CN103397756A - Heat-insulation wallboard - Google Patents
Heat-insulation wallboard Download PDFInfo
- Publication number
- CN103397756A CN103397756A CN2013103235729A CN201310323572A CN103397756A CN 103397756 A CN103397756 A CN 103397756A CN 2013103235729 A CN2013103235729 A CN 2013103235729A CN 201310323572 A CN201310323572 A CN 201310323572A CN 103397756 A CN103397756 A CN 103397756A
- Authority
- CN
- China
- Prior art keywords
- heat
- insulation wallboard
- ceramic board
- hook
- wall plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009413 insulation Methods 0.000 title claims abstract description 26
- 239000000919 ceramic Substances 0.000 claims abstract description 14
- 239000004814 polyurethane Substances 0.000 claims description 14
- 238000005187 foaming Methods 0.000 claims description 11
- 239000010410 layer Substances 0.000 claims description 11
- 229920002635 polyurethane Polymers 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 229920005830 Polyurethane Foam Polymers 0.000 abstract 4
- 239000003795 chemical substances by application Substances 0.000 abstract 4
- 239000011496 polyurethane foam Substances 0.000 abstract 4
- 230000001681 protective effect Effects 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Landscapes
- Building Environments (AREA)
- Finishing Walls (AREA)
Abstract
The invention relates to a heat-insulation wallboard which comprises a polyurethane foam layer. A ceramic board is arranged on the upper surface of the polyurethane foam layer, a protective film is connected to the lower surface of the polyurethane foam layer by an adhesion agent layer, and a hook is connected to the ceramic board by a back bolt. The heat-insulation wallboard has the advantages that the ceramic board is arranged on the surface of the heat-insulation wallboard, so that the heat-insulation wallboard is good in quality, stereoscopic impression and aesthetics; the hook is connected to the back of the ceramic board by the back bolt and brings convenience for mounting the heat-insulation wallboard; when the heat-insulation wallboard is mounted, the protective film is peeled off, the adhesion agent layer on the lower surface of the polyurethane foam layer is exposed, and then the heat-insulation wallboard can be conveniently adhered at a to-be-adhered position conveniently via the adhesion agent layer; as the ceramic board is heavy and the adhesion agent layer can drop easily after the heat-insulation wallboard is used for a period of time, the heat-insulation wallboard in an embodiment of the invention further is hung via the hook, and can be firmly mounted on the surface of a wall.
Description
Technical field
The present invention relates to a kind of heat-insulation wall plate.
Background technology
Heat-insulation wall plate has decoration, heat insulating functions, in the decorating inner and external walls field, is widely used.Traditional external wall insulation, in order to reach the effect of stone material, often arranges the true mineral varnish of one deck on the polyurethane foaming layer surface, however the comparatively complanation of this stone effect, and if want to present stereoeffect, this true mineral varnish can't reach.
Summary of the invention
The object of the invention is to: overcome the defect of above-mentioned prior art, propose a kind of heat-insulation wall plate.
In order to achieve the above object, a kind of heat-insulation wall plate that the present invention proposes, it is characterized in that: comprise polyurethane foaming layer, described polyurethane foaming layer upper surface is provided with ceramic wafer, and described polyurethane foaming layer soffit is connected with diaphragm by adhesive layer.
Heat-insulation wall plate of the present invention, further improve and be:
1, described ceramic wafer ties and is connected to hook by the back of the body.
2, described adhesive phase is the PU adhesive phase.
Heat-insulation wall plate of the present invention surface is ceramic wafer, and texture and third dimension are more arranged, and aesthetics is good, and the ceramic wafer back ties and be connected to hook by the back of the body, facilitates the installation of heat-insulation wall plate.
Description of drawings
The present invention is further illustrated below in conjunction with accompanying drawing.
Fig. 1 is heat-insulation wall plate structural representation of the present invention.
The specific embodiment
The present invention will be further described below in conjunction with the drawings and specific embodiments.
Be illustrated in figure 1 as heat-insulation wall plate of the present invention, comprise polyurethane foaming layer 1, polyurethane foaming layer 1 upper surface is provided with ceramic wafer 2, and polyurethane foaming layer 1 soffit is connected with diaphragm 4 by adhesive layer 3, and ceramic wafer 2 is connected with hook 6 by back of the body bolt 5.In this example, adhesive phase is the PU adhesive phase.
During installation, tear diaphragm 4 off, expose the adhesive layer 3 of polyurethane foaming layer 1 soffit, by adhesive layer 3, can stick on easily place to be pasted.Because ceramic wafer weight is larger, adhesive layer easily comes off in use for some time, so the heat-insulation wall plate of the present embodiment also hangs by hook, makes heat-insulation wall plate can firmly be arranged on surface of wall.
In addition to the implementation, the present invention can also have other embodiments.All employings are equal to the technical scheme of replacement or equivalent transformation formation, all drop on the protection domain of requirement of the present invention.
Claims (3)
1. heat-insulation wall plate, it is characterized in that: comprise polyurethane foaming layer, described polyurethane foaming layer upper surface is provided with ceramic wafer, and described polyurethane foaming layer soffit is connected with diaphragm by adhesive layer.
2. heat-insulation wall plate according to claim 1, it is characterized in that: described ceramic wafer ties and is connected to hook by the back of the body.
3. heat-insulation wall plate according to claim 2, it is characterized in that: described adhesive phase is the PU adhesive phase.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103235729A CN103397756A (en) | 2013-07-30 | 2013-07-30 | Heat-insulation wallboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103235729A CN103397756A (en) | 2013-07-30 | 2013-07-30 | Heat-insulation wallboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103397756A true CN103397756A (en) | 2013-11-20 |
Family
ID=49561451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013103235729A Pending CN103397756A (en) | 2013-07-30 | 2013-07-30 | Heat-insulation wallboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103397756A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10245934A (en) * | 1997-03-06 | 1998-09-14 | M D I:Kk | Panel for building |
| CN201047151Y (en) * | 2007-06-11 | 2008-04-16 | 林永飞 | Ceramic face brick polyurethane composite board |
| CN201386360Y (en) * | 2009-03-31 | 2010-01-20 | 常熟市装饰艺术研究所 | Interior and exterior wall insulation decorative board |
| CN201486073U (en) * | 2009-03-31 | 2010-05-26 | 伍少欢 | Thermal insulation composite section material |
| CN201665971U (en) * | 2009-12-15 | 2010-12-08 | 王云飞 | Ceramic polyurethane composite decorative sheet |
| CN201943294U (en) * | 2010-12-17 | 2011-08-24 | 上海亚士创能投资有限公司 | Heat insulation decorative composite plate |
| CN202866188U (en) * | 2012-09-25 | 2013-04-10 | 天津市艾迪聚氨酯工业有限公司 | Polyurethane heat insulation ceiling |
| CN202969815U (en) * | 2013-02-01 | 2013-06-05 | 鞍山师范学院 | Decorative sheet for integral shaping of indoor walls of building |
| CN203569824U (en) * | 2013-07-30 | 2014-04-30 | 苏州市世好建材新技术工程有限公司 | Thermal insulation wallboard |
-
2013
- 2013-07-30 CN CN2013103235729A patent/CN103397756A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10245934A (en) * | 1997-03-06 | 1998-09-14 | M D I:Kk | Panel for building |
| CN201047151Y (en) * | 2007-06-11 | 2008-04-16 | 林永飞 | Ceramic face brick polyurethane composite board |
| CN201386360Y (en) * | 2009-03-31 | 2010-01-20 | 常熟市装饰艺术研究所 | Interior and exterior wall insulation decorative board |
| CN201486073U (en) * | 2009-03-31 | 2010-05-26 | 伍少欢 | Thermal insulation composite section material |
| CN201665971U (en) * | 2009-12-15 | 2010-12-08 | 王云飞 | Ceramic polyurethane composite decorative sheet |
| CN201943294U (en) * | 2010-12-17 | 2011-08-24 | 上海亚士创能投资有限公司 | Heat insulation decorative composite plate |
| CN202866188U (en) * | 2012-09-25 | 2013-04-10 | 天津市艾迪聚氨酯工业有限公司 | Polyurethane heat insulation ceiling |
| CN202969815U (en) * | 2013-02-01 | 2013-06-05 | 鞍山师范学院 | Decorative sheet for integral shaping of indoor walls of building |
| CN203569824U (en) * | 2013-07-30 | 2014-04-30 | 苏州市世好建材新技术工程有限公司 | Thermal insulation wallboard |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131120 |