CN103188874A - 一种控深铣定位方法以及印刷电路板 - Google Patents
一种控深铣定位方法以及印刷电路板 Download PDFInfo
- Publication number
- CN103188874A CN103188874A CN2011104468962A CN201110446896A CN103188874A CN 103188874 A CN103188874 A CN 103188874A CN 2011104468962 A CN2011104468962 A CN 2011104468962A CN 201110446896 A CN201110446896 A CN 201110446896A CN 103188874 A CN103188874 A CN 103188874A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- control
- deeply
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 48
- 238000003801 milling Methods 0.000 title abstract description 10
- 230000004807 localization Effects 0.000 claims description 24
- 229920001131 Pulp (paper) Polymers 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09136—Means for correcting warpage
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T409/00—Gear cutting, milling, or planing
- Y10T409/30—Milling
- Y10T409/303752—Process
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110446896.2A CN103188874B (zh) | 2011-12-28 | 2011-12-28 | 一种控深铣定位方法以及印刷电路板 |
US13/730,149 US20130168140A1 (en) | 2011-12-28 | 2012-12-28 | Printed Circuit Board and Method of Manufacturing Same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110446896.2A CN103188874B (zh) | 2011-12-28 | 2011-12-28 | 一种控深铣定位方法以及印刷电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103188874A true CN103188874A (zh) | 2013-07-03 |
CN103188874B CN103188874B (zh) | 2016-01-13 |
Family
ID=48679750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110446896.2A Active CN103188874B (zh) | 2011-12-28 | 2011-12-28 | 一种控深铣定位方法以及印刷电路板 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20130168140A1 (zh) |
CN (1) | CN103188874B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103394738A (zh) * | 2013-07-25 | 2013-11-20 | 深圳市博敏电子有限公司 | 一种防擦花pcb电铣成型装置及方法 |
CN108770213A (zh) * | 2018-07-18 | 2018-11-06 | 安徽深泽电子股份有限公司 | 一种可检测pcb板弯翘的v割装置 |
CN111113549A (zh) * | 2019-12-16 | 2020-05-08 | 广州兴森快捷电路科技有限公司 | 超厚芯板冲孔系统及超厚芯板冲孔方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104080267A (zh) * | 2014-06-27 | 2014-10-01 | 杨海蓉 | 一种电路板垫片 |
CN109785324B (zh) * | 2019-02-01 | 2020-11-27 | 佛山市南海区广工大数控装备协同创新研究院 | 一种大幅面pcb板定位方法 |
CN110418505B (zh) * | 2019-07-24 | 2021-10-26 | 信丰迅捷兴电路科技有限公司 | 一种精密pcb毛胚板及其加工成型方法 |
CN113891557B (zh) * | 2021-09-17 | 2024-07-19 | 江苏苏杭电子有限公司 | 一种印刷电路板制作方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4138924A (en) * | 1975-07-12 | 1979-02-13 | Seebach Juergen | Method for the production of conductor plates |
US5692286A (en) * | 1995-10-02 | 1997-12-02 | Posulax S.A. | Method for shaping parts in one or more stacked board shaped elements and machine tool for implementing this method |
US20010032387A1 (en) * | 2000-03-24 | 2001-10-25 | Olympus Optical Co., Ltd. | Electric wiring forming system |
CN100452947C (zh) * | 2003-06-30 | 2009-01-14 | 健鼎科技股份有限公司 | 用于多片排印刷电路板排版内开槽后加斜边的处理方法 |
CN102209432A (zh) * | 2011-05-25 | 2011-10-05 | 创维液晶器件(深圳)有限公司 | 一种pcb、led灯条及液晶显示装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4311267A (en) * | 1979-05-04 | 1982-01-19 | Gte Automatic Electric Laboratories, Inc. | Method of screening paste solder onto leaded hybrid substrates |
US4495399A (en) * | 1981-03-26 | 1985-01-22 | Cann Gordon L | Micro-arc milling of metallic and non-metallic substrates |
IT1240531B (it) * | 1990-08-07 | 1993-12-17 | Pluritec Italia | Metodo e dispositivo di controllo della profondita' di lavorazione per una macchina utensile a controllo numerico |
US5154548A (en) * | 1991-09-27 | 1992-10-13 | Walsh Joseph P | Dowelling fixture |
US5404021A (en) * | 1991-11-13 | 1995-04-04 | Excellon Automation | Laser sensor for detecting the extended state of an object in continuous motion |
US5328397A (en) * | 1992-03-09 | 1994-07-12 | Fin Control Systems Pty. Limited | Surf fin fixing system |
JP3740748B2 (ja) * | 1996-06-18 | 2006-02-01 | 松下電器産業株式会社 | 光ファイバモジュール |
US6225139B1 (en) * | 2000-01-24 | 2001-05-01 | Chan Tsung-Wen | Manufacturing method of an led of a type of round concave cup with a flat bottom |
US6747862B1 (en) * | 2000-07-17 | 2004-06-08 | Alcatel | System and method for providing high voltage withstand capability between pins of a high-density compliant pin connector |
DE10120694A1 (de) * | 2001-04-27 | 2003-01-09 | Siemens Ag | Koppler für optische Signale und Verfahren zum Setzen mechanischer Führungselemente von Kopplern |
US7837218B2 (en) * | 2006-03-07 | 2010-11-23 | Flaig Theodore J | Magnetic method and apparatus for increasing foot traction on sports boards |
US8685034B2 (en) * | 2006-08-10 | 2014-04-01 | Stryker Trauma Gmbh | Distal targeting device |
JP5198748B2 (ja) * | 2006-08-31 | 2013-05-15 | 本田技研工業株式会社 | 回路基板およびその製造方法 |
DE102007049310A1 (de) * | 2007-10-15 | 2009-04-16 | Automotive Lighting Reutlingen Gmbh | Leuchtmodul für einen Scheinwerfer oder eine Leuchte eines Kraftfahrzeugs |
WO2010096707A2 (en) * | 2009-02-19 | 2010-08-26 | Touchdown Technologies, Inc. | Microelectronic contactor assembly, structures thereof, and methods of constructing same |
US8613132B2 (en) * | 2009-11-09 | 2013-12-24 | Feinics Amatech Teoranta | Transferring an antenna to an RFID inlay substrate |
-
2011
- 2011-12-28 CN CN201110446896.2A patent/CN103188874B/zh active Active
-
2012
- 2012-12-28 US US13/730,149 patent/US20130168140A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4138924A (en) * | 1975-07-12 | 1979-02-13 | Seebach Juergen | Method for the production of conductor plates |
US5692286A (en) * | 1995-10-02 | 1997-12-02 | Posulax S.A. | Method for shaping parts in one or more stacked board shaped elements and machine tool for implementing this method |
US20010032387A1 (en) * | 2000-03-24 | 2001-10-25 | Olympus Optical Co., Ltd. | Electric wiring forming system |
CN100452947C (zh) * | 2003-06-30 | 2009-01-14 | 健鼎科技股份有限公司 | 用于多片排印刷电路板排版内开槽后加斜边的处理方法 |
CN102209432A (zh) * | 2011-05-25 | 2011-10-05 | 创维液晶器件(深圳)有限公司 | 一种pcb、led灯条及液晶显示装置 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103394738A (zh) * | 2013-07-25 | 2013-11-20 | 深圳市博敏电子有限公司 | 一种防擦花pcb电铣成型装置及方法 |
CN103394738B (zh) * | 2013-07-25 | 2015-11-25 | 深圳市博敏电子有限公司 | 一种防擦花pcb电铣成型装置及方法 |
CN108770213A (zh) * | 2018-07-18 | 2018-11-06 | 安徽深泽电子股份有限公司 | 一种可检测pcb板弯翘的v割装置 |
CN108770213B (zh) * | 2018-07-18 | 2023-01-06 | 安徽深泽电子股份有限公司 | 一种可检测pcb板弯翘的v割装置 |
CN111113549A (zh) * | 2019-12-16 | 2020-05-08 | 广州兴森快捷电路科技有限公司 | 超厚芯板冲孔系统及超厚芯板冲孔方法 |
CN111113549B (zh) * | 2019-12-16 | 2021-11-09 | 广州兴森快捷电路科技有限公司 | 超厚芯板冲孔系统及超厚芯板冲孔方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103188874B (zh) | 2016-01-13 |
US20130168140A1 (en) | 2013-07-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: ZHUHAI FOUNDER TECHNOLOGY HIGH-DENSITY ELECTRONIC Free format text: FORMER OWNER: ZHUHAI FOUNDER TECHNOLOGY HIGH-DENSITY ELECTRONIC CO., LTD. Effective date: 20131024 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20131024 Address after: 100871 Beijing, Haidian District Road, building No. 298, founder of the building, Zhongguancun, layer 5 Applicant after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Applicant after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Applicant after: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. Address before: 100871 Beijing, Haidian District Road, building No. 298, founder of the building, Zhongguancun, layer 5 Applicant before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Applicant before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 100871, Beijing, Haidian District, Cheng Fu Road, No. 298, Zhongguancun Fangzheng building, 5 floor Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871, Beijing, Haidian District, Cheng Fu Road, No. 298, Zhongguancun Fangzheng building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220920 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Address before: 100871, Beijing, Haidian District, Cheng Fu Road, No. 298, Zhongguancun Fangzheng building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |