CN103328989A - 检测集成电路中的结构缺陷的电路、使用和制造方法以及设计结构 - Google Patents
检测集成电路中的结构缺陷的电路、使用和制造方法以及设计结构 Download PDFInfo
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- CN103328989A CN103328989A CN2012800060001A CN201280006000A CN103328989A CN 103328989 A CN103328989 A CN 103328989A CN 2012800060001 A CN2012800060001 A CN 2012800060001A CN 201280006000 A CN201280006000 A CN 201280006000A CN 103328989 A CN103328989 A CN 103328989A
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Semiconductor Integrated Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
Claims (21)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/010,057 | 2011-01-20 | ||
US13/010,057 US9057760B2 (en) | 2011-01-20 | 2011-01-20 | Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures |
PCT/US2012/021411 WO2012099810A1 (en) | 2011-01-20 | 2012-01-16 | Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103328989A true CN103328989A (zh) | 2013-09-25 |
CN103328989B CN103328989B (zh) | 2016-04-13 |
Family
ID=46516028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280006000.1A Expired - Fee Related CN103328989B (zh) | 2011-01-20 | 2012-01-16 | 检测集成电路中的结构缺陷的电路、使用和制造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US9057760B2 (zh) |
CN (1) | CN103328989B (zh) |
DE (1) | DE112012000256B4 (zh) |
GB (1) | GB2501853B (zh) |
WO (1) | WO2012099810A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018076272A1 (zh) * | 2016-10-28 | 2018-05-03 | 华为技术有限公司 | 设有裂纹检测电路的装置和检测系统 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9698066B2 (en) | 2015-10-08 | 2017-07-04 | Samsung Electronics Co., Ltd. | Semiconductor chips having defect detecting circuits |
KR102351323B1 (ko) * | 2017-03-28 | 2022-01-17 | 삼성전자주식회사 | 디스플레이의 균열을 감지하기 위한 회로 및 이를 포함하는 전자 장치 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW486806B (en) * | 1998-10-30 | 2002-05-11 | Hitachi Ltd | Semiconductor integrated circuit apparatus and IC card |
CN1763553A (zh) * | 2004-10-20 | 2006-04-26 | 国际商业机器公司 | 在线测量集成电路芯片参数弥散度和缺陷的方法和装置 |
US20060226847A1 (en) * | 2005-04-08 | 2006-10-12 | Lsi Logic Corporation | Defect analysis using a yield vehicle |
US20070038404A1 (en) * | 2005-04-29 | 2007-02-15 | Mohit Kapur | Testable digital delay line |
US20080203388A1 (en) * | 2007-02-28 | 2008-08-28 | Jun He | Apparatus and method for detection of edge damages |
US20100258335A1 (en) * | 2009-04-10 | 2010-10-14 | International Business Machines Corporation | Structures for improving current carrying capability of interconnects and methods of fabricating the same |
US7859285B2 (en) * | 2008-06-25 | 2010-12-28 | United Microelectronics Corp. | Device under test array for identifying defects |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0677300A (ja) | 1992-06-25 | 1994-03-18 | Fujitsu Ltd | 半導体装置 |
US5625288A (en) | 1993-10-22 | 1997-04-29 | Sandia Corporation | On-clip high frequency reliability and failure test structures |
US5912562A (en) | 1997-02-04 | 1999-06-15 | Motorola Inc. | Quiescent current monitor circuit for wafer level integrated circuit testing |
US7193904B2 (en) * | 2004-11-10 | 2007-03-20 | International Business Machines Corporation | Random access memory with stability enhancement and early read elimination |
US7649200B1 (en) | 2005-05-04 | 2010-01-19 | Advanced Micro Devices, Inc. | System and method of detecting IC die cracks |
US7256475B2 (en) | 2005-07-29 | 2007-08-14 | United Microelectronics Corp. | On-chip test circuit for assessing chip integrity |
US7339816B1 (en) * | 2006-01-27 | 2008-03-04 | Altera Corporation | Soft error tolerance for configuration memory in programmable devices |
US7598749B1 (en) | 2006-06-08 | 2009-10-06 | Xilinx, Inc. | Integrated circuit with fuse programming damage detection |
JP2008021864A (ja) | 2006-07-13 | 2008-01-31 | Nec Electronics Corp | 半導体装置 |
US7545161B2 (en) | 2007-08-02 | 2009-06-09 | International Business Machines Corporation | Method and apparatus to measure threshold shifting of a MOSFET device and voltage difference between nodes |
US8159254B2 (en) | 2008-02-13 | 2012-04-17 | Infineon Technolgies Ag | Crack sensors for semiconductor devices |
US7955895B2 (en) * | 2008-11-07 | 2011-06-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Structure and method for stacked wafer fabrication |
TWI441270B (zh) * | 2008-12-17 | 2014-06-11 | Ind Tech Res Inst | 三維積體電路之直通矽晶穿孔製程監控方法及裝置 |
US20110080184A1 (en) * | 2009-10-01 | 2011-04-07 | National Tsing Hua University | Method for testing through-silicon-via and the circuit thereof |
JP6077300B2 (ja) | 2012-12-26 | 2017-02-08 | 帝人株式会社 | 1軸延伸多層積層フィルム、それからなる偏光板、液晶表示装置用光学部材及び液晶表示装置 |
-
2011
- 2011-01-20 US US13/010,057 patent/US9057760B2/en not_active Expired - Fee Related
-
2012
- 2012-01-16 WO PCT/US2012/021411 patent/WO2012099810A1/en active Application Filing
- 2012-01-16 DE DE112012000256.3T patent/DE112012000256B4/de not_active Expired - Fee Related
- 2012-01-16 CN CN201280006000.1A patent/CN103328989B/zh not_active Expired - Fee Related
- 2012-01-16 GB GB1314831.7A patent/GB2501853B/en not_active Expired - Fee Related
-
2015
- 2015-05-15 US US14/713,626 patent/US9599664B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW486806B (en) * | 1998-10-30 | 2002-05-11 | Hitachi Ltd | Semiconductor integrated circuit apparatus and IC card |
CN1763553A (zh) * | 2004-10-20 | 2006-04-26 | 国际商业机器公司 | 在线测量集成电路芯片参数弥散度和缺陷的方法和装置 |
US20060226847A1 (en) * | 2005-04-08 | 2006-10-12 | Lsi Logic Corporation | Defect analysis using a yield vehicle |
US20070038404A1 (en) * | 2005-04-29 | 2007-02-15 | Mohit Kapur | Testable digital delay line |
US20080203388A1 (en) * | 2007-02-28 | 2008-08-28 | Jun He | Apparatus and method for detection of edge damages |
US7859285B2 (en) * | 2008-06-25 | 2010-12-28 | United Microelectronics Corp. | Device under test array for identifying defects |
US20100258335A1 (en) * | 2009-04-10 | 2010-10-14 | International Business Machines Corporation | Structures for improving current carrying capability of interconnects and methods of fabricating the same |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018076272A1 (zh) * | 2016-10-28 | 2018-05-03 | 华为技术有限公司 | 设有裂纹检测电路的装置和检测系统 |
US20190324080A1 (en) | 2016-10-28 | 2019-10-24 | Huawei Technologies Co., Ltd. | Apparatus Equipped with Crack Detection Circuit and Detection System |
US10996265B2 (en) | 2016-10-28 | 2021-05-04 | Huawei Technologies Co., Ltd. | Apparatus equipped with crack detection circuit and detection system |
Also Published As
Publication number | Publication date |
---|---|
WO2012099810A1 (en) | 2012-07-26 |
GB201314831D0 (en) | 2013-10-02 |
GB2501853A (en) | 2013-11-06 |
GB2501853B (en) | 2017-02-08 |
US9057760B2 (en) | 2015-06-16 |
DE112012000256B4 (de) | 2020-01-16 |
US20150247896A1 (en) | 2015-09-03 |
US20120187953A1 (en) | 2012-07-26 |
DE112012000256T5 (de) | 2013-08-29 |
US9599664B2 (en) | 2017-03-21 |
CN103328989B (zh) | 2016-04-13 |
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Effective date of registration: 20171108 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171108 Address after: American New York Patentee after: Core USA second LLC Address before: American New York Patentee before: International Business Machines Corp. |
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