CN103307481A - 发光装置以及使用该发光装置的照明装置和照明器具 - Google Patents

发光装置以及使用该发光装置的照明装置和照明器具 Download PDF

Info

Publication number
CN103307481A
CN103307481A CN2013100774544A CN201310077454A CN103307481A CN 103307481 A CN103307481 A CN 103307481A CN 2013100774544 A CN2013100774544 A CN 2013100774544A CN 201310077454 A CN201310077454 A CN 201310077454A CN 103307481 A CN103307481 A CN 103307481A
Authority
CN
China
Prior art keywords
light
emitting
emitting device
fluorophor
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2013100774544A
Other languages
English (en)
Inventor
田中健一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN103307481A publication Critical patent/CN103307481A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/08Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material comprising photoluminescent substances
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/10Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
    • F21V3/12Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30Elements containing photoluminescent material distinct from or spaced from the light source
    • F21V9/38Combination of two or more photoluminescent elements of different materials
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00Combination of light sources
    • F21Y2113/10Combination of light sources of different colours
    • F21Y2113/13Combination of light sources of different colours comprising an assembly of point-like light sources
    • F21Y2113/17Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124Aluminium (Al) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139Silver (Ag) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147Copper (Cu) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • H01L33/504Elements with two or more wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/507Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

一种发光装置,包括:具有不同发光颜色的多种发光单元;驱动所述发光单元的驱动器;以及公用于所述多种发光单元的罩构件。所述多种发光单元包括同一种固态发光元件,以及波长转换器,所述波长转换器分别覆盖各固态发光元件,并将固态发光元件发出的光的波长转换成不同于彼此的波长。此外,罩构件包含校正荧光体,该校正荧光体将由所述发光单元发出的光经混合得到的光的色度校正至预定的色度。

Description

发光装置以及使用该发光装置的照明装置和照明器具
技术领域
本发明涉及包括多个固态发光元件的发光装置,以及使用该发光装置的照明装置和照明器具。
背景技术
发光二极管(LED)能以较低的功率获得较高的亮度辐射。因而作为光源被用于多种电器上,诸如显示器和照明装置。近来,除了红色LED和绿色LED外,蓝色LED也已经投入实际应用。因此,可能通过组合三种颜色(即LED的红色、绿色和/或蓝色),或者通过组合LED和用于对LED发出的光的波长进行转换的荧光体来发出具有多种颜色的光。
依照惯例,公知一种发光装置,其包括设于基板上的使用LED作为光源的发光单元和覆盖发光单元的表面的透光罩(参见例如日本专利公开No.2011‐71354)。此外,该透光罩合并有荧光体。
该日本专利公开No.2011‐71354中描述的发光装置中,使用LED作为光源的发光单元实际上与包含荧光体的透光罩成为一体。通常,照明光线的色度由LED自己发出的光的色度和由荧光体转换的光的色度共同确定。制造之后可能需要对发光装置发出的光的色度进行校正。然而,如果发光单元和透光罩是整体成型的,对于发光装置的照明光线的色度进行的后续校正会变得更加困难。
发明内容
鉴于上述情况,本发明给出了一种发光装置,以及应用该发光装置的照明装置和照明器具,该发光装置能够简单地校正通过混合从多种发光单元发出的光而得到的照明光线的色度,所述多种发光单元使用一个或多个固态发光元件作为光源并具有不同发光颜色。
根据本发明的第一方面,本发明给出了一种发光装置,包括:具有不同发光颜色的多种发光单元;驱动发光单元的驱动器;以及公用于所述多种发光单元的罩构件,其中,所述多种发光单元包括同一种固态发光元件和波长转换器,所述波长转换器分别覆盖各固态发光元件,并将固态发光元件发出的光的波长转换成不同于彼此的波长,并且其中,罩构件包含校正荧光体,该校正荧光体将由各发光单元发出的光经混合得到的光的色度校正至预定的色度。
所述多种发光单元可包括发红光的红色发光单元,发绿光的绿色发光单元和发蓝光的蓝色发光单元,并被分组以通过混合自红色发光单元、绿色发光单元和蓝色发光单元发出的光来获得白色光,校正荧光体可将每组发出的白色光的色度校正至单一预定的色度。
更为可取的是,校正荧光体将在固态发光元件由驱动器以额定输出驱动时获得的白色光的色度校正至期望的色度。
此外,罩构件可包括具有透光性的树脂成型件,和附着在树脂成型件上并包含校正荧光体的荧光体片层。
根据本发明的第二方面,本发明给出了应用上述发光装置的照明装置。
根据本发明的第三方面,本发明给出了包括上述发光装置或上述照明装置的照明器具。
由于上述构造,罩构件具有校正荧光体,该校正荧光体校正由所多种发光单元发出的光经混合得到的光的色度,以便可能较为容易地通过罩构件校正自发光单元发出的光经混合后的光的色度,以获得具有预期的色度的照明光线。
附图说明
本发明的目的和特征将通过下列结合附图给出的对实施例的说明而更为清楚,其中:
图1表示根据本发明实施例的发光装置的透视图;
图2A为表示该发光装置的一部分的分解透视图;图2B为该发光装置的发光元件的放大透视图;图2C为该发光单元的修改示例;图2D表示可用于该发光单元的SMD式包装;
图3A示出垂直于根据本实施例的发光装置的纵向的截面图;且图3B表示具有修改后的波长转换器的发光装置的截面图;
图4为色度图,该色度图解释在发光装置中使用罩构件对照明光线色度的校正;
图5为根据上述实施例的修改示例的发光装置的截面图;
图6A表示照明装置的例子,该照明装置应用了根据本发明的发光装置,图6B描述照明装置的例子,该照明装置应用了多个根据本发明的发光装置;
图7A示出照明器具的例子,该照明器具中使用了根据本发明的发光装置,且图7B表示另一个照明器具的例子,该照明器具被装备在应用了根据本发明的发光装置的照明装置上。
具体实施方式
下文中,本发明的实施例将依照作为其一部分的附图予以描述。纵观说明和附图,同样的附图标记将被赋予实质上具有相同功能和结构的同样的零件,其中多余的描述将被省略。
首先,根据本发明实施例的发光装置将参考图1至4予以描述。如图1所示,此实施例中的发光装置1包括多个发光单元2,和驱动发光单元2的驱动器3。罩构件4公用于各发光单元2。此外,发光装置1包括安装了发光单元2的基板5和保持基板5的框体6。
参看图2A,基板5为矩形板,且发光单元2沿其纵向排成一列安装于基板5上。罩构件4形成为槽形并保持在基板5上,以便其凹侧面对着发光单元2。框体6具有用于容纳基板5的凹部61。基板5被固定于框体6的底面。此外,驱动器3被布置在框体6的一端。罩构件4可具有不限于槽形状的另一种形状,例如图2C所示的穹顶形。
如同2A和2B所示,每个发光单元2包括固态发光元件21(如下称“LED”)和波长转换器22,该波长转换器22覆盖LED21,并对LED21所发出的光的波长进行转换。发光单元2包括具有不同发光颜色的多种发光单元。本例中,使用三种发光单元:发红光的红色发光单元2R、发绿光的绿色发光单元2G以及发蓝光的蓝色发光单元2B。在下列描述中,当光的颜色未被特别提及时,这三种发光单元2R、2G和2B可简单地被称为发光单元2。此外,如图2D所示的表面安装装置(SMD)式包装可用作发光单元。
发光单元2R、2G和2B包括同一种LED21。此外,发光单元2R、2G和2B分别包括波长转换器22R、22G和22B(如下简称为波长转换器22)。波长转换器22将LED21发出的光的波长转换成与从其他发光单元2发出的光的波长不同的波长。通用的化合物半导体用作LED21,该化合物半导体具有相同的发光颜色,并最好发射在近紫外线到蓝色波长范围内的光。如果同一种LED21用作发光单元2,零件的采购成本可能降低。此外,通过改变波长转换器22R、22G和22B的配置或者数量,在大范围内改变照明光线的色温是可能的。
波长转换器22用透光性树脂材料和包含在该透光性树脂材料中的荧光体形成。荧光体转换LED21发出的光的波长。包含荧光体的透光性树脂材料被涂在LED21的发射表面上。确切地说,红色发光单元2R中,包含将LED21发出的光转换为红色波长范围内的光的红色荧光体(如CASN荧光体(CaAlSiN3:Eu等))。绿色发光单元2G中,使用将LED21发出的光转换为绿色波长范围内的光的绿色荧光体(如CSO荧光体(CaSc2O4:Ce等))。
在蓝色发光单元2B中,如果所使用的LED21发出蓝色光并且蓝色光的色度在预定的色度范围内,荧光体不是必需的。然而,如果LED21发出近紫外线光至紫色光,将LED21发出的光转换为蓝色波长范围内的光的蓝光荧光体(如BAM:Eu,Mn荧光体等)会被使用于蓝色发光单元2B。此外,如果LED21发出的蓝色光的色度不在预定的色度范围内,蓝光荧光体会被使用以调节蓝色光的色度。
罩构件4共同覆盖多个发光单元2(如三种中的六个单元)。罩构件4包括校正荧光体,该校正荧光体将发光单元2发出的光经混合得到的光的色度校正至预定的色度。罩构件4由例如具有预定的耐久度和透光性的丙烯酸树脂作为主要材料制成。校正荧光体被添加到该主要材料中。此外,扩散剂可被添加到该主要材料中。作为该校正荧光体,与在发光单元2的波长转换器22R、22G和22B中使用的荧光体相同的或者不同的荧光体被单独或组合使用。此外,添加到主要材料中的该校正荧光体的浓度与波长转换器22相比可被降低。
由金属板或者铝板形成的平坦板适宜用作基板5。导线孔51位于靠近安装LED21的部分。此处,“平坦”被限定为这样的一种表面:该表面具有的不平整度小于铺在由玻璃环氧树脂制成的布线板上的布线图的厚度,并且不平整度的宽度大致等于或小于75μm。基板5的厚度为1mm,且最好具有预定的矩形形状。
作为选择,基板5也可例如由导电构件如不锈钢、氧化铝陶瓷,或者绝缘材料如氮化铝来形成。此外,基板5可具有能够安装诸如LED21和波长转换器22这类元件的任何尺寸与形状。而且,基板5可具有任何厚度,该厚度具有足够的强度,不会导致诸如处理过程中的弯曲之类的形变。导线孔51设于LED21的两侧以便LED21夹在导线孔51之间。导线23被连接至LED21的阳极和阴极并被插入导线孔51以从中穿过。
发光装置1还包括布置在基板5背面的引线框7。引线框7通过导线23与LED21电连接。引线框7将每个LED21电连接至驱动器3。此外,引线框7被图案化以便每个彩色发光单元2R、2G和2B的LED21能够被单独驱动。引线框7用粘性的隔离薄片8附着并固定在基板5的背面。
引线框7为用铜制环材冲压和冲裁成型的布线构件。抗氧化表面处理(如镀Ni、镀Ni/Au或镀Ni/Pd/Au等)在引线框7的表面上进行。引线框7的材料不限于铜,还可为例如铝等。电极部分设于引线框7上,电源线以锡焊方式连接到电极部分以便该电极部分通过电源线(未示出)连接到发光装置1的电源电路。
隔离薄片8为绝缘的片状粘合物质,主要以热固性树脂例如环氧树脂制成。更为可取的是,具有高导热性以及应力松弛性能的物质用于隔离薄片8中。作为该种隔离薄片8,例如,由Toray Co.,Ltd.制造的“TSA”、由Panasonic Co.,Ltd.制造的“organic green sheet”或者其他等等可被使用。通孔81被形成于隔离薄片8中,以便对应导线孔51的部分是开口的。导线23从基板5的上表面穿过导线孔51并与引线框7连接。引线框7的与导线23相连的部分是暴露的。螺孔52在靠近基板5的两个边缘处形成。螺钉(未示出)被插入螺孔52内以便基板5(其上通过隔离薄片8固定有引线框7)被拧到框体6上。
LED21适宜以所谓的面向上方式被使用,该方式下LED21的阳极和阴极位于其上表面。该LED21按照如下所述进行安装。LED21通过使用例如硅基模结合材料(未示出)结合到基板5上。导线23将LED21电连接到引线框7上。更具体地说,导线23穿过设于基板5上的导线孔51,从位于LED21顶部的电极结合并接合至引线框7上。因而,LED21电连接到引线框7上。此外,模结合材料不限于上述材料,也可为例如银膏,或者其他具有较高耐热性的环氧树脂材料。
波长转换器22由例如具有较高透光性的硅树脂作为主要材料制成。该波长转换器22具有半球形的外围形状以及能覆盖LED21的内部尺寸。与波长转换器22中所使用的树脂相同的树脂填充在导线孔51内,导线23穿过导线孔51以将LED21与引线框7电连接在一起。随后,波长转换器22进行安装。波长转换器22的外径由波长转换器22的透光性树脂材料的折射率乘以LED21的外接圆直径得出。例如,如果透光性树脂材料为硅树脂,波长转换器22的外径为LED21的外接圆直径的1.41倍或更多倍。
通过用凹形碗覆盖LED21(凹形碗的尺寸足够容纳LED21和导线23),用硅树脂填充该碗,然后再将碗移去,来将波长转换器22安装于基板5上。波长转换器22的透光性树脂材料不限于上述材料,也可为例如无机材料,如环氧树脂或者玻璃。此外,导线孔51中填充的树脂可为不同于波长转换器22中所用的树脂的材料。
作为选择,如图3B所示,波长转换器22可通过将硅树脂或者与硅树脂具有相同折射率的树脂22b填充到碗状构件22a的凹形部分并将其安装在基板5上以覆盖LED21来形成。碗状构件22a由硅树脂制成并具有容纳LED21和导线23的尺寸。随后,填充到凹形部分的树脂被固化,碗状构件与填充的树脂一起成为其间无光学折射界面的整体结构。因此,不会发生因波长转换器22中的全反射导致的光损失。由于此构造,便捷生产波长转换构件以及更加容易地调节色度是可能的。
对于导线23,例如,通用的金线被使用。并且,铝线、银线或铜线等可被使用。导线23通过本领域内熟知的结合方法,例如热结合或者超声结合,结合至设在引线框7中的电极部分(未示出)以及LED21的电极。
根据上述结构,LED21的安装表面和用作电布线的引线框7单独设置,并且基板5位于其间。LED21和引线框7用导线23穿过导线孔51电连接,因而简化了布线结构。此外,由于引线框7的结构简单,制造成本可被降低。而且,由于引线框7布置在基板5的背面,并且安装LED21和波长转换器22的部分(即安装表面)为平坦表面,波长转换器22的固定能够得到改善。因而可能减少空隙的产生。而且,由于LED21和波长转换器22的安装更为方便,制造效率也得到了提高。
在本实施例中,红色发光单元2R、绿色发光单元2G和蓝色发光单元2B被分组以通过混合其发出的光得到白色光。例如,如图2所示,一组中包括六个发光单元2:红色发光单元2R和2R’、绿色发光单元2G和2G’以及蓝色发光单元2B和2B’。图4表示当每个发光单元2(2R~2B’)用驱动器3以LED21的额定输出(例如3V,20mA)驱动时,每个发光单元2的色度,以及混合这些光得到的白色光的色度(图4中的点M)。
此外,发光装置1的照明光线要求的色度为例如黑体辐射轨迹和具有4000K色温的等色温线的交叉坐标(设定色度L)。如果LED21以额定输出驱动时,LED发出的光的辐射强度(辐射通量)是稳定的。因此,当发光装置1被使用时,还原制造时设定的色度的照明光线是可能的。
由发光单元2获得的白色光的色度M为色度(X,Y),每个色度分量均小于图示的设定色度L。这种条件下,例如,包含有作为校正荧光体的黄光荧光体(如YAG-基荧光体)的罩构件4被提供以覆盖每个发光单元2。因而,通过罩构件4传输的光在这个方向上移动:该方向上色度(X,Y)的每个分量都从原始色度增加。因此,发光装置1能够辐射出具有黑体辐射轨迹上的色度的自然白色光。
在上述结构中,波长转换器22覆盖LED21的辐射表面。因此,波长转换器22实际上与LED21成为一体以构成发光单元2。然而,罩构件4不与发光单元2成为一体。因此,当每个彩色发光单元2R、2G和2B的色度以及由其得到的混合光的色度被测量之后,包含有合适校正荧光体的罩构件4能够从而被使用。因此,对于发光装置的照明光线的色度进行的后续校正能够简单地被完成。
此外,在本实施例中,发光单元2被分组,且包含有适合于相应组的校正荧光体的罩构件4能够被使用。因而,每组发出的白色光的色度被校正至单独的预定的色度,如上述的设定色度L。因此,发光装置1的照明光线能够被校正至在色彩上无不均匀性的期望的色度。
接下来,将参考图5描述根据上述实施例的修改示例的发光装置。在此修改示例的发光装置1中,罩构件4包括具有透光性的树脂成型件41,以及附着在树脂成型件41上的荧光体片层42。荧光体片层42包含与上述实施例中的荧光体相似的校正荧光体。荧光体片层42附着在形成为槽形的树脂成型件41的内周面上。
根据上述实施例,当罩构件4被制造时,包含校正荧光体的透光性树脂需要按照上述的槽形被成型。然而,根据修改示例,树脂成型件41不包含校正荧光体,且荧光体片层42可被附着在树脂成型件41上。因此,罩构件4的制造被简化。
根据本发明的发光装置1能够被用于照明装置中。在照明装置中,发光装置1附着在预定的器具上,并被容纳在外壳、套等中。此外,两个或更多个发光装置可被合并入该照明装置中。下文中,应用了根据本发明的发光装置的照明装置和照明器具的例子将参考图6A至7B予以描述。
图6A示出了作为照明装置的例子的LED灯泡200。如图6A所示,发光装置1安装在支架220上。该支架220用具有高导热性的材料制成,如铝,以便发光装置1产生的热量能够以较高的效率散失到外壳270。驱动器3内置于供电单元230内。套260覆盖发光装置1。此外,套260形成为大致的穹顶形以覆盖发光装置1,其开口的末端用粘合剂固定在外壳270和支架220上。
外壳270形成为例如圆筒形。发光装置1布置在外壳270的一个末端部分,螺纹帽250布置在外壳270的另一个末端部分。为了作为热散失构件(热沉)起到散失来自发光装置10的热量的作用,外壳270也用具有良好导热性的材料制成,例如铝。
对于图6A所示的照明装置,除了本发明的效果外,还可以获得与白炽灯的兼容性,因为LED灯泡200容易用螺纹帽250安装到为白炽灯制造的插座中。
图6B示出了应用多个根据本发明的发光装置的照明装置300。如图6B所示,该照明装置300包括两个发光装置1A和1B。该照明装置300包括细长的管状外壳301、布置在外壳301中的底座302和一对附着在外壳301两端的帽304和305。发光装置1A和1B安装在底座302上。
外壳301具有两端都开口的细长的管状,并容纳底座302以及发光装置1A和1B。外壳301的材料没有特别限制,但最好是透光材料。作为此种透光材料,例如,可使用树脂如塑料、玻璃等。此外,外壳301的截面形状没有特别限制,可为圆环形或者多边形环形。底座302最好起到散热器的作用,以散失来自发光装置1A和1B的热量。为此,该底座302最好用例如金属的具有高导热性的材料形成。
因为图6B所示的照明装置300能用帽304和305容易地安装到为直管状荧光灯制造的插座中,除了本发明的效果外,还可能保证其与直管状荧光灯的兼容性。
接下来,图7A示出了照明器具101,具有根据本发明的发光装置1的照明装置100适用于该照明器具。如图所示,该照明器具101为例如下射灯,其安装成嵌入天花板1012内。照明装置100可拆卸地安装在框架1013的接受部分中。驱动器3设于供电单元1014内,并响应于使用者对操作单元1030的操纵而控制照明装置100。
在图7A所示的照明器具101中,纤薄型的照明装置100能被可拆卸地安装。因此,除了本发明的作用外,还可能提升使用方便性。
图7B示出了直接安装在天花板上的一类照明器具102,该照明器具上能够应用根据本发明的发光装置1。该照明器具102包括直接附着在天花板构件(未示出)上的主体1021。发光装置1(未示出)通过板形连接件1023附着在主体1021上。此外,发光装置1被由例如塑料或玻璃的树脂制成的透光罩1022覆盖。
图7B所示的照明器具102能够代替使用了直管状荧光灯的照明器具,除了本发明的效果外,还能提供增加了的效率。
尽管应用了根据本发明的发光装置的照明装置和照明器具已经被例示和描述,但它们仅仅是示范性的,并且根据本发明的发光装置可被应用于各种照明装置和照明器具上。
本发明不局限于上述实施例,可做出各种修改。尽管在上述实施例中已经例示的是使用了三种即蓝色发光单元、绿色发光单元和红色发光单元的结构,但例如可以增加白色发光单元,该白色发光单元使用通过在蓝色LED上涂覆黄光荧光体而获得的所谓白色LED。作为该白色LED,例如,与美国制定的LED色度规定(ANSI标准)一致的LED单元被配置,以便色度的变化在黑体轨迹的预定范围内。因此,如果发光装置1被应用于色度可变的照明上时,依照该规定的LED单元从市场获得并被用在常用的色度上。因此,发光装置1的制造效率得到提升,并且可能减少其他发光单元2的LED21上的负载。
此外,上述实施例中,尽管罩构件用于共同覆盖三种六个发光单元,但并不限于此,可作出各种修改。例如,罩构件可被设置成用于共同覆盖两种四个发光单元,或者三种三个发光单元。
尽管已就各实施例图示和描述了本发明,但本领域的技术人员应当理解的是,在不超出下述权利要求所限定的本发明范围的情况下可以作出各种改变和修正。

Claims (10)

1.一种发光装置,包括:
具有不同发光颜色的多种发光单元;
驱动所述发光单元的驱动器;以及
公用于所述多种发光单元的罩构件,
其中,所述多种发光单元包括同一种固态发光元件,以及波长转换器,所述波长转换器分别覆盖各固态发光元件,并将所述固态发光元件发出的光的波长转换成彼此不同的波长,
其中,所述罩构件包含校正荧光体,该校正荧光体用于把由所述发光单元发出的光经混合得到的光的色度校正至预定的色度。
2.如权利要求1所述的发光装置,
其中,所述多种发光单元包括发红光的红色发光单元,发绿光的绿色发光单元以及发蓝光的蓝色发光单元,并被分组以通过混合从红色发光单元、绿色发光单元和蓝色发光单元发出的光来获得白色光,并且
其中,所述校正荧光体将每组发出的白色光的色度校正至单一预定的色度。
3.如权利要求2所述的发光装置,其中,所述校正荧光体将在固态发光元件由驱动器以额定输出驱动时获得的白色光的色度校正至期望的色度。
4.如权利要求1至3任一项所述的发光装置,其中所述罩构件包括具有透光性的树脂成型件,以及附着在该树脂成型件上并包含校正荧光体的荧光体片层。
5.使用了如权利要求1至3任一项所述的发光装置的照明装置。
6.使用了如权利要求4所述的发光装置的照明装置。
7.包括如权利要求1至3任一项所述的发光装置的照明器具。
8.包括如权利要求4所述的发光装置的照明器具。
9.包括如权利要求5所述的照明装置的照明器具。
10.包括如权利要求6所述的照明装置的照明器具。
CN2013100774544A 2012-03-12 2013-03-12 发光装置以及使用该发光装置的照明装置和照明器具 Pending CN103307481A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012055042 2012-03-12
JP2012-055042 2012-03-12

Publications (1)

Publication Number Publication Date
CN103307481A true CN103307481A (zh) 2013-09-18

Family

ID=47912823

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013100774544A Pending CN103307481A (zh) 2012-03-12 2013-03-12 发光装置以及使用该发光装置的照明装置和照明器具

Country Status (4)

Country Link
US (1) US9169994B2 (zh)
EP (1) EP2639491A1 (zh)
JP (1) JP2013219340A (zh)
CN (1) CN103307481A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109642718A (zh) * 2016-01-28 2019-04-16 生态照明公司 利用多区融合杯的照明
US11047534B2 (en) 2016-01-28 2021-06-29 EcoSense Lighting, Inc. Multizone mixing cup illumination system

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11476626B2 (en) * 2008-11-12 2022-10-18 Aaron Chien DC powered remote control LED light-bar assembly
CN103486451B (zh) * 2012-06-11 2017-09-15 欧司朗股份有限公司 发光装置及包括该发光装置的照明装置
DE102012109217A1 (de) * 2012-09-28 2014-04-03 Osram Opto Semiconductors Gmbh Beleuchtungsvorrichtung zum Erzeugen einer Lichtemission und Verfahren zum Erzeugen einer Lichtemission
US9565782B2 (en) 2013-02-15 2017-02-07 Ecosense Lighting Inc. Field replaceable power supply cartridge
EP2932153B1 (en) * 2013-11-25 2016-06-22 Philips Lighting Holding B.V. Lighting arrangement with improved illumination uniformity
CN105849920B (zh) * 2013-12-27 2020-11-06 西铁城电子株式会社 发光装置和发光装置的设计方法
WO2015115517A1 (ja) * 2014-01-30 2015-08-06 興和株式会社 照明装置
US11306897B2 (en) 2015-02-09 2022-04-19 Ecosense Lighting Inc. Lighting systems generating partially-collimated light emissions
US9869450B2 (en) 2015-02-09 2018-01-16 Ecosense Lighting Inc. Lighting systems having a truncated parabolic- or hyperbolic-conical light reflector, or a total internal reflection lens; and having another light reflector
US9568665B2 (en) 2015-03-03 2017-02-14 Ecosense Lighting Inc. Lighting systems including lens modules for selectable light distribution
US9746159B1 (en) 2015-03-03 2017-08-29 Ecosense Lighting Inc. Lighting system having a sealing system
US9651227B2 (en) 2015-03-03 2017-05-16 Ecosense Lighting Inc. Low-profile lighting system having pivotable lighting enclosure
US9651216B2 (en) 2015-03-03 2017-05-16 Ecosense Lighting Inc. Lighting systems including asymmetric lens modules for selectable light distribution
CN104949016B (zh) * 2015-05-22 2017-07-21 普天智能照明研究院有限公司 可以光转换的吸顶灯及充气式led灯泡的制作方法
TWI635622B (zh) 2015-06-10 2018-09-11 隆達電子股份有限公司 發光結構、燈具及背光模組
USD785218S1 (en) 2015-07-06 2017-04-25 Ecosense Lighting Inc. LED luminaire having a mounting system
USD782094S1 (en) 2015-07-20 2017-03-21 Ecosense Lighting Inc. LED luminaire having a mounting system
USD782093S1 (en) 2015-07-20 2017-03-21 Ecosense Lighting Inc. LED luminaire having a mounting system
US9651232B1 (en) 2015-08-03 2017-05-16 Ecosense Lighting Inc. Lighting system having a mounting device
US10555397B2 (en) 2016-01-28 2020-02-04 Ecosense Lighting Inc. Systems and methods for providing tunable warm white light
US10197226B2 (en) 2016-01-28 2019-02-05 Ecosense Lighting Inc Illuminating with a multizone mixing cup
US11047535B2 (en) 2016-01-28 2021-06-29 Ecosense Lighting Inc. Illuminating with a multizone mixing cup
WO2019035827A1 (en) * 2017-08-16 2019-02-21 Ecosense Lighting Inc LIGHTING WITH A MULTIZONE MIXING CUP
CN109315037B (zh) 2016-01-28 2022-07-01 生态照明公司 用于提供具有高显色性的可调白光的系统
CN109661858A (zh) * 2016-09-05 2019-04-19 昕诺飞控股有限公司 Led丝和包括led丝的照明装置
EP3647650A4 (en) * 2017-06-27 2021-01-13 Seoul Semiconductor Co., Ltd. LIGHT EMITTING DEVICE
WO2019035828A1 (en) * 2017-08-16 2019-02-21 Ecosense Lighting Inc MULTIZONE MIXING CUP LIGHTING
US10503008B2 (en) * 2018-02-28 2019-12-10 Huizhou China Star Optoelectronics Technology Co, Ltd. Quantum dot (QD) lamps and displays
JP7161100B2 (ja) * 2018-09-25 2022-10-26 日亜化学工業株式会社 発光装置及びその製造方法
CN110599956B (zh) * 2019-09-19 2021-04-23 昆山国显光电有限公司 一种显示装置以及显示装置的显示亮度的调节方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1465106A (zh) * 2001-07-26 2003-12-31 松下电工株式会社 使用led的发光装置
CN101257010A (zh) * 2008-03-19 2008-09-03 和谐光电科技(泉州)有限公司 高散热性的led发光装置
CN101679859A (zh) * 2007-06-05 2010-03-24 皇家飞利浦电子股份有限公司 自支撑发光膜和磷光体增强照明系统
CN201556644U (zh) * 2009-12-14 2010-08-18 东莞勤上光电股份有限公司 矩形光斑功率型led封装结构
CN201992366U (zh) * 2010-09-21 2011-09-28 李京津 一种可调光led灯
CN102214774A (zh) * 2010-04-01 2011-10-12 Lg伊诺特有限公司 发光器件封装和具有发光器件封装的照明单元
CN102252221A (zh) * 2010-05-18 2011-11-23 日立民用电子株式会社 照明装置
US20120051045A1 (en) * 2010-08-27 2012-03-01 Xicato, Inc. Led Based Illumination Module Color Matched To An Arbitrary Light Source

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1139917A (ja) 1997-07-22 1999-02-12 Hewlett Packard Co <Hp> 高演色性光源
JP2003051209A (ja) 2001-07-25 2003-02-21 ▲せん▼宗文 任意の色光を発する高強度光源
US20030147242A1 (en) * 2002-02-04 2003-08-07 Whelen Engineering Company, Inc. White LED array
JP2007116133A (ja) 2005-09-22 2007-05-10 Toshiba Lighting & Technology Corp 発光装置
JP4353196B2 (ja) * 2006-03-10 2009-10-28 パナソニック電工株式会社 発光装置
KR100930171B1 (ko) * 2006-12-05 2009-12-07 삼성전기주식회사 백색 발광장치 및 이를 이용한 백색 광원 모듈
JP2008218733A (ja) * 2007-03-05 2008-09-18 Mikku:Kk カラー表示用ledパネル
US7883226B2 (en) * 2007-03-05 2011-02-08 Intematix Corporation LED signal lamp
JP4753904B2 (ja) * 2007-03-15 2011-08-24 シャープ株式会社 発光装置
WO2009003176A1 (en) * 2007-06-27 2008-12-31 The Regents Of The University Of California Optical designs for high-efficacy white-light emitting diodes
JP5432478B2 (ja) 2007-07-26 2014-03-05 パナソニック株式会社 Led照明装置
KR101134996B1 (ko) 2007-07-26 2012-04-09 파나소닉 주식회사 Led 조명 디바이스
US7984999B2 (en) * 2007-10-17 2011-07-26 Xicato, Inc. Illumination device with light emitting diodes and moveable light adjustment member
JP2009141066A (ja) * 2007-12-05 2009-06-25 Nitto Denko Corp 光半導体装置の製造方法
JP5000479B2 (ja) 2007-12-27 2012-08-15 シャープ株式会社 面光源、表示装置及びその製造方法
JP5341915B2 (ja) * 2008-03-28 2013-11-13 パナソニック株式会社 樹脂成型品、半導体発光光源、照明装置及び樹脂成型品の製造方法
JP5512515B2 (ja) * 2008-05-30 2014-06-04 シャープ株式会社 発光装置、面光源および液晶表示装置
GB2469794B (en) * 2009-04-24 2014-02-19 Photonstar Led Ltd High colour quality luminaire
US8157419B2 (en) * 2009-08-26 2012-04-17 Abl Ip Holding Llc LED assembly
JP2011066227A (ja) * 2009-09-17 2011-03-31 Toshiba Corp 白色led光源、バックライトユニット、液晶パネルおよび液晶tv
JP5382335B2 (ja) 2009-09-25 2014-01-08 東芝ライテック株式会社 電球形ランプおよび照明器具
KR20110087579A (ko) * 2010-01-26 2011-08-03 삼성엘이디 주식회사 Led 모듈과 이를 구비하는 백라이트 유닛
US9631782B2 (en) * 2010-02-04 2017-04-25 Xicato, Inc. LED-based rectangular illumination device
US20110317397A1 (en) * 2010-06-23 2011-12-29 Soraa, Inc. Quantum dot wavelength conversion for hermetically sealed optical devices
JP2012015466A (ja) * 2010-07-05 2012-01-19 Panasonic Electric Works Co Ltd 発光装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1465106A (zh) * 2001-07-26 2003-12-31 松下电工株式会社 使用led的发光装置
CN101679859A (zh) * 2007-06-05 2010-03-24 皇家飞利浦电子股份有限公司 自支撑发光膜和磷光体增强照明系统
CN101257010A (zh) * 2008-03-19 2008-09-03 和谐光电科技(泉州)有限公司 高散热性的led发光装置
CN201556644U (zh) * 2009-12-14 2010-08-18 东莞勤上光电股份有限公司 矩形光斑功率型led封装结构
CN102214774A (zh) * 2010-04-01 2011-10-12 Lg伊诺特有限公司 发光器件封装和具有发光器件封装的照明单元
CN102252221A (zh) * 2010-05-18 2011-11-23 日立民用电子株式会社 照明装置
US20120051045A1 (en) * 2010-08-27 2012-03-01 Xicato, Inc. Led Based Illumination Module Color Matched To An Arbitrary Light Source
CN201992366U (zh) * 2010-09-21 2011-09-28 李京津 一种可调光led灯

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109642718A (zh) * 2016-01-28 2019-04-16 生态照明公司 利用多区融合杯的照明
CN109642718B (zh) * 2016-01-28 2020-10-16 生态照明公司 利用多区融合杯的照明
US11028976B2 (en) 2016-01-28 2021-06-08 EcoSense Lighting, Inc. Illuminating with a multizone mixing cup
US11047534B2 (en) 2016-01-28 2021-06-29 EcoSense Lighting, Inc. Multizone mixing cup illumination system
US11226074B2 (en) 2016-01-28 2022-01-18 Ecosense Lighting Inc. Illuminating with a multizone mixing cup

Also Published As

Publication number Publication date
EP2639491A1 (en) 2013-09-18
US9169994B2 (en) 2015-10-27
JP2013219340A (ja) 2013-10-24
US20130235555A1 (en) 2013-09-12

Similar Documents

Publication Publication Date Title
CN103307481A (zh) 发光装置以及使用该发光装置的照明装置和照明器具
JP5433735B2 (ja) 電球形ランプ
EP2273568B1 (en) White light led and lamp of the white light led
JP6358457B2 (ja) 発光装置、照明用光源及び照明装置
WO2012165007A1 (ja) 発光装置、照明装置および発光装置の製造方法
CN107178712A (zh) 光源模块和包括其的照明装置
US20120300430A1 (en) Light-emitting module and lighting apparatus
JP2013214735A (ja) 発光装置、これを用いた照明装置及び照明器具
JP2017163001A (ja) 発光モジュール及び照明装置
EP2490258A2 (en) Light emitting device
EP2672513B1 (en) Multichip package structure for generating a symmetrical and uniform light-blending source
JP2014146661A (ja) 発光モジュール、照明装置および照明器具
US9746145B2 (en) Light-emitting device with non-successive placement of light-emitting elements of one color, illumination light source having the same, and illumination device having the same
JP6233750B2 (ja) 発光装置およびその製造方法、照明用光源、並びに照明装置
JP2016167518A (ja) 発光装置、及び、照明装置
EP2679895A1 (en) Light-emitting module and luminaire
JP2014060328A (ja) 発光装置
US20190139948A1 (en) Led lighting apparatus
JP2015082550A (ja) 発光モジュール、照明装置および照明器具
JP2010272687A (ja) 照明装置および照明器具
CN204573618U (zh) 照明用光源以及照明装置
CN204680689U (zh) 发光装置、照明用光源以及照明装置
JP2017069284A (ja) 発光装置及び照明装置
CN102082223B (zh) 发光器件封装
KR100960099B1 (ko) 엘이디 패키지용 렌즈

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20151010

Address after: Osaka Japan

Applicant after: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co.,Ltd.

Address before: Osaka Japan

Applicant before: Matsushita Electric Industrial Co.,Ltd.

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130918