CN103264490A - Secondary ejection mechanism of spring - Google Patents

Secondary ejection mechanism of spring Download PDF

Info

Publication number
CN103264490A
CN103264490A CN2013101907577A CN201310190757A CN103264490A CN 103264490 A CN103264490 A CN 103264490A CN 2013101907577 A CN2013101907577 A CN 2013101907577A CN 201310190757 A CN201310190757 A CN 201310190757A CN 103264490 A CN103264490 A CN 103264490A
Authority
CN
China
Prior art keywords
ejecting
spring
ejection
thimble
ejector retainner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2013101907577A
Other languages
Chinese (zh)
Other versions
CN103264490B (en
Inventor
张晓亮
张雄杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan xintaili Intelligent Technology Co.,Ltd.
Original Assignee
KUNSHAN XINTAILI PRECISION MOLD CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN XINTAILI PRECISION MOLD CO Ltd filed Critical KUNSHAN XINTAILI PRECISION MOLD CO Ltd
Priority to CN201310190757.7A priority Critical patent/CN103264490B/en
Publication of CN103264490A publication Critical patent/CN103264490A/en
Application granted granted Critical
Publication of CN103264490B publication Critical patent/CN103264490B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The invention discloses a secondary ejection mechanism of a spring. The secondary ejection mechanism comprises an ejector pin, a primary ejection structure, a secondary ejection structure and a spring structure, wherein one end of the ejector pin is connected with a male template, and the other end of the ejector pin is connected with the primary ejection structure; the primary ejection structure is sleeved on the ejector pin; the spring structure is available between the primary ejection structure and the second ejection structure; when the secondary ejection mechanism runs, the secondary ejection structure drives the first ejection structure to simultaneously and upwards move at a preset distance through the spring structure to complete the first ejector pin operation range; and the primary ejection structure stops moving, and the secondary ejection structure continuously moves upwards at a preset distance and compresses the spring structure to complete the secondary ejector pin operation range. The secondary ejection mechanism of the spring provided by the invention is very high in mechanism stability, so that the maintenance cost can be avoided, and the aims of safe production and high-efficiency production can be achieved. A mould is secondarily ejected by the secondary ejection mechanism of the spring disclosed by the invention, so that the quantity of the ejector pins, especially the quantity of the flat ejector pins, in a product can be reduced.

Description

The spring secondary ejecting mechanism
Technical field
The present invention relates to the Mould Machining field, particularly relate to a kind of spring secondary ejecting mechanism.
Background technology
When a product need design secondary ejecting mechanism, existing technology was at two groups of ejector retainner plates of mould design, controls the order that ejects of two groups of ejector retainner plates with resin shutter or iron shutter, thereby realizes that secondary ejects action.
But this secondary ejecting mechanism of being made up of resin shutter or iron shutter is very unstable in product volume production process, has increased the mould number of times that repairs a die, and causes bigger cost waste, and defective is bigger.
1. the resin shutter is easy to wear, and when mould mould temperature raise gradually, frictional force can reduce gradually, thereby secondary ejecting mechanism was lost efficacy.After this failure mechanisms, need the resin shutter is changed or tightened to machine under the mould again, it is more to accumulate the number of times that repairs a die, and causes human cost to rise, and mould accessory cost rises, and the product turnout rate reduces.
2. the frictional force that produces between the iron shutter assembly is bigger, the part easy fracture.During the product volume production, need make many batches of spare parts, thereby cause die cost to rise, repair a die and cause human cost to rise often, the product turnout rate descends.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of spring secondary ejecting mechanism, simple in structure, stable, highly versatile.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of spring secondary ejecting mechanism is provided, comprises: thimble, ejecting structure, secondary ejecting structure and a spring structure,
Described thimble one end is connected with the male model plate, and the other end is connected with a described ejecting structure;
A described ejecting structure is sleeved on the described thimble;
Between a described ejecting structure and the described secondary ejecting structure spring structure is arranged;
During work, described secondary ejecting structure drives the described ejecting structure preset distance that moves upward simultaneously by spring structure, finishes thimble actuating length for the first time; Then, a described ejecting structure stop motion, described secondary ejecting structure continues the preset distance that moves upward, and the compression spring structure, finishes thimble actuating length for the second time.
In a preferred embodiment of the present invention, a nail is arranged between a described ejecting structure and the described secondary ejecting structure.
In a preferred embodiment of the present invention, described secondary ejecting structure comprises on the interconnective secondary ejector retainner plate under the ejector retainner plate and secondary.
In a preferred embodiment of the present invention, a described ejecting structure comprises the thimble piece one time, the area of the area of described thimble piece ejector retainner plate on the described secondary.
In a preferred embodiment of the present invention, described spring structure is sleeved on described support and nails on.
In a preferred embodiment of the present invention, described spring secondary ejecting mechanism also comprises limited block, and described limited block is installed in the upper surface of ejector retainner plate on the described secondary.
In a preferred embodiment of the present invention, a described ejecting structure comprises liftout plate one time, and the area of ejector retainner plate is suitable on the area of a described liftout plate and the described secondary.
In a preferred embodiment of the present invention, described spring secondary ejecting mechanism also comprises limited block, and described limited block is installed in the upper surface of a described liftout plate.
The invention has the beneficial effects as follows: spring secondary ejecting mechanism of the present invention, mechanism stable is very high, thereby has avoided maintenance cost, has reached safe one-tenth and has produced the purpose of High-efficient Production.Use spring secondary ejecting mechanism secondary of the present invention to eject in the mould, can reduce the quantity of thimble quantity, particularly flat thimble in the product.
Description of drawings
Fig. 1 is the structural representation of spring secondary ejecting mechanism one preferred embodiment of the present invention;
Fig. 2 is the first status architecture schematic diagram of spring secondary ejecting mechanism shown in Figure 1;
Fig. 3 is the second status architecture schematic diagram of spring secondary ejecting mechanism shown in Figure 1;
Fig. 4 is the structural representation of another preferred embodiment of spring secondary ejecting mechanism of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that protection scope of the present invention is made more explicit defining.
See also Fig. 1 to Fig. 3, the embodiment of the invention comprises:
A kind of spring secondary ejecting mechanism comprises: thimble 10, ejecting structure, secondary ejecting structure 30, spring structure, nail 50 and limited block 60.
Described thimble 10 1 ends are connected with male model plate 70, and the other end is connected with a described ejecting structure 20;
Described secondary ejecting structure 30 comprises on the interconnective secondary ejector retainner plate 32 under the ejector retainner plate 31 and secondary, on the described secondary under ejector retainner plate 31 and the secondary ejector retainner plate 32 directly can fix by connectors such as bolts.
A described ejecting structure porose angled slide block 21 in the middle of comprising is sleeved on the described thimble 10, and the lower end of an angled slide block 21 is installed on the described secondary in the ejector retainner plate 31.
Described spring structure comprises spring base 41 and spring 42, and described spring base 41 is installed in the lower surface of a described angled slide block 21, and is arranged on the described secondary ejector retainner plate 32 under the ejector retainner plate 31 and secondary, and described spring 42 is installed in the described spring base 41.
A nail 50 is arranged between a described ejecting structure and the described secondary ejecting structure, and a support 50 is arranged in spring base 41 in the present embodiment.The effect of nail 50 is to keep out the suffered injection pressure of the thimble 10 on the angled slide block one time, adjusts the height of thimble 10.Can calculate by the decrement of calculating spring 42 and once to eject active force.
Described limited block 60 is fixed on the upper surface of ejector retainner plate 32 on the described secondary by connectors such as bolts.
During work, described secondary ejecting structure drives the described ejecting structure preset distance that moves upward simultaneously by spring structure, finish for the first time thimble actuating length S1(as shown in Figure 2), in the present embodiment for the first time thimble actuating length S1 be to the lower surface of male module 70 from the upper surface of an angled slide block 21; Then, a described ejecting structure stop motion, described secondary ejecting structure continues the preset distance that moves upward, and compression spring structure, finish for the second time thimble actuating length A(as shown in Figure 3), in the present embodiment for the second time thimble actuating length A be lower surface from the upper surface of limited block 60 to male module 70.
The area of the area of a thimble piece 21 of present embodiment ejector retainner plate 31 on the described secondary, the spring secondary ejecting mechanism of present embodiment is applicable to the mould that a small amount of secondary ejects.
Figure 4 shows that another embodiment, a kind of spring secondary ejecting mechanism comprises: a plurality of thimbles 11 ', 12 ', ejecting structure, secondary ejecting structure 30 ', spring structure 40 ', a nail 50 ' and a limited block 60 '.Be to the main distinction embodiment illustrated in fig. 3 with Fig. 1, a described ejecting structure comprises liftout plate 21 ' one time, the area of ejector retainner plate 31 ' is suitable on the area of a described liftout plate 21 ' and the described secondary, and described limited block 60 ' is installed in the upper surface of a described liftout plate 21 '.The spring secondary ejecting mechanism of present embodiment is applicable to the mould that needs the large tracts of land secondary to eject.
During work, described secondary ejecting structure drives the described ejecting structure preset distance that moves upward simultaneously by spring structure, finish thimble actuating length for the first time, in the present embodiment for the first time the thimble actuating length be lower surface from the upper surface of limited block 60 ' to male module 70 '; Then, a described ejecting structure stop motion, described secondary ejecting structure continues the preset distance that moves upward, and compression spring structure, finish thimble actuating length for the second time, in the present embodiment for the second time the thimble actuating length be the lower surface of upper surface to the time liftout plate 21 ' of ejector retainner plate 31 ' from the secondary.
Spring secondary ejecting mechanism of the present invention has two kinds of forms, and the mould that needs mould that secondary ejects and large tracts of land to need secondary to eject on a small quantity makes the mould simplicity of designization, and processing cost is low, the pincers worker assembling easily, subsequent production is stable, the number of times that repairs a die is few.Having added this mechanism in the mould not limited by any injection moulding board!
And adopting the secondary ejecting mechanism mould design of shutter form complicated, the production cost height is produced instability, need be equipped with a lot of spare parts, causes the cost waste.Spring secondary ejecting mechanism of the present invention, inferior minimum 300,000 times of the use mould of spring can select whether to change spring when mould maintains, saved human cost, die cost, maintenance cost, guaranteed mould stability in the volume production process, improved quality and the shipment efficient of product!
After using spring secondary ejecting mechanism of the present invention on the mould, the mechanism that is made up of resin or iron shutter be can substitute fully, human cost and Mold Making cost reduced.This secondary ejecting mechanism stability is very high, thereby has avoided maintenance cost, has reached safe one-tenth and has produced the purpose of High-efficient Production.This mechanism researches and develops successfully the technological innovation ability that promotes our company has been played very obvious effects.The accessory that this mechanism forms standardization, thus design time reduced, and standardized production has reduced the production cost of part.Use secondary to eject in the mould, can reduce the quantity of thimble quantity, particularly flat thimble in the product, flat thimble is easy to generate burr, has influenced product quality.Yet the secondary ejecting mechanism that uses shutter to form, design are complicated, and the maintenance cost height seldom uses this mechanism in the general mould, can only pass through the flat thimble burr of later stage artificial removal product.Use the spring secondary ejecting mechanism of our company, its stability has guaranteed product quality.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.

Claims (8)

1. a spring secondary ejecting mechanism is characterized in that, comprising: thimble, ejecting structure, secondary ejecting structure and a spring structure,
Described thimble one end is connected with the male model plate, and the other end is connected with a described ejecting structure;
A described ejecting structure is sleeved on the described thimble;
Between a described ejecting structure and the described secondary ejecting structure spring structure is arranged;
During work, described secondary ejecting structure drives the described ejecting structure preset distance that moves upward simultaneously by spring structure, finishes thimble actuating length for the first time; Then, a described ejecting structure stop motion, described secondary ejecting structure continues the preset distance that moves upward, and the compression spring structure, finishes thimble actuating length for the second time.
2. spring secondary ejecting mechanism according to claim 1 is characterized in that, a nail is arranged between a described ejecting structure and the described secondary ejecting structure.
3. spring secondary ejecting mechanism according to claim 1 and 2 is characterized in that, described secondary ejecting structure comprises on the interconnective secondary ejector retainner plate under the ejector retainner plate and secondary.
4. spring secondary ejecting mechanism according to claim 3 is characterized in that, a described ejecting structure comprises the thimble piece one time, the area of the area of described thimble piece ejector retainner plate on the described secondary.
5. spring secondary ejecting mechanism according to claim 4 is characterized in that, described spring structure is sleeved on described support and nails on.
6. spring secondary ejecting mechanism according to claim 4 is characterized in that, described spring secondary ejecting mechanism also comprises limited block, and described limited block is installed in the upper surface of ejector retainner plate on the described secondary.
7. spring secondary ejecting mechanism according to claim 3 is characterized in that, a described ejecting structure comprises liftout plate one time, and the area of ejector retainner plate is suitable on the area of a described liftout plate and the described secondary.
8. spring secondary ejecting mechanism according to claim 7 is characterized in that, described spring secondary ejecting mechanism also comprises limited block, and described limited block is installed in the upper surface of a described liftout plate.
CN201310190757.7A 2013-05-22 2013-05-22 Spring secondary ejection mechanism Active CN103264490B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310190757.7A CN103264490B (en) 2013-05-22 2013-05-22 Spring secondary ejection mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310190757.7A CN103264490B (en) 2013-05-22 2013-05-22 Spring secondary ejection mechanism

Publications (2)

Publication Number Publication Date
CN103264490A true CN103264490A (en) 2013-08-28
CN103264490B CN103264490B (en) 2018-04-10

Family

ID=49008176

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310190757.7A Active CN103264490B (en) 2013-05-22 2013-05-22 Spring secondary ejection mechanism

Country Status (1)

Country Link
CN (1) CN103264490B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060172037A1 (en) * 2004-07-16 2006-08-03 Eagle Mold Company, Inc. Decelerated ejector pin
CN202123620U (en) * 2011-02-16 2012-01-25 深圳市银宝山新科技股份有限公司 Injection mould and secondary ejection mechanism of injection mould
CN203331362U (en) * 2013-05-22 2013-12-11 昆山鑫泰利精密模具有限公司 Spring secondary ejection mechanism

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060172037A1 (en) * 2004-07-16 2006-08-03 Eagle Mold Company, Inc. Decelerated ejector pin
CN202123620U (en) * 2011-02-16 2012-01-25 深圳市银宝山新科技股份有限公司 Injection mould and secondary ejection mechanism of injection mould
CN203331362U (en) * 2013-05-22 2013-12-11 昆山鑫泰利精密模具有限公司 Spring secondary ejection mechanism

Also Published As

Publication number Publication date
CN103264490B (en) 2018-04-10

Similar Documents

Publication Publication Date Title
CN203739167U (en) Secondary ejecting-out and demoulding mechanism for automotive plastic mold
CN104985854A (en) Tablet profiling device with automatic discharging function
CN201427372Y (en) Obliquely-ejecting structure of die
CN203331362U (en) Spring secondary ejection mechanism
CN202377384U (en) Longitudinal beam forming mold convenient in debugging
CN103264490A (en) Secondary ejection mechanism of spring
CN205660079U (en) Ejecting device of press machine
CN205130297U (en) Slider differential type demoulding mechanism
CN103264489B (en) Spring braking mold secondary ejecting mechanism
CN203543020U (en) Injection mold and mold opening controller
CN203994568U (en) A kind of secondary ejecting mechanism of injection mold
CN202656424U (en) Quick dismounting plastic inclined top structure
CN204658863U (en) A kind of secondary segmenting liftout attachment of injection mold
CN204869509U (en) Easily trade formula taper pin device
CN104494055B (en) A kind of without rank taper nanometer brush mould
CN204367339U (en) The antiseized ramp-roof structure of a kind of injection mold
CN201769346U (en) Ejection mechanism for die
CN204011052U (en) A kind of vertical around square coil coiling mould emptier
CN208930548U (en) A kind of inexpensive secondary ejecting mechanism for crystalline plastics
CN203472012U (en) Supporting machine structures
CN203293416U (en) Mold with combination type inclined ejector
CN208992988U (en) A kind of mold mechanism of the cover half with lifter ejection
CN201483747U (en) Positioning device used for plastic extrusion die
CN203543000U (en) Injection mold
CN203484487U (en) Die capable of discharging scraps

Legal Events

Date Code Title Description
PB01 Publication
C06 Publication
CB02 Change of applicant information

Address after: 215300, 2539 Yongfeng Road, Yushan Town, Kunshan Town, Suzhou, Jiangsu, China

Applicant after: KUNSHAN XINTAILI PRECISION COMPONENTS CO., LTD.

Address before: 215300, 2539 Yongfeng Road, Yushan Town, Kunshan Town, Suzhou, Jiangsu, China

Applicant before: Kunshan Xintaili Precision Mold Co.,Ltd.

COR Change of bibliographic data
SE01 Entry into force of request for substantive examination
C10 Entry into substantive examination
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: 215300 no.2539, yongfengyu Road, Chengbei, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province

Patentee after: Kunshan xintaili Intelligent Technology Co.,Ltd.

Address before: 215300 no.2539, yongfengyu Road, Chengbei, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province

Patentee before: KUNSHAN XINTAILI PRECISION COMPONENTS Co.,Ltd.

CP01 Change in the name or title of a patent holder
CP02 Change in the address of a patent holder

Address after: 215300 no.1689 Zizhu Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province

Patentee after: Kunshan xintaili Intelligent Technology Co.,Ltd.

Address before: 215300 no.2539, yongfengyu Road, Chengbei, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province

Patentee before: Kunshan xintaili Intelligent Technology Co.,Ltd.

CP02 Change in the address of a patent holder