CN103350291A - Soldering flux - Google Patents
Soldering flux Download PDFInfo
- Publication number
- CN103350291A CN103350291A CN201310267752XA CN201310267752A CN103350291A CN 103350291 A CN103350291 A CN 103350291A CN 201310267752X A CN201310267752X A CN 201310267752XA CN 201310267752 A CN201310267752 A CN 201310267752A CN 103350291 A CN103350291 A CN 103350291A
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- CN
- China
- Prior art keywords
- welding
- soldering flux
- soldering
- circuit board
- scaling powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention provides soldering flux which comprises components as follows: 60%-80% of polyethylene ethanol, 5%-10% of ethyl alcohol, 10%-30% of phenolic alcohol resin, 0.1%-1% of malonic acid, 0.1%-1% of hydrochloride, 0.1%-1% of benzotriazole, 0.1%-1% of hexadecyl ammonium bromide, 0.1%-1% of phosphate ester, 0.1%-1% of oleyl alcohol polyoxyethylene ether, 0.1%-1% of nitromethane, 0.1%-1% of nitroethane, 0.1%-1% of diethylene glycol, 0.1%-1% of alkylphenol polyoxyethylene ether, and the balance of hydrochloric acid. The soldering flux is safe, stable, difficult to resolve and combust, high in soldering ability and good in foamability, doesn't contain halogen, is particularly suitable for welding a high-quality hot air leveling circuit board and also welding a bare copper plate in a guarantee period, and is applicable to welding of a double-sided board, a composite board and a mounted and inserted mixed circuit board. The soldering flux is an ideal no-clean soldering flux and applicable to wave-soldering, spray welding and manual welding process of any top-grade circuit board.
Description
Technical field
The present invention relates to the scaling powder technical field, be specifically related to a kind of scaling powder.
Background technology
During modern industry is produced; the application of scaling powder is more and more extensive; scaling powder is a kind of material with chemistry and physically activated performance; can remove formed oxide on the oxide of soldered metal surface or other established superficial films and the outer surface of scolding tin own; the purpose of can tin sticky and weld to reach soldered surface; the function of scaling powder also can be protected the metal surface; make the welding hot environment in and be not reoxidized; simultaneously can reduce the surface tension of melting attitude tin, and promote the dispersion of scolding tin and flow etc.
Summary of the invention
For the deficiencies in the prior art, the purpose of this invention is to provide a kind of scaling powder a kind of rational in infrastructure, easy to use, it has solved these above-mentioned problems.
The technical solution adopted in the present invention is as follows: a kind of scaling powder comprises following component: PVOH 60-80%, ethanol 5-10%, phenoxy polyol resin 10-30%, malonic acid 0.1-1%, hydrochloride 0.1-1%, benzotriazole 0.1-1%, cetyl ammonium bromide 0.1-1%, phosphoesterase 30 .1-1%, Brij 0.1-1%, nitromethane 0.1-1%, nitroethane 0.1-1%, diethylene glycol list 0.1-1%, APES 0.1-1%, the hydrochloric acid surplus.
Preferably, described phenoxy polyol resin is natural rosin or modified rosin.
Preferably, also be added with wherein one or several of metal active inhibitor, defoamer, antioxidant.
Beneficial effect of the present invention comprises:
Scaling powder of the present invention, safety and stability is difficult for decomposing difficult to burn, help the weldering ability strong, foam performance is good, and is not halogen-containing, most suitable high-quality hot air leveling wiring board, heat are fit to the naked copper plate welding in the shelf-life, are applicable to dual platen, multi-layer sheet and subsides and insert the welding that loads in mixture wiring board.It is a kind of comparatively ideal no-clean scaling powder, is applicable to wave-soldering surfacing and the manual welding technique of any high-grade wiring board.
The specific embodiment
The present invention is described in detail below in conjunction with the specific embodiment.
A kind of scaling powder comprises following component: PVOH 60-80%, ethanol 5-10%, phenoxy polyol resin 10-30%, malonic acid 0.1-1%, hydrochloride 0.1-1%, benzotriazole 0.1-1%, cetyl ammonium bromide 0.1-1%, phosphoesterase 30 .1-1%, Brij 0.1-1%, nitromethane 0.1-1%, nitroethane 0.1-1%, diethylene glycol list 0.1-1%, APES 0.1-1%, the hydrochloric acid surplus.
Described phenoxy polyol resin is natural rosin or modified rosin.
Also be added with wherein one or several of metal active inhibitor, defoamer, antioxidant.
Embodiment:
Comprise following component: PVOH 70%, ethanol 6.2%, phenoxy polyol resin 20%, malonic acid 0.3%, hydrochloride 0.2%, benzotriazole 0.1%, cetyl ammonium bromide 0.1%, phosphoesterase 30 .3%, Brij 0.8%, nitromethane 0.3%, nitroethane 0.3%, diethylene glycol list 0.4%, APES 0.1-1%, hydrochloric acid surplus.
Above-mentioned embodiment is the preferred embodiments of the present invention; be not to limit enforcement of the present invention and interest field; all equivalences of making according to the described content of the present patent application scope of patent protection change and modify, and all should be included in the present patent application claim.
Claims (3)
1. a scaling powder is characterized in that, comprises following component: PVOH 60-80%, ethanol 5-10%, phenoxy polyol resin 10-30%, malonic acid 0.1-1%, hydrochloride 0.1-1%, benzotriazole 0.1-1%, cetyl ammonium bromide 0.1-1%, phosphoesterase 30 .1-1%, Brij 0.1-1%, nitromethane 0.1-1%, nitroethane 0.1-1%, diethylene glycol list 0.1-1%, APES 0.1-1%, hydrochloric acid surplus.
2. a kind of scaling powder according to claim 1 is characterized in that, described phenoxy polyol resin is natural rosin or modified rosin.
3. a kind of scaling powder according to claim 1 is characterized in that, also is added with wherein one or several of metal active inhibitor, defoamer, antioxidant.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310267752XA CN103350291A (en) | 2013-06-27 | 2013-06-27 | Soldering flux |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310267752XA CN103350291A (en) | 2013-06-27 | 2013-06-27 | Soldering flux |
Publications (1)
Publication Number | Publication Date |
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CN103350291A true CN103350291A (en) | 2013-10-16 |
Family
ID=49306753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201310267752XA Pending CN103350291A (en) | 2013-06-27 | 2013-06-27 | Soldering flux |
Country Status (1)
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CN (1) | CN103350291A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103817461A (en) * | 2014-03-17 | 2014-05-28 | 苏州龙腾万里化工科技有限公司 | Resin-core soldering flux |
CN104384753A (en) * | 2014-09-23 | 2015-03-04 | 明光旭升科技有限公司 | Environment-friendly circuit board soldering flux |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20020061556A (en) * | 2002-05-29 | 2002-07-24 | (주)케이트론 | Manufacturing processes of water-soluble flux and oil used soldering by horizontal hot air leveler |
CN101049661A (en) * | 2007-05-11 | 2007-10-10 | 北京工业大学 | Free from cleaning soldering flux without halogen and rosin in use for solder without lead |
CN101085497A (en) * | 2007-07-17 | 2007-12-12 | 西安理工大学 | Low-rosin cleaning-free scaling powder for tin-lead soldering paste and preparation method thereof |
CN101143407A (en) * | 2007-10-24 | 2008-03-19 | 汕头市骏码凯撒有限公司 | Soldering paste and its preparation method |
WO2008072654A1 (en) * | 2006-12-12 | 2008-06-19 | Senju Metal Industry Co., Ltd. | Flux for lead-free solder and method of soldering |
CN102029488A (en) * | 2010-12-17 | 2011-04-27 | 广州瀚源电子科技有限公司 | Washing-free high temperature dip soldering flux |
JP2011252171A (en) * | 2000-04-13 | 2011-12-15 | Fry's Metals Inc Doing Business As Alpha Metals Inc | Soldering flux with cationic surfactant |
-
2013
- 2013-06-27 CN CN201310267752XA patent/CN103350291A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011252171A (en) * | 2000-04-13 | 2011-12-15 | Fry's Metals Inc Doing Business As Alpha Metals Inc | Soldering flux with cationic surfactant |
KR20020061556A (en) * | 2002-05-29 | 2002-07-24 | (주)케이트론 | Manufacturing processes of water-soluble flux and oil used soldering by horizontal hot air leveler |
WO2008072654A1 (en) * | 2006-12-12 | 2008-06-19 | Senju Metal Industry Co., Ltd. | Flux for lead-free solder and method of soldering |
CN101049661A (en) * | 2007-05-11 | 2007-10-10 | 北京工业大学 | Free from cleaning soldering flux without halogen and rosin in use for solder without lead |
CN101085497A (en) * | 2007-07-17 | 2007-12-12 | 西安理工大学 | Low-rosin cleaning-free scaling powder for tin-lead soldering paste and preparation method thereof |
CN101143407A (en) * | 2007-10-24 | 2008-03-19 | 汕头市骏码凯撒有限公司 | Soldering paste and its preparation method |
CN102029488A (en) * | 2010-12-17 | 2011-04-27 | 广州瀚源电子科技有限公司 | Washing-free high temperature dip soldering flux |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103817461A (en) * | 2014-03-17 | 2014-05-28 | 苏州龙腾万里化工科技有限公司 | Resin-core soldering flux |
CN104384753A (en) * | 2014-09-23 | 2015-03-04 | 明光旭升科技有限公司 | Environment-friendly circuit board soldering flux |
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WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131016 |