CN103090220A - Semiconductor light source module - Google Patents

Semiconductor light source module Download PDF

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Publication number
CN103090220A
CN103090220A CN2012102526652A CN201210252665A CN103090220A CN 103090220 A CN103090220 A CN 103090220A CN 2012102526652 A CN2012102526652 A CN 2012102526652A CN 201210252665 A CN201210252665 A CN 201210252665A CN 103090220 A CN103090220 A CN 103090220A
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CN
China
Prior art keywords
described
semiconductor light
reflection cavity
light sources
sleeve pipe
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Application number
CN2012102526652A
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Chinese (zh)
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CN103090220B (en
Inventor
肖一胜
王俊
王伟霞
田晓改
郑子豪
Original Assignee
重庆雷士实业有限公司
惠州雷士光电科技有限公司
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Priority to CN201210252665.2A priority Critical patent/CN103090220B/en
Publication of CN103090220A publication Critical patent/CN103090220A/en
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Publication of CN103090220B publication Critical patent/CN103090220B/en

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Abstract

The invention relates to a semiconductor light source module. The semiconductor light source module comprises a shell, a light transmitting piece fixed at a light emitting end of the shell, and a light emitting device, a drive electronic device, an insulation piece and a heat sink which are arranged in the shell. A reflection cavity which generally has a shape of a cone frustum-shaped funnel is formed in the shell; and a large opening of the reflection cavity is close to the light-emitting end of the shell, and a small opening of the reflection cavity is provided with a plurality of guide columns. Holes or notches which are matched with the guide columns are formed on the light emitting device, the drive electronic device and the insulation piece. One ends of the guide columns are arranged on the inner wall of the reflection cavity, and the other ends of the guide columns are connected with the heat sink. The semiconductor light source module can be matched with the conventional lamp and is compact and firm in structure, and the design space of the matched lamp is enlarged; and after being damaged, the whole light source module can be directly removed from the lamp to be replaced, and the installation time and manpower cost can be saved.

Description

The semiconductor light sources module

Technical field

The present invention relates to the modularity lighting device, relate in particular to a kind of semiconductor light sources module.

Background technology

Along with the development of semiconductor light sources (LED) technology, the product that adopts at present semiconductor light sources just progressively substitutes conventional light source and is widely used in all kinds of lighting fields.Current semiconductor light sources is just towards the future development of modularity, miniaturization, so each manufacturer of family has released different semiconductor light sources module products one after another.The effects limit such as technical characteristic due to semiconductor light sources self, the semiconductor light sources module must comprise the elements such as heat conduction, heat abstractor and driving power (external or built-in) usually, how these necessary elements are optimized improvement, add simultaneously the illuminating effect that improves light fixture as other components and parts such as reflector, Optical devices, finally realizing the independent light source module form of miniaturization, is the target of present semiconductor light sources module product scope development.

Summary of the invention

The object of the present invention is to provide a kind of can adaptive existing light fixture, the semiconductor light sources module of compact conformation.

A kind of semiconductor light sources module comprises housing, is fixed on the transmission element of housing bright dipping end and is arranged on housing interior light-emitting device, drive electronics, insulating part and heat sink.Establish the funnel shaped reflection cavity that substantially is round table-like in described housing, the larger opening part of described reflection cavity is near the bright dipping end of housing, and its less opening part is provided with many guide pillars.Be formed with hole or breach with described guide pillar coupling on described light-emitting device, drive electronics and insulating part.One end of described guide pillar is located at the inwall of reflection cavity, and the other end is connected with heat sink.

In a preferred embodiment, described semiconductor light sources module also comprises an infundibulate reflecting element, and described reflecting element covers the inwall of described reflection cavity and the end that guide pillar is connected with the reflection cavity inwall.

In a preferred embodiment, described insulating part comprises that insulating trip, insulation board reach the sleeve pipe from the insulation board umbo, and the profile of described insulating trip and the profile of light-emitting device are similar but slightly large; Described sleeve pipe contacts with guide pillar.

In a preferred embodiment, described drive electronics comprises be used to the drive circuit that drives described semiconductor light sources, and the middle part of described drive electronics is formed with the hole that can pass for described sleeve pipe, and described insulating trip is arranged between light-emitting device and sleeve pipe.

In a preferred embodiment, describedly heat sinkly comprise heat conductive pad and from the heating column of heat conductive pad umbo, described heating column insert described sleeve pipe and with insulating trip and sleeve pipe close contact.

In a preferred embodiment, described heating column is the column of hollow substantially.

In a preferred embodiment, described heating column inside is filled with highly heat-conductive material.

In a preferred embodiment, described reflecting element can be a kind of in following: be coated with diffuse-reflective material on the inwall of (1) reflecting element; (2) reflecting element is made by the total diffuse reflection polymer composite.

The present invention also provides a kind of semiconductor light sources module, comprises housing, is fixed on the transmission element of housing bright dipping end and is arranged on housing interior light-emitting device, drive electronics, insulating part and heat sink.Establish the funnel shaped reflection cavity that substantially is round table-like in described housing.The larger opening part of described reflection cavity is near the bright dipping end of housing, and described light-emitting device is fixed on the smaller opening place of reflection cavity, and the outer wall of reflection cavity is provided with many guide pillars.Be formed with the hole or the breach that mate with described guide pillar on described insulation board, drive electronics and heat conductive pad, an end of described guide pillar is located at the outer wall of reflection cavity, and the other end is connected with heat sink.

In a preferred embodiment, described insulating part comprises that insulating trip, insulation board reach the sleeve pipe from the insulation board umbo, and the profile of described insulating trip and the profile of light-emitting device are similar but slightly large; Described sleeve pipe contacts with guide pillar; Described drive electronics comprises be used to the drive circuit that drives described semiconductor light sources, and the middle part of described drive electronics is formed with the hole that can pass for described sleeve pipe, and described insulating trip is arranged between light-emitting device and sleeve pipe; Describedly heat sinkly comprise heat conductive pad and from the heating column of heat conductive pad umbo, described heating column insert described sleeve pipe and with insulating trip and sleeve pipe close contact.

Semiconductor light sources module of the present invention can adaptive existing light fixture, its guide pillar is connected with the reflection cavity inwall, thereby has shortened semiconductor light sources module length, compact conformation, firm, can increase the design space of adaptive light fixture, and when damaging, need not to consider the internal damage reason, directly integral body is removed to change from light fixture and is got final product, need not whole lamp depot repair, save set-up time and human cost, compact structure is more conducive to Product transport simultaneously, reduces cost of transportation.In addition, many guide pillars are arranged near light source die group switching centre position, have increased the support force between heat sink and shell, make reflection cavity more firm with the space of heat sink, are difficult for because causing the damage of light source module from excessive the subsiding of the pressure in the heat sink outside.

Description of drawings

Fig. 1 is the explosive view of the semiconductor light sources module of an embodiment.

Fig. 2 is the part of the semiconductor light sources module of Fig. 1 figure that decides what is right and what is wrong.

Fig. 3 is the stereogram of Fig. 1 middle shell.

Fig. 4 is the stereogram at another visual angle of Fig. 1 middle shell.

Fig. 5 is the explosive view of the semiconductor light sources module of another embodiment.

The specific embodiment

Below in conjunction with specific embodiment and accompanying drawing, semiconductor light sources module of the present invention is described in further detail.

As shown in Figure 1, in one preferred embodiment, semiconductor light sources module of the present invention mainly comprises housing 1, is fixed on the transmission element 6 of housing 1 bright dipping end, is used for that transmission element 6 is fixed on the pressure ring 7 on housing 1 and is successively set on housing 1 interior reflecting element 8, light-emitting device 2, drive electronics 3, insulating part 5 and heat sink 4.Wherein, housing 1 is the tubular type of both-side opening substantially, and remaining part is arranged in housing or is fixed on shell end, forms thus one by the arbitrary source body of housing 1 packing, accesses by civil power and gets final product bright dipping.

Establish the funnel shaped reflection cavity 11 that substantially is round table-like in housing 1.Reflection cavity 11 is one-body molded with housing 1 outer wall, can form by plastotype, has reduced the cost of actual production, has improved the efficient of assembling, has strengthened the stress when housing can carry each module element combination.The larger opening part of reflection cavity 11 is near the bright dipping end of housing 1, and its less opening part is provided with many guide pillar 12(and sees Fig. 3 and Fig. 4, is provided with three guide pillars in the present embodiment).Preferably, guide pillar 12 is fixed on the smaller opening place of reflection cavity 12 equably.Be formed with the hole or the breach that mate with guide pillar 12 on light-emitting device 2, drive electronics 3 and insulating part 5, guide pillar 12 passes these holes or breach is connected or contacts with heat sink 4.Guide pillar 12 ends can be formed with screw, be formed with the fixing hole corresponding with guide pillar 12 on heat sink 4, can be fixed up with guide pillar 12 heat sink 4 by screw, thereby light-emitting device 2, drive electronics 3 and insulating part 5 are fixed in reflection cavity 11, housing 1 and heat sink 4 spaces that surround.

Guide pillar 12 is substantially cylindrical, and the one end is formed with the fixed station 121 that substantially is fan-shaped, and guide pillar 12 is connected by the inwall at the close smaller opening place of fixed station 121 and reflection cavity 11, provides support platform stably by fixed station 121 for reflecting element 8 simultaneously.Described inwall refers to the side towards housing 1 bright dipping end and transmission element 6 of reflection cavity 11.Also be formed with the reinforcement that is connected with the outer wall of fixed station 121 and reflection cavity 11 on the sidewall of guide pillar 12, strengthen the ability of guide pillar 12 bearer connection stress, be connected the stress requirement with heat sink 4 and create conditions for satisfying housing 1.Because an end of guide pillar 12 is arranged on reflection cavity 11 inwalls, rather than be arranged on the smaller opening outside of reflection cavity 11, thereby shortened the entire length of semiconductor light sources module.Housing 1 consists of with reflection cavity 11 one, and many guide pillars are arranged near light source die group switching centre position, on guide pillar again by fixed station 121 and reinforcement are set, stress when making housing not only can carry the combination of each module element makes again reflection cavity and the space of heat sink be difficult for because causing the damage of light source module from excessive the subsiding of the pressure in the heat sink outside.

Reflecting element 8 is round table-like infundibulate substantially, the size of its size and reflection cavity 11 coupling just covers inwall and the fixed station 121 of reflection cavity 11, forms the opening of a circle at the smaller opening place near reflection cavity 11, light source on light-emitting device 2 is exposed, as shown in Figure 2.Reflecting element 8 can be made by diffuse-reflective material, as: the total diffuse reflection material polymer composite of Whiteoptics company is attached at reflection cavity 11 sidewalls.Perhaps, be coated with diffuse-reflective material on the inwall of reflecting element 8, to reach diffuse effect, enlarge the bright dipping radius of light-emitting device 2, strengthen the light efficiency of semiconductor light sources module.

Transmission element 6 is round, and is adaptive with the bright dipping end (opening) of housing 1, and its material can be selected diffusion barrier or the reflectance coating made as the transparent material of processing through atomizing, the PC material that adds diffusion particle, by materials such as PET according to the different optical application demand.

Light-emitting device 2 comprises substrate and is fixed on semiconductor light sources on substrate.The smaller opening place of semiconductor light sources and reflection cavity 11 is relative.Be formed with hole or the breach that can supply guide pillar 12 to pass on substrate.In the present embodiment, substrate is substantially rounded, and its size is large than the smaller opening of reflection cavity 11, and its edge is formed with a plurality of breach 21 that supply guide pillar 12 to pass symmetrically.

Drive electronics 3 comprises the ringwise substrate of cardinal principle and is arranged on drive circuit on substrate, that be used for driving semiconductor light sources.The circular open of substrate center is formed with a plurality of locating holes with guide pillar 12 couplings less than the circle of guide pillar 12 definition on substrate.

Insulating part 5 comprises that insulating trip 51, insulation board 52 reach from the sleeve pipe 53 of the both ends open of insulation board 52 umbos.The profile of the profile of insulating trip 51 and light-emitting device 2 is similar but slightly large, also is formed with a plurality of holes or the breach that mate with guide pillar 12 on it, and it is arranged between light-emitting device 2 and sleeve pipe 53.Sleeve pipe 53 can insert the opening at the basic center of drive electronics 3, and with guide pillar 12 close contacts, thereby light-emitting device 2, insulating trip 51 and drive electronics 3 are compressed and are fixed between reflection cavity 11 and insulation board 52.Sleeve pipe 53 also for guide pillar 12 provides the cross-brace protection, prevents that guide pillar 12 from fractureing when providing circumferential location for insulation board 52.Insulating part 5 integral body are made by insulating heat-conduction material, and for example makrolon material or hot gap cushion material are made.

Heat sink 4 are made by highly heat-conductive material, and it comprises the heating column 42 that heat conductive pad 41 reaches from heat conductive pad 41 umbos.Also be formed with a plurality of fixing holes with guide pillar 12 coupling on heat conductive pad 41, heat conductive pad 41 surfaces be insulated that plate 52 covers and with insulation board 52 close contacts.Heating column 42 can insert sleeve pipe 53 and with the sidewall close contact of insulating trip 51 and sleeve pipe 53, derive heat with this and think that the heat abstractor transferring heat on adaptive light fixture makes necessary preparation to the heat conductive pad 41.In the present embodiment, heating column 42 is the cylindrical of hollow substantially, and its inside is filled with highly heat-conductive material, improves heat sink 4 heat conduction and radiating efficiency.

Light-emitting device 2 by heating column 42 top support insulating trips 51 and top thereof, drive electronics 3 is by its set hole, middle part, pass the sleeve pipe 53 of insulating part 5, and be placed in insulating part 5 and be covered on part on heat conductive pad 41, satisfy to prevent from leaking electricity and withstand voltage demand for security, carry out with each corresponding fixing hole of heat sink 4 light source module that screw coordinates to form an integral body by each guide pillar 12 at last.

In other embodiment, the back side of heat sink 4 heat conductive pad 41 (one side of heating column is not set) is formed with radiating fin.Heating column 42 also can be solid.

In other embodiment, as shown in Figure 5, guide pillar 12 can be arranged on the outer wall of reflection cavity 11, corresponding, be formed with at least the fixing hole with this guide pillar coupling on drive electronics 3, heat conductive pad 5 and heat sink 4.And light-emitting device 2 is fixed on the smaller opening place of reflection cavity 11, and insulation board 51 is crushed between light-emitting device 2 and heat sink heating column 42.

Although the description of this invention carries out in conjunction with above specific embodiment,, those skilled in the art that can carry out many replacements, modifications and variations, be apparent according to above-mentioned content.Therefore, all are such substitute, improve and change all is included in the spirit and scope of attached claim.

Claims (10)

1. semiconductor light sources module, comprise housing, be fixed on the transmission element of housing bright dipping end and be arranged on the interior light-emitting device of housing, drive electronics, insulating part and heat sink, it is characterized in that, establish the funnel shaped reflection cavity that substantially is round table-like in described housing, the larger opening part of described reflection cavity is near the bright dipping end of housing, its less opening part is provided with many guide pillars, described light-emitting device, be formed with hole or breach with described guide pillar coupling on drive electronics and insulating part, one end of described guide pillar is located at the inwall of reflection cavity, the other end is connected with heat sink.
2. semiconductor light sources module according to claim 1, is characterized in that, described semiconductor light sources module also comprises an infundibulate reflecting element, and described reflecting element covers the inwall of described reflection cavity and the end that guide pillar is connected with the reflection cavity inwall.
3. semiconductor light sources module according to claim 1, is characterized in that, described insulating part comprises that insulating trip, insulation board reach the sleeve pipe from the insulation board umbo, and the profile of described insulating trip and the profile of light-emitting device are similar but slightly large; Described sleeve pipe contacts with guide pillar.
4. semiconductor light sources module according to claim 3, it is characterized in that, described drive electronics comprises be used to the drive circuit that drives described semiconductor light sources, the middle part of described drive electronics is formed with the hole that can supply described sleeve pipe to pass, and described insulating trip is arranged between light-emitting device and sleeve pipe.
5. semiconductor light sources module according to claim 4, is characterized in that, describedly heat sinkly comprises heat conductive pad and from the heating column of heat conductive pad umbo, described heating column insert described sleeve pipe and with insulating trip and sleeve pipe close contact.
6. semiconductor light sources module according to claim 5, is characterized in that, described heating column is the column of hollow substantially.
7. semiconductor light sources module according to claim 6, is characterized in that, described heating column inside is filled with highly heat-conductive material.
8. semiconductor light sources module according to claim 1, is characterized in that, described reflecting element can be a kind of in following: be coated with diffuse-reflective material on the inwall of (1) reflecting element; (2) reflecting element is made by the total diffuse reflection polymer composite.
9. semiconductor light sources module, comprise housing, be fixed on the transmission element of housing bright dipping end and be arranged on housing interior light-emitting device, drive electronics, insulating part and heat sink, it is characterized in that, establish the funnel shaped reflection cavity that substantially is round table-like in described housing; The larger opening part of described reflection cavity is near the bright dipping end of housing, described light-emitting device is fixed on the smaller opening place of reflection cavity, the outer wall of reflection cavity is provided with many guide pillars, be formed with hole or breach with described guide pillar coupling on described insulation board, drive electronics and heat conductive pad, one end of described guide pillar is connected with the outer wall of reflection cavity, and the other end is connected with heat sink.
10. semiconductor light sources module according to claim 9, is characterized in that, described insulating part comprises that insulating trip, insulation board reach the sleeve pipe from the insulation board umbo, and the profile of described insulating trip and the profile of light-emitting device are similar but slightly large; Described sleeve pipe contacts with guide pillar; Described drive electronics comprises be used to the drive circuit that drives described semiconductor light sources, and the middle part of described drive electronics is formed with the hole that can pass for described sleeve pipe, and described insulating trip is arranged between light-emitting device and sleeve pipe; Describedly heat sinkly comprise heat conductive pad and from the heating column of heat conductive pad umbo, described heating column insert described sleeve pipe and with insulating trip and sleeve pipe close contact.
CN201210252665.2A 2012-07-20 2012-07-20 Semiconductor light source module CN103090220B (en)

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CN103090220B CN103090220B (en) 2015-04-15

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Cited By (1)

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CN105090788A (en) * 2015-08-10 2015-11-25 苏州速腾电子科技有限公司 LED lamp provided with high reflective film reflector

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Publication number Priority date Publication date Assignee Title
CN105090788A (en) * 2015-08-10 2015-11-25 苏州速腾电子科技有限公司 LED lamp provided with high reflective film reflector

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