CN103218648A - Near field communication chip - Google Patents

Near field communication chip Download PDF

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Publication number
CN103218648A
CN103218648A CN2012100171650A CN201210017165A CN103218648A CN 103218648 A CN103218648 A CN 103218648A CN 2012100171650 A CN2012100171650 A CN 2012100171650A CN 201210017165 A CN201210017165 A CN 201210017165A CN 103218648 A CN103218648 A CN 103218648A
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China
Prior art keywords
field communication
communication chip
coil
module
magnetic signal
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Granted
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CN2012100171650A
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Chinese (zh)
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CN103218648B (en
Inventor
康锴
潘文杰
杨丽君
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Nationz Technologies Inc
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Nationz Technologies Inc
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Priority to CN201210017165.0A priority Critical patent/CN103218648B/en
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Abstract

The invention discloses a near field communication chip. The near field communication chip comprises a master control module, a radio frequency receiving and transmitting module, a magnetic signal receiving and transmitting module and a coil module integrated on the chip. The magnetic signal receiving and transmitting module is used for conducting magnetic signal interaction with outside through the coil module. The master control module is used for judging whether the radio frequency receiving and transmitting module is switched on according to magnetic signals transmitted by the magnetic signal receiving and transmitting module or further used for generating magnetic signals and transmitting the magnetic signals to the magnetic signal receiving and transmitting module, and the magnetic signals is transmitted to the outside through the magnetic signal receiving and transmitting module. The radio frequency receiving and transmitting module is used for conducting radio frequency data interaction with the outside. According to the near field communication chip, the coil module used for receiving and transmitting signals is integrated on the chip, the number of peripheral circuits of a card is reduced, and therefore the size of the card is reduced.

Description

A kind of near-field communication chip
Technical field
The present invention relates to the chip integration field, relate in particular to a kind of near-field communication chip.
Background technology
Along with the development of radio-frequency technique, increasing radio-frequency technique is applied in the middle of people's daily life, as mass transit card, RF-SIM card, intelligent SD card, all-in-one campus card.Proposed again in recent years also to come more also to be accepted by people based on the mobile-payment system of radio-frequency technique.Mobile payment is also referred to as mobile-phone payment, allows the user to use its portable terminal (normally mobile phone) that a kind of method of service that account is paid is carried out in the commodity or the service of being consumed exactly.Whole mobile payment value chain comprises that mobile operator, payment services merchant are (such as bank, Unionpay etc.), application provider's (public transport, campus, government utility etc.), equipment supplier's (manufacturer terminal, card vendor, chip supplier etc.), system integrator, businessman and terminal user.
Control for communication distance in mobile-payment system is particularly important.In the technical scheme of communication distance, the low frequency magnetic field coupling is the more excellent reliably mode of a kind of sensitivity between current various control mobile payment terminals and card reader.The induction that the low frequency magnetic field coupling is finished magnetic signal by each coil on portable terminal and the card reader is received and dispatched, and the distance of reaction of signal is directly proportional with the coil physical parameter.And above-mentioned function is to realize by the smart card in the portable terminal; As present RF-SIM card, the function of its existing SIM card is supported the telecommunication of portable terminal, has the function of radio-frequency card to support near-field communication again.Because the widespread use people of mobile payment are more and more higher to the size requirements of card size size, integrated a large amount of functional module and device in less card.In utilization low frequency magnetic field coupling scheme is to receive and dispatch magnetic signal by the magnetic coil that is arranged in card, thereby this magnetic coil occupies certain area in card the overall dimensions of card is increased, and is difficult to satisfy people to blocking the application requirements of small compact day by day.The coil integrated level of making of the traditional printing circuit technology is low on the other hand will be to the requirement of magnetic signal induction in order to reach, thereby the number of turn that increases coil makes the area of coil become big, thereby makes the also corresponding increase of area of card.
Summary of the invention
The main technical problem to be solved in the present invention is to provide a kind of near-field communication chip, size that reduces card that can be covert and the sensitivity that increases coil-induced magnetic signal.
For solving the problems of the technologies described above, it is as follows to the invention provides the concrete technical scheme of a kind of near-field communication chip:
A kind of near-field communication chip is characterized in that, described near-field communication chip comprises: main control module, radio-frequency (RF) receiving and transmission module, magnetic signal transceiver module, be integrated in the coil module on the described near-field communication chip; It is mutual that described magnetic signal transceiver module is used for carrying out magnetic signal by the described coil module and the external world; The magnetic signal that described main control module is used for receiving according to self judges whether to open radio-frequency (RF) receiving and transmission module, and described main control module also is used for magnetic signal and is transferred to described magnetic signal transceiver module and sends to the external world by described coil module; Described radio-frequency (RF) receiving and transmission module is used for that to carry out rf data mutual with the external world.
Further, described coil module is a single layer coil.
Further, described coil module is made of a plurality of subcoils that are positioned on the different chip layer.
Further, parallel with one another between the described subcoil on adjacent two chip layer.
Further, the described subcoil that is positioned on the adjacent two layers is parallel with one another by a plurality of metallization via holes.
Further, described coil module comprises a plurality of metallization via holes, and described metallization via hole is arranged between adjacent two subcoils; Described adjacent two subcoils are parallel with one another by described metallization via hole.
Further, the described a plurality of metallization via holes that are positioned on the identical chips layer constitute the metallization via layer; The described metallization via hole alternative arrangement that is positioned on adjacent two metallization via layer
Further, the material of described subcoil is copper, aluminium or X alloy.
Further, the coil encircling in the described coil module around described near-field communication chip, the photoetching process that the integrated employing CMOS IC of described coil is adopted.
Further, described coil is provided with exit, is used to draw the magnetic signal that described coil receives.
Further, the substrate under the described coil is the NT-N type.
The invention has the beneficial effects as follows:
The integrated coil module that can receive magnetic signal can reduce chip outer circuit and components and parts in the near-field communication chip of the present invention, thereby reduces the size of card; Subcoil parallel connection on the different chip layer reduces the series equivalent resistance of coil, increases the sensitivity of coil module induced magnetism signal; Metallization via hole alternative arrangement in the coil module on the adjacent two layers can make the effect of subcoil parallel connection better, reduces series equivalent resistance; Adopt the NT-N substrate to reduce eddy current, reduce energy loss; Exit is set makes things convenient for drawing of magnetic signal.
Description of drawings
Fig. 1 is the structural representation of a kind of near-field communication chip of the embodiment of the invention one;
Fig. 2 is the sectional view of a kind of coil module of the embodiment of the invention one;
Fig. 3 is the cross-sectional view of the another kind of coil module of the embodiment of the invention two;
Fig. 4 is the cross-sectional view of a kind of coil module of the embodiment of the invention two;
Fig. 5 is the cross-sectional view of the another kind of coil module of the embodiment of the invention two.
Embodiment
In conjunction with the accompanying drawings the present invention is described in further detail below by embodiment.
Embodiment one:
Please refer to Fig. 1, be the structural representation of present embodiment near-field communication chip.The near-field communication chip of present embodiment comprises: main control module, radio-frequency (RF) receiving and transmission module, magnetic signal transceiver module, be integrated in the coil module on the described near-field communication chip; It is mutual that described magnetic signal transceiver module is used for carrying out magnetic signal by the described coil module and the external world; Described main control module is used for magnetic signal according to the transmission of described magnetic signal transceiver module and judges whether to open radio-frequency (RF) receiving and transmission module or also be used to produce magnetic signal and be transferred to described magnetic signal transceiver module and send to the external world by described coil module; Described radio-frequency (RF) receiving and transmission module is used for that to carry out rf data mutual with the external world.The photoetching process that adopted of the integrated employing CMOS IC of coil wherein, can realize the thin higher integrated level of more smart system, can be integrated on very little chip area much larger than the integrated coil turn of traditional printing circuit technology, improve the induction sensitivity of coil to magnetic signal.At 0.1um-0.3um, the space of the hundreds of um that therefore only needs to stretch out on chip 4 limits just can make hundreds of extremely coils of thousands of circles therein to high-density as the live width of the attainable metal interconnection line of current typical CMOS technology and distance between centers of tracks.Coil turn is huge, and the total magnetic flux that produces in the spiral winding that the series connection back forms on the structure can satisfy application requirements.Go up coil and the magnetic field detection chip IC area after integrated for whole and be far smaller than circuit board coil area occupied.
Coil in the present embodiment can be to be made of single coil, is encompassed the coil of screw type on chip by plain conductor.Certainly the coil in the present embodiment can be made of a plurality of subcoils that are positioned on the different chip layer.As shown in Figure 2, integrated coil is divided into 1 to 7 layer on the sheet, at each layer subcoil is set all, and the subcoil that is positioned at then on the different layers is connected to form coil.
In the present embodiment in the coil module material of coil can be copper, aluminium or X alloy.
Embodiment two:
The near-field communication chip of present embodiment is on the basis of embodiment one, will be by a plurality of subcoil parallel connections that are positioned on the different layers by the metallization via hole.As shown in Figure 3, the the 1st, 3,7 layer at the near-field communication chip is provided with subcoil, the 2nd, 4,6 layers of chips the metallization via hole being set is the subcoil parallel connection, and metallization via hole a, b, c, d, the e that is positioned at the second layer among the figure will be positioned at the subcoil on the ground floor and the subcoil that is positioned on the 3rd layer is in parallel; Equally the subcoil that is positioned on the 3rd layer of the chip is in parallel with the subcoil that is positioned on the layer 5, the subcoil that is positioned at layer 5 and is positioned on the layer 7 is in parallel by the metallization via hole that is positioned on the layer 6 by the metallization via hole that is positioned at the 4th layer.The size of the equivalent resistance that the subcoil that is positioned on the adjacent two layers is in parallel can reduce the whole winding module by the metallization via hole increases the sensitivity of coil module induced magnetism signal.
Also can the coil on the different layers be filled to parallel-connection structure between the adjacent two layers subcoil in the present embodiment by a large amount of metallization via holes can be set, the metallization via hole that is positioned on the identical layer constitutes the metallization via layer, as shown in Figure 4, on the basis of coil module structure shown in Figure 3, a large amount of metallization via holes is set on the second layer, via hole 1,2,3,4,5 ... the second layer that has n via hole to be filled in the near-field communication chip make be positioned at ground floor and the 3rd layer on subcoil be in parallel, the chip second layer comprises a large amount of metallization via holes, so the second layer also can be referred to as the via layer that metallizes.Because via layer makes the equivalent resistance of coil further reduce by a large amount of metallization via holes is set, and further improves the sensitivity of coil-induced magnetic signal.
Simultaneously a large amount of via holes is only arranged is not enough in order to reach better effect in parallel, also must optimize the layout of the metallization via hole that is positioned on the different metal via layer.Present embodiment is taked the scheme of alternative arrangement, make the via hole alternative arrangement that is positioned at adjacent two metallization via layer exactly, as shown in Figure 5, on the basis of loop construction shown in Figure 3, to be positioned at metallization via hole a, b, c, the d on the chip second layer and be positioned at metallization via hole e, f, g, h alternative arrangement on the 4th layer of the chip, will be positioned at metallization via hole e, f, g, the h on the 4th layer and be positioned at metallization via hole i, j, k, 1 alternative arrangement on the layer 6.In that a large amount of metallization via holes are set equally also is according to carrying out alternative arrangement with the similar mode of above-mentioned Fig. 5, that is to say between adjacent two metallization via layer to carry out alternative arrangement.By the arrangement of metallization via hole is set, make its alternative arrangement, improve the effect in parallel of coil.
Though integrated coil can still have some process characteristics can influence its performance producing big magnetic flux summation by high density and a large amount of number of turn in the small size very much on the sheet in CMOS technology.Because IC goes up plain conductor live width line-spacing than little 2 orders of magnitude of P.e.c., the too little 1-2 of its a thickness order of magnitude; Therefore the resistance of interconnection line is bigger on the sheet.Mix among the IC in most digital-to-analogue, circuit size is very little, only needs the metal interconnection of um level on the sheet between device, and its resistance is little, and the influence that signal is transmitted overcomes by some technological means easily.And integrated gone up coil and be in series by the very big interconnection line of total length, and final lengths is huger than (being resistance square number) with width, therefore total equivalent series resistance coil on the plate.According to the induction theorem, during magnetic field induction work, alternating magnetic field produces the induction electromotive force that distributes on each circle coil; When coil self resistance in series is big, less at the induction current of coil port gained, influence the sensitivity that magnetic signal receives; Therefore must manage to reduce coil resistance.
When the integrated coil, will be used to reduce the coil all-in resistance for the near-field communication chip of above-mentioned problem present embodiment by with the subcoil parallel connection on the different levels.
In the present embodiment position of coil can be arranged on chip around reduce coil, reduce to take area of chip, thereby reduce the size of chip.Can certainly on chip, tell certain area and be used for integrated coil.
Coil in the present embodiment near-field communication chip can be provided with exit, is used to draw magnetic signal, can not need to take the I/O interface of Chip Packaging, makes things convenient for the transmission of magnetic signal.Substrate under the present embodiment coil adopts the NT_N type, and the high resistant characteristic of utilizing NT_N type substrate is in order to reduce eddy current.
To via hole bag hole the time, the distance in bag hole can influence live width, thereby can influence the all-in resistance of coil in real process, thus when wrapping the hole, increase along the bag pitch-row of wiring direction from, reduce the distance that comprises of vertical wirings direction.As when using the hole of array (array) structure, as long as the relative direction in bag hole satisfies certain distance, the distance in bag hole, relative both sides in addition just can be smaller, can along the distance in wiring direction bag hole more than or equal to 0.06um, then the bag pitch-row of vertical wirings direction is from just wrapping 0.01um.
Above content be in conjunction with concrete embodiment to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.

Claims (10)

1. a near-field communication chip is characterized in that, described near-field communication chip comprises: main control module, radio-frequency (RF) receiving and transmission module, magnetic signal transceiver module, be integrated in the coil module on the described near-field communication chip; It is mutual that described magnetic signal transceiver module is used for carrying out magnetic signal by the described coil module and the external world; The magnetic signal that described main control module is used for receiving according to self judges whether to open radio-frequency (RF) receiving and transmission module, and described main control module also is used for magnetic signal and is transferred to described magnetic signal transceiver module and sends to the external world by described coil module; Described radio-frequency (RF) receiving and transmission module is used for that to carry out rf data mutual with the external world.
2. near-field communication chip as claimed in claim 1 is characterized in that, described coil module is a single layer coil.
3. near-field communication chip as claimed in claim 1 is characterized in that, described coil module is made of the subcoil on a plurality of different chip layer that are positioned at described near-field communication chip.
4. near-field communication chip as claimed in claim 3 is characterized in that, the subcoil on described adjacent two chip layer that are positioned at described near-field communication chip is parallel with one another.
5. near-field communication chip as claimed in claim 4 is characterized in that, described coil module comprises a plurality of metallization via holes, and described metallization via hole is arranged between adjacent two subcoils; Described adjacent two subcoils are parallel with one another by described metallization via hole.
6. near-field communication chip as claimed in claim 5 is characterized in that, the described a plurality of metallization via holes that are positioned on the identical chips layer constitute the metallization via layer; The described metallization via hole alternative arrangement that is positioned on adjacent two metallization via layer.
7. near-field communication chip as claimed in claim 6 is characterized in that, the material of described subcoil is copper, aluminium or X alloy.
8. as each described near-field communication chip of claim 1-7, it is characterized in that, the coil encircling during described coil mould is fast around described near-field communication chip, the photoetching process that the integrated employing CMOS IC of described coil is adopted.
9. near-field communication chip as claimed in claim 8 is characterized in that described coil is provided with exit, is used to draw the magnetic signal that described coil receives.
10. near-field communication chip as claimed in claim 9 is characterized in that, the substrate under the described coil is the NT-N type.
CN201210017165.0A 2012-01-19 2012-01-19 A kind of near field communications chip Active CN103218648B (en)

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Publication number Priority date Publication date Assignee Title
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CN101359668A (en) * 2007-07-30 2009-02-04 徐海生 RFID chip
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CN201725360U (en) * 2010-06-08 2011-01-26 淄博泰宝防伪技术产品有限公司 Composite double high frequency card
CN102096836A (en) * 2009-12-09 2011-06-15 国民技术股份有限公司 Radio frequency device, radio frequency card reader and related communication system and communication method
CN201965652U (en) * 2011-04-06 2011-09-07 孟晋 Client card
CN201984512U (en) * 2011-03-29 2011-09-21 上海柯斯软件有限公司 Double-interface SIM card with built-in wires
CN202067299U (en) * 2011-05-24 2011-12-07 国民技术股份有限公司 Radio frequency SIM (subscriber identity module) card and mobile terminal

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1655185B (en) * 2004-02-10 2010-05-12 株式会社日立制作所 Semiconductor chip with coil antenna and communication system with such a semiconductor chip
KR20070092389A (en) * 2006-03-10 2007-09-13 주식회사 비즈모델라인 Multi-function ic card
CN101276959A (en) * 2007-03-30 2008-10-01 麦格耐克斯有限公司 RFID chip with improved range as well as antenna
CN101359668A (en) * 2007-07-30 2009-02-04 徐海生 RFID chip
CN201303050Y (en) * 2008-10-16 2009-09-02 上海集成电路研发中心有限公司 Integrated antenna applied to RFID chip
CN101615892A (en) * 2009-07-24 2009-12-30 中国科学院微电子研究所 Radio-frequency power amplifier
CN102096836A (en) * 2009-12-09 2011-06-15 国民技术股份有限公司 Radio frequency device, radio frequency card reader and related communication system and communication method
CN201725360U (en) * 2010-06-08 2011-01-26 淄博泰宝防伪技术产品有限公司 Composite double high frequency card
CN201984512U (en) * 2011-03-29 2011-09-21 上海柯斯软件有限公司 Double-interface SIM card with built-in wires
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CN202067299U (en) * 2011-05-24 2011-12-07 国民技术股份有限公司 Radio frequency SIM (subscriber identity module) card and mobile terminal

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