CN103240229A - Sorted storing device for IC (Integrated Circuit) test - Google Patents

Sorted storing device for IC (Integrated Circuit) test Download PDF

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Publication number
CN103240229A
CN103240229A CN2013101559969A CN201310155996A CN103240229A CN 103240229 A CN103240229 A CN 103240229A CN 2013101559969 A CN2013101559969 A CN 2013101559969A CN 201310155996 A CN201310155996 A CN 201310155996A CN 103240229 A CN103240229 A CN 103240229A
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China
Prior art keywords
charging tray
unit
checked
district
storage device
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CN2013101559969A
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Chinese (zh)
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CN103240229B (en
Inventor
朱玉萍
岑刚
焦建华
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Jingyan (Jiangsu) Intelligent Equipment Co.,Ltd.
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Jiaxing Jingyan Intelligent Equipment Technology Co Ltd
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Priority to CN201310155996.9A priority Critical patent/CN103240229B/en
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Abstract

The invention relates to the technical field of packaging of integrated circuits, and discloses a sorted storing device for IC (Integrated Circuit) test. The device comprises an IC detection unit, an IC material plate unit, a first IC conveying unit, a rotary disc unit, a rotary operational unit and a second IC conveying unit, wherein the IC material plate unit comprises a storing position for the material plate to be detected and a storing position for the material plate to be placed. The rotary unit is arranged at the front end of the storing position for the material plate to be detected. The first IC conveying unit is located between the rotary disc unit and the storing position for the material plate to be detected. The rotary operational unit is located at one side of the rotary disc unit and comprises at least one rotary arm which circulates to be rotatably positioned above the rotary disc unit, the IC detection unit and the second conveying unit so as to sequentially absorb, detect and temporally store the IC. The second IC conveying unit respectively places the ICs after detection on different material plates to be placed according to the detection results. According to the device, high speed test and sorting of ICs can be realized.

Description

IC testing classification storage device
Technical field
The present invention relates to integrated circuit packing technical field, particularly a kind of IC testing classification storage device.
Background technology
Will press grade separation behind the superseded substandard products through detecting after the IC integrated package is produced, detection of the prior art and assorting process all are that semi-automation is finished.
Chinese patent " variable pitch type IC classifier " (application number: 200810129316.5) disclose a kind of slide rail type IC sorter, cooperate horizontal slide rail and IC suction nozzle by linear motor, realize continuously IC being classified, the IC suction nozzle can be regulated by guiding mechanism, is applicable to the IC of different size.But this IC sorter architecture complexity, the Installation and Debugging inconvenience.Use the mode of slide rail to be difficult to realize classification at a high speed, and its testing agency can not be integrated with sorting mechanism, operating efficiency is low.
Summary of the invention
To the objective of the invention is in order solving the problems of the technologies described above, a kind of IC testing classification storage device to be provided, in the hope of realizing high speed test and the classification to IC.
The technical scheme that the present invention takes is:
A kind of IC testing classification storage device, comprise the IC detecting unit, IC charging tray unit, it is characterized in that, also comprise an IC supply unit, turntable unit, the rotary operation unit, the 2nd IC supply unit, described IC charging tray unit comprises that charging tray to be checked deposits the position, treat that discharge plate deposits the position, described turntable unit is arranged on the front end that described charging tray to be checked is deposited the position, a described IC supply unit is deposited between the position in described turntable unit and described charging tray to be checked, be used for the IC of charging tray to be checked is delivered to described turntable unit, described rotary operation unit is positioned at a side of described turntable unit, described rotary operation unit comprises at least one pivoted arm, the circulation of described pivoted arm can rotational positioning to described turntable unit top, described IC detecting unit top and described second supply unit top, realize drawing IC successively, detect IC and temporary IC, the IC that described the 2nd IC supply unit is finished detection is positioned over different treating on the discharge plate respectively according to its testing result.
Further, described charging tray unit also comprises the first charging tray district, the second charging tray district, charging tray input mechanism to be checked, empty tray conveyor structure, finished product charging tray output mechanism, the described first charging tray district is used for depositing charging tray to be checked, the described second charging tray district is used for depositing treating discharge plate, described charging tray input mechanism to be checked is sent to described charging tray to be checked with described charging tray to be checked and deposits the position, the to be checked empty charging tray that described empty tray conveyor structure will have been got IC is sent to the described discharge plate for the treatment of and deposits the position, and described finished product charging tray output mechanism is with the finished product charging tray output in the second charging tray district.
Further, uniform 8 to 16 IC storage tanks can be placed 4 to 8 IC on the circumference of described turntable unit in each IC storage tank.
Further, described rotary operation unit comprises 4 to 8 pivoted arms, and each pivoted arm is provided with the absorption parts, and described absorption parts can realize simultaneously that once the suction of 4 to 8 IC puts.
Further, the pivoted arm of described rotary operation unit also can be positioned a position that abandons waste product, is provided with ash can below the described position that abandons waste product.
Further, described the 2nd IC supply unit comprises IC temporary storage mechanism and IC conveying mechanism, and the IC that described IC temporary storage mechanism will detect is delivered to the finished product charging tray by described IC conveying mechanism with finished product IC after being stored to some.
Further, described charging tray to be checked is deposited the position for a plurality of, all is arranged at the described first charging tray district; The described discharge plate for the treatment of is deposited the position for a plurality of, all is arranged at the second charging tray district.
Further, a described IC supply unit comprises the absorption parts, and described absorption parts are positioned over described turntable unit by connecting gear with the absorption of IC on the charging tray to be checked, and described absorption parts can realize that once the suction of 4 to 8 IC puts simultaneously.
Further, described IC temporary storage mechanism comprises IC storage tank, motor and drive lead screw, and the described screw mandrel of described motor-driven moves to the working area with described IC storage tank.
Further, a side of described IC storage tank arranges the compression spring, and opposite side arranges cylinder, by described cylinder and compression spring described IC storage tank is positioned, and in described cylinder side, a spacing adjusting micrometer is set also.
The invention has the beneficial effects as follows:
High speed test and classification at a high speed can be realized by servomotor in turntable unit and rotary operation unit;
By the structure of IC temporary storage mechanism, make this device realize different size IC detection and store classifiedly.
Description of drawings
Accompanying drawing 1 is structural representation of the present invention;
Accompanying drawing 2 is perspective view of temporary storage mechanism;
Accompanying drawing 3 is perspective view of temporary platform.
Label among the figure is respectively:
1.IC charging tray unit; 11. charging tray to be checked is deposited the position;
Deposit the position 12. treat discharge plate; 13. charging tray to be checked;
14. treat discharge plate; 15. the first charging tray district;
16. the second charging tray district; 17. charging tray input mechanism to be checked;
18. empty tray conveyor structure; 2. an IC supply unit;
21. absorption parts; 3. turntable unit;
31.IC storage tank; 4. rotary operation unit;
41. pivoted arm; 42. absorption parts;
5.IC detecting unit; 6. the 2nd IC supply unit;
61.IC temporary storage mechanism; 62.IC conveying mechanism;
63.IC storage tank; 64. motor;
65. drive lead screw; 66. compression spring;
67. cylinder; 68. spacing adjusting micrometer;
1A, 1B, 1C, 1D, 1E. charging tray zone; 2A, 2B, 2C, 2D, 2E. charging tray zone.
The specific embodiment
Elaborate below in conjunction with the specific embodiment of accompanying drawing to IC testing classification storage device of the present invention.
Referring to accompanying drawing 1, IC testing classification storage device comprises IC charging tray unit 1, the one IC supply unit 2, turntable unit 3, rotary operation unit 4, IC detecting unit 5, the 2nd IC supply unit 6, IC charging tray unit 1 comprise charging tray to be checked deposit the position 11, treat discharge plate deposit the position 12, the first charging tray district 15, the second charging tray district 16, charging tray input mechanism 17 to be checked, empty tray conveyor structure 18, finished product charging tray output mechanism, the first charging tray district 15 is used for depositing charging tray 13 to be checked, the second charging tray district 16 is used for depositing treating discharge plate 14, charging tray input mechanism 17 to be checked is sent to charging tray to be checked with charging tray 13 to be checked and deposits position 11, the charging tray to be checked 13 that empty tray conveyor structure 18 will have been got IC is sent to treats that discharge plate deposits position 12, and finished product charging tray output mechanism is with the finished product charging tray output in the second charging tray district.Charging tray to be checked is deposited position 11 and is treated that discharge plate deposits position 12 and can be made as a plurality ofly, is arranged at the first charging tray district 15 and the second charging tray district 16 respectively.Turntable unit 3 is arranged on the front end that charging tray to be checked is deposited position 11, and uniform 8 to 16 IC storage tanks 31 on the circumference of turntable unit 3 can be placed 4 to 8 IC in each IC storage tank 31.The one IC supply unit 2 is deposited between the position 11 in turntable unit 3 and charging tray to be checked, be used for the IC of charging tray 13 to be checked is delivered to turntable unit 3, the one IC supply unit 2 comprises draws parts 21, draw parts 21 and be positioned over turntable unit 3 after by the absorption of connecting gear with IC on the charging tray to be checked, draw parts 21 and can realize that once the suction of 4 to 8 IC puts simultaneously.Rotary operation unit 4 is positioned at a side of turntable unit 3, rotary operation unit 4 comprises at least one pivoted arm 41, preferred pivoted arm number is 4 to 8, pivoted arm 41 can cycle rotation be positioned to the top of turntable unit 3, top and the 2nd IC supply unit 6 tops of IC detecting unit 5, the function that realize drawing IC successively, detects IC and temporary IC.In addition, the pivoted arm 41 of rotary operation unit 4 also can be positioned a position that abandons waste product, is provided with the ash can (not shown) below abandoning the position of waste product.Each pivoted arm 41 of rotary operation unit 4 is provided with draws parts 42, draws parts 42 and can realize that once the suction of 4 to 8 IC puts simultaneously.The IC that the 2nd IC supply unit 6 is finished detection is positioned over different treating on the discharge plate 14 respectively according to its testing result.The 2nd IC supply unit 6 comprises IC temporary storage mechanism 61 and IC conveying mechanism 62, and the IC that IC temporary storage mechanism 61 will detect is delivered to the finished product charging tray by IC conveying mechanism 62 with finished product IC after being stored to some.
Referring to accompanying drawing 2,3, IC temporary storage mechanism 61 comprises IC storage tank 63, motor 64 and drive lead screw 65, and motor 64 drives screw mandrel 65 IC storage tank 63 is moved to the working area.Side at IC storage tank 63 arranges compression spring 66, and opposite side arranges cylinder 67, positions by cylinder 67 and 66 pairs of IC storage tanks 63 of compression spring, in a side of cylinder 67, a spacing adjusting micrometer 68 is set also.
Referring to accompanying drawing 1, the course of work with equipment of the present invention is described in detail below, at first stacks the 1A district and stacks filling the charging tray that does not detect IC, by charging tray input mechanism 17 to be checked charging tray is transported to the 2A district and positions.Connecting gears of the prior art such as charging tray input mechanism 17 optional belt transmission to be checked, an IC supply unit 2 is drawn IC and is transported on the rotating disk 3 and deposits by drawing parts 21.Draw IC by rotary operation unit 4 then, and rotate to IC detecting unit 5 and detect, after detection is finished again position of rotation in the pallet of IC temporary storage mechanism 61, deposit, carry by IC temporary storage mechanism 61 again then, drawn by nozzle unit by the IC conveying mechanism and be transported to the IC that different brackets is removed to deposit in 2C, 2D, three zones of 2E.
1A, 1B, 1C, 1D, 1E are be used to the zone that stacks charging tray, can stack a plurality of charging trays, can the saving personnel repeat to place charging tray.It comprises fill in the 1A zone do not detect IC charging tray, the charging tray of 1B zone hollow is deposited charging tray for detection of intact IC by 3 grades in 1C, 1D, the 1E zone.
After placement in the 1A zone does not detect the charging tray of IC, by charging tray input mechanism 17 to be checked charging tray is transported to the 2A district and positions, conveniently do not detect the IC conveying mechanism and draw.After not detecting IC and having been drawn, by empty tray conveyor structure 18 blank panel is transported to the 2B district and positions.After the charging tray in 2C, 2D, 2E district is filled the IC that has detected again by conveying mechanism be transported to 1C, 1D, deposit in the 1E district.Simultaneously by empty tray conveyor structure 18 blank panel in 2B district is transported to 2C, 2D, 2E district.After the not detection IC on the charging tray in 2A district has been drawn, carry empty charging tray to deposit to 2B district by charging tray input mechanism 17 to be checked, after the charging tray in 2C, 2D, 2E district is filled IC again by the charging tray conveyances of charging tray input mechanism 17 handle skies to be checked to 2C, 2D, 2E district.After the charging tray of filling IC was sent to the 2A district, an IC supply unit 2 was drawn to be transported in the turntable unit 3 behind the IC by nozzle unit 21 and is deposited.Wherein nozzle unit 21 is furnished with 4 suction nozzles, can draw 4 IC simultaneously.Turntable unit 3 drives cycle rotation by direct driving motor, ceaselessly is not rotated conveying to detecting IC.Rotary operation unit 4 is to carry when turntable unit 3 not detect IC behind certain position, and absorption parts 42 absorptions on it does not detect IC and carry out the IC detection to detecting unit 5, draw IC when rotary operation unit 4 and are pushed down and detect behind detecting unit 5.Having detected the back is transported on the temporary storage mechanism 61 in the absorption rotation.Temporary storage mechanism 61 is used for the conveying to the IC that detected at a high speed.Once can carry 8 IC.Carry the IC that has detected to gettering site by temporary storage mechanism 61, carry IC to store classifiedly to 2C, 2D, 2E district by the IC conveying mechanism 62 that IC detects after finishing.
The present invention mainly is in order to realize the IC high speed test, to store classifiedly, the charging tray full automatic treatment, and mechanism is compacter, and speed is faster and IC design surveys machine equipment.Charging tray input mechanism 17 to be checked is a lifting body, utilize the SERVO CONTROL charging tray to be placed on the belt conveyor, carry charging tray to locate to the charging tray district by belt conveyor, drawing IC by an IC supply unit again goes to deposit to rotating disk, after IC has been drawn, by empty tray conveyor structure 18 the blank panel conveyance is deposited to the blank panel district.
The lifting body of charging tray utilizes private clothes motor to drive screw mandrel and drives lifting pin jacking charging tray, and recycling cylinder gripping charging tray cooperates charging tray is placed on the charging tray belt conveyor.Belt conveyor utilizes cylinder to come the clamping and positioning charging tray, is gone to fix to locating by the slide unit on the stepper motor control belt again, waits for that charging tray input mechanism 17 to be checked draws IC.Empty tray conveyor structure 18 has comprised the move left and right conveying mechanism, and the cylinder gripping body utilizes gripping cylinder gripping blank panel to move to blank panel by translation mechanism and goes to place.With respect to existing IC test machine, so just saved and manually removed to place charging tray, full automatic scheduling blank panel has been saved time of artificial shutdown emptying dish, has improved production efficiency greatly.
Temporary storage mechanism 61 behind the IC high speed test, it has comprised the move left and right conveying mechanism, the IC placement platform has wherein disposed 8 IC placement positions for temporary IC on the IC placement platform.Contrast the temporary storage mechanism in other IC testing agency, other temporary storage mechanism has only two IC storage areas, conveying that can only be again and again.And temporary storage mechanism 61 of the present invention is to have disposed 8 IC districts, can be used for depositing of temporary twice IC, once deposits 4 IC.
Because the IC conveying mechanism 62 that IC detects after finishing need divide 3 grades to place detecting good IC, the needed like this time is just long, in order to be the production efficiency that improves the IC checkout equipment, 61 twice temporary IC reduce the course of conveying back and forth that IC detects the IC conveying mechanism 62 after finishing by temporary storage mechanism, allow it draw 8 IC simultaneously and deposit.With respect to the IC test back temporary storage mechanism that has earlier, so just shortened the time of delivery once of the conveying mechanism after the IC detection is finished, improved production efficiency greatly.Temporary storage mechanism of the present invention is applicable to the IC high speed test, particularly needs the IC testing equipment that stores classifiedly, has solved the storage problem behind the IC high speed test, provides a kind of and has been better than existing IC and detects the back temporary storage mechanism, and operating efficiency is higher.
Rotary operation unit 4 comprises the turning arm 41 of direct-drive motor control, and it has disposed 4 turning arms 41, the parts of absorption up and down 42 of cylinder control.Gettering site on 4 turning arms of rotary operation unit 4 configuration, corresponding rotating disk of arm, the corresponding IC detecting position of arm, the corresponding IC temporary storage mechanism of arm is placed the position, and an arm free can be added other device, abandons such as waste product.When drawing IC, can put down detection simultaneously.So not only save the time but also economized the design space.
The above only is preferred embodiment of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.

Claims (10)

1. IC testing classification storage device, comprise the IC detecting unit, IC charging tray unit, it is characterized in that, also comprise an IC supply unit, turntable unit, the rotary operation unit, the 2nd IC supply unit, described IC charging tray unit comprises that charging tray to be checked deposits the position, treat that discharge plate deposits the position, described turntable unit is arranged on the front end that described charging tray to be checked is deposited the position, a described IC supply unit is deposited between the position in described turntable unit and described charging tray to be checked, be used for the IC of charging tray to be checked is delivered to described turntable unit, described rotary operation unit is positioned at a side of described turntable unit, described rotary operation unit comprises at least one pivoted arm, the circulation of described pivoted arm can rotational positioning to described turntable unit top, described IC detecting unit top and described second supply unit top, realize drawing IC successively, detect IC and temporary IC, the IC that described the 2nd IC supply unit is finished detection is positioned over different treating on the discharge plate respectively according to its testing result.
2. IC testing classification storage device according to claim 1, it is characterized in that: described charging tray unit also comprises the first charging tray district, the second charging tray district, charging tray input mechanism to be checked, the empty tray conveyor structure, finished product charging tray output mechanism, the described first charging tray district is used for depositing charging tray to be checked, the described second charging tray district is used for depositing treating discharge plate, described charging tray input mechanism to be checked is sent to described charging tray to be checked with described charging tray to be checked and deposits the position, the to be checked empty charging tray that described empty tray conveyor structure will have been got IC is sent to the described discharge plate for the treatment of and deposits the position, and described finished product charging tray output mechanism is with the finished product charging tray output in the second charging tray district.
3. IC testing classification storage device according to claim 1 is characterized in that: uniform 8 to 16 IC storage tanks on the circumference of described turntable unit, can place 4 to 8 IC in each IC storage tank.
4. IC testing classification storage device according to claim 1, it is characterized in that: described rotary operation unit comprises 4 to 8 pivoted arms, and each pivoted arm is provided with the absorption parts, described absorption parts can realize that once the suction of 4 to 8 IC puts simultaneously.
5. IC testing classification storage device according to claim 1, it is characterized in that: the pivoted arm of described rotary operation unit also can be positioned a position that abandons waste product, is provided with ash can below the described position that abandons waste product.
6. according to each described IC testing classification storage device in the claim 1 to 5, it is characterized in that: described the 2nd IC supply unit comprises IC temporary storage mechanism and IC conveying mechanism, and the IC that described IC temporary storage mechanism will detect is delivered to the finished product charging tray by described IC conveying mechanism with finished product IC after being stored to some.
7. according to each described IC testing classification storage device in the claim 1 to 5, it is characterized in that: described charging tray to be checked is deposited the position for a plurality of, all is arranged at the described first charging tray district; The described discharge plate for the treatment of is deposited the position for a plurality of, all is arranged at the second charging tray district.
8. according to each described IC testing classification storage device in the claim 1 to 5, it is characterized in that: a described IC supply unit comprises the absorption parts, described absorption parts are positioned over described turntable unit by connecting gear with the absorption of IC on the charging tray to be checked, and described absorption parts can realize that once the suction of 4 to 8 IC puts simultaneously.
9. IC testing classification storage device according to claim 6, it is characterized in that: described IC temporary storage mechanism comprises IC storage tank, motor and drive lead screw, the described screw mandrel of described motor-driven moves to the working area with described IC storage tank.
10. IC testing classification storage device according to claim 9, it is characterized in that: a side of described IC storage tank arranges the compression spring, opposite side arranges cylinder, by described cylinder and compression spring described IC storage tank is positioned, in described cylinder side, a spacing adjusting micrometer is set also.
CN201310155996.9A 2013-04-28 2013-04-28 Sorted storing device for IC (Integrated Circuit) test Active CN103240229B (en)

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CN106697916A (en) * 2016-12-05 2017-05-24 东莞市普华精密机械有限公司 ICT automatic supply device
CN108745932A (en) * 2018-05-25 2018-11-06 上海天安轴承有限公司 A kind of end-play self-operated measuring unit of micro rolling ball bearing
CN108845559A (en) * 2018-05-18 2018-11-20 广州上龙智能科技有限公司 A kind of automatic breeding device
CN110293073A (en) * 2018-03-21 2019-10-01 英稳达科技股份有限公司 The intelligent classification system and method for solar battery sheet
CN116666249A (en) * 2023-07-28 2023-08-29 广东长兴半导体科技有限公司 Wafer testing method

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CN116666249B (en) * 2023-07-28 2024-01-26 广东长兴半导体科技有限公司 Wafer testing method

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