transmitting side and the receiving side through hole 116 separated from the through hole 126, the non-contact signal transmission path 2 is implemented by a resonant coupler, the coupler 10 may be the resonator without using vias. 例如,也可以利用布线将发送侧及接收侧共振布线连接到共面地电位。 For example, a wiring may be the transmission side and the reception side resonance coplanar wiring is connected to ground potential.

[0164] 图10是利用布线将共振布线连接于共面地电位的共振耦合器20的立体图。 [0164] FIG. 10 is a wiring line connected to the resonant perspective view of a coplanar resonator ground coupler 20. 另外,图11是这样的共振耦合器20的发送基板801的俯视图。 Further, FIG. 11 is a plan view of a substrate 801 such transmission resonator 20 of the coupler.

[0165] 另外,接收基板802的结构与发送基板801的结构同样,所以省略接收基板802 的附图。 [0165] Further, the transmission structure as the substrate 801 and the substrate 802 is also received, the drawings will be omitted receiving substrate 802. 另外,在以下的实施方式2的说明中,未特别说明的构成要素、构成、动作等的详细内容与实施方式1同样。 Further, in the following description of the second embodiment, the components not particularly described, the configuration, operation and other details of the same embodiment.

[0166] 实施方式2的共振耦合器20由发送基板801、在发送基板801的上部设置的接收基板802、在接收基板802的上部设置的盖体基板803构成。 [0166] Embodiment 2 of the resonant coupler 20 by the transmission substrate 801, the substrate 801 is received in the transmission upper portion of the substrate 802, the substrate 802 received in the upper portion of the cover substrate 803 provided configuration.

[0167] 在发送基板801的上表面,形成作为金属布线的第一发送布线811、第二发送布线812、通过发送侧缝隙815而被开放的圆形的发送侧共振布线813。 [0167] In transmitting an upper surface of the substrate 801, a first transmission line 811 is formed as a metal wiring, a second transmission line 812, a slit 815 through the transmitting side is a circular opening 813 of the transmission side resonance wiring. 另外,在第一发送布线811、第二发送布线812及发送侧共振布线813的周围,形成作为金属导体的发送侧共面地电位814。 Further, in the first transmission line 811, second transmission line 812 and the transmission side resonance around the wiring 813, a metal is formed as a transmission-side coplanar ground conductors 814. 在发送基板801的下表面形成背面地电位804。 The back surface 804 is formed a ground potential of the substrate 801 in the lower surface of the transmission.

[0168] 接收基板802与发送基板801重合。 [0168] receiving substrate 802 and the substrate 801 overlap sending. 在接收基板802上表面形成作为金属布线的第一接收布线821、第二接收布线822、通过接收侧缝隙825而被开放的圆形的接收侧共振布线823。 A first receiving surface is formed as a metal wiring 821 is a wiring substrate 802 on the receiver, receiving a second wiring 822, and is opened by a receiving-side slit 825 of circular reception side resonance wiring 823. 另外,在第一接收布线821、第二接收布线822及接收侧共振布线823的周围, 形成作为金属导体的接收侧共面地电位824。 Further, the first receiving wiring 821, the wiring 822 and the second receiving reception side resonance around the wiring 823, a metal conductor is formed as the reception-side coplanar ground potential 824.

[0169] 盖体基板803与接收基板802重合。 [0169] substrate 803 and the cover 802 superposed receiving substrate. 另外,在盖体基板803的上表面,设置作为金属导体的盖体地电位805。 Further, the upper surface of the cover substrate 803, the lid member 805 as the ground potential of the metal conductors.

[0170] 发送侧分离布线818的一端连接于距发送侧共振布线813的一端的距离为相当于发送侧共振布线813的布线长的2分之1长度的位置。 [0170] One end of the transmission side of the separation line 818 is connected to the wiring distance from the end of the transmission side resonance resonance line length of 813 positions half the length of the wiring 813 corresponds to the transmission side. 发送侧分离布线818的另一端连接于发送侧共面地电位814。 Separating the transmission-side wiring 818 is connected to the other end of the transmission-side coplanar potential 814. 发送侧共面地电位814是表示向发送基板801输入的信号的基准电位的发送地电位。 Transmitting-side coplanar ground potential 814 is a transmission reference potential of the substrate 801 to the transmitter input signal.

[0171] 接收侧分离布线819的一端连接于距接收侧共振布线823的一端的距离为相当于接收侧共振布线823的布线长的2分之1长度的位置。 End of [0171] the receiving side of the separation line 819 is connected to one end of the wiring from the reception side resonance distance of 823 corresponds to the wiring length of the wiring reception side resonance position of 1/2 length 823. 接收侧分离布线819的另一端连接于接收侧共面地电位824。 The other end of the receiving side of the separation line 819 is connected to the receiving-side coplanar potential 824. 接收侧共面地电位824是表示向接收基板802输入的信号的基准电位的接收地电位。 Receiving-side coplanar ground potential 824 is a potential to the reference potential to receiving a received signal input 802 of the substrate.

[0172] 发送侧分离布线818及接收侧分离布线819的材料例如是金,但也可以是其他金属材料。 Materials [0172] transmitting side and the receiving side separation line 818 to separator 819, for example, gold wire, but may be other metallic materials. 发送侧分离布线818及接收侧分离布线819的布线宽度例如是0. 1mm。 The transmission side of the separation line 818 and the reception-side separation line width of the wiring 819, for example, 0. 1mm.

[0173] 由此,可得到实施方式1的如图7及图8所示那样的传送特性,所以能够由一个共振耦合器实现2路径的非接触信号传送。 [0173] Thus, 7 can be obtained non-contact signal transmission of the embodiment in FIG. 1 and FIG as transmission characteristics, it is possible to realize a 2 path 8 by the resonant coupler. 即,能够使用共振耦合器10实现非接触信号传送装置的小型化、高集成化。 That is, the resonant coupler 10 can be used miniaturization of non-contact signal transmission apparatus, high integration.

[0174] 另外,实施方式2中,也可以不形成盖体地电位805及背面地电位804。 [0174] Further, in Embodiment 2, the cover member may not be formed a ground potential 805 and the back ground potential 804. 如上所述,这是因为发送侧共面地电位814成为表示向发送基板801输入的信号的基准电位的发送地电位,接收侧共面地电位成为接收地电位。 As described above, since the transmission side 814 become coplanar ground reference potential to transmit signals representing the input substrate 801 to the transmission, the receiving side receives potential becomes coplanar ground potential. 因此,该情况下,也可以采用不使用盖体基板803的结构。 Thus, in this case, may not be used to cover substrate 803 using structure.

[0175] 另外,在如上所述那样不形成盖体地电位805及背面地电位804的情况下,第一发送布线811、第二发送布线812、第一接收布线821及第二接收布线822成为共面布线结构。 [0175] Further, without forming the body as a ground potential and a back cover 805 described above, in the case where the ground potential 804, a first transmission line 811, second transmission line 812, a first wiring 821 and the second receiver 822 receives the wiring becomes coplanar wiring structure.

[0176] 如上所述,通过在同一平面中利用布线将共振布线接地,不需要形成通孔,所以能够简化共振耦合器10的制造工艺。 [0176] As described above, by using the resonance line is grounded wiring, the through hole need not be formed in the same plane, it is possible to simplify the manufacturing process of the resonant coupler 10. 另外,也可以采用不使用盖体基板的结构,所以能够实现共振耦合器20的基板的厚度方向的小型化。 Further, the lid may be used without using the substrate structure, it is possible to reduce the size of the thickness direction of the substrate 20 of the resonant coupler.

[0177] (实施方式3) [0177] (Embodiment 3)

[0178] 实施方式1中,发送侧分离通孔116与发送侧共振布线113直接连接,接收侧分离通孔126与接收侧共振布线123直接连接,但接收侧及发送侧共振布线也可以经布线而与分离通孔连接。 [0178] Embodiment 1, the transmission-side separating the through holes 116 of the transmission side resonance wiring 113 is directly connected, the receiving-side separator 126 and the reception-side through hole resonant wiring 123 is directly connected, but the reception side and the transmission side resonance line may be via wiring It is connected to the through-holes separated.

[0179] 图12是表示这样的情况下的发送基板1001的俯视图。 [0179] FIG. 12 is a plan view of the lower substrate 1001 transmits such a case. 另外,在以下的实施方式3的说明中,未特别说明的构成要素、构成、动作等的详细内容与实施方式1同样。 Further, in the following description of the embodiment 3, components not particularly described, the configuration, operation and other details of the same embodiment.

[0180] 在发送基板1001的上表面,形成发送侧共振布线1013与第一发送布线1011及第二发送布线1012。 [0180] In the upper surface of the substrate 1001 transmission, the transmission side resonance wiring 1013 is formed with a first transmission line 1011 and second transmission line 1012. 发送侧共振布线1013与第一发送布线1011及第二发送布线1012分别连接,沿第一发送布线1011、第二发送布线1012及发送侧共振布线1013的周边,形成发送侧共面地电位1014。 The transmission side transmitting a first resonant wiring 1013 and the wiring 1011 and the wiring 1012 are connected to the second transmission along the first transmission line 1011, the second transmission line 1012 and the transmission side resonance outside the wiring 1013 is formed coplanar transmission-side potential 1014.

[0181] 发送侧共振布线1013是通过发送侧缝隙1015而被开放的圆形布线,经连接布线1018连接于发送侧分离通孔1016。 [0181] transmitting side resonance wiring 1013 through 1015 to be transmitting side slit open circular wire, the connection wiring 1018 is connected to the transmission side via the through holes 1016 separated.

[0182] 发送侧分离通孔1016与在发送基板1001的背面形成的背面地电位连接。 [0182] separating the transmission side through hole 1016 is connected to the back surface of the back ground transmitting substrate 1001 is formed. 背面地电位是表示向发送基板1001输入的信号的基准电位的发送地电位。 The back ground is a ground reference potential of the transmission signal input to the transmitting substrate 1001. 因此,由将连接布线1018连接的连接部位(接地部)将发送侧共振布线1013连接于发送地电位。 Thus, the wiring connection by a connecting portion (land portion) 1018 is connected to the transmission-side resonant transmission line 1013 is connected to ground potential.

[0183] 另外,如图中虚线所示,在发送基板1001的上表面重合接收基板1002。 [0183] Further, as shown in dotted line, the transmission coincides with the upper surface of the substrate 1001 receiving the substrate 1002. 另外,由于接收基板1002的结构与发送基板1001的结构同样,所以省略接收基板1002的附图。 Further, since the reception and transmission structure as the substrate 1001 in the same substrate 1002, substrate 1002 is omitted in the drawings received.

[0184] 如上所述,实施方式3的结构也可以得到实施方式1的图7及图8所示的传送特性,能够由一个共振耦合器实现2路径的非接触信号传送。 [0184] As described above, the structure of Embodiment 3 of the embodiment can be obtained in the transmission characteristic shown in FIG. 7 and 8 in FIG. 1, the non-contact signal transmission path 2 can be implemented by a resonant coupler. 即,使用共振耦合器10能够实现非接触信号传送装置的小型化、高集成化。 That is, the size of the resonant coupler 10 can be non-contact signal transmission apparatus, high integration.

[0185] 另外,通过变更连接布线1018的布线长,还能够微调共振耦合器的传送特性。 [0185] Further, by changing the length of the connection wiring 1018 is a wiring is also possible to fine-tune the transmission characteristics of the resonant coupler.

[0186] (实施方式4) [0186] (Embodiment 4)

[0187] 在实施方式1~3中,发送侧共振布线113及接收侧共振布线123的形状是直径Imm的圆形状,但共振布线的形状也可以是矩形或其他形状。 [0187] In Embodiments 1 to 3, the transmission side resonance wiring 113 and the reception side resonance line shapes is 123 Imm diameter circular shape, but the shape of the resonance line may be rectangular or other shape.

[0188] 图13是使用实施方式4的共振布线的共振耦合器40的示意图。 [0188] FIG. 13 is a schematic view of the resonant coupler 40 using an embodiment of the resonant line 4. 图13所示的具有5处以上的弯曲部的形状的共振布线,通过使发送基板1101与接收基板1102如图3那样重合,共振耦合器10也能够与实施方式1同样地动作。 FIG 13 having the shape of the resonance line at least a curved portion 5, the substrate 1101 through the transmission and reception overlap the substrate 3 as shown in 1102, the resonant coupler 10 can operate similarly to the first embodiment.

[0189] 图14是实施方式4的发送基板1101的俯视图。 [0189] FIG. 14 is a top view of the embodiment of FIG. 4, the transmission of the substrate 1101.

[0190] 发送侧共振布线1113是具有共计12处弯曲部的环绕形状。 [0190] transmitting side resonance wiring 1113 is surrounded by a shape having a curved portion at a total of 12. 发送侧共振布线1113 的一部分通过发送侧缝隙1115而被开放。 Transmission side resonance wiring part 1113 is transmitted through the open side of the slot 1115. 发送侧共振布线1113的布线宽度例如为0. 1_。 Transmission side resonance line width of the wiring 1113, for example, 0. 1_.

[0191] 第一发送布线1111的一端连接于发送侧共振布线1113的距发送侧缝隙1115部分的一端的距离为相当于发送侧共振布线1113的布线长的8分之3长度的位置。 [0191] One end of the first transmission line 1111 is connected to the transmission side resonance wiring 1113 from an end portion side of the slot 1115 is transmitted from the transmission side resonance corresponding to position the wiring line length 3/8 the length of 1113. 另外, 第二发送布线1112的一端连接于发送侧共振布线1113的距发送侧缝隙1115部分的上述一端的距离为相当于发送侧共振布线1113的布线长的8分之5长度的位置。 Further, the end of the second transmission line 1112 is connected to the transmission side resonance wiring 1113 from the one end side of the slit portion 1115 is transmitted from the transmission side resonance corresponding to position the wiring line length of 85 parts per length of 1113.

[0192] 第一发送布线1111的未与发送侧共振布线1113连接的另一端是输入端子^, 第二发送布线1112的未与发送侧共振布线1113连接的另一端是输入端子B'。 [0192] the transmitting side does not transmit a first wiring 1111 connected to the other end of the resonant line is an input terminal ^ 1113, a second transmission line 1112 is not the transmission side resonance and the other end connected to a wiring 1113 is an input terminal B '. 第一发送布线1111及第二发送布线1112的布线宽度例如是0. 1mm。 A first transmission line 1111 and second transmission wiring width of wiring 1112, for example, 0. 1mm.

[0193] 发送侧共面地电位1114沿第一发送布线1111、第二发送布线1112及发送侧共振布线1113的周边形成。 [0193] transmitting side potential of the coplanar transmission line 1111 1114 in the first, the second transmission line 1112 and the transmission side resonance outside the wiring 1113 is formed.

[0194] 发送侧分离布线1118的一端连接于距发送侧共振布线1113的一端的距离为相当于发送侧共振布线1113的布线长的2分之1长度的位置。 [0194] One end of the transmission side of the separation line 1118 is connected to the wiring distance from the end of the transmission side resonance of the resonant line length of 1113 position half the length of the wiring 1113 is equivalent to the transmission side. 发送侧分离布线1118的另一端连接于发送侧共面地电位1114。 Separating the transmission-side wiring 1118 and the other end is connected to the transmission-side coplanar potential 1114. 发送侧共面地电位1114是表示向发送基板1101输入的信号的基准电位的发送地电位。 Transmitting-side coplanar ground potential 1114 is a potential of the reference potential of the transmission signal input to the transmitting substrate 1101.

[0195] 另外,如图中虚线所示,在发送基板1101的上表面重合接收基板1102。 [0195] Further, as shown in dotted line, the substrate 1101 in the transmission coincides with the upper surface of the substrate 1102 receiving. 另外,虽未图示,但在发送基板1101的下表面形成背面地电位。 Further, although not shown, formed in the rear surface of the substrate 1101 in the transmission ground potential lower surface.

[0196] 图15是实施方式4的接收基板1102的俯视图。 [0196] FIG. 15 is a top view of the embodiment of Figure 4 receives the substrate 1102.

[0197] 接收侧共振布线1123是与发送侧共振布线1113相同的形状。 [0197] 1123 is a wiring reception side resonance transmission side resonance same shape as the wiring 1113.

[0198] 第一接收布线1121的一端连接于接收侧共振布线1123的距接收侧缝隙1125部分的一端的距离为相当于接收侧共振布线1123的布线长的8分之3长度的位置。 [0198] receiving end of the first wiring 1121 is connected to the wiring 1123 of the reception side resonance distance 1125 from the end portion of the receiving-side slits corresponding to the reception-side resonant wiring line length of 3/8 length position 1123. 另外, 第二接收布线1122的一端连接于接收侧共振布线1123的距接收侧缝隙1125部分的上述一端的距离为相当于接收侧共振布线1123的布线长的8分之5长度的位置。 Further, the receiving end of the second wiring 1122 is connected to the receiving side from the resonance line 1123 receives the slot-side end portion 1125 of the reception side resonance distance corresponding to the wiring length of the wiring length per position 85 1123.

[0199] 第一接收布线1121的未与接收侧共振布线1123连接的另一端是输出端子C, 第二接收布线1122的未与接收侧共振布线1123连接的另一端是输出端子D'。 [0199] and the receiving side is not received the first wiring 1121 is connected to the other end of the resonance line 1123 is an output terminal C, and the receiving side is not received a second wiring 1122 and the other end of the resonance line 1123 is connected to the output terminal D '. 第一接收布线1121及第二接收布线1122的布线宽度例如是0. 1mm。 Receiving a first wiring 1121 and the wiring width of the second wiring 1122 receives, for example, 0. 1mm.

[0200] 接收侧共面地电位1124沿第一接收布线1121、第二接收布线1122及接收侧共振布线1123的周边形成。 [0200] receiving side coplanar ground wiring 1121 receives 1124 a first direction, a second wiring 1122 and the reception-side receiving resonance peripheral wiring 1123 is formed.

[0201] 接收侧分离布线1128的一端连接于距接收侧共振布线1123的一端的距离为相当于接收侧共振布线1123的布线长的2分之1长度的位置。 [0201] the receiving side of the separation line 1128 is connected to one end of the reception side from the resonance line from the end 1123 of the wiring length of the resonance position of half the length of the wiring 1123 is equivalent to the reception side. 接收侧分离布线1128的另一端连接于接收侧共面地电位1124。 The other end of the receiving side of the separation line 1128 is connected to the receiving-side coplanar potential 1124. 接收侧共面地电位1124是表示向接收基板1102输入的信号的基准电位的发送地电位。 Receiving-side coplanar ground 1124 is transmitted to the ground reference potential of the substrate 1102 receiving a signal of the input.

[0202] 另外,如图中虚线所示,在接收基板1102的上表面重合盖体基板1103。 [0202] Further, as shown in dashed lines, on the surface of the substrate 1102 receiving substrate 1103 coincides cover. 另外,虽未图示,但在盖体基板1103的上表面形成盖体地电位。 Further, although not shown, a ground potential is formed on the lid surface of the lid substrate 1103.

[0203] 如图13所示,发送基板1101与接收基板1102重合,使得在俯视的情况下,发送侧共振布线1113的轮廓与接收侧共振布线1123的轮廓一致。 [0203] As shown in FIG 13, the transmission 1101 and the substrate 1102 receiving the substrate coincide, so that in plan view, the transmission side resonance contour line 1113 and the reception side resonance wiring 1123 consistent contour. 此时,发送侧共振布线1113 与接收侧共振布线1123重合而成为点对称的关系。 In this case, the transmission-side wiring 1113 and the reception side resonance resonant wiring 1123 becomes coincident relationship of point symmetry.

[0204] 实施方式4的共振耦合器40具有与实施方式1的共振耦合器10同等的传送特性。 [0204] Embodiment 40 of the resonant coupler 4 having the transmission characteristics embodiment the resonant coupler 10 is equal to 1. 即,实施方式4的共振耦合器10的传送特性是在图7及图8中将输入端子A及B置换为输入端子A'及B'、将输出端子C及D置换为输出端子C'及D'而得到的传送特性。 That is, transmission characteristics of Embodiment 4 of the resonant coupler 10 is replaced by input terminals A 'and B', the output terminal C and D is replaced with the output terminal C 'and in FIG. 7 and the input terminals A and B 8 will D 'obtained by the transmission characteristic.

[0205] 若共振耦合器10的共振布线与共振耦合器40的共振布线的布线长相同,则共振耦合器40更能减小基板内共振布线所占的面积。 [0205] When the resonator coupler and the resonator resonant wiring coupler 10 is the same as the wiring length of the wiring 40 of the resonator, the resonator is reduced more resonant coupler 40 within the wiring substrate area occupied. 这是因为共振耦合器40的共振布线具有多个弯曲部。 This is because the resonator resonant wiring coupler 40 has a plurality of curved portions. 因此,共振耦合器40相比共振耦合器10能进一步小型化。 Thus, the resonant coupler 40 as compared to the resonant coupler 10 can be further miniaturized.

[0206] 另外,发送基板1101中,发送侧共振布线1113通过发送侧分离布线1118连接于发送侧共面地电位1114,但发送侧共振布线1113也可以通过通孔而与背面地电位连接。 [0206] In addition, the substrate 1101 in the transmission, the transmission side resonance wiring 1113 is connected to the transmission line 1118 side coplanar 1114 separated by the transmission side potential, but the transmission side resonance wiring 1113 may be connected to the back surface of the ground potential through the through hole.

[0207] 图16是表示使用通孔将实施方式4的发送侧共振布线连接于地电位的发送基板的变形例的图。 [0207] FIG. 16 is a through-hole embodiment of the transmission side resonance 4 embodiment showing a modification of the transmission is connected to the ground potential wiring substrate.

[0208] 发送侧共振布线1113连接于距发送侧共振布线1113的一端的距离为相当于发送侧共振布线1113的布线长的2分之1长度的位置(接地部)。 [0208] transmitting side resonance wiring 1113 is connected to the distance from the end of the transmission side resonance wiring 1113 is a wiring corresponding to the wiring length of the transmission side resonance position half the length 1113 (grounding portion). 发送侧分离通孔1116设置在环绕形状的发送侧共振布线1113的外侧。 Separating the transmission side through-hole 1116 provided on the transmission side resonance shape surrounding the outside of the wiring 1113.

[0209] 另外,虽未图示,但接收基板1102也能与发送基板1101同样构成。 [0209] Further, though not illustrated, the receiving substrate 1102 can be configured similarly to the transmission of the substrate 1101. 即,接收基板1102的接收侧共振布线1123也可以通过通孔而与盖体地电位连接。 That is, the substrate 1102 receiving the reception side resonance wiring 1123 may be connected to the ground potential of the cover member through the through hole.

[0210] 另外,虽未图示,但也可以如实施方式3所示那样构成为使共振布线经布线而与通孔连接。 [0210] Further, although not shown, may be connected to the through hole of the resonant line via wiring as described in Embodiment 3 configured as shown in FIG.

[0211] 另外,在以上实施方式4中,说明了在发送基板1101的上表面重合的接收基板1102的接收侧共振布线1123的形状与发送侧共振布线1113的形状相同的情况,但也可以不完全相同。 [0211] Further, in the above embodiment 4, the case where the receiving side receives the substrate transmitting substrate 1101 of the upper surface coincides with 1102 resonance line shape of the transmitting-side 1123 of the resonant line of the same shape 1113, but may not be exactly the same.

[0212] 例如,通过对同一发送基板1101将所重合的接收基板1102的接收侧共振布线1123的形状(规格)少量变更,能够调整所传送的信号的频带(变更图7及图8所示的传送特性)。 [0212] For example, the substrate 1101 by the same transmission side receives the reception substrate 1102 overlapping resonance line shape (size) of 1123 with a few changes, the signal can be adjusted as shown in the transmitted frequency band (FIGS. 7 and 8 change transmission characteristics).

[0213] 具体地,将图15所示的接收侧共振布线1123的接地部与接收侧缝隙之间的间隔即长度LU和图中所示的长度L2设置为与发送侧共振布线1113的对应的各个长度不同的长度。 [0213] Specifically, the reception side 15 shown in FIG resonant grounding wiring portion 1123, i.e., the length of the interval between the LU and the receiving slit and the side shown in FIG resonator length L2 is set to the transmission side corresponding to the wiring 1113 different lengths each length. 由此,能够调整所传送的信号的频帯。 Accordingly, it is possible to adjust the frequency of the transmitted signal Bands. 该情况下,发送侧共振布线1113的形状与接收侧共振布线1123的形状多少不同,但已确认到作为共振耦合器的动作完全没问题。 In this case, the transmission side resonance line shape of the reception side resonance wiring 1113 1123 somewhat different shape, as it has been confirmed that the operation of the resonant coupler no problems.

[0214] 以上,如实施方式4那样,通过使用具备多个弯曲部的矩形环绕形状的共振布线, 能够减小基板内共振布线所占的面积。 [0214] As described above in Embodiment 4 above, by using a plurality of bent portions includes a rectangular wire around the resonance shape, resonance can be reduced in the substrate area occupied by wiring. 即,通过使用实施方式4的共振耦合器40,能够进一步实现非接触传送装置的小型化、高集成化。 That is, 40, it is possible to further reduce the size of non-contact transmission by using the apparatus embodiment of the resonant coupler 4, the high integration.

[0215] 以上,根据实施方式1~4说明了本发明的一个形态的共振耦合器。 [0215] above, according to Embodiments 1 to 4 illustrate a resonance coupling aspect of the present invention. 根据本发明的一个形态的共振耦合器,能够由一个共振耦合器分离并非接触传送两个高频信号。 According to one aspect of the resonant coupler of the present invention, a resonator can be not contacted by the coupler transmits two separate high-frequency signals. 因此,在使用多个共振耦合器的非接触传送装置中,通过减少共振耦合器的数量,能实现装置的小型化、高集成化。 Thus, the non-contact transmission apparatus using a plurality of resonant coupler, the coupler by reducing the number of the resonator, the device can be miniaturized, highly integrated.

[0216] 本发明不限于这些实施方式或其变形例。 [0216] The present invention is not limited to these embodiments or their modification examples. 只要不脱离本发明的精神,对本实施方式或其变形例实施本领域技术人员想到的各种变形、或组合不同实施方式或其变形例的构成要素而构筑的方式也包含在本发明的范围内。 Without departing from the spirit of the present invention, the embodiment of the present modification example embodiments and variations thereof occur to those skilled in the art, or a combination of different forms or components of the embodiment and modification constructed also included within the scope of the present invention .

[0217] 工业使用性 [0217] Industrial use of

[0218] 本发明的共振耦合器能够由一个共振耦合器分离传送两个信号,适用于在逆变器系统或矩阵变换器系统等的栅极驱动中使用的非接触传送装置等。 [0218] The resonant coupler of the present invention can transmit two signals are separated by a resonant coupler for non-contact transmission device used in an inverter system or the gate driver matrix converter system or the like and the like.

[0219] 符号说明 [0219] Description of Symbols

[0220] 10、20、40共振耦合器 [0220] 10,20,40 resonant coupler

[0221] 101、701、801、1001、1101 发送基板 [0221] 101,701,801,1001,1101 transmitting substrate

[0222] 102、702、802、1002、1102 接收基板 [0222] 102,702,802,1002,1102 receiving substrate

[0223] 103、803、1103 盖体基板 [0223] 103,803,1103 cover substrate

[0224] 104、804背面地电位 [0224] back surface ground 104,804

[0225] 105、805盖体地电位 [0225] 105,805 ground cover

[0226] 106、107地电位通孔 [0226] ground vias 106, 107

[0227] 111、711、811、1011、1111 第一发送布线 [0227] The first transmission line 111,711,811,1011,1111

[0228] 112、712、812、1012、1112 第二发送布线 [0228] The second transmission line 112,712,812,1012,1112

[0229] 113、713、813、1013、1113 发送侧共振布线 [0229] transmitting side resonance wiring 113,713,813,1013,1113

[0230] 114、714A、714B、814、1014、1114 发送侧共面地电位 [0230] 114,714A, 714B, 814,1014,1114 ground coplanar transmission side

[0231] 115、715、815、1015、1115 发送侧缝隙 [0231] transmitting side slits 115,715,815,1015,1115

[0232] 116、716、1016、1116 发送侧分离通孔 [0232] separated from the transmission side through hole 116,716,1016,1116

[0233] 121、821、1121 第一接收布线 [0233] receiving a first wiring 121,821,1121

[0234] 122、822、1122 第二接收布线 [0234] receiving a second wiring 122,822,1122

[0235] 123、823、1123接收侧共振布线 [0235] 123,823,1123 reception side resonance wirings

[0236] 124、824、1124接收侧共面地电位 [0236] 124,824,1124 reception side coplanar ground

[0237] 125、825、1125 接收侧缝隙 [0237] receiving side slits 125,825,1125

[0238] 126接收侧分离通孔 [0238] separated from the through hole 126 on the receiving side

[0239] 717分离区域 [0239] Separation zone 717

[0240] 818、1118发送侧分离布线 [0240] transmitting side separation line 818,1118

[0241] 819、1128接收侧分离布线 [0241] the receiving side of the separation line 819,1128

[0242] 1018连接布线 [0242] connection wiring 1018

Claims (13)

1. 一种共振耦合器,在第一传送线路与第二传送线路之间以非接触方式传送高频信号,其特征在于, 具备: 所述第一传送线路,在第一平面上具备第一共振布线和连接于所述第一共振布线的第一输入输出布线及第二输入输出布线,所述第一共振布线是布线的一部分通过开放部而被开放的环绕形状的布线;以及所述第二传送线路,在与所述第一平面对置的第二平面上具备第二共振布线和连接于所述第二共振布线的第三输入输出布线及第四输入输出布线,所述第二共振布线是布线宽度及形状与所述第一共振布线的布线宽度及形状相同的布线, 所述第一共振布线上的、在连接所述第一输入输出布线的连接部位与连接所述第二输入输出布线的连接部位之间设置的第一接地部连接于第一地电位布线,该第一地电位布线表示所述第一传送线路内的所述高频信 A resonant coupler, high frequency signals transmitted in a contactless manner between the first transmission line and the second transmission line, characterized by comprising: a first transmission line, comprising a first plane in a first and a resonant line is connected to the first input of the first resonance line and the second output of the input-output wiring line, the first wiring is a resonance portion through the open portion of the wiring is open around the wire shape; and the second two transmission lines, comprising the second wiring and the resonant output wiring connected to the third input and the fourth input of said second resonant output wiring line on a second plane opposed to said first plane, said second resonance wiring is a wiring width and the same shape of the wiring line width and shape of the first resonant wiring, the connecting portion connecting the first input and output wiring connected to the second input of the first resonance line the first ground portion is provided between the connecting point of the output wiring is connected to the first ground potential wiring, the ground wiring represents the first high-frequency signal in said first transmission line 的基准电位, 所述第二共振布线上的、在连接所述第三输入输出布线的连接部位与连接所述第四输入输出布线的连接部位之间设置的第二接地部连接于第二地电位布线,该第二地电位布线表示所述第二传送线路内的所述高频信号的基准电位, 所述第一传送线路与所述第二传送线路对置设置,使得在从垂直于所述第一平面的方向观察的情况下,所述第一共振布线的轮廓与所述第二共振布线的轮廓一致,并且所述第一共振布线与所述第二共振布线成点对称的关系。 Reference potential, the second ground connecting portion between the connecting point of the third input connected to the output wiring connected to the input portion of the fourth output wiring connected to the second ground disposed on the second resonant wiring potential wiring, the second wiring represents the ground reference potential of the high-frequency signal in the second transmission line, the first transmission line and the second transmission line disposed opposite, so that from the perpendicular to the in a direction from said first plane observed, consistent with the contours of the first resonance line and the second resonance line, and the first resonance line and the second resonance point symmetric relationship wiring.
2. 根据权利要求1所述的共振耦合器,其特征在于, 所述第一传送线路设置在第一基板的一个面, 所述第二传送线路设置在第二基板的一个面。 The resonant coupler according to claim 1, wherein, in a surface of the first substrate, the second transmission line disposed on a surface of the second substrate of the first transmission line is provided.
3. 根据权利要求2所述的共振耦合器,其特征在于, 所述第一地电位布线设置在所述第一基板的另一面、或者对置于所述第一基板而设置的基板, 所述第一接地部通过第一通孔而与所述第一地电位布线连接, 所述第二地电位布线设置在所述第二基板的另一面、或者对置于所述第二基板而设置的基板, 所述第二接地部通过第二通孔而与所述第二地电位布线连接。 The resonant coupler according to claim 2, wherein said first ground potential wiring board disposed other surface of the first substrate, or disposed on the first substrate and disposed in, the said first portion is connected to ground through the first through hole and the first ground potential wiring, a ground potential of the second wiring disposed on the other surface of the second substrate, or disposed on the second substrate is provided the substrate, the second ground portion is connected to the second ground wiring through the second through hole.
4. 根据权利要求3所述的共振耦合器,其特征在于, 所述第一接地部经布线而与所述第一通孔连接, 所述第二接地部经布线而与所述第二通孔连接。 The resonant coupler according to claim 3, wherein the first ground wiring portion via said first through hole and connected to the second ground wiring portion via the second through the hole connection.
5. 根据权利要求3所述的共振耦合器,其特征在于, 所述第一通孔设置在所述第一共振布线的所述环绕形状的内侧, 所述第二通孔设置在所述第二共振布线的所述环绕形状的内侧。 The resonator coupling of claim 3, wherein said first through hole is provided in the surrounding inner shape of the first resonance line, the second through hole provided in the first the two resonance line shape surrounding the inside.
6. 根据权利要求2所述的共振耦合器,其特征在于, 所述第一地电位布线设置在所述第一基板的所述一个面的、所述第一共振布线、所述第一输入输出布线及所述第二输入输出布线的周边, 所述第二地电位布线设置在所述第二基板的所述一个面的、所述第二共振布线、所述第三输入输出布线及所述第四输入输出布线的周边。 6. A resonator according to claim 2 of the coupler, wherein the first ground wiring provided on the one surface of the first substrate, the first resonance line, the first input output line and the periphery of the second input-output wiring, a second wiring provided on the ground potential of the surface of a second substrate, the second resonance line, the third input and the output wirings said fourth peripheral input and output wiring.
7. 根据权利要求1所述的共振耦合器,其特征在于, 所述第一输入输出布线连接于距所述第一共振布线的一端的距离为相当于所述第一共振布线的布线长的8分之3长度的位置, 所述第二输入输出布线连接于距所述第一共振布线的所述一端的距离为相当于所述第一共振布线的布线长的8分之5长度的位置, 所述第三输入输出布线连接于距所述第二共振布线的一端的距离为相当于所述第二共振布线的布线长的8分之3长度的位置, 所述第四输入输出布线连接于距所述第二共振布线的所述一端的距离为相当于所述第二共振布线的布线长的8分之5长度的位置。 The resonant coupler according to claim 1, wherein said first input connected to the output wiring distance from the end of the first resonance line is a wiring corresponding to the wiring of the first resonant length from the end position of 3/8 length, said second input connected to the output line from the first resonant wiring length of the wiring to a position corresponding to 85 parts per length of the first resonance wirings , the third input connected to the output line of the distance from an end of the second resonant wiring length of the wiring to a position corresponding to 3/8 of the length of the second resonance line, the fourth input connected to output wiring the wiring length to the distance from the position of the second resonance line is equivalent to the one end of the second resonant wirings 85 parts per length.
8. 根据权利要求1所述的共振耦合器,其特征在于, 所述第一接地部设置在距所述第一共振布线的一端的距离为相当于所述第一共振布线的布线长的2分之1长度的位置, 所述第二接地部设置在距所述第二共振布线的一端的距离为相当于所述第二共振布线的布线长的2分之1长度的位置。 The resonant coupler according to claim 1, wherein the first ground portion provided at a distance from an end of the first resonance line is equivalent to the length of the first resonance line wirings 2 per bit length of the second ground portion is provided at an end of the second resonant distance from the wiring length of the wiring to a position corresponding to half the length of the second resonance line.
9. 根据权利要求1所述的共振耦合器,其特征在于, 所述第一传送线路与所述第二传送线路对置设置,使得所述第一共振布线与所述第二共振布线在垂直于所述第一平面的方向上的距离在所述高频信号的波长的2分之1以下。 9. A resonator according to claim 1 of the coupler, wherein the first transmission line and the second transmission line disposed opposite, such that the first resonance line and the second resonance line in the vertical distance in a direction to the first plane in the wavelength of the high frequency signal is one-half or less.
10. 根据权利要求1所述的共振耦合器,其特征在于, 所述环绕形状的轮廓为圆形状。 10. The resonator according to claim 1 of the coupler, characterized in that the contour shape surrounding a circular shape.
11. 根据权利要求1所述的共振耦合器,其特征在于, 所述环绕形状的轮廓为矩形。 11. The resonator according to claim 1 of the coupler, characterized in that the surrounding contour shape is rectangular.
12. 根据权利要求1所述的共振耦合器,其特征在于, 所述环绕形状为具有至少5处以上的弯曲部的形状。 12. The resonator according to claim 1 of the coupler, wherein, said shape having a shape surrounding at least more than 5 at the bent portion.
13. -种共振耦合器,在第一传送线路与第二传送线路之间以非接触方式传送高频信号,其特征在于, 具备: 所述第一传送线路,在第一平面上具备第一共振布线和第一输入输出布线群,所述第一共振布线是布线的一部分通过开放部而被开放的环绕形状的布线,所述第一输入输出布线群是连接于所述第一共振布线的η个布线群,η是3以上的整数;以及所述第二传送线路,在与所述第一平面对置的第二平面上具备第二共振布线和第二输入输出布线群,所述第二共振布线是布线宽度及形状与所述第一共振布线的布线宽度及形状相同的布线,所述第二输入输出布线群是连接于所述第二共振布线的η个布线群, 所述第一共振布线上的、在连接所述第一输入输出布线群的连接部位与和所述连接部位相邻的连接所述第一输入输出布线群的连接部位之间设置的η-1处 13. - types of resonant coupler, high frequency signals transmitted in a contactless manner between the first transmission line and the second transmission line, characterized by comprising: a first transmission line, comprising a first plane in a first a first input and output resonant wiring group of wirings, said first wiring is a resonance portion through the open portion of the wiring is open around the shape of the wiring, the first input-output wiring is connected to the first group of resonance wirings [eta] wirings group, [eta] is an integer of 3; and the second transmission line includes a second input and a second output resonant wiring group of wirings on a second plane opposed to said first plane, said first two resonance wiring is a wiring width and shape of the wiring width and the wiring of the same shape as the first resonance line, the second input-output wirings is connected to the second group of wirings η a resonant wiring groups, the first , η-1 is provided in the connecting portion between the connecting portion connecting the first input and output wiring group and said connecting portion adjacent to a first input is connected to the output of the group of wirings on a resonant wiring 接地部连接于第一地电位布线,该第一地电位布线表示所述第一传送线路内的所述高频信号的基准电位, 所述第二共振布线上的、在连接所述第二输入输出布线群的连接部位与和所述连接部位相邻的连接所述第二输入输出布线群的连接部位之间设置的η-1处接地部连接于第二地电位布线,该第二地电位布线表示所述第二传送线路内的所述高频信号的基准电位, 所述第一传送线路与所述第二传送线路对置设置,使得在从垂直于所述第一平面的方向观察的情况下,所述第一共振布线的轮廓与所述第二共振布线的轮廓一致,并且所述第一共振布线与所述第二共振布线成点对称的关系。 A ground portion connected to the first ground potential wiring, the first wiring represents the ground reference potential of the high-frequency signal in the first transmission line, connected to the second input on the second resonant wiring η-1 is grounded at the connection portion is provided between a connecting point of said second group of wirings connected to output input portion and an output wiring group and the adjacent connecting portion connected to the second ground wiring, the second ground said reference potential line represents the high frequency signal in the second transmission line, the first transmission line and the second transmission line disposed opposite, so that the first plane as viewed in a direction perpendicular to case, consistent with the contours of the first resonance line and the second resonance line, and the first resonance line and the second resonance point symmetric relationship wiring.
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