CN103208720B - The method of attachment of the external wire of CPU module and jockey - Google Patents
The method of attachment of the external wire of CPU module and jockey Download PDFInfo
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- CN103208720B CN103208720B CN201210014772.1A CN201210014772A CN103208720B CN 103208720 B CN103208720 B CN 103208720B CN 201210014772 A CN201210014772 A CN 201210014772A CN 103208720 B CN103208720 B CN 103208720B
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- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 47
- 229910000679 solder Inorganic materials 0.000 claims abstract description 46
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 43
- 238000003466 welding Methods 0.000 claims abstract description 37
- 229920002396 Polyurea Polymers 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 12
- 238000009966 trimming Methods 0.000 claims description 9
- 238000010521 absorption reaction Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 7
- 238000003801 milling Methods 0.000 claims description 4
- 230000000903 blocking Effects 0.000 claims description 3
- 238000010008 shearing Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 238000002955 isolation Methods 0.000 abstract description 3
- -1 and during welding Chemical compound 0.000 abstract description 2
- 238000003754 machining Methods 0.000 abstract description 2
- 238000009434 installation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 210000001503 Joints Anatomy 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000875 corresponding Effects 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 210000001161 Embryo, Mammalian Anatomy 0.000 description 1
- 230000001808 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
Abstract
The invention discloses method of attachment and the jockey of the external wire of a kind of CPU module, its method of attachment comprises the following steps: S1: on the predetermined solder joint of CPU module, add rosin; S2: place a wire on predetermined solder joint, one end of wire is placed on predetermined solder joint; S3: add tin ball on predetermined solder joint; S4: one end of wire and tin ball bonding are connected on predetermined solder joint.Its jockey comprises for carrying out adding rosin on the predetermined solder joint of CPU module, place wire, adding the annular of tin ball and welding lead rotation wire bonds mechanism (1).The beneficial effect implementing method of attachment of the present invention and jockey is: the predetermined solder joint of CPU module adds rosin, and during welding, rosin provides protection, air-isolation to weld, avoids weld to be oxidized, and improves the useful life of finished product; The small volume of jockey simultaneously, convenient installation, arranges processing stations at round turntable periphery, improves working (machining) efficiency.
Description
Technical field
The present invention relates to moving communicating field, more particularly, relate to method of attachment and the jockey of the external wire of a kind of CPU module.
Background technology
Along with information technology and economic develop rapidly all over the world, economy between people and information interchange more and more frequent, simultaneously people are also finding various communication media easily always, from early stage magnetic card storage card finally, logic encryption card and a lot of contact type CPU card (smart card) of using of field now.Current smart card also plays irreplaceable effect in the life of people, and be that contact intelligent card or contact type intelligent card all have its respective merits and demerits, the wearing and tearing between contact intelligent card and card machine tool, substantially reduce its useful life.And non-contact card is in the occasion of radio frequency interference severity, its application is limited; Secondly due to by coupling transferring energy, so require that its power consumption is very low; Moreover, due to present a lot of industry, as the industries such as finance, communication have existed technology and the infrastructure of a large amount of contact card application, continuation is also used contact card by them, the double-interface card of contact card and non-contact card advantage arises at the historic moment between this situation set, increasing to the demand of double-interface card on market.In prior art, the method of producing card is: a groove milling knockout sheet slot on the card embryo card being built-in with antenna, exposes built-in antenna, then in chip slot, place CPU module in chip slot, CPU module is welded and has wire in advance, wire and antenna carry out wire bonds.But the method for welding lead in this CPU module of prior art, easily causes weld to be oxidized, thus reduces the useful life of finished product in welding process.
Summary of the invention
One of the technical problem to be solved in the present invention is, for the method for welding lead in this CPU module of the above-mentioned prior art of prior art, in welding process, easily cause weld to be oxidized, thus reduce the defect in the useful life of finished product, the method for attachment of the external wire of a kind of CPU module is provided.
Two of the technical problem to be solved in the present invention is, for the method for welding lead in this CPU module of the above-mentioned prior art of prior art, in welding process, easily cause weld to be oxidized, thus reduce the defect in the useful life of finished product, the jockey of the external wire of a kind of CPU module is provided.
The present invention solves the technical scheme that one of its technical problem adopts: the method for attachment constructing the external wire of a kind of CPU module, comprises rotating wire bonds mechanism by annular and carrying out following steps:
S1: add rosin on the predetermined solder joint of CPU module;
S2: place a wire on predetermined solder joint, one end of wire is placed on predetermined solder joint;
S3: add tin ball on predetermined solder joint;
S4: one end of wire and tin ball bonding are connected on predetermined solder joint.
In the method for attachment of the external wire of CPU module of the present invention, also comprise step S1.1 before described step S1: CPU module be placed on the workbench of rotating group.
In the method for attachment of the external wire of CPU module of the present invention, further comprising the steps of after described step S4:
S5: by the CPU module card milling out chip slot being placed on welding lead;
S6: upset CPU module;
S7: the welding wire of CPU module and the built-in antenna of card;
S8: the CPU module welded together wire and antenna and card are transferred to orthoscopic implanted chip mechanism.
In the method for attachment of the external wire of CPU module of the present invention, be also included in orthoscopic implanted chip mechanism after described step S8 and carry out following steps:
S9: the CPU module welded together wire and antenna and card carry out non-contact detecting and trimming, wipes out the unnecessary wire of weld and antenna;
S10: repair line to the wire after trimming and antenna, revises the position of wire and antenna, CPU module is placed in directly over card chip slot;
S11: CPU module is implanted in the chip slot of card;
S12: carry out hot weld, make PUR melting in CPU module with the bonding connection of chip slot;
S13: carry out cold welding, make the PUR cooled and solidified of melting with make CPU module and chip slot affixed;
S14: contact detection and non-contact detecting are carried out to CPU module and card;
S15: according to testing result, the qualified card of separate collection blocks with useless.
The present invention solves the technical scheme that its technical problem two adopts: the jockey constructing the external wire of a kind of CPU module, comprises for carrying out adding rosin on the predetermined solder joint of CPU module, places wire, adds the annular of tin ball and welding lead and rotate wire bonds mechanism.
In the jockey of the external wire of CPU module of the present invention, described annular is rotated wire bonds mechanism and is comprised rotating group, described rotating group comprises at least one workbench of the rotatable round turntable CPU module to be processed with the placement being installed in round turntable circumferential edges, described round turntable drives described workbench to rotate, stop operating to workbench described during processing stations, described processing stations comprises and is arranged on described round turntable periphery, the following mechanism of CPU module in processing handling stage: for store CPU module to be processed and a CPU module is placed described workbench thereunder put chipset, rosin group is added for what add rosin on the predetermined solder joint turning to the CPU module below it, for turning to the unwrapping wire group of the predetermined solder joint adding the CPU module of rosin below it being placed wire, described unwrapping wire group comprises the first unwrapping wire group and the second unwrapping wire group, for turn to the predetermined solder joint placing the CPU module of wire below it adds tin ball add tin ball group, for one end of wire and tin ball bonding being connected on the first soldering group on the predetermined solder joint of CPU module.
In the jockey of the external wire of CPU module of the present invention, described processing stations also comprises and is arranged on described round turntable periphery, the following mechanism of CPU module in processing handling stage: for store the card that mills out chip slot and a card is placed on the CPU module of welding lead other enter card group, for the upset group of the CPU module after reverse welding wire, for welding the second soldering group of wire that CPU module welded and the built-in antenna of card, for the card release group that the CPU module that wire and antenna welded together and card migrate out.
In the jockey of the external wire of CPU module of the present invention, the jockey of the external wire of this CPU module also comprises orthoscopic implanted chip mechanism, described orthoscopic implanted chip mechanism comprises: for receiving the CPU module and card that described card release group migrates out, non-contact detecting is carried out to CPU module and card and the non-contact detecting of wire unnecessary for weld and antenna being wiped out and line shearing group, for carrying out position correction to the wire after trimming and antenna, CPU module is placed in and directly over card chip slot, repaiies line group, for CPU module being implanted the implanted chip group in the chip slot of card, for making PUR melting in CPU module with the hot weld group with the bonding connection of chip slot, for making the PUR cooled and solidified of melting to make the affixed cold welding group of CPU module and chip slot, for carrying out the contact detection group of contact detection to the CPU module after cold welding and card, for carrying out the non-contact detecting group of non-contact detecting to the CPU module after contact detection and card, qualified card collection group for collecting qualified card according to testing result useless card collection group of blocking useless in collection.
In the jockey of the external wire of CPU module of the present invention, the described tin ball group that adds comprises the Y-axis motion that can move along Y-axis, described Y-axis motion is provided with the Z axis motion that can move along Z axis, Z axis motion be installed with absorption tin ball and the tin ball of absorption be placed on the Xi Xi ball mechanism on the predetermined solder joint of the CPU module of placing wire under described Y-axis motion and Z axis motion drive, described Xi Xi ball mechanism offers vacuum interface, below Xi Xi ball mechanism, is provided with the tin disc mechanism placing tin ball.
In the jockey of the external wire of CPU module of the present invention, described hot weld group, comprise the first hot weld group and the second hot weld group.
Implement method of attachment and the jockey of the external wire of CPU module of the present invention; there is following beneficial effect: on the predetermined solder joint of CPU module, add rosin; during welding, rosin provides protection, air-isolation to weld, avoids weld to be oxidized, and improves the useful life of finished product.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the flow process chart of method of attachment first embodiment of the external wire of CPU module of the present invention;
Fig. 2 is the structural representation of jockey first embodiment of the external wire of CPU module of the present invention;
Fig. 3 is the structural representation adding tin ball group in Fig. 2.
Embodiment
In order to there be understanding clearly to technical characteristic of the present invention, object and effect, now contrast accompanying drawing and describe the specific embodiment of the present invention in detail.
As shown in Figure 1, in method of attachment first embodiment of the external wire of CPU module of the present invention, comprise and carry out following steps with annular rotation wire bonds mechanism:
S1: add rosin on the predetermined solder joint of CPU module, the rosin added needs appropriate, has 2 predetermined solder joints, A point as shown in Figure 1 and B point in the present embodiment;
S2: place a wire on predetermined solder joint, one end of wire is placed on predetermined solder joint, i.e. A point and B point place each placement wire, and one end of wire is placed on A point or B point, the diameter of wire is about 0.13mm, and the diameter of wire is also not limited thereto size in other embodiments certainly;
S3: add tin ball on predetermined solder joint, namely on A point and B point, add tin ball, the diameter of tin ball is about 0.76mm, in other embodiments, also according to the size of predetermined solder joint and diameter of wire, can select the tin ball of suitable size;
S4: one end of wire and tin ball bonding are connected on predetermined solder joint.
In other embodiments, also step S1.1 is comprised before described step S1: CPU module be placed on the workbench of rotating group.
In other embodiments, further comprising the steps of after described step S4:
S5: by the CPU module card milling out chip slot being placed on welding lead, card is built-in with antenna, when card mills out chip slot, the aerial head of antenna exposes in chip slot;
S6: upset CPU module;
S7: the welding wire of CPU module and the built-in antenna of card;
S8: the CPU module welded together wire and antenna and card are transferred to orthoscopic implanted chip mechanism.
In other embodiments, be also included in orthoscopic implanted chip mechanism after described step S8 and carry out following steps:
S9: the CPU module welded together wire and antenna and card carry out non-contact detecting and trimming, wipes out the unnecessary wire of weld and antenna;
S10: repair line to the wire after trimming and antenna, revises the position of wire and antenna, CPU module is placed in directly over card chip slot;
S11: CPU module is implanted in the chip slot of card;
S12: carry out hot weld, make PUR melting in CPU module with the bonding connection of chip slot;
S13: carry out cold welding, make the PUR cooled and solidified of melting with make CPU module and chip slot affixed;
S14: contact detection and non-contact detecting are carried out to CPU module and card, contact detection and non-contact detecting whether qualified in order to the performance detecting CPU module and card;
S15: according to testing result, the qualified card of separate collection blocks with useless.
As shown in Figure 2, in the first embodiment of the jockey of the external wire of CPU module of the present invention, comprise for carrying out adding rosin on the predetermined solder joint of CPU module, place wire, adding the annular of tin ball and welding lead rotation wire bonds mechanism 1.
Annular is rotated wire bonds mechanism 1 and is comprised rotating group 111, rotating group 111 comprises at least one workbench 1112 of rotatable round turntable 1111 CPU module to be processed with the placement being installed in round turntable 1111 circumferential edges, the present embodiment comprises 12 workbench 1112, the circumferential edges of round turntable 1111 arranges a workbench 1112 every the central angle of 30 degree, round turntable 1111 drives workbench 1112 to rotate, stop operating to workbench during processing stations 1112, processing stations comprises and is arranged on round turntable 1111 periphery, the following mechanism of CPU module in processing handling stage: for store CPU module to be processed and a CPU module is placed workbench 1112 thereunder put chipset 101, rosin group 102 is added for what add rosin on the predetermined solder joint turning to the CPU module below it, for turning to the unwrapping wire group 103 of the predetermined solder joint adding the CPU module of rosin below it being placed wire, 104, unwrapping wire group 103, 104 comprise the first unwrapping wire group 103 and the second unwrapping wire group 104, for turn to the predetermined solder joint placing the CPU module of wire below it adds tin ball add tin ball group 105, for one end of wire and tin ball bonding being connected on the first soldering group 106 on the predetermined solder joint of CPU module.
In the present embodiment, as above-mentioned, CPU module has 2 predetermined solder joints, the A point namely shown in Fig. 1 and B point.First soldering group 106 can use the welders such as laser, infrared ray, ultrasonic wave or electric iron, one of wire section with A, B two together with contact weld.
Processing stations also comprise be arranged on round turntable 1111 periphery, the following mechanism of CPU module in processing handling stage: for store the card that mills out chip slot and a card is placed on the CPU module of welding lead other enter card group 107, for the upset group 108 of the CPU module after reverse welding wire, for welding the second soldering group 109 of wire that CPU module welded and the built-in antenna of card, for the card release group 110 that the CPU module that wire and antenna welded together and card migrate out.
Processing stations also comprises unwrapping wire group for subsequent use and for subsequent usely adds rosin group (not marking numeral in figure), unwrapping wire group for subsequent use and 10 the mechanism 101-110 adding rosin group and above-mentioned processing stations for subsequent use form 12 processing stations, 12 processing stations are evenly arranged on round turntable 1111 periphery, every 30 degree, a processing stations is set, with with 12 workbench 1112 cooperatings, the CPU module on the workbench 1112 turned to below it and card are processed.Round turntable 1111 rotates around its center of circle, drive 12 workbench 1112 to rotate thereupon, workbench 1112 stops operating when turning to processing stations, the corresponding mechanism of processing stations carries out processing process to the CPU module on workbench 1112, processing process aftertable 1112 turns to next processing stations again, the like.The device of the present embodiment, change the linear structure of prior art, be designed to circular configuration, round turntable 1111 periphery arranges corresponding processing stations, and this structure can the space of saveall, reduces the volume of device, improves working (machining) efficiency simultaneously.
The predetermined solder joint of CPU module adds rosin, and during welding, rosin provides protection, air-isolation to weld, avoids weld to be oxidized, and improves the useful life of finished product.
In other embodiments, the jockey of the external wire of this CPU module also comprises orthoscopic implanted chip mechanism 2, orthoscopic implanted chip mechanism 2 comprises: for receiving the CPU module and card that card release group 110 migrates out, non-contact detecting is carried out to CPU module and card and the non-contact detecting of wire unnecessary for weld and antenna being wiped out and line shearing group 211, for carrying out position correction to the wire after trimming and antenna, CPU module is placed in and directly over card chip slot, repaiies line group 212, for CPU module being implanted the implanted chip group 213 in the chip slot of card, for making PUR melting in CPU module with the hot weld group 214 with the bonding connection of chip slot, 215, for making the PUR cooled and solidified of melting to make the affixed cold welding group 216 of CPU module and chip slot, for carrying out the contact detection group 217 of contact detection to the CPU module after cold welding and card, for carrying out the non-contact detecting group 218 of non-contact detecting to the CPU module after contact detection and card, qualified card collection group 219 for collecting qualified card according to testing result useless card collection group 220 of blocking useless in collection.
Further, as shown in Figure 3, add tin ball group 105 and comprise the Y-axis motion 1051 that can move along Y-axis, Y-axis motion 1051 is provided with the Z axis motion 1052 that can move along Z axis, Z axis motion 1052 be installed with absorption tin ball and the tin ball of absorption be placed on the Xi Xi ball mechanism 1054 on the predetermined solder joint of the CPU module of placing wire under Y-axis motion 1051 and Z axis motion 1052 drive, Xi Xi ball mechanism 1054 offers the tin disc mechanism 1053 being provided with below vacuum interface 1055, Xi Xi ball mechanism 1054 and placing tin ball.2 tin balls are adsorbed from tin disc mechanism 1053 in Xi Xi ball mechanism 1054, are placed on the predetermined solder joint of the CPU module of placing wire by the tin ball of absorption under Y-axis motion 1051 and Z axis motion 1052 drive.
Hot weld group 214,215 comprises the first hot weld group 214 and the second hot weld group 215.
In the present embodiment, card used is built-in with antenna, and card mills out chip slot in advance, and 2 aerial heads of antenna are exposed in chip slot, and 2 wire heads of 2 wires that 2 aerial heads have welded with CPU module weld.CPU module is attached with PUR in advance.
By reference to the accompanying drawings embodiments of the invention are described above; but the present invention is not limited to above-mentioned embodiment; above-mentioned embodiment is only schematic; instead of it is restrictive; those of ordinary skill in the art is under enlightenment of the present invention; do not departing under the ambit that present inventive concept and claim protect, also can make a lot of form, these all belong within protection of the present invention.
Claims (8)
1. a method of attachment for the external wire of CPU module, is characterized in that, comprises and carries out following steps with annular rotation wire bonds mechanism:
S1: add rosin on the predetermined solder joint of CPU module;
S2: place a wire on predetermined solder joint, one end of wire is placed on predetermined solder joint;
S3: add tin ball on predetermined solder joint;
S4: one end of wire and tin ball bonding are connected on predetermined solder joint;
S5: by the CPU module card milling out chip slot being placed on welding lead;
S6: upset CPU module;
S7: the welding wire of CPU module and the built-in antenna of card;
S8: the CPU module welded together wire and antenna and card are transferred to orthoscopic implanted chip mechanism.
2. the method for attachment of the external wire of CPU module according to claim 1, is characterized in that, also comprises step S1.1: CPU module be placed on the workbench of rotating group before described step S1.
3. the method for attachment of the external wire of CPU module according to claim 1, is characterized in that, is also included in orthoscopic implanted chip mechanism and carries out following steps after described step S8:
S9: the CPU module welded together wire and antenna and card carry out non-contact detecting and trimming, wipes out the unnecessary wire of weld and antenna;
S10: repair line to the wire after trimming and antenna, revises the position of wire and antenna, CPU module is placed in directly over card chip slot;
S11: CPU module is implanted in the chip slot of card;
S12: carry out hot weld, make PUR melting in CPU module with the bonding connection of chip slot;
S13: carry out cold welding, make the PUR cooled and solidified of melting with make CPU module and chip slot affixed;
S14: contact detection and non-contact detecting are carried out to CPU module and card;
S15: according to testing result, the qualified card of separate collection blocks with useless.
4. a jockey for the external wire of CPU module, is characterized in that, comprises for carrying out adding rosin on the predetermined solder joint of CPU module, place wire, adding the annular of tin ball and welding lead rotation wire bonds mechanism (1);
Described annular is rotated wire bonds mechanism (1) and is comprised rotating group (111), described rotating group (111) comprises rotatable round turntable (1111) and is installed at least one workbench (1112) of the placement of round turntable (1111) circumferential edges CPU module to be processed, described round turntable (1111) drives described workbench (1112) to rotate, stop operating to workbench (1112) described during processing stations, described processing stations comprises and is arranged on described round turntable (1111) periphery, the following mechanism of CPU module in processing handling stage: for store CPU module to be processed and a CPU module is placed described workbench (1112) thereunder put chipset (101), rosin group (102) is added for what add rosin on the predetermined solder joint turning to the CPU module below it, for turning to the unwrapping wire group (103 of the predetermined solder joint adding the CPU module of rosin below it being placed wire, 104), described unwrapping wire group (103,104) the first unwrapping wire group (103) and the second unwrapping wire group (104) is comprised, for turn to the predetermined solder joint placing the CPU module of wire below it adds tin ball add tin ball group (105), for one end of wire and tin ball bonding being connected on the first soldering group (106) on the predetermined solder joint of CPU module.
5. the jockey of the external wire of CPU module according to claim 4, it is characterized in that, described processing stations also comprises and is arranged on described round turntable (1111) periphery, the following mechanism of CPU module in processing handling stage: for store the card that mills out chip slot and a card is placed on the CPU module of welding lead other enter card group (107), for the upset group (108) of the CPU module after reverse welding wire, for welding second soldering group (109) of wire that CPU module welded and the built-in antenna of card, for the card release group (110) that the CPU module that wire and antenna welded together and card migrate out.
6. the jockey of the external wire of CPU module according to claim 4, it is characterized in that, the jockey of the external wire of this CPU module also comprises orthoscopic implanted chip mechanism (2), described orthoscopic implanted chip mechanism (2) comprising: for receiving the CPU module and card that described card release group (110) migrates out, non-contact detecting is carried out to CPU module and card and the non-contact detecting of wire unnecessary for weld and antenna being wiped out and line shearing group (211), for carrying out position correction to the wire after trimming and antenna, CPU module is placed in and directly over card chip slot, repaiies line group (212), for CPU module being implanted the implanted chip group (213) in the chip slot of card, for making PUR melting in CPU module with the hot weld group (214 with the bonding connection of chip slot, 215), for making the PUR cooled and solidified of melting to make the affixed cold welding group (216) of CPU module and chip slot, for carrying out the contact detection group (217) of contact detection to the CPU module after cold welding and card, for carrying out the non-contact detecting group (218) of non-contact detecting to the CPU module after contact detection and card, qualified card collection group (219) for collecting qualified card according to testing result useless card collection group (220) of blocking useless in collection.
7. the jockey of the external wire of CPU module according to claim 4, it is characterized in that, the described tin ball group (105) that adds comprises the Y-axis motion (1051) that can move along Y-axis, described Y-axis motion (1051) is provided with the Z axis motion (1052) that can move along Z axis, Z axis motion (1052) be installed with absorption tin ball and the tin ball of absorption be placed on the Xi Xi ball mechanism (1054) on the predetermined solder joint of the CPU module of placing wire under described Y-axis motion (1051) and Z axis motion (1052) drive, described Xi Xi ball mechanism (1054) offers vacuum interface (1055), Xi Xi ball mechanism (1054) below is provided with the tin disc mechanism (1053) placing tin ball.
8. the jockey of the external wire of CPU module according to claim 6, is characterized in that, described hot weld group (214,215) comprises the first hot weld group (214) and the second hot weld group (215).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210014772.1A CN103208720B (en) | 2012-01-17 | 2012-01-17 | The method of attachment of the external wire of CPU module and jockey |
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| CN201210014772.1A CN103208720B (en) | 2012-01-17 | 2012-01-17 | The method of attachment of the external wire of CPU module and jockey |
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| CN103208720B true CN103208720B (en) | 2015-09-02 |
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| CN104148834B (en) * | 2014-08-01 | 2017-02-15 | 广州明森科技股份有限公司 | Equipment and method for efficiently welding chips of double-interface intelligent cards |
| CN104148833B (en) * | 2014-08-01 | 2015-09-30 | 广州市明森机电设备有限公司 | A kind of Double interface intelligent card chip welding method and welding equipment |
| CN108666851B (en) * | 2017-10-13 | 2019-10-08 | 深圳安博电子有限公司 | A kind of segmented line sending equipment and line sending method |
| CN114799402B (en) * | 2022-06-27 | 2022-09-02 | 南通同贵模具科技有限公司 | Soldering device convenient for temperature adjustment for electronic product production |
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| CN1388613A (en) * | 2001-05-30 | 2003-01-01 | 株式会社萌利克 | Method and apparatus for connecting conductor |
| CN102303189A (en) * | 2011-08-15 | 2012-01-04 | 佛山市顺德区德芯智能科技有限公司 | IC card welding device for dual-interface welding packaging machine and control method of IC card welding device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1967936A (en) * | 2006-11-24 | 2007-05-23 | 深圳市明华澳汉科技股份有限公司 | Double-interface card module and connection method of antenna |
| CN102133686B (en) * | 2011-01-24 | 2013-12-18 | 东莞市锐祥智能卡科技有限公司 | Wire soldering method and device for dual interface cards |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1388613A (en) * | 2001-05-30 | 2003-01-01 | 株式会社萌利克 | Method and apparatus for connecting conductor |
| CN102303189A (en) * | 2011-08-15 | 2012-01-04 | 佛山市顺德区德芯智能科技有限公司 | IC card welding device for dual-interface welding packaging machine and control method of IC card welding device |
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