CN103379738A - Method for processing surface of printed circuit board - Google Patents

Method for processing surface of printed circuit board Download PDF

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Publication number
CN103379738A
CN103379738A CN2012101215675A CN201210121567A CN103379738A CN 103379738 A CN103379738 A CN 103379738A CN 2012101215675 A CN2012101215675 A CN 2012101215675A CN 201210121567 A CN201210121567 A CN 201210121567A CN 103379738 A CN103379738 A CN 103379738A
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circuit board
printed circuit
surface
method
polymer
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CN2012101215675A
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Chinese (zh)
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陈小芳
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镇江华扬信息科技有限公司
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Priority to CN2012101215675A priority Critical patent/CN103379738A/en
Publication of CN103379738A publication Critical patent/CN103379738A/en

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Abstract

The invention relates to a method for processing the surface of a printed circuit board. The method comprises the following steps that the surface of the printed circuit board is coated with polymethyl methacrylate solution, after the printed circuit board is dried, a polymer film is formed on the surface of the printed circuit board; before welding is carried out, the surface of the printed circuit board is irradiated through high-energy light beams so as to decompose polymer and expose a copper surface. Due to the adoption of the method, good welding performance is guaranteed, and meanwhile the printed circuit board can be roundly protected, service life of the printed circuit board can be prolonged, the cost is low, and the process is simple.

Description

一种印刷电路板的表面处理方法 The surface treatment method of a printed circuit board

技术领域 FIELD

[0001] 本发明涉及印刷电路板制作技术领域,特别涉及印刷电路板的表面处理方法。 [0001] Technical Field relates to the production of printed circuit boards, in particular surface treatment method of the present invention relates to a printed circuit board.

背景技术 Background technique

[0002] 对印刷电路板进行表面处理的目的是确保线路板无防焊油墨保护的铜表面在一定的保存期限内,具有良好的可焊接性。 [0002] The object of the printed circuit board surface treatment to ensure the protection circuit board without solder mask copper surface in a certain shelf life, having good weldability. 由于铜在空气中易形成氧化物,导致在后续的组装过程中,线路板的上锡性不良或者焊锡与线路板的结合力变差,对最终电子产品的性能造成巨大的影响,因此需要对铜面进行处理。 Since copper oxide easily formed in the air, resulting in a subsequent assembly process, failure of the circuit board on the tin or solder bonding strength deterioration of the circuit board, a huge impact on the electronic properties of the final product, it is necessary to copper surfaces processed. 目前常见的印刷电路板表面处理技术有热风整平、有机涂覆、化学镀镍/浸金和浸银等,这些表面处理技术都已经在印刷电路板生产中得到了长期的应用,工艺成熟,但也存在着一些问题,如热风整平技术虽然能够提供可焊性很高的涂层、使装配具有较大的工艺条件范围以及使线路板有更长的存储期;但其所需的工艺温度高、操作环境差,对印刷电路板的热冲强,而且铜面上的锡层厚度不均匀,平坦度差;化学镀镍/浸金和浸银可以提供良好的平坦度和接触性,但是需要使用贵重金属,成本较高,焊接时,金或银分散在焊接层中,容易造成焊点变脆(化学镀镍/浸金),焊点空洞(浸银)等不良缺点;使得元件与线路板的结合力变差;有机涂覆技术成本低,但后续焊接电子元件时,无法被助焊剂完全清洗掉而导致印刷电路板的焊接性不良。 Current common printed circuit board surface-treated with a hot air leveling technology, organic coating, electroless nickel / immersion gold and silver leaching, surface treatment techniques have long been used in the production of printed circuit boards, mature technology, However, there are some problems, such as hot air leveling technology, while providing high coating weldability, so that the assembly has a greater range of process conditions and causing the circuit board has a longer storage period; but the desired process high temperature, poor operating environment to heat the printed circuit board of the red intensity, and the uneven surface of the tin layer thickness of the copper, the flatness of the difference; electroless nickel / immersion gold, silver immersion may provide good flatness and contact, but requires the use of precious metals, the high cost, welding, gold or silver dispersed in the solder layer, the solder is likely to cause embrittlement (electroless nickel / immersion gold), solder voids (immersion silver) and other undesirable drawbacks; elements such that bonding force of the circuit board deteriorates; low-cost organic coating techniques, but the subsequent soldering of electronic components, can not be completely washed off the flux results in poor weldability and the printed circuit board. 以上表面处理技术存在的另一个重要问题是这些表面处理只针对铜表面,所形成的金、银或有机涂覆层只是在铜表面形成,不能覆盖印刷电路板其它部分,如防焊油墨。 Another important problem of the above surface treatment technology is gold, silver or organic coating surface treatment only for the surface of copper, is formed formed only on the copper surface, not to cover other portions of the printed circuit board, such as solder mask. 实际生产时,在铜面和防焊油墨接触的界面往往不能形成连续、完整的表面处理保护层,使得水分及空气中的酸气等可以攻击该界面,从而导致铜面的腐蚀等,降低了印刷电路板的可焊性以及耐腐蚀性,缩短了印刷电路板的保存期限。 Actual production, often can not be formed on the copper surface and a solder mask interface contact continuous, unbroken surface treatment protective layer, such that moisture and the like in the air can attack the acid gas interface, leading to corrosion of the copper surface, etc., is reduced the printed circuit board weldability, and corrosion resistance, shorten the shelf life of the printed circuit board.

发明内容 SUMMARY

[0003] 因此,有必要提供一种印刷电路板的表面处理技术,其平坦度高,同时能够对印刷电路板进行整体的保护,从而能够延长印刷电路板的保存期限,而且在后续焊接电子元件时,是铜表面与焊料直接接触,保证焊点的可靠性。 [0003] Accordingly, it is necessary to provide a surface treatment technique of a printed circuit board, which has high flatness, it can be performed while the overall protection of the printed circuit board, it is possible to extend the shelf life of the printed circuit board, and in the subsequent soldering of electronic components , the copper surface is in direct contact with the solder, the solder joint reliability.

[0004] 下面将以实施例说明一种印刷电路板的表面处理方法 [0004] Example embodiments will be described below surface processing method of a printed circuit board

一种印刷电路板的表面处理方法,其包括以下步骤:将聚甲基丙烯酸甲酯的溶液涂布于印刷电路板表面,烘干后,在印刷电路板表面形成聚合物膜;焊接前,用高能光束对印刷电路板表面进行照射,使聚合物分解,以使铜面露出。 The surface treatment method of a printed circuit board, comprising the steps of: applying a solution of polymethyl methacrylate in the surface of the printed circuit board, after drying, the polymer film is formed on the surface of the printed circuit board; before welding, with high energy beam for irradiating the surface of the printed circuit board, so that decomposition of the polymer, so that the copper surface is exposed.

[0005] 与现有技术相比,该印刷电路板的表面处理技术在保证良好的可焊接性的同时,能够对印刷电路板进行全面的保护,提高其保存期限,而且成本低廉,工艺简单。 [0005] Compared with the prior art, surface treatment of the printed circuit board at the same time ensure good weldability, on the printed circuit board can be fully protected, improved shelf life, and low cost, simple process.

[0006]附图说明 [0006] BRIEF DESCRIPTION OF DRAWINGS

[0007] 图1是本技术方案实施例提供的印刷电路板的结构示意图。 [0007] FIG. 1 is a schematic view of a printed circuit board according to the technical solution provided in the present embodiment. [0008] 图2是图1印刷电路板表面进彳丁表面处理后的结构不意图。 [0008] FIG. 2 is a diagram showing a structure of a printed circuit board into the rear surface of the left foot butoxy surface treatment is not intended.

[0009] 图3是是图2印刷电路板表面进行闻能光福照后的结构不意图。 [0009] FIG. 3 is a surface of a printed circuit board 2 in FIG structured light after the smell can not fu as intended.

[0010] 具体实施方式 [0010] DETAILED DESCRIPTION

[0011] 下面将结合附图及实施例对本技术方案实施例提供的一种印刷电路板的表面处理方法作进一步详细说明 [0011] The accompanying drawings and the following embodiments of the present technical solution of the surface treatment method of a printed circuit board provided in the embodiments described in further detail

本实施例提供的一种印刷电路板的表面处理方法,包括以下步骤: The surface treatment method of a printed circuit board provided in the present embodiment, comprising the steps of:

第一步,请参阅图1及图2,将聚甲基丙烯酸甲酯的溶液涂布于印刷电路板100表面,烘干后,在印刷电路板表面形成聚合物膜层200 ; The first step, see FIG. 1 and FIG. 2, the polymethyl methacrylate was applied to the surface of the printed circuit board 100, after drying, the polymer film layer 200 is formed on the surface of the printed circuit board;

如图1所示,本实施例中,印刷电路板100为需要进行表面处理的电路板,可以为硬质电路板,多层电路板,软性电路板等,本实施例中,印刷电路板为硬质电路板 1, in this embodiment, the printed circuit board 100 to circuit board surface needs to be treated, and the like may be a hard circuit board, a multilayer circuit board, flexible circuit boards, for example, the printed circuit board according to the present embodiment a hard circuit board

在对印刷电路板100进行表面处理之前,可以通过微蚀、火山灰处理等方式对印刷电路板进行清洁,尤其是露铜区110,要求露铜区110无脏物、油脂和铜氧化物,同时具有一定的粗糙度,粗糙度Ra范围为0.1微米〜1.0微米,优选地,粗糙度Ra范围为0.2微米〜0.5微米。 Before the printed circuit board 100 surface treatment can be carried out by micro-etching, ash handling, etc. on a printed circuit board cleaning, especially copper exposure area 110, exposed copper region 110 requires no dirt, grease and copper oxides, while having a certain roughness, the roughness Ra in the range of 0.1 microns ~1.0 microns, preferably in the range of roughness Ra of 0.2 m ~ 0.5 [mu] m.

[0012] 如图2所示,在印刷电路板100的表面,形成聚合物膜200层。 [0012] As shown in FIG 2, the surface of the printed circuit board 100, 200 form a polymer film layer. 具体地,将聚甲基丙烯酸甲酯的溶液涂布于印刷电路板100表面,烘干后在印刷电路板表面形成聚合物膜200。 Specifically, the coating solution of polymethyl methacrylate in the surface of the printed circuit board 100, the dried polymer film 200 is formed in the surface of the printed circuit board.

[0013] 本实施例中,采用的聚合物为聚甲基丙烯酸甲酯。 [0013] In this embodiment, the polymer employed is polymethyl methacrylate. 聚合物的分子量范围为1000至1000000,优选地,聚合物的分子量范围为10000至50000。 Molecular weight range of the polymer is 1000 to 1000000, preferably a molecular weight range of the polymer is from 10,000 to 50,000. 所用溶剂为丙酮、氯仿、二氯甲烷、四氢呋喃、二甲基甲酰胺等等有机溶剂,可以为单一溶剂,也可以使用多种溶剂的混合物,可以根据涂布方法的需要而选择溶剂;聚合物的浓度范围可为质量百分比1%至50% ;涂布的方法可以采用浸泡的方式,也可以是旋涂、喷涂、辊涂、帘涂等各种方式,优选为浸泡的方式,溶液浓度为质量百分比2%至40%,浸泡时间10秒到5分钟。 The acetone, chloroform, dichloromethane, tetrahydrofuran, dimethylformamide and the like organic solvent, may be a single solvent, a mixture of various solvents may also be used with a solvent, the solvent can be selected according to the required coating method; polymer the percentage concentration range of 1-50% by mass; immersion coating method can be employed the way, may be spin coating, spray coating, roll coating, curtain coating and other means, preferably a soaking mode, concentration of the solution mass percentage 2-40%, soaking time of 10 seconds to 5 minutes. 浸泡时所选的溶液浓度与浸泡时间与最终形成的聚合物膜厚度相关。 Associated with the selected concentration of the solution and the immersion time of forming the polymer film thickness of the final soaking. 聚合物膜厚度要求为5微米至1000微米,优选地,5微米至50微米。 The thickness of the polymer film of claim 5 to 1000 microns, preferably 5 to 50 microns.

[0014] 涂布有聚合物溶液的印刷电路板经过烘烤,在印刷电路板表面形成聚合物膜层200。 [0014] The polymer solution is coated after baking the printed circuit board, a polymer layer 200 is formed in the surface of the printed circuit board. 烘干的方式不限,可以采用烘箱烘烤或热风烘烤等方式实现,烘干温度和时间与所选用的溶剂以及涂布的方式有关,烘干温度应在50摄氏度到120摄氏度之间,优选为50摄氏度至80摄氏度,加热的时间为I分钟到半个小时之间。 Drying is not limited, may be employed air baking oven baking or the like manner, the drying temperature and time chosen solvent and a coating related to the way, the drying temperature should be between 50 degrees Celsius to 120 degrees Celsius, preferably from 50 degrees Celsius to 80 degrees Celsius, the heating time was I minute to between half an hour. 实际操作中,可以根据实际情况的需要,对烘干时间以及烘干温度进行调节。 In practice, according to actual needs, on the drying time and the drying temperature can be adjusted. 由于印刷电路板的材质主要为有机材料,烘干的温度不得高于其玻璃化转变温度。 Since the main material of the printed circuit board is an organic material, the drying temperature not higher than its glass transition temperature.

[0015] 以上,完成了印刷电路板的表面处理。 [0015] or more, the surface treatment is completed printed circuit board.

[0016] 第二步为经过表面处理后的印刷电路板在后续焊接电子元件的步骤,请参阅图2及图3,焊接前,用高能光束对印刷电路板表面进行照射,使聚合物分解,以使铜面露出。 [0016] The second step is through the printed circuit board after the surface treatment in the subsequent step of soldering electronic components, see FIG. 2 and FIG. 3, before welding, with a high energy beam is irradiated on the surface of the printed circuit board, so that decomposition of the polymer, in the copper surface is exposed.

[0017] 该高能光束可以为紫外光,激光,Y射线等。 [0017] The energy beam may be ultraviolet light, the laser, Y-rays. 本实施例中,选用紫外光辐照。 In this embodiment, the selection of UV radiation. 由于紫外光可以使聚甲基丙烯酸甲酯发生分解反应,聚合物链加速断开,形成聚合物的片段。 Since ultraviolet light can be made of polymethyl methacrylate decomposition reaction, accelerated opening polymer chain, segments of the polymer formed. 该聚合物片段失去了与印刷电路板的附着性,在抽气、吹气或吸真空的条件下,聚合物片段从印刷电路板表面脱离,从而使原覆盖于聚合物膜下的铜表面暴露出来,为后续的焊接提供新鲜、无氧化、无脏物、无油污等干净的铜表面。 The polymer fragment loses adhesion to the printed circuit board under suction, blowing or sucking vacuum conditions, polymer segments from the surface of the printed circuit board, so that the original polymer film covering the exposed copper surfaces out fresh for subsequent welding, no oxidation, no dirt, oil-free and clean copper surface and the like.

[0018] 优选地,紫外光波长为220纳米至450纳米之间,以240纳米至380纳米之间为优;辐照能量为IX IO2微瓦/平方厘米至4X IO5微瓦/平方厘米,优选为4X IO3微瓦/平方厘米至4X IO5微瓦/平方厘米;辐照时间为I分钟至20分钟之间。 [0018] Preferably, ultraviolet light having a wavelength of between 220 nanometers to 450 nanometers, between 240 nanometers to 380 nanometers, preferably to; radiation energy IX IO2 microwatts / cm2 to 4X IO5 microwatts / cm, preferably to 4X IO3 microwatts / cm2 to 4X IO5 microwatts / cm; irradiation time of between I to 20 minutes. 实际操作中,可以根据实际情况的需要,对辐照能量和辐照时间进行调节。 In practice, according to actual needs, the irradiation energy and irradiation time of adjustment. 辐照能量越高,分解聚合物所需的时间就越少。 The higher the irradiated energy, the less time required for decomposition of the polymer.

[0019] 至此,完成了印刷电路板的表面处理以及后续在焊接电子元件时,将该表面处理去掉的工作。 [0019] This completes the surface treatment of printed circuit boards and the work during subsequent soldering of electronic components, the surface treatment removed. 该表面处理方法,用聚合物膜将电路板全面覆盖,不但对铜面进行了保护,同时也覆盖于印刷电路板的其它部分,所形成聚合物膜层连续无孔洞,空气中的湿气以及酸气不容易穿透该聚合物层而到达印刷电路板表面,从而为对印刷电路板进行全面的保护,提高其保存期限,而且保证了铜表面不被氧化以及其他物质所沾物;在后续焊接电子元件时,该聚合物层可以通过高能光辐照的方式被分解掉,避免了如有机涂覆技术存在有机物残留而导致印刷电路板的焊接性不良等缺陷;另外,该印刷电路板的表面处理方式简单,成本低廉,适用于所有的印刷电路板产品 The surface treatment method, a polymer film with a circuit board full coverage, not only on the copper surface is protected, but also covers other portions of the printed circuit board, the polymeric film layer to form a continuous void-free, moisture in the air, and acid gas does not readily penetrate the polymer layer to reach the surface of the printed circuit board, such as printed circuit boards for complete protection, improved shelf life, and to ensure that the copper surface from oxidation and other substances stick thereof; in a subsequent when soldering electronic components, the polymer layer may be broken down by way of high-energy light irradiation to avoid the presence of organic residues such as the organic coating technique results in poor weldability defects such as a printed circuit board; Further, the printed circuit board simple surface treatment, low cost, for all printed circuit board products

可以理解的是,对于本领域的普通技术人员来说,可以根据本发明的技术构思做出其它各种相应的改变与变形,而所有这些改变与变形都应属于本发明权利要求的保护范围。 It will be appreciated that those of ordinary skill in the art, that various other changes and modification in accordance with the respective technical concept of the present invention, and all such changes and modifications should fall into the scope of the claims of the invention.

Claims (7)

1.一种印刷电路板的表面处理方法,其包括以下步骤: 将聚甲基丙烯酸甲酯的溶液涂布于印刷电路板表面,烘干后,在印刷电路板表面形成聚合物膜; 焊接前,用高能光束对印刷电路板表面进行照射,使聚合物分解,以使铜面露出。 1. A surface processing method for a printed circuit board, comprising the steps of: applying a solution of polymethyl methacrylate in the surface of the printed circuit board, after drying, the polymer film is formed on the surface of the printed circuit board; before welding , irradiating the surface of the printed circuit board with a high energy beam, so that decomposition of the polymer, so that the copper surface is exposed.
2.如权利要求1所述的印刷电路板的表面处理方法,其特征在于,所述聚合物为聚甲基丙烯酸甲酯,分子量为1000至1000000。 2. The method of processing a surface of a printed circuit board according to claim, wherein said polymer is a polymethyl methacrylate, a molecular weight of 1,000 to 1,000,000.
3.如权利要求1所述的印刷电路板的表面处理方法,其特征在于,所述的涂布方法为浸泡、旋涂、喷涂、辊涂、帘涂等方式。 The surface treatment method of a printed circuit board as claimed in claim 3, wherein the coating method is immersion, spin coating, spray coating, roll coating, curtain coating or the like.
4.如权利要求1所述的印刷电路板的表面处理方法,其特征在于,所形成的聚合物膜层厚度为5微米至1000微米。 4. The surface treatment method according to claim 1 of a printed circuit board, characterized in that the thickness of the polymer film formed is 5 to 1000 microns.
5.如权利要求1所述的印刷电路板的表面处理方法,其特征在于用高能光对印刷电路板表面进行辐照。 5. The surface treatment method of the printed circuit board of claim, characterized in that the optical surface of the printed circuit board is irradiated with high energy.
6.如权利要求5所述的印刷电路板的表面处理方法,其特征在于用紫外光对印刷电路板表面进行辐照。 5 is a surface treatment method of the printed circuit board as claimed in claim 6, characterized in that the irradiation of ultraviolet light with the surface of the printed circuit board.
7.如权利要求6所述的印刷电路板的表面处理方法,其特征在于紫外光波长为220纳米至450纳米。 7. The method of processing a surface of the printed circuit board of claim 6, characterized in that ultraviolet light having a wavelength of 220 to 450 nm.
CN2012101215675A 2012-04-24 2012-04-24 Method for processing surface of printed circuit board CN103379738A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080311406A1 (en) * 2005-12-06 2008-12-18 Arkema France (Ligno) Cellulose Material Board Coated with a Pmma and Pvdf-Based film
CN101682998A (en) * 2007-02-19 2010-03-24 克龙比123有限公司 Printed circuit boards
CN102212240A (en) * 2010-04-02 2011-10-12 素塔电子科技(上海)有限公司 Printed circuit board protective film and using method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080311406A1 (en) * 2005-12-06 2008-12-18 Arkema France (Ligno) Cellulose Material Board Coated with a Pmma and Pvdf-Based film
CN101682998A (en) * 2007-02-19 2010-03-24 克龙比123有限公司 Printed circuit boards
CN102212240A (en) * 2010-04-02 2011-10-12 素塔电子科技(上海)有限公司 Printed circuit board protective film and using method thereof

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