CN103364671A - Full-automatic IC (Integrated Circuit) and LED (Light Emitting Diode) testing integrated system - Google Patents

Full-automatic IC (Integrated Circuit) and LED (Light Emitting Diode) testing integrated system Download PDF

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Publication number
CN103364671A
CN103364671A CN2013103394227A CN201310339422A CN103364671A CN 103364671 A CN103364671 A CN 103364671A CN 2013103394227 A CN2013103394227 A CN 2013103394227A CN 201310339422 A CN201310339422 A CN 201310339422A CN 103364671 A CN103364671 A CN 103364671A
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China
Prior art keywords
automatic
led
full
wafer
test
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Pending
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CN2013103394227A
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Chinese (zh)
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丁天翔
曹学兵
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SUZHOU JIZHIDA ELECTRONIC TECHNOLOGY Co Ltd
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SUZHOU JIZHIDA ELECTRONIC TECHNOLOGY Co Ltd
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Priority to CN2013103394227A priority Critical patent/CN103364671A/en
Publication of CN103364671A publication Critical patent/CN103364671A/en
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Abstract

The invention provides a full-automatic IC (Integrated Circuit) and LED (Light Emitting Diode) testing integrated system. The full-automatic IC and LED testing integrated system comprises a probe platform module and a tester module, wherein the probe platform module comprises a chip box lifting mechanism used for conveying a wafer, a chip bearing mechanism used for moving the wafer to a testing position, and a chip feeding mechanism used for transmitting the wafer from the chip box lifting mechanism to the chip bearing mechanism; the tester module comprises a probe card and a tester which are connected; the probe card is matched with the chip bearing mechanism and is arranged above the wafer bearing mechanism; the tester is connected with the chip bearing mechanism; the chip bearing mechanism also comprises a chip bearing platform, a first power device and a second power device; the first power device is used for linearly driving the chip bearing platform; and the second power device is used for rotatably driving the chip bearing platform. According to the technical scheme, a probe platform and the tester are integrated, so that the performance and efficiency of a probe testing platform are improved, the cost is saved, and the expenses are decreased.

Description

The test integrated system of full-automatic IC and LED
Technical field
The invention belongs to industrial automation and make the field, relate to a kind of test macro, relate in particular to the test integrated system of a kind of full-automatic IC and LED.
Background technology
The present both at home and abroad IC(integrated circuit produced of semiconductor-equipment maker) and the LED(light emitting diode) test macro, comprise full-automatic probe test platform and IC and LED test machine, carry out data transmission by the Special industrial communication modes each other.
Mostly full-automatic probe station is realized high-precision workbench with servomotor and guide rail leading screw at present both at home and abroad.Rotating mechanism is realized by the worm and gear technology.The testing efficiency of probe test platform is lower.In addition, probe station and test machine divide and are arranged, and exist in the data transmission procedure and disturb, and have affected the degree of accuracy of test data.
Summary of the invention
In view of above-mentioned the problems of the prior art, the present invention has promoted performance and the efficient of probe test platform by probe station and test machine are combined, and saves simultaneously cost, the spending of minimizing fund.
For achieving the above object, concrete technical scheme is as follows:
The test integrated system of a kind of full-automatic IC and LED, comprise probe station module and test machine module, described probe station module comprises the film magazine elevating mechanism of carrying wafer, mobile wafer holds sheet mechanism and wafer is passed to upper slice mechanism of holding sheet mechanism by described film magazine elevating mechanism to test position, described test machine module comprises continuous exploration card and test machine, described exploration card cooperates and places described top of holding sheet mechanism with the described sheet mechanism of holding, described test machine links to each other with the described sheet mechanism of holding, described holding also comprises wafer-supporting platform in the sheet mechanism, the first propulsion system and the second propulsion system, the described wafer-supporting platform of described the first propulsion system linear drives, the described wafer-supporting platform of described the second propulsion system rotary actuation.
Preferably, described the first propulsion system are linear electric motors, and described the second propulsion system are direct-drive motor.
Preferably, also comprise the webserver, the described webserver links to each other with described test machine by the internet.
Preferably, comprise that also marble is dull and stereotyped, the described sheet mechanism of holding places on the described marble flat board.
Preferably, the described sheet mechanism of holding also comprises guide rail and grating scale.
Preferably, described film magazine elevating mechanism also comprises position transducer.
Preferably, described film magazine elevating mechanism also comprises warning horn.
Preferably, described warning horn comprises warning light.
Preferably, described upper slice mechanism also comprises mechanical arm, and described mechanical arm can rotate around described upper slice mechanism.
Preferably, also comprise frame, described probe station module and test machine module are located on the described frame.
The advantage of technical scheme of the present invention has:
Form worktable by linear electric motors, high precision guide rail and grating scale, improve precision;
To wafer-supporting platform mechanism, change former worm-and-wheel gear into accurate location that DDR motor (direct-drive motor) is realized the θ direction.Can accurately capture " target " during auto-alignment;
Simultaneously, for guaranteeing precision and rigid demand, this worktable is fixed on the marble flat board, can slows down the interference of external environment;
In addition, by " cloud " processing mode the DCO result of the circuit on the wafer is stored in server by " cloud " technology, makes things convenient for IC design side, manufacturing side to carry out data check, be convenient to carry out technique and promote.
Description of drawings
The accompanying drawing that consists of a part of the present invention is used to provide a further understanding of the present invention, and illustrative examples of the present invention and explanation thereof are used for explaining the present invention, do not consist of improper restriction of the present invention.In the accompanying drawings:
Fig. 1 is the structural representation of embodiments of the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
Need to prove that in the situation of not conflicting, embodiment and the feature among the embodiment among the present invention can make up mutually.
Below with reference to accompanying drawing embodiments of the invention are done concrete explaination.
The test integrated system of the full-automatic IC of embodiments of the invention as shown in fig. 1 and LED comprises probe station module and test machine module.
The probe station module comprises the film magazine elevating mechanism 1 of carrying wafer, mobile wafer holding sheet mechanism 2 and wafer is passed to upper slice mechanism 3 of holding sheet mechanism 2 by film magazine elevating mechanism 1 to test position.
The test machine module comprises continuous exploration card 4 and test machine 5.Exploration card 4 with hold sheet mechanism 2 and cooperate and place the top of holding sheet mechanism 2.Test machine 5 with hold sheet mechanism 2 and link to each other.
Hold and also comprise wafer-supporting platform, the first propulsion system and the second propulsion system in the sheet mechanism 2, the first propulsion system linear drives wafer-supporting platform, the second propulsion system rotary actuation wafer-supporting platform.Preferred the first propulsion system are linear electric motors, and the second propulsion system are direct-drive motor.
In addition, also comprise the webserver, the webserver links to each other with test machine 7 by the internet, i.e. " cloud " processing mode.Also comprise frame, probe station module and test machine module are located on the frame.
Embodiments of the invention have promoted performance and the efficient of probe test platform by probe station and test machine are combined, and save simultaneously cost, the spending of minimizing fund.The production efficiency of product can either be improved, the yield rate of product can be improved again.The many kinds of parameters that can real-time online detects circuit on the wafer, carry out sorting, classification according to user's request, the classification that same batch of wafer is divided into automatically several different qualities or different process definition, promote the overall value of product for IC manufacturing enterprise, used enterprise to reduce production cost for IC.
In embodiments of the invention work, as shown in fig. 1, the film magazine that wafer is housed is placed on the film magazine elevating mechanism 1.Move down by the motor driving on the film magazine elevating mechanism 1, until the correspondence position sensor stops when having detected wafer.The mechanical arm 6 of right back lab mechanism 3 is lived wafer by vacuum suction, by taking out wafer in upper slice mechanism 3 film magazine from the film magazine elevating mechanism 1, and moves to a position.Wafer is placed on the wafer-supporting platform that holds sheet mechanism 2 by rotatablely moving by mechanical arm 6.Begin scanning after substrate is attracted on the wafer-supporting platform that holds sheet mechanism 2 and carry out the image automatic identification alignment work.After finishing alignment work, hold sheet mechanism 2 and carry out plane motion according to setting track, the circuit position on every wafer holds sheet mechanism 2 according to the lifting value lifting that arranges in the software, make pin and the complete close contact of the circuit on the wafer on the exploration card 4, signal to test machine 5.Test machine 5 begins to carry out DATA REASONING.After measuring end, test machine 5 signals to and holds sheet mechanism 2, holds sheet mechanism 2 and descends, and then test table is gone to next circuit position.Repeat thing just now.Finish the test of finishing to circuit.
In the scanning motion process, mechanical arm 6 runs to film magazine elevating mechanism 1 and gets the sheet position in drive and self rotation of upper mechanism 3.Film magazine elevating mechanism 1 descends, until the correspondence position sensor stops after having detected substrate, then mechanical arm 6 repeats above-mentioned action and runs to a position, waits END instruction to be detected.Receiving then rotation on the lower arm that the substrate that tests is adsorbed on after detecting the instruction (this moment, substrate ran to the relevant position by upper slice mechanism 3) finish mechanical arm 6, new film on upper slice arm of mechanical arm 6 is delivered to simultaneously to be held in the sheet mechanism 2, finishes handshaking.
After finishing handshaking, machine begins scanning work, hold sheet mechanism 2 and carry out plane motion according to setting track, pin on the exploration card 4 is by holding 2 liftings of sheet mechanism, circuit on the wafer is fully contacted with pin on the exploration card 4, send detection signal then for test machine 5,5 pairs of circuit of test machine carry out the surveying work of electrical quantity.After measuring end, test machine 5 informs that test finishes.Hold sheet mechanism 2 and descend, test table continues mobile.And test result is stored.After the full wafer wafer sort finished, mechanical arm 6 was put the wafer that tests the film magazine of appointment in drive and self rotation of upper mechanism 3, and then ran to that the film magazine place repeats above-mentioned action until wafer is delivered to delivery position waits for.
By above-mentioned motion, until after all wafer sorts were finished in the upper film magazine, alarm 7 can be reported to the police, simultaneously the blinking red lamp of the alarm lamp of alarm 7.By operating personnel empty film magazine is taken off and places the film magazine that the wafer of not testing is housed, the equipment follow-on test, when filling the substrate of finishing test, alarm 7 can be reported to the police blinking red lamp.By operating personnel this film magazine is taken off, and place empty film magazine.
During warning, blinking red lamp is eliminated warning by " cancellation " button on the push panel.
Because the singularity of wafer, in order to reduce pollution, whole material loading, testing process are robotization control entirely simultaneously.The auto-alignment identifying need not manual intervention, can automatically finish.Test machine according to the requirement of IC design, carries out respectively detailed measurement to each parameter of circuit in test process.
The software systems of native system comprise two parts, need 2 industrial computers to realize respectively.Be defined as probe station module controls system and test machine module software system.Probe station module controls system finishes the automatic upper and lower film, image recognition auto-alignment of wafer, accurate location etc.Each circuit distributing position on the wafer that test machine module software system sends according to the probe station module, building database is stored each circuit parameter.And the threshold values that arranges according to the user judges whether certified products.Simultaneously, utilize computing machine " cloud " technology, related data is kept at the webserver, convenient design side and manufacturing side carry out Data Spot-checking.In addition, the embodiments of the invention operational efficiency is high, and product is not polluted.
More than specific embodiments of the invention are described in detail, but it is just as example, the present invention is not restricted to specific embodiment described above.To those skilled in the art, any equivalent modifications that the present invention is carried out and substituting also all among category of the present invention.Therefore, not breaking away from impartial conversion and the modification of doing under the spirit and scope of the present invention, all should contain within the scope of the invention.

Claims (10)

1. a full-automatic IC and the test integrated system of LED, it is characterized in that, comprise probe station module and test machine module, described probe station module comprises the film magazine elevating mechanism of carrying wafer, mobile wafer holds sheet mechanism and wafer is passed to upper slice mechanism of holding sheet mechanism by described film magazine elevating mechanism to test position, described test machine module comprises continuous exploration card and test machine, described exploration card cooperates and places described top of holding sheet mechanism with the described sheet mechanism of holding, described test machine links to each other with the described sheet mechanism of holding, described holding also comprises wafer-supporting platform in the sheet mechanism, the first propulsion system and the second propulsion system, the described wafer-supporting platform of described the first propulsion system linear drives, the described wafer-supporting platform of described the second propulsion system rotary actuation.
2. the test integrated system of full-automatic IC as claimed in claim 1 and LED is characterized in that, described the first propulsion system are linear electric motors, and described the second propulsion system are direct-drive motor.
3. the test integrated system of full-automatic IC as claimed in claim 2 and LED is characterized in that, also comprises the webserver, and the described webserver links to each other with described test machine by the internet.
4. the test integrated system of full-automatic IC as claimed in claim 3 and LED is characterized in that, comprises that also marble is dull and stereotyped, and the described sheet mechanism of holding places on the described marble flat board.
5. the test integrated system of full-automatic IC as claimed in claim 4 and LED is characterized in that, the described sheet mechanism of holding also comprises guide rail and grating scale.
6. the test integrated system of full-automatic IC as claimed in claim 5 and LED is characterized in that, described film magazine elevating mechanism also comprises position transducer.
7. the test integrated system of full-automatic IC as claimed in claim 6 and LED is characterized in that, described film magazine elevating mechanism also comprises warning horn.
8. the test integrated system of full-automatic IC as claimed in claim 7 and LED is characterized in that, described warning horn comprises warning light.
9. the test integrated system of full-automatic IC as claimed in claim 8 and LED is characterized in that, described upper slice mechanism also comprises mechanical arm, and described mechanical arm can rotate around described upper slice mechanism.
10. the test integrated system of full-automatic IC as claimed in claim 9 and LED is characterized in that, also comprises frame, and described probe station module and test machine module are located on the described frame.
CN2013103394227A 2013-08-06 2013-08-06 Full-automatic IC (Integrated Circuit) and LED (Light Emitting Diode) testing integrated system Pending CN103364671A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104502828A (en) * 2014-12-31 2015-04-08 华中科技大学 Flip LED (light emitting diode) chip on-line detecting method
CN105467250A (en) * 2015-12-22 2016-04-06 东莞光智通讯科技有限公司 Optical device automatic test apparatus
CN109142940A (en) * 2018-10-24 2019-01-04 江苏迅弘科技有限公司 A kind of full-automatic LED display screen tester
CN110412440A (en) * 2019-06-24 2019-11-05 深圳市森美协尔科技有限公司 A kind of full-automatic wafer probe station and full-automatic wafer test equipment

Citations (6)

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Publication number Priority date Publication date Assignee Title
US6027301A (en) * 1996-10-04 2000-02-22 Samsung Electronics Co., Ltd. Semiconductor wafer testing apparatus with a combined wafer alignment/wafer recognition station
CN101619965A (en) * 2009-08-14 2010-01-06 北京领邦仪器技术有限公司 Wheel-pair automatic measuring device
CN102288119A (en) * 2011-06-27 2011-12-21 上海卓晶半导体科技有限公司 Device for automatically detecting flatness and thickness of substrates and separating substrates
CN102288138A (en) * 2011-06-27 2011-12-21 上海卓晶半导体科技有限公司 Equipment for automatically testing semiconductor substrate
CN202230986U (en) * 2011-07-26 2012-05-23 上海卓晶半导体科技有限公司 Split transmission structure for six substrate boxes
CN203414540U (en) * 2013-08-06 2014-01-29 苏州集智达电子科技有限公司 Full-automatic IC (Integrated Circuit) and LED (Light Emitting Diode) testing integrated system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6027301A (en) * 1996-10-04 2000-02-22 Samsung Electronics Co., Ltd. Semiconductor wafer testing apparatus with a combined wafer alignment/wafer recognition station
CN101619965A (en) * 2009-08-14 2010-01-06 北京领邦仪器技术有限公司 Wheel-pair automatic measuring device
CN102288119A (en) * 2011-06-27 2011-12-21 上海卓晶半导体科技有限公司 Device for automatically detecting flatness and thickness of substrates and separating substrates
CN102288138A (en) * 2011-06-27 2011-12-21 上海卓晶半导体科技有限公司 Equipment for automatically testing semiconductor substrate
CN202230986U (en) * 2011-07-26 2012-05-23 上海卓晶半导体科技有限公司 Split transmission structure for six substrate boxes
CN203414540U (en) * 2013-08-06 2014-01-29 苏州集智达电子科技有限公司 Full-automatic IC (Integrated Circuit) and LED (Light Emitting Diode) testing integrated system

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104502828A (en) * 2014-12-31 2015-04-08 华中科技大学 Flip LED (light emitting diode) chip on-line detecting method
CN105467250A (en) * 2015-12-22 2016-04-06 东莞光智通讯科技有限公司 Optical device automatic test apparatus
CN105467250B (en) * 2015-12-22 2018-03-20 东莞光智通讯科技有限公司 Optical device ATE
CN109142940A (en) * 2018-10-24 2019-01-04 江苏迅弘科技有限公司 A kind of full-automatic LED display screen tester
CN110412440A (en) * 2019-06-24 2019-11-05 深圳市森美协尔科技有限公司 A kind of full-automatic wafer probe station and full-automatic wafer test equipment

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Inventor after: Ding Tianxiang

Inventor after: Cao Xuebing

Inventor before: Ding Tianxiang

Inventor before: Cao Xuebing

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Application publication date: 20131023