CN103149991A - Silent non-power-consumption heat dissipation type computer mainframe - Google Patents
Silent non-power-consumption heat dissipation type computer mainframe Download PDFInfo
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- CN103149991A CN103149991A CN2012105707630A CN201210570763A CN103149991A CN 103149991 A CN103149991 A CN 103149991A CN 2012105707630 A CN2012105707630 A CN 2012105707630A CN 201210570763 A CN201210570763 A CN 201210570763A CN 103149991 A CN103149991 A CN 103149991A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The invention discloses a silent non-power-consumption heat dissipation type computer mainframe, wherein heating components in the computer mainframe are directly and fixedly arranged on a case wall board with a heat dissipation function; the heat conducted to the outer surface of a case is brought away through external natural air flow to perform physical heat dissipation; and the silent non-power-consumption heat dissipation type computer mainframe is characterized in that no additional power consumption exists in the entire heat dissipation process. The computer case wall board is made of metal with high thermal conduction ratio; and a heat dissipation toothed lattice for increasing the heat dissipation area is arranged on the outer side of the computer case wall board according to a heat dissipation requirement. The heat of the heating components in the mainframe is directly conducted to the exterior of a computer in real time through the heat dissipation wall board, so that infrasonic wave and noise caused by a fan are avoided, meanwhile, the stability performance for operation of the computer is improved, and the service life of the electronic components in the computer is effectively prolonged. Meanwhile, electromagnetic radiation in the computer is effectively obstructed by the metal wall board with high thermal conduction ratio and the heat dissipation toothed lattice of the metal wall board. The silent non-power-consumption heat dissipation type computer mainframe has a good actual measurement effect in the aspects of performance, energy conservation and environmental protection.
Description
Technical field
The invention belongs to field of computer technology, be specifically related to a kind of quiet powerless heat dissipating formula main frame in field of computer technology.
Technical background
The main frame cooling system of computing machine generally adopts drive fan or liquid cooling technology to be relevant heating element cooling at present, but has technically certain defective:
One, air-cooled technological deficiency:
1, in the process of fan cooling, the power supply in main frame and line related can increase load, produce secondary heat energy.
2, fan itself increases power consumption, and the electric weight load strengthens, not energy-conserving and environment-protective.
3, fan is producing static with air and the friction of airborne dust, and the absorption dust granules causes dirt accumulation after long-play, and radiating effect reduces, and easily causes short circuit in wet environment, has potential safety hazard.
4, heat radiation postpones, general fan-type fan heat is to control rotation speed of the fan fan heat by temperature sensor, when the components and parts increase in temperature, information offers sensor, sensors command changes rotation speed of the fan, this process can form the heat radiation timeliness and postpone, and in fact high temperature has produced certain loss to components and parts, has reduced the components and parts life-span.
5, fan produces noise and infrasonic wave in operational process, can damage human body.
Two, liquid cooling technological deficiency:
The part main frame adopts the liquid cooling technology, although avoided the absorption of part dust, but still there is power consumption to produce the in service of liquid circulation pump, can not make useful improvement for energy-conserving and environment-protective, and because of host power supply part heater element numerous, adopt the more difficult enforcement of liquid-cooling heat radiation circulation line complexity, only do liquid cooling cooling-down for CPU and GPU so liquid-cooling heat radiation is general, generally power unit still adopts fan for cooling.
Summary of the invention
for above-mentioned technical matters, the invention provides a kind of quiet powerless heat dissipating formula main frame, in the computer run process in main frame the heating element in related hardware continue to dispel the heat by the cabinet wallboard that has high heat conduction and make than metal, this main frame is due to the heat dissipation design of uniqueness, can effectively improve the operation usefulness of computing machine, and the serviceable life of the interior electronic devices and components of prolongation main frame, noise and the infrasonic wave of having avoided simultaneously fan to produce in operational process, reduced the electromagnetic radiation of computer-internal components and parts to the outside, provide certain guarantee to user healthy.
Realize that technical scheme of the present invention is as follows:
A kind of quiet powerless heat dissipating formula main frame, it is to be realized the real-time heat sinking function of the heat that the main high heating element to main frame inside produces by the high heat conduction wallboard of computer host box.Heating element in main frame is fixed on the mainframe box wallboard with heat sinking function, the heat of heating element is directly transferred to the cabinet outside by the cabinet wallboard, take away heat by the natural airflow that forms of cabinet outside again, components and parts heat in whole computer run process is transmitted to the cabinet outside in real time, and whole heat radiation process can not produce any additional power consumption, is a kind of main frame of novel environment friendly.
The heat radiation wallboard of computing machine is according to the radiation tooth lattice of radiating requirements customizable increasing area of dissipation in the outside, the main high heating element of computer mainframe internal contacts with the main frame wall panel is inboard, heat directly exports to the cabinet outside by the heat radiation wallboard, loops Physical temperature-lowering with natural air.
Described heat radiation wallboard adopts high heat conduction to make than metal material, has the effect of the electromagnetic radiation that shielding main frame internal component produces, and the computer operator is played certain protective effect.
Beneficial effect of the present invention is:
1, produce without additional power consumption in whole heat radiation process, energy-efficient.
2, additional owing to not producing in whole heat radiation process, idle can for power supply and line related generation load, not produce secondary heat energy.
3, heat radiation in real time, the temperature that in the computer run process, heating element produces the directly cabinet wallboard by high heat conduction ratio conducts to the cabinet outside, this conductive process is physical action, it is real-time conduction, can not produce accumulation of heat, reduce the components and parts loss, can effectively improve the components and parts life-span.
4, fan-free heat radiation can not adsorbed dust, and in cabinet, the dirt accumulation amount is minimum, can not affect circuit serviceable life, uses relevant components and parts longer service life.
5, fan-free operation can not produce noise and infrasonic wave, and tranquility environmental protection is played good healthy protect effect to the computer operator.
6, high heat conduction than the effect that metal wallboard and outside radiation tooth lattice thereof have good block electromagnetic radiation, is played good healthy protect effect to the computer operator.
Description of drawings
Fig. 1 is that the inside of quiet powerless heat dissipating formula main frame of the present invention forms framework and external cooling schematic diagram;
Fig. 2 is the inner structure diagrammatic cross-section of quiet powerless heat dissipating formula main frame of the present invention.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
As shown in Figure 1, a kind of quiet powerless heat dissipating formula main frame, it is to realize real-time heat sinking function by the heat of the main heating element of computer mainframe internal by the mainframe box wallboard, it is characterized in that, described cabinet wallboard adopts high heat conduction to make than metal material, mainframe box wallboard large tracts of land heat radiation, the main heating element of described main frame inside is fixed on the mainframe box wallboard.
About the heat radiation of described cabinet wallboard large tracts of land, be the demand according to the computing machine thermal value, can corresponding customization heat radiation wallboard the radiation tooth lattice in the outside, to strengthen area of dissipation.In actual test process, indices all is better than traditional computer.
As shown in Figure 2, above-mentioned a kind of quiet powerless heat dissipating formula main frame, the heating element of its main frame inside directly contacts with the board-like cabinet wallboard of heat radiation that described high heat conduction is made than metal, heat is directly exported to the cabinet outside, loop Physical temperature-lowering with natural air, the main hardware part of computer mainframe internal is fixed take heating element as surface of contact with the heat radiation wallboard of computing machine respectively, and the heat of heating element is directly outside by heat radiation wallboard derivation cabinet.
Above-described only for one of better embodiment of the present invention, point out that at this any those of ordinary skill in the art under the prerequisite that does not break away from the invention design, can also make improvement, but these all belong to protection scope of the present invention.
Claims (3)
1. quiet powerless heat dissipating formula main frame, this main frame is the heating element in computing machine directly to be fixed on the cabinet wallboard inboard of proprietary heat sinking function, the heat that heating element produces in operational process is directly conducted to the cabinet appearance through the heat conduction wallboard, the natural airflow of cabinet appearance is taken away the heat that the cabinet inside heating element is derived the cabinet outside, the radiation tooth lattice that can strengthen area of dissipation are formulated in the heat-conducting plate outside according to radiating requirements, in the computer run process, having the cabinet wallboard of heat sinking function directly derives the cabinet outside in the situation that do not produce other power consumptions with the heat of components and parts.
2. quiet powerless heat dissipating formula main frame according to claim 1 is characterized in that: it is inboard that the heating element in described main frame directly is fixed on the cabinet wallboard with high heat conduction ratio.
3. quiet powerless heat dissipating formula main frame according to claim 1 and 2, it is characterized in that: the cabinet wallboard has high heat conduction function, the cabinet wallboard of the main high heating element of computer mainframe internal by high heat conduction ratio directly exports to the cabinet outside with heat, form updraft after the heating of cabinet extraneous air and take away heat, thereby realize the Physical temperature-lowering of quiet idle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105707630A CN103149991A (en) | 2012-12-26 | 2012-12-26 | Silent non-power-consumption heat dissipation type computer mainframe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105707630A CN103149991A (en) | 2012-12-26 | 2012-12-26 | Silent non-power-consumption heat dissipation type computer mainframe |
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| CN103149991A true CN103149991A (en) | 2013-06-12 |
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| CN2012105707630A Pending CN103149991A (en) | 2012-12-26 | 2012-12-26 | Silent non-power-consumption heat dissipation type computer mainframe |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104780744A (en) * | 2015-04-23 | 2015-07-15 | 特变电工西安电气科技有限公司 | Heat radiating system of electrical device |
| CN106292907A (en) * | 2015-12-29 | 2017-01-04 | 北京典赞科技有限公司 | A kind of cabinet framework of complete quiet natural heat dissipation |
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| CN1641528A (en) * | 2003-03-24 | 2005-07-20 | 庄福良 | Computer case radiating casing |
| CN1629770A (en) * | 2004-08-05 | 2005-06-22 | 项非 | Computer radiating method requiring no fans |
| CN2859638Y (en) * | 2005-03-23 | 2007-01-17 | 莫傲 | Heat abstractor for integrated circuit module in desk computer |
| CN101097471A (en) * | 2005-03-23 | 2008-01-02 | 莫傲 | Heat radiation system of desk type computer |
| CN2826507Y (en) * | 2005-09-26 | 2006-10-11 | 郭军 | Computer with external radiator |
| CN101141868A (en) * | 2007-02-14 | 2008-03-12 | 南京理工大学 | Non-fan chip heat radiator |
| CN101017386A (en) * | 2007-03-02 | 2007-08-15 | 浙江大学 | Dust-proof low noise computer vertical box |
| CN201084095Y (en) * | 2007-10-19 | 2008-07-09 | 讯凯国际股份有限公司 | Mobile radiation structure and machine box possessing same |
| CN201230432Y (en) * | 2008-08-01 | 2009-04-29 | 北京星网锐捷网络技术有限公司 | Machine box and heat radiating device |
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| CN204102055U (en) * | 2014-03-17 | 2015-01-14 | 李冬梅 | Fan-free cooling cabinet |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104780744A (en) * | 2015-04-23 | 2015-07-15 | 特变电工西安电气科技有限公司 | Heat radiating system of electrical device |
| CN104780744B (en) * | 2015-04-23 | 2017-07-18 | 特变电工西安电气科技有限公司 | A kind of cooling system of electrical equipment |
| CN106292907A (en) * | 2015-12-29 | 2017-01-04 | 北京典赞科技有限公司 | A kind of cabinet framework of complete quiet natural heat dissipation |
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Application publication date: 20130612 |