CN103228122B - Multistage subregion cooling system - Google Patents
Multistage subregion cooling system Download PDFInfo
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- CN103228122B CN103228122B CN201310157037.0A CN201310157037A CN103228122B CN 103228122 B CN103228122 B CN 103228122B CN 201310157037 A CN201310157037 A CN 201310157037A CN 103228122 B CN103228122 B CN 103228122B
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- fan
- cooling system
- temperature sensor
- electronic equipment
- multistage
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Abstract
The invention provides a kind of multistage subregion cooling system, for giving electronic equipment dissipating heat, described cooling system comprises multiple temperature sensor and multiple fan, each described transducer is all connected with control chip with each described fan, the radiating area of described electronic equipment is divided into multiple region, each described overlying regions all arranges a temperature sensor and a fan, and described control chip controls the rotating speed of described fan.The present invention's multistage subregion cooling system realizes the multistage subregion heat radiation of multistage fan rotating speed and can, according to actual temperature from Row sum-equal matrix, accomplish as much as possible to reduce space, energy savings, be convenient to maintenance on the basis ensureing equipment cooling while realizing being dispelled the heat in equipment subregion.
Description
Technical field
The present invention relates to electronic equipment dissipating heat system, particularly relate to a kind of multistage subregion cooling system on large area electron integrated component.
Background technology
Along with the development of electronic technology, the development that electronic equipment is being advanced by leaps and bounds, electronic equipment forward miniaturization, electronic original part is more and more less, the integration degree of electron plate is more and more higher, electronic curtain is also towards high-resolution simultaneously, large area develops, but this also means that the heat that unit are produces in electronic equipment use procedure is also more and more higher, what draw is exactly its heat dissipation problem thereupon, and because electron plate, cause zones of different temperature different from working level such as the position of the arrangement of the original paper of electronic curtain etc. has very large gap, even the heat that in same electronic equipment, each component units produces is also different, the holistic radiating mode of traditional list cannot be satisfied the demand, high-temperature area fast cooling cannot be made, and the space occupied is large, consume energy high, waste resource, the miniaturization that impact is overall.
Following heat abstractor is disclosed in prior art, such as application number is semiconductor encapsulation and the heat radiation shape lead frame of CN201080052196.9, exposing outside the leading part be connected by wire bonding with semiconductor element, semiconductor element is kept and side element-retaining member that heat is dispelled the heat overleaf in face side, and separate in the encapsulation in insulating divisions portion of leading part and element-retaining member by insulating resin, in the boundary face in element-retaining member and insulating divisions portion, the surface of semiconductor element is kept to comprise crooked route repeatedly to the creepage path encapsulating the back side, so the rear side sealing resin keeping the region of semiconductor element to seal being leached into encapsulation can be prevented.In addition, also have application number to be the prior art of CN201010154205.7, temperature acquisition is carried out to the hot subregion of inside communication equipment; By the associated configuration of gathered temperature and described hot subregion and other subregions, calculate the radiation parameter of heat-sink unit in described hot subregion; In described hot subregion, heat-sink unit dispels the heat according to described radiation parameter.There is following defect in above-mentioned prior art: equipment is connected with exposed parts such as semiconductors, insulating properties needs to be investigated, if simultaneously due to separated the insulating divisions portion of leading part and element-retaining member by insulating resin encapsulation in make operationally temperature cross high resin spontaneous combustion may to occur, no longer adopt fan cooling, cost and technical requirement increase, and simple subregion heat radiation cannot realize the adjustment of the degree of heat radiation unified.
Summary of the invention
The present invention is directed to above-mentioned deficiency of the prior art and needs, propose a kind of reduce space, energy savings, be convenient to keep in repair multistage subregion cooling system.
To achieve these goals, the present invention proposes a kind of multistage subregion cooling system, for giving electronic equipment dissipating heat, described cooling system comprises multiple temperature sensor and multiple fan, each described transducer is all connected with control chip with each described fan, the radiating area of described electronic equipment is divided into multiple region, and each described overlying regions all arranges a temperature sensor and a fan, and described control chip controls the rotating speed of described fan.
Optionally, described electronic equipment, described temperature sensor, described fan and described control chip are powered by same electronic equipment power source.
Optionally, described fan is driven by the motor that speed is controlled.
Optionally, described temperature sensor, described fan, described motor are installed on base, and described transducer is positioned at the below of described fan.
Optionally, described electronic equipment is divided into five heat dissipation region, and wherein four heat dissipation region are positioned at around another heat dissipation region.
Optionally, described control chip is CUP or single-chip microcomputer.
The Advantageous Effects of the present invention's multistage subregion cooling system is: the multistage subregion cooling system of the present invention with the thinking of modularized design by the means in conjunction with warming technology, electronic technology, realize the multistage subregion heat radiation of multistage fan rotating speed while realizing being dispelled the heat in equipment subregion and can, according to actual temperature from Row sum-equal matrix, accomplish as much as possible to reduce space, energy savings, be convenient to maintenance on the basis ensureing equipment cooling.
Accompanying drawing explanation
Fig. 1 is the structural representation of the multistage subregion cooling system of the present invention.
Fig. 2 is the schematic diagram of the radiating module cell cube of the multistage subregion cooling system of the present invention.
Embodiment
Below; by reference to the accompanying drawings 1 and Fig. 2 the present invention is described in further detail; the present embodiment is implemented under premised on technical solution of the present invention, give detailed execution mode and concrete operating process, but protection scope of the present invention is not limited to following embodiment.
Please refer to Fig. 1, the present invention proposes a kind of multistage subregion cooling system, this cooling system is used for dispelling the heat to electronic equipment 10, in the present embodiment, the heat dissipation region of electronic equipment 10 is divided into five regions, and wherein the first heat dissipation region 11, second heat dissipation region 12, the 3rd heat dissipation region 13, the 4th heat dissipation region 14 are positioned at the 5th heat dissipation region 15 around.
First temperature sensor and the first motor-driven first fan 21 are set above the first heat dissipation region 11, first temperature sensor, first motor and the first fan 21 are all fixed on the first base by screw thread, control chip 17 is provided with in the outside of heat dissipation region, control chip 17 and the first temperature sensor, first fan 21 is connected, first temperature sensor detects the temperature of the first heat dissipation region 11, and transfer data to control chip 17, control chip 17 sets the velocity of rotation of the first fan 21 according to the temperature of the first heat dissipation region 11, control chip 17 is velocities of rotation that the rotating speed of the first motor by controlling the first fan 21 controls the first fan 21, first motor is the controlled motor of speed, this control chip 17 can be the control appliance CPU of electronic equipment self or additional control appliance single-chip microcomputer, above-mentioned electronic equipment, first temperature sensor, first fan 21 and control chip 17 are powered by same electronic equipment power source 16.
Above the second temperature sensor above the second heat dissipation region 12 in Fig. 1 and the second fan 22, the 3rd heat dissipation region 13 three-temperature sensor and three fan 23, the 4th temperature sensor above the 4th heat dissipation region 14 and the 4th fan 24, the 5th temperature sensor above the 5th heat dissipation region 15 and tendencies fan 25, its structure, control method and supply power mode, the situation of all with the first heat dissipation region 11 is identical, no longer superfluous words.
Fig. 2 is the schematic diagram of the radiating module cell cube of the multistage subregion cooling system of the present invention, modular unit body is the base unit of multistage subregion radiator, it is by fan 1, motor 2, electronic chip 3, temperature sensor 4, base 5 is formed, wherein temperature sensor 4 and electronic chip 3 have tiny data wire to be connected, and base 5 is all threaded with electronic chip 3, motor 2, temperature sensor 4.This equipment is arranged on as electron plate (electronic screen) position of dispelling the heat, when its work and when producing heat, temperature sensor 4 thermometric, and by the electronic chip 3 of transfer of data, electronic chip 3 is analyzed through row input data, and the rotating speed of the motor 2 in region drives fan 1 to produce the wind-force of different size corresponding to the temperature data control different temperatures transducer 4 of zones of different, thus electron plate rationally can be lowered the temperature according to zones of different different temperatures, reach energy-conservation, reduce the effect in space.
This equipment is mounted in a kind of equipment replacing conventional fan of electronic equipment internal, and its motor, sensor electric energy provide by electronic equipment power source.
More than show and describe general principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Therefore, protection scope of the present invention is when being as the criterion depending on those as defined in claim.
Claims (5)
1. a multistage subregion cooling system, for giving electronic equipment dissipating heat, it is characterized in that: described cooling system comprises multiple temperature sensor and multiple fan, each described transducer is all connected with control chip with each described fan, the radiating area of described electronic equipment is divided into multiple region, each described overlying regions all arranges a temperature sensor and a fan, described temperature sensor is located at below described fan, described control chip controls the rotating speed of described fan, described electronic equipment is divided into five heat dissipation region, wherein four heat dissipation region are positioned at around another heat dissipation region.
2. multistage subregion cooling system according to claim 1, is characterized in that: described electronic equipment, described temperature sensor, described fan and described control chip are powered by same electronic equipment power source.
3. multistage subregion cooling system according to claim 1, is characterized in that: described fan is driven by the motor that speed is controlled.
4. multistage subregion cooling system according to claim 3, is characterized in that: described temperature sensor, described fan, described motor are installed on base.
5. multistage subregion cooling system according to claim 1, is characterized in that: described control chip is CUP or single-chip microcomputer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310157037.0A CN103228122B (en) | 2013-04-28 | 2013-04-28 | Multistage subregion cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310157037.0A CN103228122B (en) | 2013-04-28 | 2013-04-28 | Multistage subregion cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103228122A CN103228122A (en) | 2013-07-31 |
| CN103228122B true CN103228122B (en) | 2016-04-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310157037.0A Expired - Fee Related CN103228122B (en) | 2013-04-28 | 2013-04-28 | Multistage subregion cooling system |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103593029A (en) * | 2013-11-01 | 2014-02-19 | 浪潮电子信息产业股份有限公司 | Design method of power supply and heat dissipation integrated equipment cabinet |
| CN103984372A (en) * | 2014-04-25 | 2014-08-13 | 夏云美 | Intelligent temperature control electric control cabinet |
| CN104571386A (en) * | 2014-12-19 | 2015-04-29 | 合肥彩象信息科技有限公司 | Dust removal and heat radiation type computer host |
| CN106595007A (en) * | 2016-11-09 | 2017-04-26 | 珠海格力电器股份有限公司 | Temperature control device and method, electric cabinet and air-conditioner |
| CN108116341A (en) * | 2016-11-28 | 2018-06-05 | 法乐第(北京)网络科技有限公司 | Functional unit integrates cooling system in mobile unit |
| CN106873671A (en) * | 2017-03-28 | 2017-06-20 | 中国电子科技集团公司第二十九研究所 | A kind of active multilevel heat management device and method |
| CN111061317A (en) * | 2019-12-20 | 2020-04-24 | 深圳市奥拓电子股份有限公司 | LED display controller and safety monitoring circuit thereof |
| CN112105225B (en) * | 2020-09-08 | 2022-04-22 | 苏州浪潮智能科技有限公司 | Heat dissipation control method, device and equipment |
| CN112543567A (en) * | 2020-12-18 | 2021-03-23 | 南京鼎天吉贸易有限公司 | Integrative communication rack device of light-harvesting electricity conversion and fire prevention function |
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| CN101334677A (en) * | 2008-06-23 | 2008-12-31 | 中兴通讯股份有限公司 | Machine frame equipment temperature control system and temperature control method |
| CN201336787Y (en) * | 2008-08-22 | 2009-10-28 | 杭州华三通信技术有限公司 | Communication electronic device |
| JP2010178134A (en) * | 2009-01-30 | 2010-08-12 | Seiko Epson Corp | Projector device |
| CN102014593A (en) * | 2010-10-29 | 2011-04-13 | 艾默生网络能源有限公司 | Water-cooled cabinet |
| CN102289402A (en) * | 2011-08-24 | 2011-12-21 | 浪潮电子信息产业股份有限公司 | Monitoring and managing method based on physical multi-partition computer architecture |
| CN202196366U (en) * | 2011-09-22 | 2012-04-18 | 沈恺 | Laptop radiator |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201223423A (en) * | 2010-11-23 | 2012-06-01 | Inventec Corp | Heat dissipating device and method thereof |
-
2013
- 2013-04-28 CN CN201310157037.0A patent/CN103228122B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101334677A (en) * | 2008-06-23 | 2008-12-31 | 中兴通讯股份有限公司 | Machine frame equipment temperature control system and temperature control method |
| CN201336787Y (en) * | 2008-08-22 | 2009-10-28 | 杭州华三通信技术有限公司 | Communication electronic device |
| JP2010178134A (en) * | 2009-01-30 | 2010-08-12 | Seiko Epson Corp | Projector device |
| CN102014593A (en) * | 2010-10-29 | 2011-04-13 | 艾默生网络能源有限公司 | Water-cooled cabinet |
| CN102289402A (en) * | 2011-08-24 | 2011-12-21 | 浪潮电子信息产业股份有限公司 | Monitoring and managing method based on physical multi-partition computer architecture |
| CN202196366U (en) * | 2011-09-22 | 2012-04-18 | 沈恺 | Laptop radiator |
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| CN103228122A (en) | 2013-07-31 |
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