CN103199047A - Wafer center prealignment method - Google Patents
Wafer center prealignment method Download PDFInfo
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- CN103199047A CN103199047A CN2012100023095A CN201210002309A CN103199047A CN 103199047 A CN103199047 A CN 103199047A CN 2012100023095 A CN2012100023095 A CN 2012100023095A CN 201210002309 A CN201210002309 A CN 201210002309A CN 103199047 A CN103199047 A CN 103199047A
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Abstract
A wafer center prealignment method comprises the following steps: a first step of providing a turn table motor for supporting and rotating one wafer, a second step of providing an optical detector used for collecting edge data of the wafer and obtaining a corresponding coded disc value of the turn table motor, a third step of data sampling, data conversion, obtaining a present motor coded disc value, rectangular coordinate fitting and determining a circle through three points, and a fourth step of obtaining a present wafer circle center position by carrying out three point fitting for many times to obtain an average. According to the wafer center prealignment method, a three point fitting method is adopted for obtaining the center position of the wafer, the method is not affected by single sampling data error, data sampling is very convenient, and the center of the wafer can be calculated easily and high efficiently by full utilizing of sampling data.
Description
Technical field
The present invention relates to a kind of computer control field, refer to that especially a kind of IC makes definite method of field crystal circle center.
Background technology
Along with development of science and technology, commercial production scale is increasing, so human cost can increase, and efficient requires also more and more higher, gradually a large amount of automation or semi-automatic instruments introduced in factory all need to obtain in advance wafer accurate in locating and attitude as a lot of technologies in the IC manufacturing.When semiconductor technology develops into deep-submicron, Nano grade from micron order, the IC manufacturing equipment has reached very harsh stage to the requirement of each subsystem.As the wafer prealignment device of one of IC manufacturing equipment critical component, its service behaviour directly influences precision and the efficient of entire I C manufacturing process.
It is one of main task of wafer prealignment that off-centre is asked in the wafer match.In the wafer The Fitting Calculation method of current use, radius of gyration method amount of calculation is little, but it requires sampled point will evenly distribute with respect to the angle of pivot, and all sampled points add up to two even numbers, cause very big difficulty for the data acquisition of sampled point; Though track fitting method amount of calculation is little, wafer is not the rule circle, and has breach, and is not easy to operate.
Summary of the invention
In view of above content, be necessary to provide a kind of simple and effective to ask the method for crystal circle center.
A kind of crystal circle center prealignment method may further comprise the steps: provide a rotating platform motor, in order to support rotation one wafer; Optical detector, in order to gather crystal round fringes data and the code-disc value of obtaining corresponding rotating platform motor, this method is further comprising the steps of:
Data sampling: rotate a circle marginal date in the process of described wafer is gathered in the rotation of the described wafer of described rotating platform driven by motor, described optical detector, and obtains the code-disc Value Data of corresponding rotating platform motor simultaneously;
Data transaction: after removing near the data of breach, the marginal date that optical detector is sampled converts boundary point to apart from the physical length data of motor pivot;
Obtain when front motor code-disc value: obtain the code-disc value of rotating platform motor under current halted state, with this benchmark code-disc value as the rectangular coordinate match;
Rectangular coordinate match: according to motor benchmark code-disc value, the motor code-disc Value Data that sampling is obtained is converted to angle-data, according to angle-data, just can calculate each sample point coordinate under current rectangular coordinate system by the boundary point length data, finish that so sampled data is converted to the rectangular coordinate data;
Determine a circle at 3: three points of sampling, obtain the home position of a match circle under described rectangular coordinate with 3 circle approximating methods.
In one embodiment, repeat 3 matches circle, obtain the data of many group match circles, and the data that will organize the match circle are averaging more, just can obtain the wafer home position.
In one embodiment, described wafer to the distance of the pivot of described rotating platform motor equals pivot to the distance of described optical detector and deducts described crystal round fringes to the distance of described optical detector.
In one embodiment, described optical detector has maximum range L, and described maximum range is S to the distance of described pivot, and the distance that described optical detector is measured the edge of described wafer is l
i(i ∈ (1,2,3...N)), described crystal round fringes to the distance of described pivot is S+L-l
i, (i ∈ (1,2,3...N)).
In one embodiment, to be converted to angle-data be θ to the motor code-disc value that obtains of the corresponding sampling of described crystal round fringes
i(i ∈ (1,2,3...N)), the coordinate figure of described crystal round fringes under described rectangular coordinate system can by described crystal round fringes to described pivot apart from S+L-l
i, (i ∈ (1,2,3...N)) and angle θ
i(i ∈ (1,2,3...N)) calculates ((S+L-l
i) cos θ
i, (S+L-l
i) sin θ
i) wherein, i ∈ (1,2,3...N).
In one embodiment, from the marginal value of described wafer at interval choose 3 points, obtain the coordinate (A of match circle by 3 match circule methods
1, B
1), the central coordinate of circle value that the coordinate figure that obtains by round match is repeatedly obtained wafer is
In one embodiment, choose and do not require equally spaced collection for three of described wafer.
Compared with prior art, in the above-mentioned crystal circle center prealignment method, ask the position at the center of wafer by 3 approximating methods, this method is not subjected to the influence of single sampled data error, and the sampling of data is very convenient, and can utilize sampled data fully, simply and efficiently calculate the center of wafer.
Description of drawings
Fig. 1 is a schematic diagram of crystal circle center of the present invention prealignment apparatus embodiments structure.
Fig. 2 is the flow chart that 3 match circles of the present invention are asked partial method.
Fig. 3 is a schematic diagram of crystal round fringes sampled point among the present invention.
Fig. 4 is a schematic diagram of rectangular coordinate data fitting among the present invention.
Fig. 5 is a schematic diagram of 3 match circles of the present invention.
The main element symbol description
| Optical detector | ?1 |
| Wafer | ?2 |
| The rotating platform motor | ?4 |
Following embodiment will further specify the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
See also Fig. 1, in a preferred embodiments of the present invention, crystal circle center's prealignment equipment comprises a rotating platform motor 4, in order to support rotation one wafer 2; One optical detector 1 is used for gathering wafer 4 marginal date and the code-disc value of obtaining corresponding rotating platform motor 4.In one embodiment, described optical detector is a single ccd sensor.
Described rotating platform motor 4 has a pivot.The maximum range of described optical detector 1 is L, and its maximum range is S to the distance of described rotating platform motor 4, and then described optical detector 1 is L+S to the distance of the pivot of described rotating platform motor 4.
Please refer to Fig. 2-5, described crystal circle center prealignment method may further comprise the steps:
S11, data sampling: described rotating platform motor 4 drives described wafer 2 and rotates a circle around the direction of a P (see figure 3), described optical detector 1 is gathered rotate a circle marginal date in the process of described wafer 2, and obtains the code-disc Value Data of corresponding rotating platform motor 4 simultaneously.Wherein, suitably regulate sample frequency according to wafer 2 sizes.Fig. 2 is crystal round fringes sampled point schematic diagram, and the present invention does not also require uniformly-spaced collection;
S12, data transaction: remove near the breach after the data, the boundary point that described optical detector 1 sampled data is converted to wafer 2 is l apart from the physical length data of the pivot of rotating platform motor 4
i(i ∈ (1,2,3...N)), N are total sampling number, and then described wafer 2 edges to the distance of described pivot is S+L-l
i, (i ∈ (1,2,3...N)).In one embodiment, as shown in Figure 3, it is l1 that affiliated optical detector 1 is gathered the A point data, and the A point extremely distance of described pivot is S+L-l1, and L-l1=a wherein is so the A point can be designated as S+a to the distance of pivot; Same method, described optical detector 1 is gathered B, the C point data is respectively l2, l3, B, C point respectively extremely the distance of described pivot be respectively: S+b, S+c, wherein (b=L-l2, c=L-l3);
S21 obtains when front motor code-disc value: obtain the code-disc value of rotating platform motor 4 under current halted state, with this benchmark as the rectangular coordinate match, in Fig. 3, with the pivot of the rotating platform motor 4 xo ' y reference axis as the origin of coordinates;
S22, the rectangular coordinate match: according to rotating platform motor 4 benchmark code-disc values, it is θ that the motor code-disc value that sampling is obtained is converted to angle-data
i(i ∈ (1,2,3...N)) calculates the coordinate figure of each sampled point under coordinate system xo ' y according to angle-data, so just finishes that sampled data is converted to the rectangular coordinate data.In one embodiment, as shown in Figure 3, the motor code-disc Value Data that A, B, C point sampling obtain is converted to angle-data and is respectively θ
1, θ
2, θ
3, then the abscissa value of A point under xo ' y is X
1=(S+a) cos θ
1, ordinate value is Y
1=(S+a) sin θ
1, same method B point coordinates value (X
2, Y
2) be ((S+b) cos θ
2, (S+b) sin θ
2), C point coordinates value (X
3, Y
3) be ((S+c) cos θ
3, (S+c) sin θ
3);
S31, determine circles at 3: 3 points are selected in the compartment of terrain, by three null circle fitting processs and then obtain home position.Determine that according to 3 a round principle can be (A by the coordinate of the center of circle under coordinate system xo ' y of above-mentioned 3 matches circle
1, B
1), radius is R
0
S32: repeatedly be averaging behind the match circle: repeating step S31, take full advantage of data, the center of circle data that obtain many group match circles are (A
1, B
1), (A
2, B
2) ... (A
N, B
N);
S33: obtain current wafer home position: many groups center of circle data that step S32 is obtained are averaging, can be with the result as current wafer home position.Be that the central coordinate of circle of wafer under xo ' y coordinate system is
Thus, calculate the position of the center of circle under coordinate system xo ' y of wafer 4, accurately convenient again.
Compared with prior art, crystal circle center of the present invention prealignment method, ask the position at the center of wafer by 3 approximating methods, this method is not subjected to the influence of single sampled data error, and the sampling of data is very convenient, and can utilize sampled data fully, simply and efficiently calculate the center of wafer.
Claims (7)
1. crystal circle center's prealignment method may further comprise the steps: provide a rotating platform motor, in order to support rotation one wafer; Optical detector, in order to gather crystal round fringes data and the code-disc value of obtaining corresponding rotating platform motor, it is characterized in that: this method is further comprising the steps of:
Data sampling: rotate a circle marginal date in the process of described wafer is gathered in the rotation of the described wafer of described rotating platform driven by motor, described optical detector, and obtains the code-disc Value Data of corresponding rotating platform motor simultaneously;
Data transaction: after removing near the data of breach, the marginal date that optical detector is sampled converts boundary point to apart from the physical length data of motor pivot;
Obtain when front motor code-disc value: obtain the code-disc value of rotating platform motor under current halted state, with this benchmark code-disc value as the rectangular coordinate match;
Rectangular coordinate match: according to motor benchmark code-disc value, the motor code-disc Value Data that sampling is obtained is converted to angle-data, according to angle-data, just can calculate each sample point coordinate under current rectangular coordinate system by the boundary point length data, finish that so sampled data is converted to the rectangular coordinate data;
Determine a circle at 3: three points of sampling, obtain the home position of a match circle under described rectangular coordinate with 3 circle approximating methods.
2. crystal circle center as claimed in claim 1 prealignment method is characterized in that: repeat 3 matches circles, obtain the data of many group match circles, and the data that will organize the match circle are averaging more, just can obtain the wafer home position.
3. crystal circle center as claimed in claim 2 prealignment method is characterized in that: described wafer to the distance of the pivot of described rotating platform motor equals pivot to the distance of described optical detector and deducts described crystal round fringes to the distance of described optical detector.
4. crystal circle center as claimed in claim 3 prealignment method, it is characterized in that: described optical detector has maximum range L, and described maximum range is S to the distance of described pivot, and the distance that described optical detector is measured the edge of described wafer is l
i(i ∈ (1,2,3...N)), described crystal round fringes to the distance of described pivot is S+L-l
i, (i ∈ (1,2,3...N)).
5. crystal circle center as claimed in claim 4 prealignment method, it is characterized in that: it is θ that the motor code-disc value that the corresponding sampling of described crystal round fringes obtains is converted to angle-data
i(i ∈ (1,2,3...N)), the coordinate figure of described crystal round fringes under described rectangular coordinate system can by described crystal round fringes to described pivot apart from S+L-l
i, (i ∈ (1,2,3...N)) and angle θ
i(i ∈ (1,2,3...N)) calculates ((S+L-l
i) cos θ
i, (S+L-l
i) sin θ
i) wherein, i ∈ (1,2,3...N).
6. crystal circle center as claimed in claim 5 prealignment method is characterized in that: from the marginal value of described wafer at interval choose 3 points, obtain the coordinate (A of match circle by 3 match circule methods
1, B
1), the central coordinate of circle value that the coordinate figure that obtains by round match is repeatedly obtained wafer is
7. crystal circle center as claimed in claim 6 prealignment method is characterized in that: choose for 3 of described wafer and do not require equally spaced collection.
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| CN201210002309.5A CN103199047B (en) | 2012-01-05 | 2012-01-05 | Wafer center prealignment method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104362090A (en) * | 2014-11-18 | 2015-02-18 | 天津中环领先材料技术有限公司 | Method for removing silicon dioxide on edge of CCD type optical localization silicon wafer |
| CN104979257A (en) * | 2014-04-14 | 2015-10-14 | 睿励科学仪器（上海）有限公司 | Positioning method for pattern-free silicon chip measurement |
| CN105022073A (en) * | 2014-04-28 | 2015-11-04 | 昆明中铁大型养路机械集团有限公司 | Method for reducing GPS positioning errors and automatic control device based on GPS positioning |
| CN105022358A (en) * | 2014-04-28 | 2015-11-04 | 昆明中铁大型养路机械集团有限公司 | Railway large-scale road maintenance machinery automatic control device based on GPS, method and corresponding vehicle |
| CN109118511A (en) * | 2018-08-29 | 2019-01-01 | 苏州钮曼精密机电科技有限公司 | A kind of image processing method of inclination sensor |
| CN112635350A (en) * | 2019-09-24 | 2021-04-09 | 沈阳新松机器人自动化股份有限公司 | Clamping type wafer calibration device and calibration method |
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| CN1787200A (en) * | 2005-10-28 | 2006-06-14 | 清华大学 | Method for controlling pre-aligning of silicon wafer |
| CN101436004A (en) * | 2008-12-01 | 2009-05-20 | 上海微电子装备有限公司 | Method for pre-aligning silicon chip |
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| US20040089515A1 (en) * | 2002-11-11 | 2004-05-13 | Cheol-Joon Yoo | Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape |
| CN1787200A (en) * | 2005-10-28 | 2006-06-14 | 清华大学 | Method for controlling pre-aligning of silicon wafer |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979257A (en) * | 2014-04-14 | 2015-10-14 | 睿励科学仪器（上海）有限公司 | Positioning method for pattern-free silicon chip measurement |
| CN105022073A (en) * | 2014-04-28 | 2015-11-04 | 昆明中铁大型养路机械集团有限公司 | Method for reducing GPS positioning errors and automatic control device based on GPS positioning |
| CN105022358A (en) * | 2014-04-28 | 2015-11-04 | 昆明中铁大型养路机械集团有限公司 | Railway large-scale road maintenance machinery automatic control device based on GPS, method and corresponding vehicle |
| CN105022073B (en) * | 2014-04-28 | 2017-09-12 | 中国铁建高新装备股份有限公司 | Reduce the method for GPS location error and the self-con-tained unit based on GPS location |
| CN105022358B (en) * | 2014-04-28 | 2018-06-08 | 中国铁建高新装备股份有限公司 | Railway large-scale maintenance machinery self-con-tained unit and method and corresponding vehicle based on GPS |
| CN104362090A (en) * | 2014-11-18 | 2015-02-18 | 天津中环领先材料技术有限公司 | Method for removing silicon dioxide on edge of CCD type optical localization silicon wafer |
| CN109118511A (en) * | 2018-08-29 | 2019-01-01 | 苏州钮曼精密机电科技有限公司 | A kind of image processing method of inclination sensor |
| CN109118511B (en) * | 2018-08-29 | 2022-06-28 | 苏州钮曼精密机电科技有限公司 | Image processing method of tilt sensor |
| CN112635350A (en) * | 2019-09-24 | 2021-04-09 | 沈阳新松机器人自动化股份有限公司 | Clamping type wafer calibration device and calibration method |
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| CN103199047B (en) | 2015-08-19 |
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